CN110064605A - For testing the sorting machine of semiconductor element - Google Patents

For testing the sorting machine of semiconductor element Download PDF

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Publication number
CN110064605A
CN110064605A CN201910142020.5A CN201910142020A CN110064605A CN 110064605 A CN110064605 A CN 110064605A CN 201910142020 A CN201910142020 A CN 201910142020A CN 110064605 A CN110064605 A CN 110064605A
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CN
China
Prior art keywords
semiconductor element
correction
hole
insert
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910142020.5A
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Chinese (zh)
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CN110064605B (en
Inventor
李镇福
成耆烛
李建雨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Techwing Co Ltd
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Techwing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Techwing Co Ltd filed Critical Techwing Co Ltd
Publication of CN110064605A publication Critical patent/CN110064605A/en
Application granted granted Critical
Publication of CN110064605B publication Critical patent/CN110064605B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2644—Adaptations of individual semiconductor devices to facilitate the testing thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C2301/00—Sorting according to destination
    • B07C2301/0008—Electronic Devices, e.g. keyboard, displays

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to the sorting machines for being used to test semiconductor element that one kind can support the test of semiconductor element.It is according to the present invention for test the sorting machine of semiconductor element to include: contact guidance device, in conjunction with the socket of tester, and guide and semiconductor element enable accurately to be electrically connected with the test jack that the socket is arranged in；And element power supply unit, for semiconductor element to be supplied to the contact guidance device, wherein the contact guidance device includes: board, in conjunction with the socket；Insert is movably arranged at the board in a manner of corresponding one to one with the test jack, and has the placing groove for placing the semiconductor element supplied by the element power supply unit；And elastomeric element, the insert is flexibly supported upwards, to enable the insert to decline relative to the test jack when the element power supply unit pressurizes downwards to the semiconductor element for being placed on the insert.

Description

For testing the sorting machine of semiconductor element
It is on December 29th, 2016 that the application, which is the applying date, entitled " for testing half application No. is 201611241234.0 The divisional application of the patent application of the sorting machine of conductor element ".
Technical field
The present invention relates to a kind of sorting machines for being used to test semiconductor element used when testing semiconductor element (handler)。
Background technique
Sorting machine (hereinafter referred to as ' sorting machine ') for testing semiconductor element is a kind of will to pass through scheduled manufacture work Skill and the semiconductor element manufactured is electrically connected to after tester, according to test result by semiconductor element classify device.
The published technology about sorting machine has: KR published patent the 10-2002-0053406th is (hereinafter referred to as ' prior art 1 ') or a variety of patents texts such as Japanese Laid-Open Patent special open 2011-247908 (hereinafter referred to as ' prior art 2 ') It offers.
According to disclosed patent document, grasps head and (be named as in the prior art 1 on ' inductance head ', quilt in the prior art 2 It is named as ' compressorium ') decline in the state of grasping semiconductor element and is electrically connected to semiconductor element positioned at socket The test jack (being named as ' checking with socket ' in the prior art 2) of (being named as ' tester ' in the prior art 2).For This, grasping head is constituted in a manner of it can move horizontally and vertically move.Wherein, moving horizontally for carrying half for head is grasped The top place of the reciprocating part (shuttle) (being named as " sliding stand " in the prior art 2) of conductor element and socket it is upper It is carried out between square place.Also, when grasping from reciprocating part or releasing grasping semiconductor element, and make semiconductor element When electrical connection is electrically connected or released with test jack, vertically moving for grasping head is carried out.Obviously, between reciprocating part and grasping head Position or other relevant structures can have variform.
The operation for making semiconductor element be electrically connected to test jack by the decline of grasping head needs to be grasped in realization It is carried out in the state of accurate position setting between the semiconductor element and test jack of head grasping.
But because the reason of to the control tolerance moved horizontally or other a variety of design aspects, it is difficult to which realization is grasped Accurate position between the semiconductor element and test jack of head grasping is set.To solve the above-mentioned problems, such as the prior art 2 Described in, pin (being named as ' guidance pin ' in the prior art 2) usually is set in socket setting position, and in grasping head setting Position setting hole (is named as ' guide hole ') in the prior art 2.Therefore, when grasping head decline, the position setting of socket Pin is initially inserted into the position setting hole of grasping head, therefore can formerly realize the accurate position between grasping head and test jack It installs in the state of determining, semiconductor element is made to be electrically connected to test jack.
In addition, the number of terminals of semiconductor element gradually becomes more due to the development etc. of integrated technology.Semiconductor element manufacturer In order to accommodate a large amount of terminal in limited area, and attempt between reducing between the size and terminal of terminal Away from.Therefore, the production that exploitation at present has the spacing between a kind of terminal to be reduced to 0.35mm~0.30mm from 0.50mm~0.40mm Product, and it is expected that further decrease in the future.Obviously, the size of terminal naturally should with the reduction of the spacing between terminal and Become smaller.For example, in the case that the spacing between terminal (ball) is 0.50mm, the diameter of terminal is in BGA type 0.33mm, but the spacing between terminal be 0.35mm in the case where, the diameter of terminal is reduced to 0.23mm.In particular, recently Trend be to be reduced with the spacing between terminal to 0.30mm, terminal diameter is also just being reduced to 0.20mm or less.In this situation Under, it, can if semiconductor element is detached from the position of itself with small degree or grasped with the posture of skew by grasping head Being electrically connected between generation semiconductor element and test jack is bad.Also, exists and terminal impaired or short-circuit (Short) occurs Hidden danger.
Therefore, it is necessary to more accurately realize being electrically connected between semiconductor element and test jack.
But, it is contemplated that the trend of the spacing reduction between the diameter or terminal of above-mentioned terminal is set merely with position Pin and position setting hole and realize the accurate position between semiconductor element and test jack setting method can be because of following original Thus it may become extremely difficult in the near future.
The first, when setting pin is repeatedly inserted to position setting hole and is detached from when position, it may cause forming position setting The wall surface in hole is worn.In these cases, position setting pin and position setting hole will lose the function of itself.In order to overcome The above problem needs with cumbersome operations such as part replacements, therefore can accordingly result in the waste and operation ratio of human resources Decline.
The second, the grasping of the semiconductor element carried out by grasping head may become bad.It is being grabbed that is, grasping head needs to have Hold the structure for declining in the state of semiconductor element and semiconductor element being made to be electrically connected to test jack, therefore, semiconductor element Grasping state it is extremely important.But the mounting tolerance of the mobile control tolerance or semiconductor element of reciprocating part or grasping head It will affect the accurate grasping of the semiconductor element grasped by grasping head.Therefore, as being greatly exaggerated to show in (a) and (b) of Fig. 1, Semiconductor element D may be grasped in the state of not being picked device P and accurately grasping or minutely rotate.But it is used for The trial for being reduced as far as design tolerance will necessarily be by the limitation of mechanical aspects.
Therefore, applicant of the present invention propose KR published patent 10-2014-0121909 it is (hereinafter referred to as ' existing Technology ') etc. with liftable pocket plate technology.
According to the prior art, semiconductor element is mounted to pocket plate and realizes aligning, therefore even if grasping head exists Semiconductor element is poorly grasped on predetermined extent, semiconductor element can also be suitably electrically connected to test jack.
But the spacing between terminal can gradually microminiaturization, and the tolerance of many mechanical aspects can still remain.And And, it is also necessary to the individual semiconductor element in view of being placed in pocket plate may have different from each other due to thermally expanding or shrinking Position deviation.Because of above-mentioned reason sooner or later, it is contemplated that need to carry out each semiconductor element more accurate and independent position Control.
Summary of the invention
The purpose of the present invention is as follows.
First, at least two step can independently be passed through with element power supply unit and accurately correct semiconductor by providing one kind The technology of the position of element.
Second, providing one kind can make the multiple semiconductor elements supplied by element power supply unit independently obtain position control Technology.
For achieving the above object according to the present invention for test the sorting machine of semiconductor element to include: contact guidance Device in conjunction with the socket of tester, and guides and enables semiconductor element and the test that the socket is arranged in Socket is accurately electrically connected；And element power supply unit, for semiconductor element to be supplied to the contact guidance device, wherein institute Stating contact guidance device includes: board, in conjunction with the socket；Insert, with corresponding one to one with the test jack Mode be arranged, and the board can be set with moving about in the horizontal direction, and have and supplied for placing by the element The placing groove for the semiconductor element for answering device to supply；And elastomeric element, the insert is flexibly supported upwards, thus in institute When stating element power supply unit and pressurizeing downwards to the semiconductor element for being placed on the insert, keep the insert opposite Decline in the test jack.
The insert, which has, corrects hole with the first correction hole of the position of the test jack and second for correcting, and matches Standby the first correction pin in the test jack is inserted into the first correction hole and carries out to the position of the insert primary Correction, when the semiconductor element for being placed in the insert is pressurizeed downwards by the element power supply unit, is provided to the survey Second correction pin of examination socket is inserted into second correction hole, so that the position to the insert carries out secondary correction.
The semiconductor element of the insert is provided to by means of the placing groove by means of the element power supply unit And an aligning is obtained, and obtain secondary aligning by means of the second correction hole and the second correction pin.
The diameter in second correction hole is less than the diameter in first correction hole.
When the first correction pin is inserted into the first correction hole, the center of the second correction pin is remedied to energy Enough it is inserted into the position in the second correction hole.
The height of the second correction pin is lower than the height that first correction is sold, in the state that the insert rises Under, the described first at least upper end for correcting pin is inserted into first correction hole, but the second correction pin is in from institute State the state of the second correction hole disengaging.
The board includes: Integration Framework, is integrated to the socket；And handling frame, separably it is incorporated into The Integration Framework, and the insert can be provided with moving about.
The present invention has the following effects that.
First, it can independently pass through at least two step with element power supply unit and accurately correct the position of semiconductor element It sets, therefore the reliability being electrically connected between semiconductor element and test jack can be improved.
Second, the multiple semiconductor elements supplied by element power supply unit independently obtain position control, therefore even if multiple Semiconductor element has position deviation different from each other because of mechanical tolerance, thermal expansion or contraction etc., can also make semiconductor element Being electrically connected between part and test jack is accurately realized.
Detailed description of the invention
Fig. 1 is the reference figure for illustrating problem of the prior art.
Fig. 2 is the schematic plan structure chart of sorting machine according to the present invention.
Fig. 3 is the exploded perspective view that local cutting is carried out for the main portions of the sorting machine of Fig. 2.
Fig. 4 is the exploded perspective view of the contact guidance device of the sorting machine applied to Fig. 2.
Fig. 5 is the perspective cut-away view of the insert of the contact guidance device applied to Fig. 4.
Fig. 6 is the bottom isometric view of the insert of the contact guidance device applied to Fig. 4.
Fig. 7 is the schematic side elevation of the element power supply unit of the sorting machine applied to Fig. 2
Fig. 8 is equipped with the socket in tester and wins plan view.
Fig. 9 is the board of the sorting machine applied to Fig. 2 and the sectional view of state that socket is fixed to one another.
Figure 10 be in the state of explanatory diagram 9 first correction pin and first correction hole and second correction pin and second rectify The reference figure of positional relationship between positive hole.
Figure 11 is show state that the board of the sorting machine that can be applied to Fig. 2 and socket are fixed to one another another Exemplary sectional view.
Symbol description
200: for testing the sorting machine of semiconductor element
240: contact guidance device 241: board
241a: Integration Framework 241b: handling frame
242: insert RS: placing groove
PH1: the first correction hole PH2: the second correction hole
243: elastomeric element 250: element power supply unit
SP: socket TS: test jack
PP1: the first correction pin PP2: the second correction pin
Specific embodiment
Hereinafter, be illustrated to preferred embodiment in accordance with the present invention, in order to illustrate it is succinct and as much as possible will be known Or repeat description is omitted or compression.
<to the explanation of device>
Fig. 2 is according to the present invention for testing the sorting machine (200, hereinafter referred to as ' sorting machine ') of semiconductor element Schematic plan structure chart.Fig. 3 is the exploded perspective view that local cutting is carried out for the main portions IP of the sorting machine of Fig. 2.
Referring to Fig. 2 and Fig. 3, sorting machine 200 according to the present invention include: reciprocating part (shuttle) 210, loading part 220, Uninstalling portion 230, contact guidance device 240 and element power supply unit 250.
Reciprocating part 210, which has, to be connected " loaded " position LP in left-right direction, is grasping the straight of position DP and unloading position UP The pocket platform 211 to move back and forth on line.
Pocket platform 211 has the 16 loading pocket 211a and 16 unloading pocket 211b that can load semiconductor element. Wherein, pocket 211a is loaded to carry out by means of the reciprocating movement of pocket platform 211 and between " loaded " position LP and grasping position DP It moves back and forth, unloads pocket 211b by means of the reciprocating movement of pocket platform 211 and in grasping position DP and unloading position UP Between move back and forth.Loading part 220, which loads (loading) to the loading pocket 211a of reciprocating part 210, needs to be tested half Conductor element.
Uninstalling portion 230 is used for the semiconductor being completed from the unloading pocket 211b of reciprocating part 210 unloading (unloading) Element.
As reference, for the semiconductor element realized by 220/ uninstalling portion 230 of loading part loading/Unloading Technology It is disclosed with variform and known, therefore omits the detailed description to this.
Contact guidance device 240 is in conjunction with the socket SP of tester and guides and is inserting semiconductor element and setting The test jack TS of seat board SP is electrically connected.For this purpose, as shown in figure 4, contact guidance device 240 includes 241,16 inserts of board 242 and multiple elastomeric elements 243.
Board 241 including Integration Framework 241a and loads and unloads frame 241b in conjunction with socket SP.
Integration Framework 241a is formed as quadrangular frame shape, and is close to combine in a fixed manner with socket SP.
Handling frame 241b is separably incorporated into Integration Framework 241a, and makes 16 inserts 242 of top with 2*8 row The form of column can along the vertical direction or horizontal direction is arranged with slightly moving about.Therefore, needing to replace insert 242 When, as long as handling frame 241b is only replaced operation after Integration Framework 241a separation by operator.Obviously, in conjunction with The Integration Framework 241a and handling frame 241b of plate 241 can be integrally equipped with according to embodiment and without ground is distinguished.
16 inserts 242 structure all having the same.Insert 242 along horizontal direction and vertical direction can swim Dynamic mode is set to handling frame 241b, with corresponding one to one respectively with test jack TS.The insert 242 accommodates quilt The semiconductor element that element power supply unit 250 is supplied.Fig. 5 is the perspective cut-away view of insert 242.As shown in figure 5, insert 242 With the placing groove RS for accommodating semiconductor element.Also, the spacing between the inner wall IF of placing groove RS is formed with leaning on Narrow below close.Therefore, when element power supply unit 250 makes semiconductor element drop to placing groove RS, the appearance of semiconductor element Gesture and position are corrected and be placed by the inclinations of inner wall IF.Obviously, it is placed on the semiconductor element quilt of placing groove RS Thin support film 242a support, and the terminal of semiconductor element is sudden and violent downwards by the exposed hole EH of support film 242a Dew.Also, as shown in Fig. 6 of the bottom isometric view as insert 242,2 first correction holes are formed in insert 242 PH1, 4 second correction hole PH2And 2 fixing groove FS.
First correction hole PH1With the second correction hole PH1In order to accurately set between semiconductor element and test jack TS Position and be equipped with
It is provided to the first correction pin PP of test jack TS1(referring to Fig. 8) is inserted into the first correction hole PH1And to insert It is once corrected 242 position.Therefore, insert 242 is also placed on by the semiconductor element that element power supply unit 250 is supplied Placing groove RS and be placed on the position after correction, wherein the position of the degree corrected and insert 242 is rectified by means of first Positive hole PH1With the second correction pin PP1And the degree corrected is suitable.
It is provided to the second correction pin PP of test jack TS2(referring to Fig. 8) is inserted into the second correction hole PH2And to insert 242 position carries out secondary correction.Above-mentioned second correction hole PH2Diameter than first correction hole PH1Diameter it is small, and second Correct hole PH2It is equipped with to finely tune the position of semiconductor element.
Later to the first correction hole PH1With the second correction hole PH2Function be described in detail.
The upper end of elastomeric element 243 is inserted into fixing groove FS, and elastomeric element 243 is held be inserted into fixing groove FS on it In the state of fixed.
Elastomeric element 243 flexibly supports insert 242 upwards, to maintain between insert 242 and test jack TS Spacing, thus when element power supply unit 250 pressurizes be placed on the semiconductor element of insert 242 downwards, 242 energy of insert It is enough to decline relative to test jack TS.This elastomeric element 243 can be equipped with by helical spring, and its lower end is tested slotting Seat TS support.
Element power supply unit 250 is supplied after grasping 16 semiconductor elements from the loading pocket 211a for being located at grasping position DP To board 241, and it is supplied to after grasping 16 semiconductor elements being completed from board 241 and is located at grasping position The unloading pocket 211b of DP.For this purpose, element power supply unit 250 includes grasping head 251, level as shown in the schematic side elevation of Fig. 7 Shifter 252 and vertically move device 253.
Grasping head 251 can grasp 16 semiconductor elements or release grasping, and has and vacuum can be utilized to press and distinguish By a semiconductor element grasping or release the 16 pick-up P grasped.
Device 252 is moved horizontally for moving grasping head 251 along anterior-posterior horizontal direction, and can be equipped with by cylinder.It grabs Holding first 251 can be by means of this top for moving horizontally device 252 and being located at socket SP, or positioned at the upper of grasping position DP Side.
Device 253 is vertically moved for moving grasping head 251 along up and down direction, and can be equipped with by motor.Grasp head 251 can vertically move device 253 and suitably adsorb semiconductor element from grasping position DP or board 241 by means of this Grasping, or put down, in turn, the semiconductor element for being placed in socket SP can be pressurizeed to the side test jack TS.
As reference, such as winning shown in plan view for Fig. 8, socket SP has 16 test jack TS.It is placed on and connects 16 semiconductor elements of the insert 242 of guiding device 240 are touched by the decline of grasping head 251 and towards 16 test jack TS quilts Pressurization, and it is electrically connected to tester.Also, test jack TS is respectively provided with 2 first correction pin PP1It is sold with 4 second corrections PP2.First correction pin PP1It is inserted into the first correction hole PH1And the position of insert 242 is once corrected, and half When conductor element and insert 242 are pressurizeed downwards and are moved by element power supply unit 250, the second correction pin PP2It is inserted into second Correct hole PH2And accurate secondary correction is carried out to the position of insert 242 and semiconductor element.For this purpose, the first correction pin PP1 With the second correction pin PP2Being equipped to upper end is round and smooth curved cone shape, with the first correction hole PH1With the second correction hole PH2Diameter accordingly, second correction pin PP2Diameter h less than first correction pin PP1Diameter H.Obviously, first can be rectified Positive pin PP1With the second correction pin PP2Part separates from the electrical connections SA of test jack TS and is independently named as socket guidance Device.
<to the explanation of the function of major part>
When the abutting of board 241 is fixed on socket SP, as shown in figure 9, the first correction pin PP1In being inserted into first Correct hole PH1State.At this point, in the first correction pin PP1It is inserted into the first correction hole PH1During, the position of insert 242 It sets and is once corrected.Obviously, because insert 242 individually moves about, insert 242 can be directed at corresponding test jack TS and respectively obtain aligning.Also, in the state of Fig. 8, although the second correction pin PP2From the second correction hole PH2It is detached from, However due to selling PP by the first correction1With the first correction hole PH1Effect and the aligning of insert 242 that promotes, such as Figure 10 Ground plan shown in, second correction pin PP2Center O be located at second correction hole PH2It is interior, therefore the second correction pin PP can be made2With After be inserted into the second correction hole PH2.For this purpose, as illustrated in fig. 9, the second correction pin PP2It is highly preferred less than first correction pin PP1Height.
In addition, making the shape for declining predetermined altitude positioned at the grasping head 251 of the top of board 241 in element power supply unit 250 Under state, if semiconductor element is made to land, its position while semiconductor element is inserted into the placing groove RS of insert 242 And posture is once corrected.
Then, if element power supply unit 250 makes to grasp the further decline desired height of head 251, first 251 is grasped and is being declined During pressurize downwards semiconductor element and insert 242, to make the second correction pin PP2It is inserted into the second correction hole PH2.Accordingly, in the state that the position of insert 242 and semiconductor element is by accurately secondary correction, semiconductor element and survey Examination socket TS is electrically connected.Obviously, the position of insert 242 and semiconductor element is also independently controlled at this time.
In turn, it is close to be fixed to socket SP even with plate 241 also to can be implemented as only making first as shown in figure 11 Correction pin PP1Upper end end be in be inserted into the first correction hole PH1State.In these cases, semiconductor element is placed Its position and posture are once corrected while the placing groove RS of insert 242, and are placed in the semiconductor of insert 242 Element is pressurizeed downwards and sells PP by the first correction1With the first correction hole PH1And its position obtains secondary correction, then borrows Help the second correction pin PP2With the second correction hole PH2And its position obtains accurate correction three times.That is, according to the present invention it is possible to Comprising obtaining the position of semiconductor element accurately by 2 or more steps using the insert 242 that can be moved about respectively Correction a variety of examples.
In addition, the present embodiment has been passed the imperial examinations at the provincial level, 16 semiconductor elements are by the example of disposable test, but the present invention can be good It is applied to the situation of the semiconductor element of 1 test 1 or more well.Obviously, the quantity of pick-up, the quantity of insert and survey The quantity of examination socket can be equipped to identical as the quantity for the semiconductor element disposably tested.
Also, the present embodiment, which has been passed the imperial examinations at the provincial level, only constitutes the example of a reciprocating part, but such as the applicant's earlier application Disclosed in 10-2012-0110424 (South Korea) numbers, the situation for constituting multiple reciprocating parts and multiple grasping heads can be applied to.
As described above, specific description has been carried out to the present invention with reference to accompanying drawings and embodiments, but above-described embodiment is only It is the preferred embodiment of the present invention, it should be understood that should not be limited to above-described embodiment, and right of the invention to the present invention Range should include claims range and with its equivalents.

Claims (6)

1. a kind of for testing the sorting machine of semiconductor element, comprising:
Contact guidance device in conjunction with the socket of tester, and guides and enables semiconductor element and be arranged described The test jack of socket is accurately electrically connected；And
Element power supply unit, for semiconductor element to be supplied to the contact guidance device,
Wherein, the contact guidance device includes:
Board, in conjunction with the socket；
Insert, it is described to be arranged in such a way that the test jack is corresponding one to one and can move about in the horizontal direction Board, and there is the placing groove for placing the semiconductor element supplied by the element power supply unit,
Wherein, the insert, which has, corrects hole with the first correction hole of the position of the test jack and second for correcting,
Be provided to the test jack first correction pin be inserted into it is described first correction hole and to the position of the insert into The primary correction of row,
When the semiconductor element for being placed in the insert is pressurizeed downwards by the element power supply unit, it is provided to the test Second correction pin of socket is inserted into second correction hole, so that the position to the insert carries out secondary correction.
2. as described in claim 1 for testing the sorting machine of semiconductor element, wherein the diameter in second correction hole is small Diameter in first correction hole.
3. as described in claim 1 for testing the sorting machine of semiconductor element, wherein rectify in the first correction hole and second Positive hole arrangement are as follows: when the first correction pin is inserted into the first correction hole, the center of the second correction pin is corrected To the position being inserted into the second correction hole.
4. as claimed in claim 3 for testing semiconductor element from sorting machine, wherein be supplied to by the element power supply unit The semiconductor element of the contact guidance device is once corrected when being placed in the placing groove of the insert,
Its position is placed in when the semiconductor element of the placing groove is pressurizeed downwards by the element power supply unit by described the One correction pin and described first corrects hole by secondary correction, and hereafter hole is corrected by the second correction pin and second in its position And it is corrected three times.
5. as claimed in claim 3 for testing semiconductor element from sorting machine, wherein second correction hole is arranged as comparing Described first corrects hole closer to the semiconductor element for being placed in the placing groove.
6. as described in claim 1 for testing semiconductor element from sorting machine, wherein the insert includes being used to support It is placed on the support film of the semiconductor element of the placing groove,
The exposed hole for exposing the terminal of the semiconductor element downwards is formed in the support film.
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190124132A (en) * 2018-04-25 2019-11-04 (주)테크윙 Test handler for testing electronic component
KR102610287B1 (en) * 2018-08-24 2023-12-06 (주)테크윙 Test tray and handler for testing electronic component
KR20200071357A (en) * 2018-12-11 2020-06-19 (주)테크윙 Handler for testing electronic components
KR20210063164A (en) * 2019-11-22 2021-06-01 (주)테크윙 Tester coupling portion
KR102295435B1 (en) * 2020-03-12 2021-08-31 에이엠티 주식회사 The align of the device having micro pitch and testing device and align method of device
KR20230022567A (en) * 2021-08-09 2023-02-16 (주)테크윙 Socket guider for tester of testing electronic components

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002071750A (en) * 2000-08-29 2002-03-12 Enplas Corp Carrier and pusher for handler device and handler device
JP2011247908A (en) * 2011-09-14 2011-12-08 Seiko Epson Corp Maintenance method of positioning device and positioning device of ic handler
CN103430031A (en) * 2011-03-14 2013-12-04 李诺工业有限公司 Apparatus for inspecting semiconductor device
CN103706576A (en) * 2012-10-05 2014-04-09 泰克元有限公司 Sorting machine used for semiconductor element test
CN104096684A (en) * 2013-04-03 2014-10-15 泰克元有限公司 Sorting Machine For Testing Semiconductor Components
CN204177830U (en) * 2014-09-11 2015-02-25 法特迪精密科技（苏州）有限公司 The automatic assignment test socket of multistation

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6547571B2 (en) * 2001-06-21 2003-04-15 Maxim Integrated Products, Inc. Low cost, high performance flexible tester handler docking interface
JP3531644B2 (en) * 2002-05-31 2004-05-31 沖電気工業株式会社 Semiconductor socket and probe replacement method for the socket
KR100942527B1 (en) * 2006-10-04 2010-02-12 가부시키가이샤 아드반테스트 Electronic component testing apparatus
JP2010129505A (en) * 2008-12-01 2010-06-10 Elpida Memory Inc Ic socket and guide plate for ic socket
KR101505955B1 (en) * 2009-11-17 2015-03-27 (주)테크윙 Opening apparatus for test handler
CN202614797U (en) * 2012-05-02 2012-12-19 苏州创瑞机电科技有限公司 Floating plate mechanism of chip module test socket
CN103439541B (en) * 2013-09-03 2016-05-18 苏州创瑞机电科技有限公司 The CMOS camera chip automatic assignment test socket of support plate that floats

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002071750A (en) * 2000-08-29 2002-03-12 Enplas Corp Carrier and pusher for handler device and handler device
CN103430031A (en) * 2011-03-14 2013-12-04 李诺工业有限公司 Apparatus for inspecting semiconductor device
JP2011247908A (en) * 2011-09-14 2011-12-08 Seiko Epson Corp Maintenance method of positioning device and positioning device of ic handler
CN103706576A (en) * 2012-10-05 2014-04-09 泰克元有限公司 Sorting machine used for semiconductor element test
CN104096684A (en) * 2013-04-03 2014-10-15 泰克元有限公司 Sorting Machine For Testing Semiconductor Components
CN204177830U (en) * 2014-09-11 2015-02-25 法特迪精密科技（苏州）有限公司 The automatic assignment test socket of multistation

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CN106955855A (en) 2017-07-18
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KR20170078209A (en) 2017-07-07

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