CN100461999C - Wafer table for preparing electrical components and device for equipping substrates with the components - Google Patents

Wafer table for preparing electrical components and device for equipping substrates with the components Download PDF

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Publication number
CN100461999C
CN100461999C CNB200680000795XA CN200680000795A CN100461999C CN 100461999 C CN100461999 C CN 100461999C CN B200680000795X A CNB200680000795X A CN B200680000795XA CN 200680000795 A CN200680000795 A CN 200680000795A CN 100461999 C CN100461999 C CN 100461999C
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China
Prior art keywords
wafer
assembly
wafer table
rotating disk
moves
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CNB200680000795XA
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Chinese (zh)
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CN101019477A (en
Inventor
马赛厄斯·弗林特
穆罕麦德·梅迪安波尔
哈拉尔德·斯坦兹尔
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ASMPT GmbH and Co KG
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Siemens AG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53478—Means to assemble or disassemble with magazine supply

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A wafer table for a wafer with electrical components comprises a horizontal rotary disk for placing the wafer upon and a stationary ejector for detaching the components from a carrier foil of the wafer. The rotary disk is mounted on a carriage, which can be finely displaced linearly parallel to the wafer plane in discrete steps and which can be rotated by a finely actuatable rotary drive. The rotary drive and the linear drive can be positioned in such a manner that each of the components arrives at a pick-up position specified by the position of the ejector. This makes it possible to arrange and operate the wafer table in a space-saving manner.

Description

Be used to provide the wafer table of electric component and be used to substrate to be equipped with the device of electric component
Technical field
The present invention relates to a kind of wafer table (wafertable) that is used to provide the electric component of a wafer, described wafer can be placed on the rotating disk of described wafer table, described rotating disk can be parallel to wafer plane and move subtly with discrete stride, make described assembly arrive a fixing fetch bit of choosing and put, describedly choose fetch bit and put and be assigned at least one fixing servicing unit.
Background technology
A kind of like this wafer table was for example disclosed among the EP0971390A.In view of the above, an assembly head can be parallel to a substrate between two given positions carries out straight line and moves, and described substrate is transmitted by regularly a band conveyer.Described wafer table is arranged near the conveyer belt, and it has a cross slide seat that can move along x, y direction, is used for providing the wafer table assembly at a wafer parallel with substrate.Whereby, assembly head is chosen fetch bit and is put to choose and get an assembly fixing at every turn, moves described assembly by transversely movable substrate, and places it in the substrate.Because wafer table only has a limited x-y turnover zone, thereby the fetch bit of choosing that all component of wafer all can't be sent to assembly head is put.Get remaining component for choosing, wafer is disposed on the rotating disk of cross slide seat, and rotatable 90 ° or 180 °.
Summary of the invention
The purpose of this invention is to provide a kind of width wafer table less and that simplify to some extent of installing.
This purpose is reached by following technical scheme: a kind of wafer table that is used to provide the electric component of a wafer, described wafer is placed on the rotating disk of described wafer table, wherein, described rotating disk is parallel to wafer plane with discrete stride and moves subtly, make described assembly arrive a fixing fetch bit of choosing and put, describedly choose fetch bit and put and be assigned at least one fixing servicing unit; Described rotating disk by one can meticulous running first rotating driving device be rotated; Described rotating disk is arranged in one on the slide that moves on the fixing linear guide, and described slide is parallel to described wafer by the linear drive apparatus of a meticulous running and moves; And the location of described first rotating driving device and described linear drive apparatus makes described each assembly all can arrive and describedly chooses fetch bit and put.
Wafer table of the present invention replaces an x-y linear axis of cross slide seat with a meticulous rotating driving device, and described rotating driving device replaces a linear guide and a straight line drive unit with a simple rotation bearing and rotating driving device.Only keep a fixing linear guide for slide.Make the complicated cross guider of superimposed motion with needs and compare, this simple guider can be realized higher setting accuracy.Rotatablely move and need not the additional motion space.Rotating disk only carries out straight line and moves.Therefore, wafer table only needs less installation width, and this point can improve its for example availability when the assembling printed circuit board (PCB).Though the wafer rotation can make the position, angle of each assembly change, and can proofread and correct this by following measure, promptly for example an assembly head follow-up grasping tool carries out a corresponding reverse rotation.
In the improvement project of wafer table of the present invention, described servicing unit is configured as an ejector that is separated in order to the carrier film with described assembly and described wafer, and has a rotor, and described rotor has a rotating shaft perpendicular to described wafer plane; Described rotor has at least two spacing pins at regular intervals to each other, as to be used for described assembly; And described rotor rotates subtly according to the position, angle of described rotating disk.The position, angle of spacing pin under every kind of situation (distancing needle) is complementary with the position, angle of waiting to choose the assembly of getting.
In another improvement project of wafer table of the present invention, describedly to choose fetch bit and put and be furnished with another servicing unit, described servicing unit is a fixing inverter, is used to choose and gets and rotate described assembly.Wherein, described inverter can move to the assembly that for example is configured as flip-chip one and can choose the delivering position of getting by an assembly head on a direction that is fit to assemble.
A kind of is the device that substrate is equipped with electric component by an assembly head, described electric component provides on wafer table according to the present invention, described assembly head is parallel to described substrate and moves, and has a grasping device that at least one is used to operate described assembly, wherein, described device transmits described substrate on first coordinate direction; Second rotating driving device coupling of a described grasping device and a meticulous running; And described slide moves on second coordinate direction vertical with described first coordinate direction.
In assembling device of the present invention, the installation width of wafer table significantly reduces.
In the improvement project of assembling device of the present invention, described device has a video camera that is used to measure the position of described assembly on described grasping device.Can measure the assembly definite position on the grasping device of assembly head, especially Qi Jiao position by means of described video camera, and this is carried out corresponding correction.
In another improvement project of assembling device of the present invention,, also be provided with the position of the feedway that is used to arrange other types in the catching block of described assembly head at contiguous described wafer table place.This improvement project realizes by the narrow-structured model of wafer table, and can provide add-on assemble from other reservoir by conveyer belt thus, for example from the assembly of assembly band.
Description of drawings
The present invention is described in detail by embodiment shown in the drawings below, wherein:
Fig. 1 one has the end view of the assembling device of a wafer table of the present invention; And
Fig. 2 is the profile along the intercepting of the II-II line among Fig. 1.
The reference symbol table
X, the y coordinate direction
1 substrate
2 assemblies
3 assembly heads
4 frameworks
5 supports
6 registration arm
7 grasping devices
8 supporting walls
9 perforation
10 transmit the district
15 assembly feedwaies
16 inverters
17 absorption type grasping devices
18 linear motors
19 video cameras
20 slides
21 wafer tables
23 choose fetch bit puts
24 catching blocks
25 wafers
26 rotating disks
27 spacing pins
28 ejectors
29 rotors
Embodiment
Fig. 1 and Fig. 2 show is one to be equipped with the device of electric component 2 by an assembly head 3 for flat base 1, and described assembly head can be parallel on the working face of substrate 1 one and moves.The framework 4 of described device has a fixed support 5, is furnished with one on the described support 5 and can moves on one second coordinate direction Y and by the electric motor driven registration arm 6 of a straight line.Assembly head 3 is arranged in longitudinally on the registration arm 6, and can move on first a coordinate direction x vertical with the second coordinate direction y.Support 5 in its whole length range with one day rigid support wall 8 downwards, that extend longitudinally be fixedly linked.
Described perforation is vertically passed in the transmission district 10 that has a perforation 9, to be used to transmit substrate 1 in the zone line of supporting walls 8.Whole device is mirror symmetrical structure in the both sides of supporting walls 8, and support 5 is two side-prominent, and both sides all have registration arm 6 and assembly head 3.As shown in drawings, substrate 1 can correspondingly temporarily be fixed on the rigging position that transmits the both sides that are positioned at supporting walls 8 in the district 10.
In the rigging position upstream, the next-door neighbour transmits the district and is furnished with the position that is used to arrange a wafer table 21 and a plurality of assembly feedwaies 15 long and narrow, that the next-door neighbour arranges.Above-mentioned position has a series ofly to be chosen fetch bit and puts 23, and assembly head 3 can be chosen fetch bit and puts to choose and get the assembly of for example being supplied with by the biscuit frame 2 described, and then these assemblies 2 are sent to it on the installation site in the substrate 1.
The maximum catching block of representing with chain-dotted line 24 of assembly head 3 has covered to be chosen fetch bit comprising of the assembly section of substrate 1 and assembly 2 and puts 23 choose and get the district.Wafer table 21 is close to a part of assembly feedway 15 and arranges, and is furnished with a rotating disk 26, and a wafer 25 parallel with substrate arranged on the described rotating disk.Rotating disk 26 has a rotating shaft vertical with wafer 25, and does not do illustrated rotating driving device coupling with an accompanying drawing, and described rotating driving device can make rotating disk 26 be rotated with less angular increment.Rotating disk 26 is arranged in one can be on the slide 20 that moves on the fixing linear guide 11, and described slide 20 can not carry out moving subtly under an accompanying drawing is done the driving of illustrated linear drive apparatus.
Combine by linear coordinate and angular coordinate, each assembly 2 can be moved to a fixing fetch bit of choosing and put, describedly choose fetch bit and put the determining positions that is arranged in the fixedly ejector 28 below the wafer 25 by slide 20 and rotating disk 26.Described ejector is furnished with towards spacing pin 27 top, elevated, and described spacing pin is with the carrier film of assembly 2 tops from described wafer.Spacing pin 27 by one of ejector 28 can meticulous adjusting angle rotor 29 supportings, thereby can be turned to one with the position, angle of assembly 2 couplings.
Be furnished with a runner type inverter 16 on the wafer table 21, described inverter is positioned at the top of ejector 28, and has the absorption type grasping device 17 that is used to grasp by the assembly 2 of jack-up.By progressively rotating around a trunnion axis, absorption type grasping device 17 rotates up and rotates with assembly 2.Assembly 2 is assembled a grasping device 7 of 3 and chooses and get on this delivering position.Assembly head one be fixed on video camera 19 on the framework above move, described video camera is used to measure the definite position of assembly 2.Grasping device 7 can rotate around its longitudinal axis by one second rotating driving device, and by rotation the assembly 2 that adsorbs is sent on the rigging position of appointment.
The transmission district 10 that moves horizontally direction and substrate 1 of slide 20 is perpendicular.Therefore, the installation width that 21 need of wafer table one are less can thus be and arranges that other feedwaies 15 win the space.

Claims (6)

1. wafer table (21) that is used to provide the electric component (2) of a wafer (25), described wafer is placed on the rotating disk (26) of described wafer table (21), wherein, described rotating disk (26) is parallel to wafer plane with discrete stride and moves subtly, making described assembly (2) arrive a fixing fetch bit of choosing puts, describedly choose fetch bit and put and be assigned at least one fixing servicing unit
It is characterized in that,
Described rotating disk (26) by one can meticulous running first rotating driving device be rotated,
Described rotating disk (26) is arranged in one on the slide (20) that moves on the fixing linear guide (11), and described slide is parallel to described wafer (25) by the linear drive apparatus of a meticulous running and moves, and
The location of described first rotating driving device and described linear drive apparatus makes described each assembly (2) all can arrive and describedly chooses fetch bit and put.
2. wafer table according to claim 1 is characterized in that,
Described servicing unit is configured as an ejector (28) that is separated in order to the carrier film with described assembly (2) and described wafer (25), and has a rotor (29), and described rotor has a rotating shaft perpendicular to described wafer plane,
Described rotor (29) has at least two spacing pins (27) at regular intervals to each other, as to be used for described assembly (2), and
Described rotor (29) rotates subtly according to the position, angle of described rotating disk (26).
3. wafer table according to claim 1 and 2 is characterized in that,
Describedly choose fetch bit and put and be furnished with another servicing unit, described servicing unit is a fixing inverter (16), is used to choose and gets and rotate described assembly (2).
4. one kind is the device that substrate (1) is equipped with electric component (2) by an assembly head (3), described electric component provides on according to claim 1,2 or 3 described wafer tables, described assembly head is parallel to described substrate (1) and moves, and has at least one grasping device that is used to operate described assembly (2) (7), wherein, described device is gone up at first coordinate direction (X) and is transmitted described substrate (1)
It is characterized in that,
Described grasping device (7) is coupled with second rotating driving device of a meticulous running, and
Described slide (20) is gone up at second coordinate direction (y) vertical with described first coordinate direction (x) and is moved.
5. device according to claim 4 is characterized in that,
Described device has a video camera (19) that is used to measure the position of described assembly (2) on described grasping device (7).
6. according to claim 4 or 5 described devices, it is characterized in that,
Locate at contiguous described wafer table (21), also be provided with the position of the feedway (15) that is used to arrange other types in the catching block (24) of described assembly head (3).
CNB200680000795XA 2005-01-25 2006-01-05 Wafer table for preparing electrical components and device for equipping substrates with the components Active CN100461999C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005003454 2005-01-25
DE102005003454.3 2005-01-25

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Publication Number Publication Date
CN101019477A CN101019477A (en) 2007-08-15
CN100461999C true CN100461999C (en) 2009-02-11

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US (1) US7913380B2 (en)
EP (1) EP1771877B1 (en)
JP (1) JP4518513B2 (en)
KR (1) KR100853887B1 (en)
CN (1) CN100461999C (en)
AT (1) ATE388486T1 (en)
DE (1) DE502006000431D1 (en)
WO (1) WO2006079577A2 (en)

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Publication number Priority date Publication date Assignee Title
US20110248738A1 (en) * 2010-04-12 2011-10-13 Sze Chak Tong Testing apparatus for electronic devices
CN106064305B (en) * 2016-07-20 2023-10-27 梁启明 Single-wing intravenous needle assembling machine
DE102018128616A1 (en) * 2018-06-24 2019-12-24 Besi Switzerland Ag Device and method for detaching a chip from an adhesive film

Citations (3)

* Cited by examiner, † Cited by third party
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EP1771877B1 (en) 2008-03-05
KR100853887B1 (en) 2008-08-25

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