CN100452373C - Connecting structure of integrated circuit and its production - Google Patents
Connecting structure of integrated circuit and its production Download PDFInfo
- Publication number
- CN100452373C CN100452373C CNB2005101302334A CN200510130233A CN100452373C CN 100452373 C CN100452373 C CN 100452373C CN B2005101302334 A CNB2005101302334 A CN B2005101302334A CN 200510130233 A CN200510130233 A CN 200510130233A CN 100452373 C CN100452373 C CN 100452373C
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- connected structure
- column
- pad
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 239000000835 fiber Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 58
- 229920002120 photoresistant polymer Polymers 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 14
- 238000009826 distribution Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 230000009471 action Effects 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 10
- 230000000875 corresponding effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 208000037170 Delayed Emergence from Anesthesia Diseases 0.000 description 1
- 229920000914 Metallic fiber Polymers 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Abstract
The invention is concerned with the jointing structure and the manufacture method of the integrate circuit in order to joint the first base-board and the second base-board, the jointing structure includes: the first filling piece, adheres on the first base-board; several first columns, form on the first filling piece by the first density; the second filling piece, adheres on the second base-board; several second columns, form on the second filling piece by the second density; the first columns and the second columns interlude to joint the first base-board and the second base-board. The invention can connect with the fiber structure made by the conductive material, and without the action of thermosetting high polymer to maintain the characteristic.
Description
Technical field
The present invention relates to a kind of connected structure and manufacture method thereof, particularly relate to a kind of connected structure and manufacture method thereof of integrated circuit.
Background technology
Science and technology have made huge strides now, because scientist's positive research and development and effort make people be enjoyed the life of high-quality more.When further developing the multi-purpose electronic product of tool, that research and development are made is light, thin, short, little, the various components of safety and environmental protection, and takes into account portability and wearable property, is the most urgent problem that present scientist faces.Therefore developing soft semi-conductor packaging is to be one of main developing direction.Yet, in the research of soft electronic structure dress, still can't provide the solution that meets the flexible demand at present at each inter-module joint.
Current connected structure all engages (surface mount) mode with face and realizes, must be by the mode of scolding tin between electric substrate to do connection.Quite bother, and do not have pliability, contact self can't bear the thermal stress that causes because of heat.When desiring to disassemble; also need tin is heated to about 220 ℃ high temperature; to two substrates could be separated after the tin fusing; so the more residual block tins of regular meeting are on substrate; cause influence to some extent on the performance; if have pliability so can invent out a cover, the connected structure that can easily engage and disassemble is a big Gospel of society in fact again.
Summary of the invention
Subject matter to be solved by this invention is to provide a kind of connected structure and manufacture method thereof of integrated circuit, makes the process of combination and dismounting all very convenient.By form as devil's felt, on different pads, make many thicknesses, shape and the different column of density, promptly can closely block after making two pads engage.And because column is quite small, have the characteristic of flexible, one tear can be with two pads separately along the edge for the user, to solve the existing in prior technology problem.
Therefore, for achieving the above object, the connected structure of a kind of integrated circuit disclosed in this invention and manufacture method thereof, in order to engage first substrate and second substrate, on first substrate, adhere to one first pad, on second substrate, adhere to one second pad, then, on first pad, form a plurality of first columns, on second pad, form a plurality of second columns, wherein, the distribution density of first column and second column, shape and thickness size can be difference, by a plurality of first columns and a plurality of second column are interted mutually, just can engage first substrate and second substrate, its notion is as with two thicknesses, the different comb of density interts mutually, promptly can closely block.
Wherein, first pad and second pad and be formed at first column and second column on two pads, it is made to be all the conductivity material, in order to transmit the signal of telecommunication that first substrate and second substrate are sent.
In addition, the connected structure by integrated circuit of the present invention also can be engaged in electric substrate on the object with fibr tissue except that two electric substrates can being engaged.For example, be engaged on the clothes with conducting fibre tissue, electric substrate is sticked on a pad, on this pad, form a plurality of columns, its Intermediate gasket and column are made by the conductivity material, each column is interspersed in the fibr tissue, just can be attached on the object with conducting fibre tissue thus with electric substrate or by the electronic product that electric substrate constitutes.
This special contact is except the characteristic with soft flexible, can also absorb because of heat or stress that deflection deformation produced, this structure is for to make many small columns on the surface at contact two ends with conductive material, utilize between the column of both sides density different, make contact do so can when engaging, produce contact strength and combine closely with thickness.And the corresponding contact other end can be identical structure, be the fibr tissue of making by the tool conductive material, make tool conductivity uncinus can with its tight connection, the density of uncinus is big more, it is strong more to engage strength, and the column of the two ends tool conductivity of contact utilizes distribution density to engage with the different of thickness.
Below in execution mode, be described in detail detailed features of the present invention and advantage, its content is enough to make any those of ordinary skill in the art to understand technology contents of the present invention and implements according to this, and according to the disclosed content of this specification, claim and accompanying drawing, any those of ordinary skill in the art can understand purpose and the advantage that the present invention is correlated with easily.
Description of drawings
Figure 1A and Figure 1B are the connected structure schematic diagram of the integrated circuit of first embodiment of the invention.
Fig. 2 A and Fig. 2 B are the connected structure schematic diagram of the integrated circuit of second embodiment of the invention.
Fig. 3 is the connected structure schematic diagram of the integrated circuit of third embodiment of the invention.
Fig. 4 is the connected structure schematic diagram of the integrated circuit of fourth embodiment of the invention.
Fig. 5 A is that the object with having fibr tissue of fifth embodiment of the invention is done the structural representation that engages.
Fig. 5 B is that the object with having fibr tissue of sixth embodiment of the invention is done the structural representation that engages.
Fig. 5 C is that the object with having fibr tissue of seventh embodiment of the invention is done the structural representation that engages.
Fig. 6 A, Fig. 6 B, Fig. 6 C, Fig. 6 D, Fig. 6 E, Fig. 6 F, Fig. 6 G, Fig. 6 H, Fig. 6 I, Fig. 6 J, Fig. 6 K, Fig. 6 L, 6M figure and 6N figure are the making schematic flow sheet of connected structure of the present invention.
Wherein, Reference numeral:
110 first pads, 120 second pads
130 first columns, 132 second columns
140 first substrates, 150 second substrates
160 first conducting shells, 170 second conducting shells
180 protective layers, 210 first columns
212 second columns, 310 second columns (hook-shaped)
312 first columns (hook-shaped), 410 first columns (column)
420 second columns (taper), 510 fibr tissues
520 columns, 522 columns
524 columns (taper), 530 pads
540 substrates, 550 conducting shells
560 have object 610 pads of fibr tissue
620 first photoresist layers, 630 first masks
634 exposures of 632 potholes
636 first column potholes, 640 conductive materials
650 second photoresist layers, 652 second masks
654 potholes, 656 second column potholes
Embodiment
For making purpose of the present invention, structure, feature and function thereof there are further understanding, now cooperate embodiment to be described in detail as follows.Above about content of the present invention explanation and the explanation of following execution mode in order to demonstration with explain principle of the present invention, and provide patent claim of the present invention further explained.
See also Figure 1A, connected structure schematic diagram for the integrated circuit of the first embodiment of the present invention, in order to engage first substrate 140 and second substrate 150, this connected structure includes one first pad 110, a plurality of first column 130, one second pad 120 and a plurality of second column 132, and it is made to be all the conductivity material.
In addition, between first pad 110 and first substrate 140, also can contain one first conducting shell 160, and between second pad 120 and second substrate 150, also can contain one second conducting shell 170, in order to transmit the signal of telecommunication that sends by first substrate 140 and second substrate 150.Wherein, first pad 110, first substrate 140 and first conducting shell 160 adhering mode each other can be direct joint, alloy reflow joint, gummed or pressing one of them.And second pad 120, second substrate 150 and second conducting shell 170 adhering mode each other are also together.
See also Figure 1B,,, intert mutually to engage as two densitys and the different comb of thickness for the connected structure of the integrated circuit of Figure 1A schematic diagram after interconnecting.Wherein, protective layer 180 has the effect of isolating with foreign object in order to first substrate 140, second substrate 150, first conducting shell 160 and second conducting shell 170 of protection conductivity material.
Please continue to consult Fig. 2 A, connected structure schematic diagram for the integrated circuit of the second embodiment of the present invention, as seen from the figure, wherein first column 210 is identical with the shape of second column 212, and the structure of column is made of a thinner column and the column of a broad, Fig. 2 B is the schematic diagram after the connected structure of Fig. 2 A engages, the joint best results of this kind structure.Because each column is all very small, therefore have the characteristic of flexible, this design makes disassembles conveniently, and one tears and can separate along the edge.
And Fig. 3 is the connected structure schematic diagram of the third embodiment of the present invention, and wherein first column 312 and second column 310 are all hook-shapedly, promptly can closely block after the identical structural engagement in two ends.Fig. 4 is the connected structure schematic diagram of the fourth embodiment of the present invention again, and wherein first column 410 is a column, and second column 420 is a taper, interts mutually to engage.
The present invention is except connected structure can join in twos, also can do and engage with an object 560 with fibr tissue, see also Fig. 5 A, adhere to the pad 530 of a tool conductivity, on this pad 530, form the column 520 of a plurality of tool conductivity in a side of the substrate 540 that comprises electronic building brick.Being shaped as of column among Fig. 5 A is hook-shaped, and the arrangement mode of these columns 520 on pad 530 can be face array (areaarray), the outer ring arranges (peripheral) or indivedual contact is arranged, these uncinuses are interspersed in the fibr tissue 510, just can engage with substrate 540.
Wherein, the material of fibr tissue 510 is the conductivity material, fibr tissue can be knitted in the clothes, and thus, electric substrate just can directly fit on the clothes, has wearable property.In addition, between substrate 540 and pad 530, more can include a conducting shell 550, in order to transmitting the signal of telecommunication that sends by substrate 540, and substrate 540, pad 530 and conducting shell 550 adhering mode each other can be direct joint, alloy reflow joint, gummed or pressing one of them.
In Fig. 5 B, the shape of column 522 couples together institute by the column of a thinner column and a broad and constitutes.And in Fig. 5 C, column 524 be shaped as taper, all can be interspersed in the object 560 with fibr tissue 510, as have the clothing of fibr tissue 510.
See also Fig. 6 A, Fig. 6 B, Fig. 6 C, Fig. 6 D, Fig. 6 E, Fig. 6 F, Fig. 6 G, Fig. 6 H, Fig. 6 I, Fig. 6 J, Fig. 6 K, Fig. 6 L, 6M figure and 6N figure at last, for making making schematic flow sheet as the connected structure of Fig. 2 A shape.At first, one pad 610 is provided, then, coating one first photoresist layer 620 on pad 610, place one first mask 630 on first photoresist layer 620, this first mask 630 has a plurality of potholes 632, exposes 634 by 630 pairs first photoresist layers 620 of first mask, afterwards, first photoresist layer 620 is developed, then, remove all exposures place of first photoresist layer 620, each exposure place is corresponding to each pothole position of first mask 630, formed a plurality of first column potholes 636, and then, filled conductive material 640 is in each first column pothole 636, then first mask 630 is removed, promptly finish the first part column.
Continue at coating one second photoresist layer 650 on first photoresist layer 620, on second photoresist layer 650, place one second mask 652, have a plurality of potholes 654 on second mask 652, the position of each pothole 654 is corresponding to the position of each first column pothole 636, and width is wide slightly.Afterwards, expose 634 by 652 pairs second photoresist layers 650 of second mask, then, second photoresist layer 650 is developed, then, remove all exposures place of second photoresist layer 650, each exposure place is corresponding to each pothole position of second mask 652, a plurality of second column potholes 656 have been formed, then, filled conductive material 640 removes second mask 652 in each second column pothole 656 then, at last by the etching mode, remove first photoresist layer 620 and second photoresist layer 650 of no filled conductive material 640 parts together, thus, promptly finished the connected structure of integrated circuit of the present invention, the joint best results of this kind connected structure shape.
The present invention is a kind of flexible construction connected structure, utilizes the particular bond structural design to make packaging housing have the characteristic of flexible, and contact self also can bear flexible distortion and can absorb thermal stress because of heat produced.Therefore the present invention also has quite high reliability except the characteristic with flexible.
The present invention utilizes the form of devil's felt to make contact have soft characteristic, and can absorb the thermal stress that does not match and caused because of thermal coefficient of expansion, and cooperates the flexible characteristic of slim chip and flexible base plate can realize the requirement that the flexible structure is adorned.On pad, make many little hook-shaped or various Fastening tenon structures, promptly can closely block after the identical structural engagement in two ends, though formed adhesion is little, but if number increase then can produce suitable for strength, and so design makes and disassembles conveniently, one tears and can separate along the edge, has the convenient and reusable advantage of displacement.And the contact other end also can be the metallic fiber of tight braiding except can be identical structure.The speciality that the action that this invention does not need any thermosetting polymer to do reinforcement can be possessed flexible, connected structure itself has soft characteristic makes it bear distortion when deflection, has high-reliability.
Though the present invention with aforesaid embodiment openly as above, it is not in order to limit the present invention.Without departing from the spirit and scope of the present invention, change of being made and modification all belong to scope of patent protection of the present invention.See also appending claims about the protection range that the present invention defined.
Claims (26)
1, a kind of connected structure of integrated circuit in order to engage one first substrate and one second substrate, is characterized in that this connected structure includes:
One first pad is attached on this first substrate;
A plurality of first columns are formed on this first pad with one first density;
One second pad is attached on this second substrate; And
A plurality of second columns are formed on this second pad with one second density;
Wherein, this first density is different with this second density, and these a plurality of first columns intert to engage this first substrate and this second substrate mutually with these a plurality of second columns.
2, the connected structure of integrated circuit as claimed in claim 1 is characterized in that, also includes a conducting shell respectively between this first pad and this first substrate and between this second pad and this second substrate, in order to transmit the signal of telecommunication.
3, the connected structure of integrated circuit as claimed in claim 1 is characterized in that, respectively this first column and respectively the arrangement mode of this second column one of be selected from group's combination that face array, outer ring are arranged and indivedual contact is arranged.
4, the connected structure of integrated circuit as claimed in claim 1, it is characterized in that the adhering mode of this first pad and this first substrate and this second pad are selected from directly with the adhering mode of this second substrate and engage, one of in group's combination of alloy reflow joint, gummed and pressing.
5, the connected structure of integrated circuit as claimed in claim 1 is characterized in that, this first substrate and this second substrate are a conductivity material.
6, the connected structure of integrated circuit as claimed in claim 1 is characterized in that, this first pad and this second pad are a conductivity material.
7, the connected structure of integrated circuit as claimed in claim 1 is characterized in that, respectively this first column and respectively this second column by a conductivity material manufacturing.
8, the connected structure of integrated circuit as claimed in claim 1 is characterized in that, respectively this first column and respectively the shape of this second column one of be selected from column, taper and the hook-shaped group's combination.
9, a kind of connected structure of integrated circuit in order to engage the object that a substrate and has fibr tissue, is characterized in that, this connected structure includes:
One pad is attached on this substrate; And
A plurality of columns are formed on this pad;
Wherein, these a plurality of columns are interspersed in this fibr tissue, to engage this substrate and this has the object of fibr tissue.
10, the connected structure of integrated circuit as claimed in claim 9 is characterized in that, this fibr tissue is a conducting fibre tissue.
11, the connected structure of integrated circuit as claimed in claim 9 is characterized in that, also includes a conducting shell, between this pad and this substrate, in order to transmit the signal of telecommunication that this substrate sends.
12, the connected structure of integrated circuit as claimed in claim 9 is characterized in that, respectively the arrangement mode of this column one of is selected from group's combination that face array, outer ring are arranged and indivedual contact is arranged.
13, the connected structure of integrated circuit as claimed in claim 9 is characterized in that, this pad is selected from directly with the adhering mode of this substrate and engages, one of in group's combination of alloy reflow joint, gummed and pressing.
14, the connected structure of integrated circuit as claimed in claim 9 is characterized in that, this substrate is a conductivity material.
15, the connected structure of integrated circuit as claimed in claim 9 is characterized in that, this pad is a conductivity material.
16, the connected structure of integrated circuit as claimed in claim 9 is characterized in that, respectively this column is by a conductivity material manufacturing.
17, the connected structure of integrated circuit as claimed in claim 9 is characterized in that, respectively the shape of this column one of is selected from column, taper and the hook-shaped group's combination.
18, a kind of manufacture method of connected structure of integrated circuit is characterized in that, includes the following step:
One pad is provided;
Coating one photoresist layer on this pad;
In a plurality of column potholes of this photoresist layer formation with one first density distribution;
Fill a conductive material in these a plurality of column potholes;
Remove this photoresist layer, form a plurality of first columns with one first density distribution; And
Repeat abovementioned steps, form a plurality of second columns with one second density distribution, this first density is different with this second density, and these a plurality of second columns are used for interting mutually with these a plurality of first columns.
19, the manufacture method of the connected structure of integrated circuit as claimed in claim 18 is characterized in that, this step that removes this photoresist layer utilizes an etching mode that this photoresist layer is removed.
20, the manufacture method of the connected structure of integrated circuit as claimed in claim 18 is characterized in that, the arrangement mode of these a plurality of column potholes one of is selected from group's combination that face array, outer ring are arranged and indivedual contact is arranged.
21, the manufacture method of the connected structure of integrated circuit as claimed in claim 18 is characterized in that, this pad is a conductivity material.
22, a kind of manufacture method of connected structure of integrated circuit is characterized in that, includes the following step:
One pad is provided;
Coating one first photoresist layer on this pad;
In a plurality of first column potholes of this first photoresist layer formation with one first density distribution;
Fill a conductive material in these a plurality of first column potholes;
Coating one second photoresist layer on this first photoresist layer;
Form a plurality of second potholes in this second photoresist layer, the position of these a plurality of second potholes is corresponding to these a plurality of first column potholes, and the width of these a plurality of second potholes is greater than the width of these a plurality of first column potholes;
Fill this conductive material in these a plurality of second potholes;
Remove this first photoresist layer and this second photoresist layer, form a plurality of first columns with one first density distribution; And
Repeat abovementioned steps, form a plurality of second columns with one second density distribution, this first density is different with this second density, and these a plurality of second columns are used for interting mutually with these a plurality of first columns.
23, the manufacture method of the connected structure of integrated circuit as claimed in claim 22 is characterized in that, these a plurality of second potholes be shaped as column or taper.
24, the manufacture method of the connected structure of integrated circuit as claimed in claim 22, it is characterized in that the arrangement mode of these a plurality of first column potholes and these a plurality of second potholes one of is selected from group's combination that face array, outer ring are arranged and indivedual contact is arranged.
25, the manufacture method of the connected structure of integrated circuit as claimed in claim 22 is characterized in that, this pad is a conductivity material.
26, the manufacture method of the connected structure of integrated circuit as claimed in claim 22 is characterized in that, this step that removes this first photoresist layer and this second photoresist layer is utilized an etching mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101302334A CN100452373C (en) | 2005-12-14 | 2005-12-14 | Connecting structure of integrated circuit and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101302334A CN100452373C (en) | 2005-12-14 | 2005-12-14 | Connecting structure of integrated circuit and its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1983578A CN1983578A (en) | 2007-06-20 |
| CN100452373C true CN100452373C (en) | 2009-01-14 |
Family
ID=38165973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101302334A Expired - Fee Related CN100452373C (en) | 2005-12-14 | 2005-12-14 | Connecting structure of integrated circuit and its production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100452373C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104597677B (en) * | 2015-02-09 | 2017-05-31 | 合肥京东方光电科技有限公司 | A kind of integrated circuit, first circuit structure and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6319827A (en) * | 1986-07-14 | 1988-01-27 | Hitachi Ltd | Method of connecting integrated circuit chip |
| US6352436B1 (en) * | 2000-06-29 | 2002-03-05 | Teradyne, Inc. | Self retained pressure connection |
| US6829147B2 (en) * | 2000-12-21 | 2004-12-07 | Sÿnergestic Computing Systems ApS | Multilayered hybrid electronic module |
-
2005
- 2005-12-14 CN CNB2005101302334A patent/CN100452373C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6319827A (en) * | 1986-07-14 | 1988-01-27 | Hitachi Ltd | Method of connecting integrated circuit chip |
| US6352436B1 (en) * | 2000-06-29 | 2002-03-05 | Teradyne, Inc. | Self retained pressure connection |
| US6829147B2 (en) * | 2000-12-21 | 2004-12-07 | Sÿnergestic Computing Systems ApS | Multilayered hybrid electronic module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1983578A (en) | 2007-06-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2415027C2 (en) | Method of fabricating contactless card with built-in ic with higher flatness | |
| US5026452A (en) | Method of producing IC cards | |
| CN201667759U (en) | Printed circuit board | |
| CN100381025C (en) | Flexible wiring board with multilayer structure and its making method | |
| EP0951064A4 (en) | Manufacture of semiconductor device | |
| CN103907405B (en) | For the method for assembling microelectronic chip device, chip device in fabric and the fabric for the chip device for adding crimping | |
| CN101689552B (en) | Camera module and camera module manufacturing method | |
| TW200306771A (en) | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same | |
| CN103531488B (en) | Method and the camera of semiconductor equipment, manufacture semiconductor equipment | |
| JP2003334903A (en) | Release film | |
| US9242426B2 (en) | Composite plate structure and manufacturing method thereof | |
| CN100452373C (en) | Connecting structure of integrated circuit and its production | |
| JPH10211784A (en) | Ic card and its manufacture | |
| US20070128845A1 (en) | Interconnect structure of an integrated circuit and manufacturing method thereof | |
| TW200901236A (en) | Chip resistor and method for fabricating the same | |
| TW567717B (en) | Solid-state camera device and its manufacture method | |
| CN101115354B (en) | Moulding circuit board and manufacturing method therefor | |
| TWI413467B (en) | Fabrication method of rigid-flex circuit board | |
| CN1968566B (en) | Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board | |
| JP2000200335A (en) | Ic card and production thereof | |
| CN205902206U (en) | Flexble printed circuit , spotlight photovoltaic module and spotlight photovoltaic panel | |
| CN204028876U (en) | A kind of touch-screen module and mobile terminal | |
| CN209169127U (en) | A kind of electronic device and electronic device | |
| CN102714211A (en) | Solid-state image pickup device | |
| TWI811014B (en) | Thin film resistor and method for producing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090114 |