CN100476441C - Test tray for handler for testing semiconductor devices - Google Patents
Test tray for handler for testing semiconductor devices Download PDFInfo
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- CN100476441C CN100476441C CNB2005101082832A CN200510108283A CN100476441C CN 100476441 C CN100476441 C CN 100476441C CN B2005101082832 A CNB2005101082832 A CN B2005101082832A CN 200510108283 A CN200510108283 A CN 200510108283A CN 100476441 C CN100476441 C CN 100476441C
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- kayser
- cell body
- relevant
- test pallet
- fixed block
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- 238000012360 testing method Methods 0.000 title claims abstract description 146
- 239000004065 semiconductor Substances 0.000 title claims abstract description 115
- 210000005056 cell body Anatomy 0.000 claims description 99
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 51
- 230000009471 action Effects 0.000 claims description 24
- 230000008878 coupling Effects 0.000 claims description 22
- 238000010168 coupling process Methods 0.000 claims description 22
- 238000005859 coupling reaction Methods 0.000 claims description 22
- 229910001561 spheroidite Inorganic materials 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
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- 238000007906 compression Methods 0.000 description 9
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- 230000008569 process Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000012467 final product Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 210000004128 D cell Anatomy 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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Images
Classifications
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; CARE OF BIRDS, FISHES, INSECTS; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K63/00—Receptacles for live fish, e.g. aquaria; Terraria
- A01K63/04—Arrangements for treating water specially adapted to receptacles for live fish
- A01K63/047—Liquid pumps for aquaria
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; CARE OF BIRDS, FISHES, INSECTS; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K63/00—Receptacles for live fish, e.g. aquaria; Terraria
- A01K63/003—Aquaria; Terraria
- A01K63/006—Accessories for aquaria or terraria
Abstract
A test tray for a handler for testing semiconductor devices is disclosed which is capable of reducing the costs and time taken for replacement of carrier modules, and achieving an enhancement in workability. The test tray includes a frame, pockets mounted to the frame while being uniformly spaced apart from one another, each of the pockets including a seat on which a semiconductor device is to be seated, latches mounted to the frame to be arranged in pairs for respective pockets such that the latches of each latch pair face each other at opposite sides of an associated one of the pockets, respectively, each of the latches being movable between a first position where the latch holds a semiconductor device seated in the seat of the associated pocket and a second position where the latch releases the held state of the semiconductor device, and latch operating members each mounted to the frame, and adapted to move an associated one of the latches between the first position and the second position, each of the latch operating members being separate from the associated latch.
Description
The cross reference of related application
The application requires korean patent application 2005-15870 number submitted on February 25th, 2005 and the right of priority of the korean patent application submitted on June 2nd, 2005 2005-46988 number, and its full content is hereby expressly incorporated by reference.
Technical field
The present invention relates to a kind of processor that is used for semiconductor test, more specifically, relate to a kind of test pallet that is used for the processor of semiconductor test, it is suitable for the semiconductor supply device, and comprises a module of carrying that is used for fixing semiconductor devices.
Background technology
Usually, storer or non-memory semiconductor device or modular IC will pass through various tests after manufacturing is finished, before the shipment, each of these semiconductor devices or modular IC all includes storer or the non-memory semiconductor device that suitably is arranged on the substrate with the formation circuit.
In order to realize this test automatically, need to use processor to semiconductor devices or modular IC.In this processor, the artificially will receive the stackable pallet of semiconductor devices to be tested therein in stacker-loader (stacker).Then, loading semiconductor device in the heat-resisting test pallet that separates, this test pallet are sent to testing station or test board then with semiconductor test.At this test board, each lead-in wire or the spheroidite of the semiconductor devices in test pallet are electrically connected on the joint that is arranged at the test bench in the test board, and stand required electrical testing.To unload from this test pallet at the semiconductor devices in the test pallet that test is finished, and according to test result it be classified then.To be loaded into respectively in the relevant user tray through the semiconductor devices of classification then.Like this, finished the test of semiconductor devices.
The test pallet of above-mentioned processor comprises a plurality of years seat modules, is used for aiming at semiconductor devices to be tested with the corresponding to spacing of the spacing of test bench, and fixes the semiconductor devices of this aligning.
Fig. 1 and Fig. 2 show and are used for the view conventional process machine and that be provided with the test pallet that carries the seat module.
As shown in Figure 1, the seat module 20 of carrying that semiconductor devices is installed on it is arranged in the test pallet 10, separates equably each other simultaneously.Usually, in a test pallet 10, be provided with the individual year seat module 20 in 64 (16 * 4).Yet what can be provided with varying number in a test pallet carries a seat module, and for example, 32 or 128 carry a seat module.
Each elastic component (not shown) that carries the framework 11 of seat module 20 by being installed to test pallet 10 flexibly is fixed in the test pallet 10, thereby makes that carrying a seat module 20 can move in particular range.
Each carries seat module 20 and comprises: rectangular body 21; Pedestal 22 is formed on the body 21 so that semiconductor devices D is contained on the pedestal 22; And a pair of kayser 23, be installed to body 21 movably in the end, opposite flank of pedestal 22 respectively, fixedly to be contained in the semiconductor devices D on the pedestal 22.Action button 24 is arranged on the rear side of body 21.When action button 24 was pressed, kayser 23 moved away from each other, and had therefore discharged the semiconductor devices D that is fixed by kayser 23.When release was applied to pressing force on the action button 24, kayser 23 turned back to its original position by the elastic force of connected elastic component (not shown), thereby kayser 23 can stationary semiconductor devices D.
Yet, there are the following problems to have the traditional test pallet of above-mentioned year seat module, that is, when the thickness of the semiconductor devices of required test or size and not simultaneously, must not carry a seat module and change this year of seat module itself with suitable corresponding to the thickness of the semiconductor devices that carries the seat module or size.
For this reason, increased the cost and the time of carrying the required cost of seat module of changing.
Summary of the invention
Therefore, the present invention relates to a kind of test pallet that is used for the processor of semiconductor test, this test pallet can overcome fully owing to the restriction of correlation technique and the not enough one or more problems that cause.
One object of the present invention is to provide a kind of test pallet that is used for the processor of semiconductor test, and it has to reduce changes year cost of the required cost of seat module and the structure of time, and the workability that can obtain to improve.
Another object of the present invention is to provide a kind of test pallet that is used for the processor of semiconductor test, even when the spheroidite zone of each semiconductor devices extends to the peripheral edge portion of semiconductor devices, this test pallet also can stably support semiconductor devices, thereby makes that the outer peripheral areas of semiconductor devices is very little.
Other advantage, purpose and feature of the present invention partly provides in explanation subsequently, partly can obviously find out from following explanation for those of ordinary skills, maybe can draw from enforcement of the present invention.The structure that purpose of the present invention and other advantage can provide from following written explanation, claim and accompanying drawing is especially understood, is obtained.
For realizing these purposes or other advantage, and consistent with purpose of the present invention, as implementing and broadly described, the invention provides a kind of test pallet that is used for the processor of semiconductor test here, it comprises: framework; A plurality of cell bodies (pocket) are installed on this framework, separate equably each other simultaneously, and each cell body includes pedestal, accommodates semiconductor devices on this pedestal; A plurality of kaysers, be installed on the framework, and be provided with in pairs for each cell body, right kayser faces with each other at the opposite side of a relevant cell body respectively thereby make each kayser, each kayser can move between the primary importance and the second place, wherein, fixedly be contained in semiconductor devices in the pedestal of relevant cell body, and discharge the stationary state of semiconductor devices at second place kayser at the primary importance kayser; And a plurality of kayser operating parts, each kayser operating parts all is installed on the framework, and is suitable for moving between the primary importance and the second place a relevant kayser, and each kayser operating parts is separated with corresponding kayser.
According to a further aspect in the invention, the test pallet that is used for the processor of semiconductor test comprises: framework; A plurality of cell bodies are installed on this framework and separate equably each other simultaneously, and each cell body includes pedestal, is placed with semiconductor devices on this pedestal; A plurality of fixed blocks are fixedly secured on the framework, and are provided with in pairs for each cell body, thereby make the fixed block of each fixed block centering face with each other at the opposite side of a relevant cell body respectively; A plurality of kaysers, each kayser wherein all is installed on the relevant fixed block, thereby make kayser between the primary importance and the second place, to move, wherein, at the semiconductor devices of primary importance kayser fixed placement on a relevant cell body, and discharge the stationary state of this semiconductor devices at second place kayser; And a plurality of action buttons, each operation knob wherein is installed on the relevant fixed block movably, and the end in action button is connected on the relevant kayser, each is operated knob and move relevant kayser between the primary importance and the second place, moves by external force simultaneously.
According to the present invention, because year seat module component of test pallet, also promptly, be used for cell body at test pallet holding semiconductor device, the kayser operating parts that is used for fixing the kayser that is contained in the semiconductor devices in the cell body and is used to operate kayser is made of the resolution element that is arranged separately on the framework respectively.Therefore, even when the thickness of the semiconductor devices of required test or size with not simultaneously corresponding to the thickness of those semiconductor devices that carry a module or size, only need simply cell body to be replaced by suitable cell body and get final product, wherein in this cell body, accommodate semiconductor devices.Therefore, can reduce and change the cost and the time of carrying the required cost of seat module, and the workability that can obtain to improve.
Be appreciated that above-mentioned explanation of the present invention and the following detailed description all are illustrative and exemplary, its objective is the invention provides further instruction.
Description of drawings
Accompanying drawing can provide further understanding of the invention, and the ingredient of book as an illustration in being included in, and it shows embodiments of the invention, and and instructions be used for explaining principle of the present invention together.Wherein:
Fig. 1 shows the front view of example of the test pallet of traditional processor that is used for semiconductor test;
Fig. 2 shows the cut-open view that the tradition that is installed on the test pallet shown in Figure 1 is carried the part of a module;
Fig. 3 shows the front view according to the test pallet of the processor that is used for semiconductor test of the first embodiment of the present invention;
Fig. 4 shows the stereographic map that the part of the kayser that is included in the test pallet shown in Figure 3 and kayser operating parts is cut open;
Fig. 5 shows the stereographic map of the structure of the kayser operating parts that is included in the test pallet shown in Figure 3;
Fig. 6 shows the stereographic map of the structure that is included in the cell body in the test pallet shown in Figure 3;
Fig. 7 shows the sectional view of the state on the framework that cell body is installed to test pallet shown in Figure 3;
Fig. 8 A and 8B show the sectional view of the operation of the test pallet shown in Fig. 3;
Fig. 9 A and 9B show the structure of test pallet according to a second embodiment of the present invention and the sectional view of operation;
Figure 10 A and 10B show the structure of test pallet of a third embodiment in accordance with the invention and the sectional view of operation;
Figure 11 and Fig. 4 are similar, show the stereographic map that the part of structure of the test pallet of a fourth embodiment in accordance with the invention is cut open;
Figure 12 is the stereographic map that is included in the cell body in the test pallet shown in Figure 11;
Figure 13 shows the upward view of the test pallet shown in Figure 11.
Embodiment
Referring now to accompanying drawing to a preferred embodiment of the present invention will be described in detail.As much as possible, identical parts are represented with same or analogous reference number in whole accompanying drawing.
With reference to Fig. 3, it shows according to test pallet 100 of the present invention.As shown in Figure 3, test pallet 100 comprises the framework 110 that is made of metal, and is being arranged in a plurality of cell bodies that four lines evenly separates in each row simultaneously each other on the framework.Test pallet 100 also comprises: a pair of kayser 130, and the opposite side at each pedestal 120 is installed on the framework 110 respectively, faces with each other simultaneously, and is suitable for fixing or discharging the semiconductor devices D (Fig. 8) that is contained in the pedestal 120; And the kayser operating parts, be installed on the framework 110, and be suitable for operating a relevant kayser 130.
Composed component according to test pallet 100 of the present invention, also promptly, wherein being equipped with each cell body 120 of semiconductor devices D, the kayser 130 and being suitable for that is arranged in the opposite side of each cell body 120 operates the kayser operating parts of a relevant kayser 130 and is made of the element that separates respectively.Equally, kayser 130 and kayser operating parts are mounted to respectively on the framework 110 of test pallet 100.
Each kayser 130 hingedly is installed to the associated card latching operation spare that separates with relevant cell body 120, and may be operably coupled to the operation knob 150 of kayser operating parts, thereby make kayser 130 hinged, be contained in semiconductor component D in the kayser operating parts fixedly to be contained in semiconductor component D in the kayser operating parts or release according to the operation of operation knob 150.
As shown in Figure 4 and Figure 5, each kayser operating parts comprises the fixed block 140 of the framework 110 that is fixedly secured to test pallet.The operation knob 150 that is included in equally in the kayser operating parts is mounted to fixed block 140, thereby makes that operation knob 150 can vertical moving.The kayser operating parts comprises swivel pin 131 equally, is suitable for kayser 130 hingedly is connected to the bottom of operation knob 150.
Inclined guide groove 132 is formed on the kayser 130.Pilot pin 145 is mounted to fixed block 140.Pilot pin 145 is contained in the guide groove 132 to guide the hinge operation of kayser 130.
In shown embodiment, the fixed block 140 drawing strickle guide frame 110 that is threaded.Also promptly, connecting hole 142 is formed at the central authorities of fixed block 140.Equally, threaded connection hole 112 is formed in the framework 110 in the connecting hole 142 corresponding positions with fixed block 140.The screw (not shown) is secured to the connecting hole 142 of fixed block 140 and the threaded connection hole 112 of framework 110, so fixed block is secured to framework 110.
As shown in Figure 5, preferably, each the kayser operating parts that is installed to the center section (frame part that extends also promptly) of framework 110 between the adjacent lines of the row of cell body 120 is set so that the fixed block 140 of kayser operating parts has a pair of kayser 130 positioned opposite to each other.This structure according to the kayser operating parts, be installed to a fixed block 140 of framework 110 by use, can fix the semiconductor devices D that is arranged at respectively in two cell bodies of two adjacent cell bodies in capable, therefore, minimizing is installed to the quantity of the kayser operating parts of framework 110.In other words, can be easy to realize the kayser operating parts is installed to the process of framework 110.
In shown embodiment, each kayser operating parts that is installed to the marginal portion of framework 110 is set to, and makes the fixed block 140 of kayser operating parts only have a kayser 130 in a side of fixed block 140.
Simultaneously, as shown in Figure 6 and Figure 7, each cell body 120 has the hexahedron structure of rectangle, wherein is formed with the cavity of upward opening in central authorities.The pedestal 121 that to place the edge part of semiconductor devices D on it is formed at the bottom surface of cavity 122.The middle body that opening 121a passes pedestal 121 forms, to expose spheroidite or the lead-in wire of the semiconductor devices D that is positioned on the pedestal 121.
The diameter of each coupling shaft 124 is less than the interior diameter of each mounting hole 114 of framework 110, thereby makes coupling shaft 124 radially to move in the particular range in the mounting hole 114.
Fitted around at each coupling shaft 124 has the silicon elastic component 126 with conical shaped shape.Silicon elastic component 126 has the lower end that contacts with the external peripheral surface of coupling shaft 124, and is inserted into the upper end that contacts with the step shape part of mounting hole 114 under the state of mounting hole 114 at coupling shaft 124.Therefore, silicon elastic component 126 can make coupling shaft 124 flexibly be supported by framework 110.Silicon elastic component 126 also is used in and prevents that in a way coupling shaft 124 from separating from mounting hole 114.
The reason that moves with respect to framework 110 that to describe now that framework 110 that each cell body 120 is installed to test pallet 100 simultaneously can be more or less.Because to during being loaded into semiconductor devices in the test pallet 100 and carrying out high temperature test, test pallet 100 is heated in preheating chamber, therefore, test pallet 100 may thermal deformation, thereby causes the change in location of the cell body 120 that is installed to test pallet 100.For this reason, if cell body 120 is fixed to test pallet 100 under the situation that can not move more or less, then may exists semiconductor devices D in the cell body 120 not connect or can not be connected to possibility in the test bench (not shown) of test board exactly.
Yet, can be more or less when cell body 120 is installed on the framework 110 with respect to test pallet 100 resilient movement the time, as mentioned above, even under the state that cell body 120 and corresponding test bench depart from, this cell body 120 also can be aimed at corresponding test bench automatically, this is because cell body 120 can move in specific scope with respect to each test bench, thereby aligns with each test bench.Therefore, the semiconductor devices D in cell body 120 can be connected to each test bench exactly.
Hereinafter, will describe according to the operation with test pallet of said structure of the present invention.For simplicity, following description is only in conjunction with a kayser relevant with cell body, and a kayser operating parts relevant with this kayser carries out.
Shown in Fig. 8 A, there be not external pressure to be applied under the state of operation knob 150 of kayser operating parts, operation knob 150 is because the elastic force of compression elastic piece (spring) 152 and being boosted, and therefore operating knob 150 remains on its upper position.Similarly, kayser 130 is pushed into hinged with swivel pin 131, thereby makes the outer end of kayser 130 move to the inside of cell body 120, thereby pushes the semiconductor devices D in the pedestal 121 of the cavity 122 that is positioned over cell body 120.As a result, semiconductor devices D is fixed in the pedestal 120.
When the outside from test pallet 100 applies external pressure when being in the operation knob 150 of state shown in Fig. 8 A, shown in Fig. 8 B, operation knob 150 moves down.As a result, kayser 130 is hinged with swivel pin 131, thereby makes the outer end of kayser 130 move to the outside of cell body 120.
At this moment, because pilot pin 145 is housed inside in the guide groove 132 of kayser 130, kayser 130 moves simultaneously hinged reposefully away from cell body 120.
Complete when hinged when kayser 130, the stationary state of semiconductor devices D is released.Therefore, can freely semiconductor devices D be removed from the cavity 122 of cell body 120.In this state, semiconductor devices D can be received in the cavity 122 of cell body 120 once more.
When discharging the external pressure that is applied to operation knob 150 subsequently, operation knob 150 is owing to the elastic force of compression elastic piece 152 moves up.Simultaneously, shown in Fig. 8 A, kayser 130 is hinged on the direction opposite with said process, thereby kayser 130 is retained as the state that the peninsula body device D that is contained in cell body 120 is pushed in the outer end of kayser 130.
Simultaneously, when test pallet 100 is sent to the test board (not shown) of processor so that semiconductor devices when being connected to the test bench (not shown), correspondingly, the register pin (not shown) that is formed at a side of each test bench is inserted in the pilot hole 123 that is arranged at a corresponding cell body 120.Therefore, the operation of register pin and pilot hole 123 can make the lead-in wire of relevant semiconductor devices D or spheroidite be connected to test bench exactly.
Fig. 9 A and Fig. 9 B show test pallet according to a second embodiment of the present invention.In the configuration aspects of the kayser operating parts that is suitable for hingedly operating each kayser 230, the test pallet of this embodiment is different from the test pallet of first embodiment.
That is to say that comprise according to each kayser operating parts of present embodiment: fixed block 240 is fixedly secured on the framework 110 of test pallet; Operation knob 250 is installed on the fixed block 240, thereby but feasible operation knob 250 vertical moving; And vertically extending connecting rod 252, hingedly be connected to operation knob 250 by link pin 253 in the top.The pilot pin 255 that is fixed to the lower end of connecting rod 252 is housed inside in the guide groove 232 of the inner end that is formed on kayser 230.
The operation knob 250 with respect to fixed block 240 by compression elastic piece 254 elastic bearings.
Operation according to the test pallet of this embodiment will be described now.For simplicity, following description is only in conjunction with a kayser relevant with cell body, and a kayser operating parts relevant with this kayser carries out.
Shown in Fig. 9 A, as the first above-mentioned embodiment, there be not external pressure to be applied under the state of operation knob 250 of kayser operating parts, operation knob 250 is because the elastic force of compression elastic piece 254 and being boosted, therefore, operation knob 250 remains on its upper position.Similarly, kayser 230 is pushed into hinged with swivel pin 231, thereby makes the outer end of kayser 230 move to the inside of cell body 120, thereby pushes the semiconductor devices D in the cavity that is positioned over cell body 120.As a result, semiconductor devices is fixed in the cell body 120.
When the outside from test pallet 100 applies external pressure when being in the operation knob 250 of state shown in Fig. 9 A, shown in Fig. 9 B, operation knob 250 and connecting rod 252 move down together.As a result, kayser 230 is hinged with swivel pin 231, thereby makes the outer end of kayser 230 move to the outside of cell body 120.
At this moment, because the pilot pin 255 of connecting rod 252 is housed inside in the guide groove 232 of kayser 230, therefore the upper end of connecting rod 252 is hinged with the link pin 253 that is connected to operation knob 250, and the pilot pin 255 that is fixed to the lower end of connecting rod 252 slides along the guide groove 232 of kayser 230.As a result, kayser 230 is hinged.
Finish when hinged when kayser 230, the stationary state of semiconductor devices D is released.Therefore, can freely semiconductor devices D be removed from cell body 120.In this state, semiconductor devices D can be contained in the cell body 120 once more.
When discharging the external pressure that is applied to operation knob 250 subsequently, operation knob 250 and connecting rod 252 are owing to the elastic force of compression elastic piece 254 moves up.Simultaneously, shown in Fig. 9 A, kayser 230 with the side of above-mentioned process go up in the opposite direction hinged, thereby kayser 230 is retained as the state that the peninsula body device D that is contained in cell body 120 is pushed in the outer end of kayser 230.
Figure 10 A and 10B show the test pallet of a third embodiment in accordance with the invention.Test pallet according to this embodiment is set to, and makes kayser carry out slide under the situation of not carrying out hinge operation, semiconductor devices being fixed in each cell body 120, or discharges semiconductor devices from each cell body 120.
At length, test pallet 100 comprises the fixed block 340 of the framework 110 that is installed to test pallet 100.A pair of kayser 330 is installed to each fixed block 340, thereby makes each kayser 330 to slide with respect to a relevant cell body 120.Operation knob 350 is installed to the top of each fixed block 340, thereby but feasible operation knob 350 vertical moving, with the relevant kayser 330 that slides.Compression elastic piece 346 is installed on each fixed block 340 flexibly to support a relevant kayser 330 with respect to fixed block 340.
Each kayser 330 is provided with guide groove 332.Each fixed block 340 is provided with pilot pin 345, and each pilot pin 345 is housed inside in the guide groove 332 of relevant kayser 330.
Each kayser 330 is provided with the inclined contact surface 334 with the following end in contact of relevant operation knob 350 in the top.Corresponding to the inclined contact surface 334 of each kayser 330, relevant operation knob 350 is provided with inclined contact surface 351 in its lower end, thereby makes inclined contact surface 351 contact inclined contact surfaces 334.Although inclined contact surface 334 and 351 is a straight line in shown embodiment, it can have curve shape.
Operation according to the test pallet of this embodiment will be described now.For simplicity, following description is only in conjunction with a kayser relevant with cell body, and a kayser operating parts relevant with this kayser carries out.
Shown in Figure 10 B, when applying external pressure to operation during knob 350, operation knob 350 moves down, thereby makes kayser 330 overcome the elastic force of compression elastic piece 346 and withdraw.As a result, the outer end of kayser 330 is from cell body 120 withdrawals.Therefore, can freely semiconductor devices D be removed from cell body 120.In this case, semiconductor devices D can be housed inside in the pedestal 120 once more.
When discharging the external pressure that is applied to operation knob 350 subsequently, kayser 330 slides on the direction opposite with above-mentioned process owing to the elastic force of compression elastic piece 346.As a result, shown in Figure 10 A, the outer end of kayser 330 extends to cell body 120, thereby semiconductor devices D is fixed in the cell body 120.
Simultaneously, because pilot pin 345 is housed inside in the guide groove 332 of kayser 330, so kayser 330 can slide reposefully according to the pilot operationp of pilot pin 345.Except guiding function, pilot pin 345 can also play the mobile effect that is limited to the detent of desired location with kayser 330.
In the above embodiment of the present invention, year seat module original paper of test pallet 100, also promptly, be used for test pallet 100 place semiconductor devices D cell body 120, be used for fixing the semiconductor devices D that is positioned in the cell body 120 kayser 130,230 or 330 and the kayser operating parts that is used to operate kayser 130,230 or 330 constitute by being installed to the individual component on the framework 110 separately respectively.Therefore, with use its each all to have a traditional test pallet 10 of integrally-built year seat module 20 opposite, even when the thickness of the semiconductor devices of required test or size are different from corresponding to the thickness of the semiconductor devices that carries the seat module or size, also there is no need to change and carry a module itself with the suitable seat module of carrying.According to the present invention, only need to replace this cell body 120 with suitable cell body simply.
According to the present invention, kayser and kayser operating parts also can have other various structures that are different from said structure.
Figure 11 to 13 shows the test pallet of a fourth embodiment in accordance with the invention.Except cell body 420, according to the test pallet of this embodiment with consistent according to the test pallet of first embodiment.Therefore, all the other element except that cell body 420 of test pallet are represented with identical reference number respectively, and are no longer provided detailed description.
Comprise the cavity 422 of the upward opening of the middle body that is formed at pedestal 420 according to the cell body 420 of present embodiment, and the pedestal 421 that is formed at the bottom surface of cavity 422, thereby the marginal portion of semiconductor devices D can be contained in the pedestal 421.Opening 423 passes the middle body of pedestal 421 and forms, to expose spheroidite or the lead-in wire of the semiconductor devices D that is positioned in the pedestal 421.
The inner circumferential surface that is used to limit opening 423 along pedestal 421 forms continuous spherical gathering sill 424, partly to receive the outmost terminal in the outside terminal, also, is positioned over the spheroidite B of the semiconductor devices D in the pedestal 421.Spherical gathering sill 424 has partly the arc corresponding to the shape of spheroidite B.
According to present embodiment, the thickness of pedestal 421 is greater than the height of the spheroidite B of semiconductor devices D.Certainly, the thickness of pedestal 421 can be less than the height of the spheroidite B of semiconductor devices D, thereby makes spheroidite B pass through according to the shape of the splicing ear of the test bench that is arranged at processor (this test pallet is applied to this processor) and size that Open Side Down gives prominence to.
When the thickness of pedestal 421 during greater than the height of the spheroidite B of semiconductor devices D, as in the cell body 420 according to shown embodiment, preferably, each spherical gathering sill 424 is provided with inside acclivitous guide surface portion 425 in its underpart.
When semiconductor devices D was positioned in the pedestal 421 of each cell body 420 after being supplied with by external device (ED) feeder (not shown), the outmost spheroidite B of each semiconductor devices D was received at each spherical gathering sill 424 of the relevant pedestal 421 that is used for limiting associated openings 423.Therefore, each the semiconductor devices D that is positioned in the relevant cell body 420 is not only supported by relevant pedestal 421, but also by the area supporting that between adjacent spherical gathering sill 424, limits.Therefore, each semiconductor devices D can support with being stabilized.Especially, even extend to the form peripheral edge portions of semiconductor devices D so that the outer peripheral areas of semiconductor devices D very hour, also can stably support semiconductor devices D when the spheroidite zone of each semiconductor devices D.
Although in shown embodiment, the pedestal 421 of each cell body 420 forms one with cell body 420, makes yet pedestal 421 also can separate with the main body of cell body 420.In this case, pedestal 421 can be by such as the securing member of screw and be connected to test pallet separably.
From top description as can be seen, according to the present invention, even when the thickness of the semiconductor devices of required test or size are different from corresponding to the thickness of the semiconductor devices that carries the seat module or size, only need to change simply cell body (wherein will place semiconductor devices) and get final product.Thereby, can reduce and change the cost and the time of carrying the required cost of seat module, and the workability that can obtain to improve.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.Within the spirit and principles in the present invention all, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (26)
1. test pallet that is used for the processor of semiconductor test comprises:
Framework;
A plurality of cell bodies are installed on the described framework, separate each other simultaneously, and each described cell body includes pedestal, and described pedestal is used for the holding semiconductor device;
A plurality of kaysers, be installed on the described framework, and be provided with in pairs for each cell body, thereby make the kayser of each kayser centering face with each other at the opposite side of a relevant cell body respectively, each described kayser can move between the primary importance and the second place, wherein, fixedly be contained in semiconductor devices in the pedestal of relevant cell body, and discharge the stationary state of described semiconductor devices at the described kayser of the described second place at the described kayser of described primary importance; And
A plurality of kayser operating parts, wherein each all is installed on the described framework, and is suitable between the described primary importance and the described second place moving a relevant kayser, and each in the described kayser operating parts all is separated with relevant kayser.
2. test pallet according to claim 1, wherein, each described kayser is connected to relevant kayser operating parts, thereby make described kayser be hinged between the described primary importance and the described second place, be fixed on described semiconductor devices in the relevant cell body or the described semiconductor devices of release from described relevant cell body with operation according to described kayser operating parts.
3. test pallet according to claim 1, wherein, each described kayser is connected to relevant kayser operating parts, thereby make described kayser between the described primary importance and the described second place, slide, be fixed on described semiconductor devices in the relevant cell body or the described semiconductor devices of release from described relevant cell body with operation according to described kayser operating parts.
4. test pallet according to claim 2, wherein, described each kayser operating parts includes:
Fixed block, it is fixedly secured on the described framework;
Action button, it is installed on the described fixed block, thereby but make described action button straight line move; And
Swivel pin, it hingedly will the kayser relevant with described kayser operating parts be connected to an end of described action button.
5. test pallet according to claim 4, wherein, described kayser operating parts further comprises:
Elastic component, it is with respect to the described action button of described fixed block elastic bearing.
6. test pallet according to claim 4, wherein:
Described kayser has guide groove; And
Described fixed block has pilot pin, and described pilot pin is contained in the described guide groove of described kayser, to guide the hinge operation of described kayser.
7. test pallet according to claim 4, wherein, each kayser is arranged in the opposite side place of shared fixed block and toward each other, and each action button of kayser operating parts is arranged in the opposite side place of described shared fixed block and toward each other.
8. test pallet according to claim 2, wherein:
Each described kayser all has guide groove; And
Each described kayser operating parts includes:
Fixed block is fixedly secured on the described framework;
Action button, it is installed on the described fixed block, thereby but make described action button straight line move;
Connecting rod, an end of described connecting rod hingedly is connected on the described action button;
Swivel pin hingedly is connected to described fixed block with the kayser relevant with described kayser operating parts;
Pilot pin is fixed to the other end of described connecting rod, and described pilot pin is housed inside in the described guide groove of relevant kayser; And
Elastic component is with respect to the described action button of described fixed block elastic bearing.
9. test pallet according to claim 8, wherein, each kayser is arranged in the opposite side place of shared fixed block and toward each other, and each action button of kayser operating parts is arranged in the opposite side place of described shared fixed block and toward each other.
10. test pallet according to claim 3, wherein:
Each described kayser all has the surface of contact and the guide groove of inclination; And
Each described kayser operating parts includes:
Fixed block, it is fixedly secured on the described framework, and the kayser relevant with described kayser operating parts is installed on the described fixed block slidably;
Action button is installed on the described fixed block, thereby but make described action button straight line move, described action button has the surface of contact of inclination, and this surface of contact contacts with the surface of contact of the inclination of relevant kayser; And
Pilot pin is fixed on the described fixed block, and described pilot pin is housed inside in the described guide groove of described relevant kayser.
11. test pallet according to claim 10, wherein, each kayser is arranged in the opposite side place of shared fixed block and toward each other, and each action button of kayser operating parts is arranged in the opposite side place of described shared fixed block and toward each other.
12. test pallet according to claim 1 further comprises:
A plurality of installation units are used for described cell body is installed to described framework, thereby make described cell body to move in predetermined scope respectively.
13. test pallet according to claim 12, wherein, each described installation unit includes:
Mounting hole is formed on the described framework;
Coupling shaft, be formed on the cell body relevant with described installation unit, thereby make described coupling shaft to extend by described mounting hole, the diameter of described coupling shaft is less than the diameter of described mounting hole, and the end of described coupling shaft is outstanding and is connected with described framework from described mounting hole, allows the described coupling shaft can be laterally mobile with respect to described framework simultaneously; And
Resilient ring is made by the synthetic resin material, and be assemblied in described coupling shaft around with the described coupling shaft of elastic bearing in described mounting hole.
14. test pallet according to claim 13, wherein, described resilient ring has cone shape, thereby makes the external peripheral surface of the described coupling shaft of an end in contact of described resilient ring, and the other end of described resilient ring contacts the inner circumferential surface of described mounting hole.
15. test pallet according to claim 13, wherein, described installation unit further comprises:
Anti-separative element is used for preventing that described coupling shaft from separating from described mounting hole.
16. test pallet according to claim 15, wherein, described anti-separative element comprises:
Annular groove forms at the jag of the described coupling shaft external peripheral surface along described coupling shaft; And
E shape ring, around described annular groove, the overall diameter of described E shape ring is greater than the interior diameter of described mounting hole in the external mounting of the mounting hole of described framework.
17. test pallet according to claim 1, wherein, each described cell body comprises that further at least one passes the described pedestal of described cell body and the opening that forms, and described opening is suitable for passing described pedestal and exposes the described semiconductor devices that is contained in the described pedestal downwards.
18. test pallet according to claim 17, wherein, described cell body further comprises the continuous spherical gathering sill that forms along the inner circumferential surface of the described pedestal that limits described opening, partly receiving the outmost spheroidite be contained in the described semiconductor devices in the described pedestal, described spherical gathering sill has partly the arc corresponding to the shape of described spheroidite.
19. test pallet according to claim 17, wherein, described pedestal and described cell body integrally form.
20. test pallet according to claim 18, wherein, described pedestal and described cell body integrally form.
21. test pallet according to claim 17, wherein, described pedestal removably is connected with described cell body.
22. test pallet according to claim 18, wherein, described pedestal removably is connected with described cell body.
23. test pallet according to claim 18, wherein, each described spherical gathering sill all is provided with inside acclivitous spigot surface in its underpart.
24. test pallet according to claim 18, wherein, the degree of depth of the opening of described pedestal is greater than the height of the spheroidite of described semiconductor devices.
25. a test pallet that is used for the processor of semiconductor test comprises:
Framework;
A plurality of cell bodies are installed on the described framework, separate equably each other simultaneously, and each described cell body includes pedestal, and described pedestal is used for the holding semiconductor device;
A plurality of fixed blocks are fixedly secured on the described framework, being provided with in pairs for each cell body, thereby make the described fixed block of each fixed block centering face with each other at the opposite side of a relevant cell body respectively;
A plurality of kaysers, its each all be installed on the relevant fixed block, thereby make described kayser between the primary importance and the second place, to move, wherein, fixedly be contained in semiconductor devices in the pedestal of a relevant cell body at the described kayser of described primary importance, and discharge the stationary state of described semiconductor devices at the described kayser of the described second place; And
A plurality of action buttons, wherein each all is installed on the relevant fixed block movably, and be connected on the relevant described kayser in an end of described action button, each described action button all moves relevant kayser between the described primary importance and the described second place, move by external force simultaneously.
26. test pallet according to claim 25 further comprises:
A plurality of elastic components, each described elastic component all are suitable for flexibly supporting relevant a kayser and a relevant action button with respect to a relevant fixed block.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050015870 | 2005-02-25 | ||
| KR1020050015870A KR100610779B1 (en) | 2005-02-25 | 2005-02-25 | Test tray for handler for testing semiconductors |
| KR1020050046988 | 2005-06-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1825124A CN1825124A (en) | 2006-08-30 |
| CN100476441C true CN100476441C (en) | 2009-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101082832A Expired - Fee Related CN100476441C (en) | 2005-02-25 | 2005-10-10 | Test tray for handler for testing semiconductor devices |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100610779B1 (en) |
| CN (1) | CN100476441C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100860597B1 (en) * | 2007-04-18 | 2008-09-26 | 미래산업 주식회사 | A receiver of an electronic element and a handler including the same |
| KR100944890B1 (en) | 2008-01-14 | 2010-03-03 | 에버테크노 주식회사 | Test Tray of A Solid State Disk Test Handler |
| KR101050074B1 (en) * | 2008-05-27 | 2011-07-19 | 에버테크노 주식회사 | carrier |
| KR101323423B1 (en) * | 2011-09-30 | 2013-10-29 | 주식회사 오킨스전자 | semi-conductor chip package carrier |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6476629B1 (en) * | 2000-02-23 | 2002-11-05 | Micron Technology, Inc. | In-tray burn-in board for testing integrated circuit devices in situ on processing trays |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3294978B2 (en) * | 1994-10-11 | 2002-06-24 | 株式会社アドバンテスト | IC carrier |
| KR100495819B1 (en) * | 2003-06-14 | 2005-06-16 | 미래산업 주식회사 | Apparatus for Seating Devices in Semiconductor Test Handler |
-
2005
- 2005-02-25 KR KR1020050015870A patent/KR100610779B1/en active IP Right Grant
- 2005-10-10 CN CNB2005101082832A patent/CN100476441C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6476629B1 (en) * | 2000-02-23 | 2002-11-05 | Micron Technology, Inc. | In-tray burn-in board for testing integrated circuit devices in situ on processing trays |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100610779B1 (en) | 2006-08-09 |
| CN1825124A (en) | 2006-08-30 |
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