CN100451758C

CN100451758C - Imaging system

Info

Publication number: CN100451758C
Application number: CNB200410027693XA
Authority: CN
Inventors: 陈栋栋
Original assignee: Individual
Current assignee: Individual
Priority date: 2004-06-18
Filing date: 2004-06-18
Publication date: 2009-01-14
Anticipated expiration: 2024-06-18
Also published as: CN1710471A

Abstract

The present invention relates to an imaging system which comprises a light reflector, a half-transmission and half-reflection device, a CCD camera device and a light source, wherein the light reflector, the half-transmission and half-reflection device and the CCD camera device are arranged on the same axis; the working faces of the light reflector and the half-transmission and half-reflection device are mutually parallel and form an angle of 45 DEG with the axis; the light source is perpendicular to the axis and is opposite to the half-transmission and half-reflection device. The imaging system is used for realizing accurate positioning for electronic devices, such as IC for driving a liquid crystal and a panel of the liquid crystal.

Description

Imaging system

[technical field]

The invention relates to the imaging system in a kind of thermal pressure welding equipment of LCD.

[background technology]

Liquid crystal panel comprises two transparency carriers being oppositely arranged, is enclosed in the liquid crystal in these two formed gaps of transparency carrier.In order to pass through visual informations such as this liquid crystal panel display text, pattern, a plurality of contact conductors that must will be formed on one of transparency carrier carry out and can be connected conductively with the electron device IC that liquid crystal drive is used.

A kind of prior art IC and liquid crystal panel electrode lead-in wire is conducted electricity ways of connecting as shown in Figure 1, this kind syndeton 1 comprises IC 11, liquid crystal panel 12 and ACF (Anisotropic Conductive Film, aeolotropic conductive film) 13.The forming process of this syndeton 1 comprises: one section ACF 13 is attached on the contact conductor 121 of liquid crystal panel 12; Behind the conductive projection (Bump) 111 and contact conductor 121 accurate contrapositions with IC 11, be pressed together on the ACF 13, the pressing of this moment is referred to as precompressed because not with conductive projection 111 and contact conductor 121 conductings by industry; IC 11 is applied suitable pressure, make that the conducting particles 131 between conductive projection 111 and contact conductor 121 is out of shape, thus conducting conductive projection 111 and contact conductor 121, and the industry that is pressed together on of this moment is referred to as this pressure.This kind conducts electricity the technology that is connected with IC 11 and liquid crystal panel electrode lead-in wire 121 and in the industry cycle is referred to as COG (Chip On Glass) technology.

Because the contact conductor 121 on conductive projection 111 on the IC 11 and the liquid crystal panel 12 all is trickle square bulge-structure, need accurate contraposition, so, precompressed process in the above-mentioned connected mode is crucial processing procedure, need use thermal pressure welding equipment usually IC accurately is pressed together on the contact conductor of liquid crystal panel.

A kind of thermal pressure welding equipment of prior art as shown in Figure 2, this thermal pressure welding equipment 2 comprises a pressure head 21, a fixing structure 22, a directions X guide rail 23, a Y traversing guide 24 and a brace table 25.This pressure head 21 mainly has a flat end face, to apply uniform pressure by this flat end face absorption IC 27 and to this IC 27.This pressure head 21 is arranged on these fixing structure 22 belows and by fixing structure 22 fixings.This fixing structure 22 can be on directions X guide rail 23 move left and right, 23 on this directions X guide rail is arranged on the Y traversing guide 24 and can moves forward and backward along Y traversing guide 24.This brace table 25 is in order to support liquid crystal panel 26, and it normally fixedly installs.Behind the IC 27 in the IC supply disk 28 by pressure head 21 is arranged on by the vacuum adsorption force absorption, need moving by control device (figure does not show) control directions X guide rail 23 and Y traversing guide 24, after the correct in vertical direction contraposition of the contact conductor of IC 27 and liquid crystal panel 26, moved towards the direction near liquid crystal panel 26 by pressure head 21, IC 27 is pressed together on the contact conductor of liquid crystal panel 26 the most at last.

But, because the mechanism that above-mentioned thermal pressure welding equipment 2 adopts directions

X guide rail

23 and 24 conducts of Y traversing guide to regulate the position of IC 27, the intensity of these two

guide rails

23 and 24 bound fractions a little less than, and there is certain error usually in its two combination, moreover, because also need to bear the acting force of vertical direction during pressure head 21 pressings, the mechanism's matching relationship that relates to is many more, the degree of accuracy that final IC 27 and liquid crystal panel 26 are installed is difficult to guarantee more.In addition, this kind structure makes that also whole thermal pressure welding equipment 2 volumes are bigger, takes up room.

In order to address the above problem, another thermal pressure welding equipment is developed.As shown in Figure 3, the thermal pressure welding equipment 3 of the prior art discloses No. the 5th, 894,657, United States Patent (USP) at bulletin on April 20th, 1999.This thermal pressure welding equipment 3 also is to be used for electron device such as IC 37 are installed in liquid crystal panel 36, and it comprises a pressure head 31, a directions X guide rail 33, a Y traversing guide 34 and a brace table 35.This directions X guide rail 33 is single shaft mobile devices, and it can drive pressure head 31 and move at left and right directions.This brace table 35 is in order to immobile liquid crystal panel 36, and it can move in the Y traversing guide 34 upper edges Y direction vertical with directions X.IC 37 in the IC supply disk 38 by this pressure head 31 is arranged on by the vacuum adsorption force absorption, and after being fixed on liquid crystal panel 36 on the brace table 35, need (English be Recognition Camera by a imaging system between pressure head 31 and liquid crystal panel 36, figure does not show) make brace table 35 drive liquid crystal panel 36 to first precalculated positions, make pressure head 31 drive IC 37 by this imaging system again to second precalculated position corresponding with above-mentioned first precalculated position, after these two kinds of precalculated positions are all determined, think this IC 37 and liquid crystal panel 36 accurately contraposition, can be moved towards the direction near liquid crystal panel 36 by pressure head 31, IC37 is pressed together on the contact conductor of liquid crystal panel 36 the most at last.

This kind thermal pressure welding equipment 3 adopts a single shaft mobile device, be that directions X guide rail 23 drive pressure heads 31 move, though the mode that the guide rail 23 of more above-mentioned thermal pressure welding equipment 2 employing both directions and 24 drive pressure heads 21 move has reduced mechanism error to a certain degree, but because pressure head 31 still need be made move left and right on directions X guide rail 23, oneself moving and exerting pressure in vertical direction, the inter-agency error that cooperatively interacts still exists.In addition, in order to keep the sufficient intensity of directions X guide rail 23, the design of directions X guide rail 23 also comparatively needs large-size, can take up room equally.

And, because the imaging system of this thermal pressure welding equipment 3 is between pressure head 31 and liquid crystal panel 36, it needs constantly to move, to catch the position of this IC 37 and liquid crystal panel 36, this IC 37 and liquid crystal panel 36 also need move in addition, this kind mode exists the position identification of electron device accurate inadequately to a certain extent, also can cause the contraposition of IC 37 and liquid crystal panel 36 accurate inadequately.

[summary of the invention]

For the imaging system of the thermal pressure welding equipment that overcomes prior art to the identification of the position of electron device and liquid crystal panel problem accurately inadequately, the invention provides a kind of can be from the side the accurate imaging system of the position of identification electron device and liquid crystal panel.

The technical scheme that technical solution problem of the present invention is adopted is: a kind of imaging system is provided, it comprises a reflective optical system, a semi-penetration semi-reflective device, a CCD camera head, object lens, three subsidy mirrors and a light source, this reflective optical system, semi-penetration semi-reflective device and CCD camera head are arranged on the axis, the workplace of this reflective optical system and this semi-penetration semi-reflective device is parallel to each other and becomes 45 degree, this light source to be arranged on perpendicular on this axis and the direction relative with the workplace of this semi-penetration semi-reflective device with this axis.These object lens are between this reflective optical system and semi-penetration semi-reflective device, this first the subsidy mirror between these object lens and semi-penetration semi-reflective device, this second subsidy mirror is between this semi-penetration semi-reflective device and CCD camera head, and the 3rd subsidy mirror is between this light source and semi-penetration semi-reflective device.This reflective optical system, object lens, first subsidy mirror, semi-penetration semi-reflective device and second subsidy mirror are arranged in the cylinder.A through hole is set on this cylinder, and this through hole is on perpendicular to this axis and the direction relative with this reflective optical system.

Compared to prior art, because the light that imaging system of the present invention can make light source send passes through semi-penetration semi-reflective device vertical reflection to reflective optical system, this reflective optical system is again with the light vertical reflection and illuminate electron device, the light of this electron device reflection is to be sent on the semi-penetration semi-reflective device with the opposite approach of above-mentioned light circuit, and some light is sent on the CCD camera head clear picture of the electron device that this kind mode forms, accurate through this semi-penetration semi-reflective device.

[description of drawings]

Fig. 1 is a kind of diagrammatic cross-section of the structure that drive IC and liquid crystal panel are electrically connected in the COG mode of prior art.

Fig. 2 is a kind of floor map of thermal pressure welding equipment of prior art.

Fig. 3 is the floor map of the thermal pressure welding equipment of another prior art.

Fig. 4 is the front view of thermal pressure welding equipment of the present invention.

Fig. 5 is the floor map of the locating device of thermal pressure welding equipment of the present invention.

Fig. 6 is the process synoptic diagram that the corrective gauge of locating device shown in Figure 5 is proofreaied and correct the drive IC position.

Fig. 7 is the diagrammatic cross-section of the imaging system of thermal pressure welding equipment of the present invention.

Fig. 8 is the light path synoptic diagram between imaging system shown in Figure 7 and liquid crystal panel.

Fig. 9 utilizes imaging system of the present invention drive IC and liquid crystal panel to be carried out the process synoptic diagram of position identification and correction.

[embodiment]

With reference to shown in Figure 4, be the floor map of thermal pressure welding equipment of the present invention.This thermal pressure welding equipment 4 comprises a thermal head device 41, location device 42, a brace table 43 and two imaging systems 44.

This thermal head device 41 comprises first cylinder 411, second cylinder 412 and pressure head 415.One shaft coupling 413 couples together the axle center of this first cylinder 411 and second cylinder 412 and forms a duplex cylinder, one fixing piece 414 is in order to fix this pressure head 415 and to cooperate with a chute (figure does not show), move up and down to guarantee that this pressure head 415 is only done, and this fixing piece 414 is installed in this second cylinder, 412 belows.This first cylinder 411 and second cylinder 412 can move up and down separately, come and go mobile in one direction to drive this pressure head 415.This pressure head 415 comes and goes the Stroke Control of mobile distance by this first cylinder 411 and/or second cylinder 412.

This brace table 43 is arranged on locating device 42 belows, and and this thermal head device 41 over against, it can do certain fine setting in directions X, Y direction, and can do certain rotation in surface level.This brace table 43 and pressure head 415 over against the position make with light transmissive material.Certainly, this brace table 43 also can be arranged on a folk prescription on guide rail (figure does not show), and when placing liquid crystal panel 200, this brace table 43 can move to the position of handled easily.

With reference to Fig. 5, this locating device 42 comprises a directions X guide rail 422, a Y traversing guide 421 and a corrective gauge 423 together.This directions X guide rail 422 and Y traversing guide 421 can adopt the screw mandrel track-type facilities, and this Y traversing guide 421 is arranged on this directions X guide rail 422.One servomotor 426 connects this directions X guide rail 422, and to drive this directions X guide rail 422 work, the work of this directions X guide rail 422 drives these Y traversing guide 421 integral body in the directions X move left and right.This Y traversing guide 421 self also passes through a servomotor 427 driving work, and this corrective gauge 423 promptly is arranged on this Y traversing guide 421, moves forward and backward in the Y direction to drive these corrective gauges 423 by this Y traversing guide 421, and this corrective gauge 423 comprises one

Connected in star should

Connected in star is surrounded by a Y directional reference face 424, directions X reference field 425 and the 2nd Y directional reference face 426.One IC supply disk 45 also is arranged on this Y traversing guide 421, and can be moved forward and backward in the Y direction by these Y traversing guide 421 drives.Because this pressure head 415 is fixed at X and Y direction, the effect of this Y traversing guide 421 and directions X guide rail 422 just is to drive this IC supply disk 45 under this pressure head 415, drive these pressure heads 415 near an IC 100 to be laminated in the IC supply disk 45 by cylinder 412, and draw this IC 100 by the vacuum adsorption force of this pressure head 415.

Owing to have the gap between IC accepting groove in the IC supply disk 45 and the IC 100, it cooperates can not reach very accurate usually, and after this IC 100 was adsorbed on the pressure head 415, there were deviation in its meeting and predetermined absorption position.The effect of this corrective gauge 423 is further proofreaied and correct the position of IC100 with regard to being.

The trimming process figure of the position of 423 couples of IC 100 of this corrective gauge please refer to Fig. 6.With reference to Fig. 6 (a), suppose that reference point 300 is reference positions on the pressure head 415, when the central point 101 of IC 100 overlaps fully with this reference point 300, think that just the location of 415 couples of IC100 of this pressure head is accurately, shown in this Fig. 6 (a) is the original position of pressure head 415 from the IC 100 of IC supply disk 45 interior absorption, central point 101 and the reference point 300 of this IC 100 have certain deviation, need this moment to promote this IC 100 from reference position with direction shown in arrow Fig. 6 (a) by this corrective gauge 423; With reference to Fig. 6 (b), a Y directional reference face 424 of this corrective gauge 423 is corrected to the central point 101 of IC 100 consistent in the Y direction with reference point 300; With reference to Fig. 6 (c), this corrective gauge 423 promotes this IC 100 from reference position with direction shown in arrow Fig. 6 (c) again; With reference to Fig. 6 (d), the directions X reference field 425 of this corrective gauge 423 is corrected to the central point 101 of IC 100 consistent at directions X with reference point 300, and overlaps fully; With reference to Fig. 6 (e), this corrective gauge 423 returns reference position, leaves this pressure head 415 subsequently.

Certainly, after finishing the step shown in Fig. 6 (b), can also the central point 101 of IC 100 be carried out second-order correction in the Y direction by the 2nd Y directional reference face 426 of this corrective gauge 423.

For making things convenient for the program setting, IC 100 is corrected to accurate position by original position, need be with the stationkeeping that is provided with of corrective gauge 423 and IC supply disk 45.

The position of this IC 100 is after overcorrect, this first cylinder 411 and second cylinder 412 drive this pressure head 415 together to predetermined pressing position, at this moment, liquid crystal panel 200 is not placed on brace table 43 as yet, but make a video recording by two end angles of 44 couples of IC 100 of two imaging systems earlier, and be presented at respectively on two monitors 461,462 (ginseng Fig. 9), subsequently, this first cylinder 411 and second cylinder 412 drive this pressure head 415 together and rise, and liquid crystal panel 200 are placed on the brace table 43 again.

With reference to Fig. 7, this imaging system 44 comprises a total reflection prism 443, object lens 444, a subsidy mirror 454, a duplex prism 445, two

subsidy mirrors

446 and 452, and a CCD (Charge Coupled Device, charge-coupled image sensor) camera head 448.The workplace of this total reflection prism 443 is in order to the light vertical reflection, and 454 pairs of light of this subsidy mirror play amplification.This duplex prism 445 is combinations of two prisms, and the face that these two prisms are combined is a workplace, and ray cast can realize the effect of semi-penetration semi-reflective on this workplace.This subsidy mirror 446 is photography subsidy mirror, and it plays multistage amplification to light.This total reflection prism 443, object lens 444, subsidy mirror 454, duplex prism 445 and subsidy mirror 446 are in line and are arranged in the cylinder 441.This subsidy mirror 452 by a cylinder 451 with this duplex prism 445 over against and be provided with perpendicular to the mode of above-mentioned rectilinear direction, the light that is sent by optical fiber 453 with guiding is to this duplex prism 445.This cylinder 441 is connected with CCD camera head 448, and offers an opening 442 over against the position with this total reflection prism 443.

With reference to Fig. 8, be the index path between this imaging system 44 and this liquid crystal panel 200 together.The opening 442 of this cylinder 441 is over against the contact conductor position of liquid crystal panel 200, after light that optical fiber 453 sends is to this duplex prism 445, reflect opening 442 by these duplex prism 445 reflections and through total reflection prism 443, because the position printing opacity of brace table 43 counter electrodes lead-in wire, and liquid crystal panel 200 also is that clear glass is made, so light can shine on the contact conductor of liquid crystal panel 200, this contact conductor reflexes to light on this total reflection prism 443 again, and be transferred on this duplex prism 445 by object lens 444 and subsidy mirror 454 after these total reflection prism 443 reflections, because this duplex prism 445 is Transflective lens, part light can see through this duplex prism 445, and is transferred to CCD camera head 448 by subsidy mirror 446.

Together with reference to Fig. 9, all be presented on monitor 461 and 462 through the IC 100 of imaging system 44 formation and the image of liquid crystal panel 200 contact conductors, wherein, the image of the end angle 100a of IC 100 is presented on the monitor 461, be presented on the monitor 462 with the image of another end angle 100b of the paired angular dependence of this end angle 100a, because the amplification of this imaging system 44, the projection 101 on this IC 100 is clear and legible.

Fig. 9 (a), Fig. 9 (b) and Fig. 9 (c) show the process synoptic diagram that carries out position identification and correction by 44 couples of IC 100 of imaging system and liquid crystal panel 300.Wherein, Fig. 9 (a) shows the image of 44 couples of IC 100 of this imaging system, this image is the image of liquid crystal panel 200 IC 100 when not being placed on the brace table 43 as yet, placement of liquid crystal panel 200 subsequently and the image that the position identification of liquid crystal panel 200 is not influenced this IC 100; What Fig. 9 (b) represented is: in the image of fixing this IC 100 of demonstration, 44 pairs of liquid crystal panels of imaging system, 200 formed images are presented on monitor 461 and 462, there are deviation in the contact conductor 201 of liquid crystal panel 200 and the projection 101 of IC 100 at this moment again; Rely on the demonstration of this monitor 461 and 462, can regulate the position of brace table 43, up to the image that shows on monitor 461 and 462 till the projection 101 of contact conductor 201 and IC 100 overlaps shown in Fig. 9 (c), thermal head device 41 can be moved towards the direction near liquid crystal panel 200 then, IC 100 is pressed together on the contact conductor 201 of liquid crystal panel 200 the most at last.

The integrated operation process of thermal pressure welding equipment 4 of the present invention is described to Fig. 9 below in conjunction with Fig. 4.The operation steps of this thermal pressure welding equipment 4 comprises: the IC supply disk 45 that IC 100 will be housed is placed on this Y traversing guide 421; Drive IC supply disk 45 under this pressure head 415 by this locating device 42; Second cylinder 412 drives this pressure head 415 and descends absorption IC 100; This second gas 412 drives this pressure head 415 and rises, and this locating device 42 drives IC supply disk 45 and leaves pressure head 415; Second gas 412 drives these pressure heads 415 and drops to the position contour with corrective gauge 423 once more, and this locating device 42 drives corrective gauges 423 to pressure head 415 times; Position by 423 couples of IC 100 of this corrective gauge is regulated, is proofreaied and correct; This locating device 42 drives corrective gauge 423 and leaves pressure head 415; This first gas 411 and second cylinder 412 descend together, drive this pressure head 415 to predetermined pressing position; Respectively end angle 100a, the 100b of two paired angular dependences of IC 100 are taken pictures, image are presented on monitor 461 and 462 after the store images by these two imaging systems 44; This first cylinder 411 and/or second cylinder 412 drive this pressure head 415 and rise; Liquid crystal panel 200 is placed on the brace table 43, and, makes the image of liquid crystal panel 200 carry out contraposition the image that IC 100 is stored on the monitor by position device for identifying 44; This first cylinder 411 and/or second cylinder 412 descend, and drive this pressure head 415 IC 100 is pressed together on the contact conductor 201 of liquid crystal panel 200.

Thermal pressure welding equipment 4 of the present invention also can be used in COF (Chip On Film), TAB (Tape Auto Bonding) technology and carry out on the equipment of crimping, and it can also have following change design:

This corrective gauge 423

Connected in star can replace with a right angle Connected in star;

This total reflection prism 443 can replace with a fully-reflected plane mirror;

This duplex prism 445 can replace with a semi-penetration semi-reflective plate.

Claims

1. imaging system, it comprises a semi-penetration semi-reflective device, an one CCD camera head and a light source, it is characterized in that: this imaging system further comprises a reflective optical system, one object lens and three subsidy mirrors, this reflective optical system, semi-penetration semi-reflective device and CCD camera head are arranged on the axis, the workplace of this reflective optical system and this semi-penetration semi-reflective device is parallel to each other and becomes 45 to spend with this axis, this light source is arranged on perpendicular on this axis and the direction relative with the workplace of this semi-penetration semi-reflective device, these object lens are between this reflective optical system and semi-penetration semi-reflective device, this first the subsidy mirror between these object lens and semi-penetration semi-reflective device, this second subsidy mirror is between this semi-penetration semi-reflective device and CCD camera head, the 3rd subsidy mirror is between this light source and semi-penetration semi-reflective device, this reflective optical system, object lens, first subsidizes mirror, semi-penetration semi-reflective device and second subsidy mirror are arranged in the cylinder, a through hole is set on this cylinder, and this through hole is on perpendicular to this axis and the direction relative with this reflective optical system.

2. imaging system as claimed in claim 1 is characterized in that: further comprise a monitor, this monitor is connected with this CCD camera head.

3. imaging system as claimed in claim 1 is characterized in that: this reflective optical system is a total reflection prism.

4. imaging system as claimed in claim 1 is characterized in that: this reflective optical system is a fully-reflected plane mirror.

5. imaging system as claimed in claim 1 is characterized in that: this semi-penetration semi-reflective device is a semi-penetration semi-reflective plate.

6. imaging system as claimed in claim 1 is characterized in that: this semi-penetration semi-reflective device is a duplex prism.