CN100447997C - Electronic device - Google Patents

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Publication number
CN100447997C
CN100447997C CNB200510105464XA CN200510105464A CN100447997C CN 100447997 C CN100447997 C CN 100447997C CN B200510105464X A CNB200510105464X A CN B200510105464XA CN 200510105464 A CN200510105464 A CN 200510105464A CN 100447997 C CN100447997 C CN 100447997C
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CN
China
Prior art keywords
conductor
support plate
insulator
chip
electronic installation
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Expired - Fee Related
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CNB200510105464XA
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Chinese (zh)
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CN1941345A (en
Inventor
王忠诚
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Individual
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Priority to CNB200510105464XA priority Critical patent/CN100447997C/en
Publication of CN1941345A publication Critical patent/CN1941345A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention is concerned with the electronic equipment, including: at least one basic piece, the CMOS chip, the loading panel, the conducting piece; the CMOS chip joints and electric connects with the basic piece by the conducting piece; the loading panel sets on the CMOS chip and includes an insulator and at least a conductor; the insulator is with at least a first upper surface, a first under surface and a sidewall, the conductor is with at least a first upper surface, a first under surface and a sidewall, the conductor covers by the insulator that leads to at least part of the conductor sidewall in the insulator, a part of the conductor emerges at the first upper surface of the insulator, and the conductor if for the electric connection. The invention enhances the jointing area of the conductor and the insulator, improves the quality and the reliability of the electronic equipment, and improves the radiating ability of the CMOS chip because the conductor can be adjacent and open to the under surface of the insulator of the loading panel.

Description

A kind of electronic installation
Technical field
The present invention relates to a kind of electronic installation, be meant a kind of electronic installation that can reduce conductor wire materials and lifting device reliability (Reliability) especially.
Background technology
As shown in figure 20, for practising formula electronic installation 180, the power supply contact 91,92 that it comprises two different magnitudes of voltage is located on holding area 80 peripheries.One chip 20, is practised formula support plate 4, is arranged on the chip 20, practises formula support plate 4 lip-deep conductors 9 and is embodied as electrical contact respectively; Many electric-conductors 60, with conductor 9 and 30 electric connections of basic part of chip 20, habit formula support plate 4, this basic part 30 is embodied as circuit board respectively; In electronic installation 180, because the conductor 9 of the formula of habit support plate 4 is arranged on insulator 5 surfaces, therefore, in the process of making habit formula support plate 4, can and cause the reliability problem of unstable, the explanation of details are as follows Figure 21 A～21B and Figure 22 in the trickle gap of 5 generations of conductor 9 and insulator.
At first shown in Figure 21 A, 21B (cutaway view that Figure 21 B cuts along line of cut " A-A " for Figure 21 A), it is the structure of habit formula support plate 4 in manufacture process.In order to produce in a large number to reduce manufacturing cost, in process of production a plurality of habit formula support plates 4 are set together usually so that produces, this habit formula support plate 4 comprises: an insulator 5, insulator 5 is made by materials such as glass fibre, pottery or insulating resins.A plurality of conductors 9, conductor 9 are attached on the insulator 5, are made by copper or metal alloy (metalic alloy) etc., and implement an electroplating process again with the plating of electric conducting materials such as nickel, palladium, gold or silver in its surface on conductor 9, to be easy to and extraneous electric connection.A plurality of galvanic circles (trace) 2, the material of galvanic circle 2 and conductor 9 are identical and be attached on the insulator 5, and its function is metals such as nickel, palladium, gold or silver to be plated on conductor 9 surfaces when making 9 electrical communication of each conductor be beneficial to conductor 9 to implement electroplating processes.
Secondly, as shown in figure 22, it is after finishing the manufacturing process of Figure 21 A, provide one to cut instrument B and cut conductor 9 again in order to sanction, insulator 5 is to form habit formula support plate 4, because cutting instrument B directly contacts with conductor 9 and insulator 5 when cutting, make between the terminal 9A of insulator 5 surface and conductor 9 and produce trickle clearance G because of friction and the vibrations that cut instrument B, the reliability of practising formula support plate 4 in case clearance G produces promptly can variation, because of practising formula electronic installation 180 when the big environment of variations in temperature operates, can be because of chip 20, insulator 5, conductor 9, electric-conductor 60, basic part 30, conducting sphere 50 is different with the thermal coefficient of expansion (Coiefficient of ThermalExpansion) of packaging body 40, in rising-heat contracting-cold, make and produce thermal stress (Thermal stress) between each part and the phenomenon of pullling is arranged, especially when conductor 9 terminal 9A be embodied as with electric-conductor 60 electrically engage local time, clearance G place 5 of conductor 9 terminal 9A and insulators, can make clearance G become big gradually because of pullling of stress repeatedly, at last, this conductor 9 terminal 9A are from insulating barrier 5 sur-face peelings, cause electric-conductor 60 and the electrical joint of conductor 9 terminal 9A to be pulled apart because of rising-heat contracting-cold produces to pull, make the electrical transmission of 9 of electric-conductor 60 and conductors unstable, cause electronic installation 180 because of the loss of function of reliability variation.For overcoming the problem that clearance G causes,, manufacturing cost is increased though a welding resisting layer (Solder mask) can be set again on the formula of habit support plate 4 to reduce the phenomenon of peeling off of conductor 9.
Summary of the invention
At the problems referred to above, main purpose of the present invention is to provide a kind of electronic installation, and it can overcome the existing not high problem of electronic installation quality, improves the quality of electronic installation.
For achieving the above object, a kind of electronic installation provided by the present invention, it includes: at least one basic part, chip, support plate, electric-conductor; It is characterized in that: described chip engages with described basic part, and described chip electrically connects by described electric-conductor and described basic part; Described support plate is arranged on the described chip, and described support plate includes an insulator and at least one conductor; Described insulator has one first upper surface, first lower surface and abutment wall at least, described conductor has a upper surface, lower surface and side at least, wherein, described conductor is coated by described insulator, make the side of described conductor have at least a part to be embedded in the described insulator, the part of described conductor exposes to described insulator first upper surface, and described conductor-powered connection is used.
A kind of electronic installation that another technical scheme of the present invention is provided, it includes: at least one basic part, chip, support plate, electric-conductor; It is characterized in that: described chip engages with described basic part, and described chip electrically connects by described electric-conductor and described basic part; Described support plate is arranged on the described chip, and described support plate includes an insulator and at least one conductor; Described insulator has one first upper surface, first lower surface and abutment wall at least, described conductor has a upper surface, lower surface and side at least, wherein, described conductor engages with the abutment wall of described insulator, making described conductor and described insulator is adjacent setting, and described conductor-powered connection is used.
A kind of electronic installation that a technical scheme more of the present invention is provided, it includes: at least one basic part, chip, support plate, electric-conductor; It is characterized in that: described chip engages with described basic part, and described chip electrically connects by described electric-conductor and described basic part; Described support plate is arranged on the described chip, and described support plate includes an insulator and at least one conductor; Described insulator has one first upper surface, second upper surface, first lower surface and abutment wall at least, and described abutment wall is at first upper surface and second upper surface between the two; Described conductor has a upper surface, lower surface and side at least, wherein, the lower surface of described conductor has at least a part to engage with second upper surface of described insulator, and described conductor can be arranged on the second surface of described insulator, and some the power supply property connection of described conductor is used.
Owing to adopted above technical scheme, the present invention is had the following advantages: 1, the present invention promotes the electronic installation reliability because of the bonding area that increases conductor and insulator; 2, the present invention implements the thin electronic installation heat-sinking capability that promoted because of the integral thickness of support plate; 3, the present invention avoids short circuit problem between conductor wire because of conductor can protrude insulator surface; 4, the present invention can stepped setting avoid the problem that is short-circuited between conductor wire because of conductor; 5, the present invention makes the design of electronic installation have more elasticity because of the conductor of support plate can have extension; 6, the present invention has shortened conductor wire length because of power supply contact moves to support plate from basic part, and makes the design of electronic installation can have more elasticity.
Description of drawings
Figure 1A a is the vertical view of first kind support plate of the present invention;
Figure 1A b is the cutaway view of Figure 1A a;
Figure 1B～1H is the cutaway view of first kind support plate of the present invention;
Fig. 1 J～1L is the cutaway view of first kind support plate of the present invention;
Fig. 1 M～1N is the cutaway view of the present invention's second class support plate;
Fig. 1 P～1R is the cutaway view of the present invention's second class support plate;
Fig. 1 S is the cutaway view of first kind support plate of the present invention;
Fig. 1 S-1～1S-9 is the cutaway view of the present invention's the 3rd class support plate;
Fig. 1 S-10a is the vertical view of the present invention's the 3rd class support plate;
Fig. 1 S-10b is the cutaway view of Fig. 1 S-10a;
Fig. 2 is a first embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Fig. 3 is a second embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Fig. 4 is a third embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Fig. 5 is a fourth embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Fig. 6 is a fifth embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Fig. 7 is a sixth embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Fig. 8 is a seventh embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Fig. 9 is an eighth embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Figure 10 is a ninth embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Figure 11 is a tenth embodiment of the invention, uses the electronic installation cutaway view of first kind support plate;
Figure 12 is an eleventh embodiment of the invention, with the electronic installation cutaway view of first kind support plate;
Figure 13 is a twelveth embodiment of the invention, with the electronic installation cutaway view of first kind support plate;
Figure 14 is a thriteenth embodiment of the invention, with the electronic installation cutaway view of first kind support plate;
Figure 15 is a fourteenth embodiment of the invention, with the electronic installation cutaway view of the second class support plate;
Figure 16 is a fifteenth embodiment of the invention, with the electronic installation cutaway view of the second class support plate;
Figure 17 is a sixteenth embodiment of the invention, with the electronic installation cutaway view of the second class support plate;
Figure 18 is a seventeenth embodiment of the invention, with the electronic installation cutaway view of the 3rd class support plate;
Figure 19 is an eighteenth embodiment of the invention, with the electronic installation cutaway view of first kind support plate;
Figure 20 is the cutaway view of habit formula electronic installation;
Figure 21 A is the vertical view of habit formula support plate;
Figure 21 B is the cutaway view of Figure 21 A;
Figure 22 is the cutaway view of habit formula support plate.
Embodiment
For the effect that describes structure of the present invention in detail and reached, existing under following some embodiment and the conjunction with figs. explanation.
First kind support plate provided by the present invention is made up of insulator and conductor, now according to following accompanying drawing in detail its structure and function is described in detail.
Shown in Figure 1A a, 1Ab (Figure 1A b is the cutaway view of Figure 1A a), a support plate 90, it comprises: an insulator 46, it has one first upper surface 41, one first lower surface 44 and an abutment wall 43; One conductor 17, it has a upper surface 11, a lower surface 12, side 16 and an end 19, the side 16 of this conductor 17, lower surface 12 coat with terminal 19 insulated bodys 46, so, conductor 17 just is embedded in the insulator 46, and wherein the upper surface 11 of conductor 17 exposes to insulator 46 first upper surfaces 41 power supply property connections usefulness.In support plate 90, because conductor 17 is embedded in the insulator 46, just conductor 17 is not only to be arranged on insulator first upper surface 41 by its lower surface 12, but by its side 16 and lower surface 12 thereof with in insulator 46 engages and is embedded in insulator 46.So, just increase the area that conductor 17 engages with insulator 46, but make conductor 17 insulated bodys 46 coat more firmly, can avoid in producing the process of support plate 90 lower surface that friction and vibrations because of the instrument of cutting produce conductor 17 ends 19 and the phenomenon that insulator 46 is peeled off thus, and then avoid producing the problem that conductor wire is torn etc., improve the reliability of electronic installation.Because conductor 17 is embedded in the insulator 46, makes the integral thickness of support plate 90 can do thinly, and help the application of industry again with the saving material.
Shown in Figure 1B, a support plate 90, it comprises: an insulator 46; One conductor, 17 insulated bodys 46 coat and are embedded in the insulator 46, and conductor 17 tool recesses 18, make conductor 17 have a upper surface 11 and a lower surface 12 at least, make the more firm of conductor 17 insulated bodys 46 coatings, and its upper surface 11 and all outer separately insulator 46 first upper and lower surperficial 41, the 44 power supply property connections usefulness that are exposed at of lower surface 12.Owing to be exposed at insulator 46 first lower surfaces 44 outside conductor 17 lower surfaces 12, can promote the heat-sinking capability of chip thus in addition, thereby improve the reliability of electronic installation.
Shown in Fig. 1 C, a support plate 90, it comprises: an insulator 46; Two conductors 17, the equal insulated body 46 of 17A coat, conductor 17,17A are embedded in the insulator 46, wherein conductor 17 has recess 18, making conductor 17 upper surfaces 11 protrude from the 41 power supply property connections of insulator 46 first upper surfaces uses, and conductor 17 upper surfaces 11 are higher than upper surface 11a one height H of conductor 17a, conductor 17 and conductor 17a are positioned on the horizontal plane inequality, and the advantage that other relevant conductor 17 upper surfaces 11 are convex shape sees also the explanation of Fig. 8.
Shown in Fig. 1 D, one support plate 90, it comprises: two conductors, 17 equal insulated bodys 46 coat, wherein, the upper surface 11 of each conductor 17 and lower surface 12 all protrude and expose in insulator 46 first upper surfaces 41 and first lower surface, 44 outsides, so, the upper surface 11, lower surface 12 that makes conductor 17 except that the connection of power supply property with, also can promote the chip cooling ability.
Shown in Fig. 1 E, a support plate 90, it comprises: an insulator 46 has recess 47, makes support plate 90 be convex shape, and makes insulator 46 have one first upper surface 41 and second upper surface 42; Two conductors 17 and another conductor 17a are coated by insulator 46 all, and wherein, two conductors, 17 upper surfaces expose in insulator 46 second upper surfaces 42 power supply property connection usefulness, and another conductor 17a is embodied as heat dissipation path, to promote the heat-sinking capability of support plate 90.
Shown in Fig. 1 F, one support plate 90, it comprises: an insulator 46, insulator 46 has the recess 47 of a non-penetration state, make support plate 90 be recess, and make insulator 46 have first and second upper surface 41,42 and recess 47, recess 47 can be for taking in chip, packaging body, another conductor or other object, and recess 47 can make support plate 90 increase and the contact area of packaging body (not shown), to promote the bond strength of support plate 90 and packaging body; Two conductors 17, insulated body 46 coats, and conductor 17 upper surfaces 11 are not coated in the insulator 46.
Shown in Fig. 1 G, a support plate 90, it comprises: an insulator 46; The equal insulated body of two conductors 17 and another conductor 17a 46 coats and its upper surface 11,11a all exposes and protrude from insulator 46 surperficial height H, use for electrically connecting, wherein two conductors 17 have extension 17h respectively, extension 17h engages with insulator 46 first upper surfaces 41, and be positioned as close to insulator abutment wall 43 and be provided with, be beneficial to electrically connect with conductor wire.Because the extension 17h of conductor 17 is bonded on insulator 46 first upper surfaces 41, can freely stretch by demand, to form different preset shape patterns (Patterns), therefore can reduce the restriction that support plate 90 designs are used, improve the practicality of support plate 90.In addition, each conductor 17,17a lower surface 12,12a also insulated body 46 coat, wherein the lower surface 12 of each conductor, 12a are as far as possible near insulator 46 first lower surfaces 44, so can shorten the distance D of each lower surface 12,12a and insulator 46 first lower surfaces 44, thereby promote the heat-sinking capability of support plate 90.Simultaneously, owing to conductor 17 extension 17h can freely extend at insulator 46 first upper surfaces 41, thus can increase area, the volume of extension 17h by demand, to promote the heat-sinking capability of support plate 90.
Shown in Fig. 1 H, a support plate 90, its structure is similar to Fig. 1 G, but the lower surface 12 of each conductor 17,17a, 12a all expose to insulator 46 first lower surfaces 44, make conductor 17,17a except that the connection of power supply property with also can improve the heat-sinking capability of chip.Also can at support plate 90 lower surfaces a plurality of conductors (dotted line among the figure) 17b be set in addition by demand, and each conductor 17b is engaged respectively with lower surface 12, the 12a of conductor 17,17a, so, support plate 90 not only can electrically connect to external world by conductor 17,17a, 17b, also can increase the heat-sinking capability that promotes support plate 90 with the chip contact area because of conductor 17b.
Shown in Fig. 1 J, a support plate 90, it comprises: an insulator 46, insulator 46 is made up of one first insulator 48 and one second insulator 49; The equal insulated body 46 of two conductors 17 and another conductor 17a coats, wherein, conductor 17a has recess 18, extension 17h, and extension 17h is coated by first insulator 48, the upper surface 11a of conductor 17a exposes in insulator 46 first upper surfaces 41 externally fed connection usefulness, and the lower surface 12 of conductor 17,17a, 12a all protrudes and expose to insulator 46 first lower surfaces 44; In the present embodiment, conductor 17,17a can coat by demand coverlet one insulator 46, also can make conductor 17a have the hole of a penetration state on demand.
Shown in Fig. 1 K, a support plate 90, it comprises: an insulator 46; A plurality of conductors 17 are positioned at the first upper and lower surperficial 41,44 of insulator 46, and each conductor 17 equal insulated body 46 coats and is embedded in the insulator 46, and makes each conductor 17 upper surface 11 expose to insulator 46 first upper and lower surperficial 41,44; A plurality of conductive through holes 95 are pressed demand respectively with insulator 46 first upper and lower surperficial 41,44 each corresponding conductor 17 electrical communication; So, support plate 90 can all can electrically connect the upper and lower surface of support plate with the external world by conductive through hole (via) 95.
Shown in Fig. 1 L, a support plate 90, it comprises: an insulator 46; The equal insulated bodys 46 of two conductors 17 coat, and make the horizontal plane of conductor 17 upper surfaces 11 be lower than the horizontal plane of insulator 46 first upper surfaces 41, make support plate 90 tools one recess 94, strengthen the then intensity of support plate 90 and packaging body to increase surface area.
The second class support plate 90 provided by the present invention also is made up of insulator and conductor, wherein the insulator 46 of support plate 90 can have first insulator and one second insulator by demand, and that conductor also can form by demand is stepped, can avoid conductor wire to contact with each other thus and cause the phenomenon of short circuit.And can one assembly be set by demand in the insulator, this assembly is embodied as heat sink to promote support plate 90 heat-sinking capabilities, now according to following view in detail its structure and function is described in detail.
Shown in Fig. 1 M, a support plate 90, it comprises: an insulator 46; The conductor 17 equal insulated bodys 46 of two preset shapes coat, two conductors 17 are all stepped and have a first 171, second portion 172, third part 173 respectively, wherein second portion 172 links together first 171 and does not expose outside insulator 46 with third part 173, only makes the upper surface of first 171, third part 173 be exposed to insulator 46 power supply property connections usefulness.Because first 171 is positioned at different level with third part 173, cause short circuit phenomenon so can avoid conductor wire to contact with each other, and second portion 172 upper surfaces also insulated body 46 coat, so just increased the bonding area of conductor 17 with insulator 46, more firmly insulated body 46 is fixing to make conductor 17, avoid because of thermal stress causes the phenomenon of peeling off, improve the quality of support plate 90.Wherein, conductor 17 is in the outward appearance of insulator surface and does not connect shape.
Shown in Fig. 1 N, a support plate 90, it comprises: an insulator 46; The equal insulated bodys 46 of the conductor 17 of two preset shapes coat, and two conductors 17 are all stepped and have a first 171, second portion 172, third part 173 respectively.Second portion 172 links together first 171 with third part 173, wherein, third part 173 lower surface 12c also are exposed to insulator 46 power supply property connections and use.One assembly 85 engages with conductor 17a and insulated body 46 coats, and assembly 85 is embodied as heat sink to promote support plate 90 heat-sinking capabilities.One to stick together part 55 cemented with each conductor 17, thus, can prevent the phenomenon of conductor 17 generation warpage before insulated body 46 coats, and is beneficial to the production operation of support plate 90.
Shown in Fig. 1 P, a support plate 90, it comprises: an insulator 46, comprise one first insulator 48, second insulator 49, first upper surface 41, second upper surface 42, abutment wall 43, abutment wall 43 is at first upper surface 41 and second upper surface 42 between the two.Two conductors 17 have first, second and third part 171,172,173 and stepped respectively, conductor 17 engages and is arranged on the insulator 46 with insulator 46, wherein conductor 17 extends to second upper surface 42 from insulator 46 first upper surfaces 41 via abutment wall 43 power supply property connection usefulness is set.Because the stepped shape of conductor, therefore, the area that the packed body of conductor is coated increases, and makes conductor engage more firmly with packaging body, is difficult for the problem that generation packaging body and support plate are peeled off.Simultaneously, conductor also can increase the area that engages with insulator 46 and it more firmly is fixed on the insulator 46.In addition, first insulator 48 can be asked as required and be embodied as adhesive tape (adhesive tape) in the present embodiment, and second insulator 49 then can be embodied as viscose body (epoxy, glue).
Shown in Fig. 1 Q, a support plate 90, it comprises: an insulator 46 is stepped; One conductor 17 is arranged on the insulator 46 also stepped, and its side 16 exposes to insulator 46 power supply property connections usefulness.
Shown in Fig. 1 R, a support plate 90, it comprises: an insulator 46; Two conductors 17 are stepped, have first, second and third part 171,172,173 and insulated body 46 respectively and coat, and a part that makes conductor 17 surfaces not insulated body 46 be coated with the connection of power supply property and use.Make also insulated body 46 coatings of a conductor 17a, and make the part of conductor 17a protrude from insulator 46 first upper surfaces 41 for electrically connecting usefulness.
The 3rd class support plate provided by the present invention also is made up of insulator and conductor, wherein, the 3rd class support plate is the support plate that is derived by first kind support plate of the present invention (Fig. 1 S), just, after the support plate shown in Fig. 1 S formed, manufacturing process was implemented on the support plate by providing one or more etching, cut etc. again, in view of the above, can form the structure shown in Fig. 1 S-1～1S-10B, be described in detail as follows:
Shown in Fig. 1 S, a support plate 90 is first kind support plate of the present invention, and it comprises: an insulator 46; One conductor 17, wherein conductor 17 each side 16 coat and are embedded in the insulator 46 with each lower surface 12 equal insulated body 46, and conductor 17 upper surfaces 11 protrude and expose at insulator 46 first upper surfaces 41 for electrically connecting usefulness.
Shown in Fig. 1 S-1, one support plate 9A, its support plate for deriving by support plate 90 shown in Fig. 1 S, support plate 9A is at the support plate that carries out on the conductor 17 of support plate 90 shown in Fig. 1 S forming after the etching manufacturing process, it includes: an insulator 46 has first upper surface 41, second upper surface 42, two recesses 47 and four abutment walls 43, and abutment wall 43 is at first upper surface 41 and second upper surface 42 between the two.Four conductors 17, each conductor 17 has lower surface 12, side 16 and extension 17h, wherein, second upper surface 42 is provided with each conductor 17 along insulator 46 abutment walls 43 to insulator from insulator 46 first upper surfaces 41, wherein conductor 17 another side 16n are positioned at recess 47, thus, increased the area that conductor 17 engages with insulator 46, make conductor 17 more firmly insulated body 46 fix, and because the packaging body (not shown) can be received in the recess 47, conductor 17 can be fixed by more firmly packed body, so can avoid conductor 17 can promote the reliability of support plate 9A from insulator 46 disengagings.In the present embodiment, each conductor 17 lower surfaces 12 can expose in insulator 46 first lower surfaces 44 outsides by demand, and recess 47 can not be provided with by demand yet.
Shown in Fig. 1 S-2, one support plate 9B, it is the support plate of being derived by the support plate 9A shown in Fig. 1 S-1, wherein, the structure of support plate 9B and dotted portion combination is identical with the support plate 9A of Fig. 1 S-1, and support plate 9B only is the support plate that forms behind the cutting processing procedure providing again on the insulator 46 of support plate 9A, make solid line support plate 9B partly be rendered as one and have the structure of an insulator 46, an insulator 46 recesses 47, two conductors 17, wherein, another side 16n of conductor 17 does not engage with insulator 46 and exposes to insulator recess 47.
Shown in Fig. 1 S-3, one support plate 9C, it also is the support plate of being derived by the support plate 9A shown in Fig. 1 S-1, wherein, the structure of support plate 9C and dotted portion combination is identical with the support plate 9A of Fig. 1 S-1, and support plate 9C only is the support plate that forms behind the cutting processing procedure providing again on the insulator 46 of support plate 9A, make solid line support plate 9C partly be rendered as one and have the structure of an insulator 46, two conductors 17, wherein, another side 16n of conductor 17 does not engage with insulator 46, and the outer most edge because of conductor 17 side 16n are positioned at support plate 9C in view of the above, can shorten the length of conductor wire.
Shown in Fig. 1 S-4, one support plate 9D, it also is the support plate of being derived by the support plate 90 shown in Fig. 1 S, wherein, support plate 9D is at the support plate that carries out on the support plate 90 shown in Fig. 1 S forming behind an etching, the cutting process, makes support plate 9D be rendered as one and has the structure of an insulator 46, two conductors 17, wherein, insulator 46 has first upper surface 41, second upper surface 42, first lower surface 44, abutment wall 43 and another abutment wall 43n, and abutment wall 43 is at first upper surface 41 and second upper surface 42 between the two.Two conductors 17 shape that is rectangle, it has upper surface 11, lower surface 12 and side 16 respectively, and conductor 17 lower surfaces 12 are arranged on insulator 46 second upper surfaces 42, conductor 17 sides 16 engage with insulator 46 abutment walls 43, wherein, conductor 17 another side 16n do not engage with insulator 46, and conductor 17 upper surfaces 11 do not protrude from insulator 46 first upper surfaces 41 for electrically connecting usefulness.
Shown in Fig. 1 S-5, one support plate 9E, it also is the support plate of being derived by the support plate 90 shown in Fig. 1 S, wherein, support plate 9E is at the support plate that carries out on the support plate shown in Fig. 1 S 90 forming behind an etching, the cutting process, makes support plate 9E be rendered as one and has the structure of an insulator 46, two conductors 17.Wherein, insulator 46 has first upper surface 41, second upper surface 42, first lower surface 44, abutment wall 43 and another abutment wall 43n, and abutment wall 43 be positioned at first upper surface 41 and second upper surface 42 the two.Two conductors 17 shape that is rectangle, it has upper surface 11, lower surface 12, side 16 and another side 16n respectively, and the part of conductor 17 lower surfaces 12 is arranged on insulator 46 second upper surfaces 42, the side 16 of conductor 17 engages with the abutment wall 43 of insulator 46, and conductor 17 upper surfaces 11 do not protrude from insulator 46 first upper surfaces 41 for electrically connecting usefulness.Wherein, conductor 17 another side 16n do not engage and protrude from insulator 46 abutment wall 43n with insulator 46, the length of conductor wire can be more shortened in view of the above, and conductor wire can be held in the space between insulator 46 side 43n and conductor 17 side 16n to promote the practicality of support plate 9E.
Shown in Fig. 1 S-6, one support plate 9F, it also is the support plate of being derived by the support plate 90 shown in Fig. 1 S, wherein, support plate 9F is at the support plate that carries out on the support plate 90 shown in Fig. 1 S forming behind an etching, the cutting process, and support plate 9F is rendered as one and has the structure of an insulator 46, conductor 17, wherein, insulator 46 has first upper surface 41, second upper surface 42, first lower surface 44 and abutment wall 43, and abutment wall 43 be positioned at first upper surface 41 and second upper surface 42 the two.Conductor 17, it has upper surface 11, many lower surfaces 12,12b, side 16 and another side 16n, and conductor 17 lower surfaces 12,12b are separately positioned on insulator 46 second upper surfaces 42 and first upper surface 41, conductor 17 sides 16 engage with insulator 46 abutment walls 43, wherein, conductor 17 another side 16n do not engage with insulator 46 and expose to insulator 46.
Shown in Fig. 1 S-7, one support plate 9G, it is the support plate of being derived by the support plate 9F shown in Fig. 1 S-6, wherein, support plate 9G carries out forming behind an etching or the cutting process on support plate 9F conductor 17, and the difference of support plate 9F and support plate 9G only is that the conductor 17 of dotted portion is removed, make support plate 9G be rendered as one and have an insulator 46, two conductors (solid line person) 17, the structure of 17a, wherein, conductor 17 upper surfaces 11 are positioned on the different level with conductor 17a upper surface 11a, so, can avoid the problem that is short-circuited between the conductor wire of different potentials, simultaneously, can make conductor 17a upper surface 11a be lower than insulator 46 first upper surfaces 41 to increase the alternate position spike of conductor 17 and conductor 17a upper surface.
Shown in Fig. 1 S-8, one support plate 9H, it is the support plate of being derived by the support plate 9C shown in Fig. 1 S-3, wherein, support plate 9H carries out forming behind the process of lapping on support plate 9C insulator 46, and the difference of support plate 9H and support plate 9C only is that the insulator 46 of dotted portion is removed, and makes support plate 9H be rendered as one and has the structure of an insulator 46, two conductors 17.Wherein, conductor 17 lower surfaces 12 are not subjected to insulator 46 to coat and expose to insulator 46 first lower surfaces 44 outsides, so, conductor 17 not only the connection of power supply property with and can improve the heat-sinking capability of support plate 9H.
Shown in Fig. 1 S-9, one support plate 9J, it is the support plate of being derived by the support plate 9D shown in Fig. 1 S-4, wherein, support plate 9J forms after grinding manufacturing process carrying out one on the support plate 9D insulator 46, and the difference of support plate 9J and support plate 9D only is that the insulator 46 of dotted portion is removed, and makes support plate 9J be rendered as one and has the structure of an insulator 46, two conductors 17.Wherein, conductor 17 lower surfaces 12 are not coated by insulator 46 and expose to insulator 46 first lower surfaces 44 outsides.
Shown in Fig. 1 S-10a, 1S-10b (cutaway view that Fig. 1 S-10b cuts along line of cut " A-A " for Fig. 1 S-10a), one support plate 9K, it is the support plate of being derived by the support plate 90 shown in Fig. 1 S, wherein, support plate 9K carries out forming behind the etching process on the support plate 90 of Fig. 1 S, makes support plate 9K be rendered as a structure that contains an insulator 46 and four conductors 17,17a, 17k, 17p.Wherein, insulator 46 has one first upper surface 41, one second upper surface 42, one first lower surface 44 and abutment wall 43, and abutment wall 43 is at first upper surface 41 and second upper surface 42 between the two.One conductor, 17 oval in shape, have a upper surface 11, lower surface 12 and side 16, wherein, the lower surface 12 of conductor 17 engages with second upper surface 42 of insulator 46, conductor 17 sides 16 insulated bodys 46 coat, and the part of side 16 exposes to the abutment wall 43 of insulator 46, uses and conductor 17 upper surfaces 11 protrude and expose to the 41 power supply property connections of insulator 46 first upper surfaces.The rectangular shape tool one upper surface 11a of conductor 17a, lower surface 12a and four side 16a, wherein, conductor 17a lower surface 12a engages with second upper surface 42 of insulator 46, and the side 16a of conductor 17a does not all contact insulator 46 abutment walls 43 and exposes in atmosphere (atmosphere).Conductor 17k is designed to polygon-shaped by demand, and is arranged on second upper surface 42 of insulator 46.Conductor 17p is half-oval shaped, and is arranged on second upper surface 42 of insulator 46, and its side 16p contacts with the abutment wall 43 of insulator 46.In the present embodiment, the side 16 of conductor 17,17k, 16k can expose by demand but not protrude from the abutment wall 43 of insulator 46, extension also can be set extend insulator 46 first upper surfaces 41.
More than the support plate of first, second and third class, can change shape, pattern and the quantity of each structure of support plate to meet the demand of use by demand, insulator can be made by megohmite insulants such as colloid, pottery, glass or resins, conductor can be made by materials such as Copper Foil, nickel or other proper metal alloys, and conductor is exposed to the part of insulator the quality of metals such as silver, palladium or gold when promote electrically connecting can be set, simultaneously, can make the side of conductor exposed or be not exposed to the insulator abutment wall, protrude or do not protrude from the insulator abutment wall.Support plate removes can be by demand conductive through hole (Via; Fig. 1 K) conductor with each layer of support plate connects outside the electric connection each other, also can one welding resisting layer (solder mask) be set by demand, exposes to the conductor or the support plate surface of insulator with protection.
The utilization of relevant first, second and third class support plate and effect, now lift the following example and conjunction with figs. is described as follows:
As shown in Figure 2, be the electronic installation that first embodiment of the invention provided, it comprises: a basic part 30, basic part 30 is a circuit board, its first surface 31 has holding area 80 and uses for object is set, a plurality of electrical contact 70 rings are located at holding area 80 peripheries, and its second surface 32 is provided with a plurality of conducting sphere 50 power supply property connections and uses.One chip 20 is arranged on the holding area 80, and its chips 20 acting surfaces 21 have a plurality of electrical contact (not shown), and each electrical contact externally electrically connects for chip 20 and uses.One support plate 90 is arranged on the acting surface 21 of chip 20, and it has two conductors, is embodied as the cathode power supply contact 91 and the negative power supply contact 92 of power supply property connection usefulness respectively.Thus, the power supply contact function of basic part 30 just can be moved on the support plate 90, and some does not combine its chips 20 acting surfaces 21 with support plate 90, the electrical contact of acting surface 21 is exposed in support plate 90 externally fed connections use.Many electric-conductor 60 is embodied as conductor wire, respectively chip 20 and electrical contact 70 and support plate 90 positive and negative electrode power supply contacts 91,92 is electrically connected, and wherein, positive and negative electrode power supply contact 91,92 connects many electric-conductors 60 simultaneously to chip 20.One packaging body 40, encapsulate chip 20, electric-conductor 60, basic part 30 electrical contacts 70 and support plate 90.Thus example as can be known, the conductor wire length A makes the conductor wire length A be shortened and reduce consumption because of not crossing over positive and negative electrode power supply contact width W, E.And in support plate 90, because conductor all is embedded in the insulator 46, therefore can avoid producing the problem that electric-conductor 60 is torn, improve the reliability of this electronic installation.Because conductor is embedded in the insulator 46, make the integral thickness of support plate 90 can do again than the thin material that also can save insulator 46.
As shown in Figure 3, be the electronic installation that second embodiment of the invention provided, it comprises: a chip 20, many electric-conductors 60 are embodied as conductor wire and packaging body 40.One basic part 35 is embodied as the lead foot support, and it is made up of an insulator 45 and a plurality of lead foot (Lead) 75, and basic part 35 has a holding area 80 for chip 20 usefulness are set, and wherein, each lead foot 75 has an electrical contact 70 power supply property connections and uses.One support plate 90 is arranged on the chip 20, and makes the abutment wall 43 of support plate 90 insulators 46 exceed chip 20 sides 23, makes the negative power supply contact 92 can be more near electrical contact 70.Example because the side 13 of support plate 90 exceeds chip 20 sides 23, is more shortened the conductor wire length A that connects power supply contact and electrical contact as can be known thus, makes conductor wire length also more be shortened and reduce consumption.And another abutment wall 43K of support plate 90 insulators exceeds chip 20 another side 23K also can seek common ground as required the time.
As shown in Figure 4, be the electronic installation that third embodiment of the invention provided, it comprises: a chip 20; One basic part 30 is embodied as circuit board; Many electric-conductor 60 is embodied as conductor wire; One support plate 90, tool two conductors just are being embodied as respectively, negative power supply contact 91,92, the area of support plate 90 first upper surfaces 36 (it is to be combined with each conductor upper surface by insulator 46 first upper surfaces 41) is greater than the area of chip 20 acting surfaces 21, and the area of first lower surface 38 of support plate 90 is less than the area of chip 20 acting surfaces 21, wherein, support plate 90 is convex down because of having recess 94, make support plate 90 also have one second lower surface 39, and the height H of recess 94 is greater than the height of electric-conductor 60 on the chip 20, make support plate 90 not touch electric-conductor 60, and support plate 90 still can be arranged on the chip.One capacitive electronic building brick 200 insulated bodys 46 coat and are embedded in the insulator 46, and electrically connect with positive and negative electrode power supply contact 91,92, to reduce interference of noise, wherein electronic building brick 200 can be arranged on support plate 90 first upper surfaces and electrically connects with positive and negative electrode power supply contact 91,92 by demand.Thus example as can be known, support plate has recess and is down convex, can make the power supply contact 91,92 of support plate exceed sides of chip 23, and the conductor wire length that connects support plate and electrical contact is shortened.
As shown in Figure 5, be the electronic installation that fourth embodiment of the invention provided, it comprises: a chip 20, it has a middle section 28, and middle section 28 has a plurality of electrical contact (not shown).Two support plates 90,93 have a conductor respectively and are embedded in the insulator, two conductors are embodied as positive and negative electrode power supply contact 91,92 respectively, and support plate 90,93 is arranged at respectively on the chip 20, wherein, the electrical contact that is positioned at chip 20 middle sections 28 can pass through electric-conductor 60 and support plate 90,93 electric connections.Example is pressed the difference of external electrical contact position on the chip as can be known thus, and a plurality of support plates are set on chip, makes the conductor wire contraction in length of the electrical contact 70 that connects chip and basic part 30.In addition, present embodiment also can the two be provided with one or more chip again at basic part 30 and chip 20 by demand, so, just can make the effect of electronic installation become more powerful.
As shown in Figure 6, be the electronic installation that fifth embodiment of the invention provided, it comprises: a chip 20 engages with basic part 30, and chip 20 electrically connects by electric-conductor 60 and basic part 30.One support plate 90 is arranged on the chip 20, support plate 90 includes the conductor that an insulator 46 and is embodied as cathode power supply contact 91, wherein, insulator 46 directly combines with chip 20, and cathode power supply contact 91 is arranged on the insulator 46, and makes cathode power supply contact 91 upper surfaces have at least a part to expose to insulator 46 for electrically connecting usefulness.Insulator 46 first upper surfaces 41 and abutment wall 43 adopt non-planar irregularly shaped respectively in addition.By present embodiment as can be known, support plate 90 is set directly on the chip 20 by insulator 46, make support plate 90 not need to engage with chip 20 by the part that sticks together that an adhesive tape (adhesive tape) or viscose body materials such as (glue, epoxy) form, so, can save material and the integral thickness of electronic installation is able to thinner, help industry and use.In addition, present embodiment also can make the conductor of support plate 90 have the perforate of a penetration state by demand, in order to increase the area that conductor insulated body 46 coats, in view of the above, more can promote the reliability of electronic installation.
As shown in Figure 7, be the electronic installation that sixth embodiment of the invention provided, it comprises: a support plate 90, be arranged on the chip 20, and support plate 90 has the holding area 81 of a penetration state and is embodied as two conductors of cathode power supply contact 91.Another chip 25 is arranged on the chip 20, and is placed in support plate 90 holding areas 81, and chip 25 can be electrically connected by the positive supply contact 91 of electric-conductor 60 with support plate 90.Embodiment as can be known thus, because electronic installation has two chips 20,25 simultaneously, not only make the effect of electronic installation become more powerful, and since chip 25 for to be contained in the holding area 81 of support plate 90, make the integral thickness of electronic installation also can do thin and help the industry application.Wherein negative power supply contact 92 is arranged on the basic part 30.
As shown in Figure 8, be the electronic installation that seventh embodiment of the invention provided, it comprises: a support plate 90, tool three conductors also all are embedded in the insulator 46, and be embodied as positive and negative electrode power supply contact 91,92 respectively, wherein, the upper surface 911 of cathode power supply contact 91 protrudes and exposes to insulator 46 first upper surfaces 41.Many electric- conductor 60k, 60m are embodied as conductor wire, electrically connect with positive and negative electrode power supply contact 91,92 respectively, wherein, because the upper surface 911 of cathode power supply contact 91 protrudes from insulator 46 first upper surfaces 41 outsides, make the two clearance G of electric- conductor 60k, 60m be widened and not touch each other together, so just can avoid the problem that is short-circuited, thereby promote the quality of electronic installation.
As shown in Figure 9, be the electronic installation that eighth embodiment of the invention provided, it comprises: a support plate 90, and it is arranged on the chip 20, and support plate 90 has two conductors and is embodied as cathode power supply contact 91.The support plate 93 that one area is littler than support plate 90, it is arranged on the support plate 90, and support plate 93 has a conductor and is embodied as negative power supply contact 92.Another chip 25, it is arranged on the support plate 93, can make the effect of electronic installation become more powerful.By present embodiment as can be known,, the two clearance G of electric- conductor 60k, 60m is widened, can prevent between conductor wire the electrically phenomenon of short circuit, improve the quality of electronic installation because the positive and negative electrode power supply contact is arranged at different height.
As shown in figure 10, be the electronic installation that ninth embodiment of the invention provided, it comprises: a basic part 30, be embodied as circuit board, and it has a penetration state holding area 82, and a plurality of electrical contact 70 rings are located at holding area 82 peripheries.One fin 15 is engaged in basic part 30.One chip 20 is arranged on the fin 15, and is placed in the penetration state holding area 82 of basic part 30; One support plate 90 is arranged on the chip 20, it has recess 94 makes support plate 90 present convex, and have two conductors and be arranged at second upper surface, 37, two conductors and be embodied as positive and negative electrode power supply contact 91,92 respectively, its first upper surface, 36 non-transformer contacts also are exposed to packaging body 40 outsides.Wherein, the insulator 46 of support plate 90 can be embodied as the preferable ceramic material of radiating efficiency, and the heat that chip 20 is produced passes to outside the packaging body 40 faster by support plate 90.Embodiment by changing the shape and the material of support plate, not only can shorten conductor wire length as can be known thus, also can promote the heat-sinking capability of chip.
As shown in figure 11, be the electronic installation that tenth embodiment of the invention provided, it comprises: a support plate 90 is arranged on the chip 20, it has recess 94 makes support plate 90 present convex, and have three conductors and be arranged at respectively on support plate 90 first and second upper surfaces 36,37, wherein, a conductor is arranged on the first surface 36 and is embodied as cathode power supply contact 91, and two conductors are arranged on second upper surface 37 and are embodied as negative power supply contact 92 in addition.Thus embodiment as can be known, positive and negative power supply contact is arranged at different height, gap between conductor wire is widened can prevent between conductor wire the electrically phenomenon of short circuit.
As shown in figure 12, be the electronic installation that eleventh embodiment of the invention provided, it comprises: a chip 20, stick together part 10 by one and be arranged at running through in the holding area 82 of basic part 30, the side 23 of chip 20 engages with basic part 30 by sticking together part 10, and do not get adhered part 10 of the non-acting surface 22 of chip 20 coats, to promote the heat-sinking capability of electronic installation.One support plate 90 is arranged on the chip 10.Stick together part 10 and can ask a part that is embodied as packaging body 40 as required.
As shown in figure 13, be the electronic installation that twelveth embodiment of the invention provided, it comprises: a support plate 90, its with basic part 30 second surfaces 32 engage and stride establish basic part 30 run through holding area 82; One chip 20 is arranged in the basic part 30 penetration state holding areas 82 and makes its non-acting surface 22 be engaged on the support plate 90.Thus embodiment as can be known, support plate 90 can more flexibly be employed support plate 90 except that can also engaging with the non-acting surface 22 of chip 20 with the acting surface 21 of chip 20 engages.
As shown in figure 14, be the electronic installation that thriteenth embodiment of the invention provided, it comprises: a basic part 30 is embodied as circuit board, a chip 20, a support plate 90, many electric-conductors 60 and packaging body 40.Wherein, support plate 90 is arranged on the chip 20, has three conductors, and wherein, two conductors 17 are embodied as the cathode power supply contact, and conductor 17a is embodied as the negative power supply contact, and three conductors electrically connect with electric-conductor 60 respectively.Wherein, each conductor 17,17a lower surface 12,12a insulated body 46 coat, and each lower surface 12,12a are as far as possible near insulator first lower surface 44, so just can shorten the distance D of each lower surface 12,12a and insulator 46 first lower surfaces 44, and conductor 17 upper surfaces 11 and conductor 17a upper surface 11a all protrude and expose to first upper surface 41 of insulator 46.Embodiment as can be known thus, because the lower surface of each conductor of support plate is as far as possible near the insulator lower surface, can shorten the distance D of conductor lower surface and insulator lower surface, simultaneously, the upper surface of each conductor of support plate all protrudes and exposes to the insulator upper surface, thereby the distance D 1 between shortening support plate 90 and packaging body 40 upper surface 40m, by the D that reduces the distance, D1 can improve the heat-sinking capability of electronic installation, because the heat energy that chip produces when operation, wherein a part is that conductor from support plate reaches packaging body upper surface 40m heat radiation, thus conductor more more then heat transfer speed is sooner near the packaging body upper surface near chip and conductor.
The utilization of the relevant second class support plate 90 and effect are now lifted the following example and are cooperated cutaway view to describe.
As shown in figure 15, be the electronic installation that fourteenth embodiment of the invention provided, it comprises: a support plate 90 has two conductors, two conductors are embodied as positive and negative electrode power supply contact 91,92 respectively, wherein, electric- conductor 60k, 60m electrically connect with first and third part 91A, the 91C of cathode power supply contact 91 respectively.Embodiment because first and third part of power supply contact is arranged at different height, widens the clearance G between electric- conductor 60k, 60m as can be known thus, can prevent the phenomenon of electrical short circuit between conductor wire.Wherein the material of insulator 46 can be identical with packaging body 40 by demand.
As shown in figure 16, be the electronic installation that fifteenth embodiment of the invention provided, it comprises: a support plate 90, its insulator 46 is made up of one first insulator 48 and second insulator 49, support plate 90 directly anchors on the chip 20 by first and second insulator 48,49 by demand, and support plate 90 just need not stick together part by one and engages with chip 20 like this.
As shown in figure 17, be the electronic installation that sixteenth embodiment of the invention provided, it comprises: a basic part 35 is embodied as the lead foot support, have a plurality of lead foots 75 and a chip bearing (Die Pad) 76, each lead foot 75 has an electrical contact 70 power supply property connections and uses.One chip 20 is arranged on the chip bearing 76, and a support plate 90 is convex shape, and it has three conductors and is embodied as 91, the 92 power supply property connections of positive and negative electrode power supply contact respectively uses.Thus embodiment as can be known, support plate 90 also can be used to basic part and be embodied as in the electronic installation of lead foot supporting structure, and support plate 90 can more flexibly be employed.In addition, 92 of the power supply contacts that magnitude of voltage is identical in the present embodiment can pass through electric-conductor 60 electrical communication each other by demand.
As shown in figure 18, be the electronic installation that seventeenth embodiment of the invention provided, it comprises: a distance piece S is arranged on the acting surface 21 of chip 20.One support plate 9J, be arranged on the distance piece S, this support plate is the support plate 9J of Fig. 1 S-9 in the present invention's the 3rd class support plate, it has two conductors and is embodied as positive and negative electrode power supply contact 91,92 respectively, so, distance piece S is just at support plate 9J and chip 20 between the two, wherein because the height of distance piece S is higher than electric-conductor 60 height on the chip 20, so support plate 9J does not touch electric-conductor 60, support plate 9J still can be arranged on the chip 20.Because the power supply contact 91,92 of support plate 9J engages with the abutment wall 43 of insulator 46 respectively, electric-conductor 60 length A that connect power supply contact 91 and electrical contact 70 are shortened, and can save the material of conductor wire.In addition, present embodiment spacers S also can have recess by demand, thereby makes distance piece be following convex or go up convex person's (consulting Fig. 4 and label " 94 " shown in Figure 10 illustrates).
As shown in figure 19, be the electronic installation that eighteenth embodiment of the invention provided, it comprises: three chips 20,25,26, wherein two chips 25,26 are embodied as crystal covered chip (Flip chip), and electrically connect with support plate 90, basic part 30 respectively, and make chip 26 not only electrically connect and engage the chip holding area 80 that is bonded to basic part 30 with basic part 30 by a plurality of electric-conductors 65 (be embodied as conduction protuberance).One support plate 90 is arranged on chip 25,26 between the two, and it has a plurality of conductors and is embodied as positive and negative electrode power supply contact 91,92 and electrical contact 72 respectively, and electrically connects with the chip 20 and the basic part 30 that are arranged on the chip 25 respectively by electric-conductor 60.Wherein, a plurality of electrical contacts 70 are positioned at the inside and outside edge of basic part 30 chip holding areas 80, and chip 20,25 can ask as required and be embodied as electronic building brick or be not provided with by demand, simultaneously, chip 26 and support plate 90 also can be provided with chip or distance piece by demand between the two again.Embodiment by the utilization of support plate 90 provided by the present invention, can make the effect of electronic installation become more powerful a plurality of crystal covered chips 25,26 and non-crystal covered chip 20 stacking being set together as can be known thus.
By the explanation of the various embodiments described above, can derive the present invention and have following advantage:
1, the present invention promotes the electronic installation reliability because of the bonding area that increases conductor and insulator;
2, the present invention implements the thin electronic installation heat-sinking capability that promoted because of the integral thickness of support plate;
3, the present invention avoids short circuit problem between conductor wire because of conductor can protrude insulator surface;
4, the present invention can stepped setting avoid the problem that is short-circuited between conductor wire because of conductor;
5, the present invention makes the design of electronic installation have more elasticity because of the conductor of support plate can have extension;
6, the present invention has shortened conductor wire length because of power supply contact moves to support plate from basic part, and makes the design of electronic installation can have more elasticity.
The above embodiment only is preferred embodiment of the present invention, can not be used for limiting practical range of the present invention, and for example: shown in Fig. 1 S, conductor 17 can have the through hole of running through or recess by demand.Shown in Fig. 1 S-1, recess 47 also can be embodied as the non-penetration state holding area of support plate 9A.Shown in Fig. 1 S-4, can another or a plurality of conductor be arranged in the insulator 46 for heat radiation or electric connection usefulness by demand.Shown in Fig. 1 S-10a, b, insulator second upper surface 42 can not be provided with conductor 17a by demand yet.As shown in Figure 2, support plate 90 can replace with disclosed various support plates by demand, also can between the two, by demand one or more chips, support plate or the distance piece function with the increase electronic installation be set again at chip 20 and basic part 30.As shown in Figure 9, at support plate 90 and chip 20 between the two, can one or more chips, support plate or distance piece be set again to increase the function of electronic installation by demand, also can by demand on chip 25, one or more chips, support plate or distance piece be set again to increase the function of electronic installation.As shown in figure 11, cathode power supply contact 91 can be arranged on insulator 46 second upper surfaces 42 by demand.
Simultaneously, support plate of the present invention if its conductor upper surface and lower surface all not insulated body coat and can carry out electric connection, can be by demand with the support plate flip vertical, support plate 9H shown in Fig. 1 S-8, after upset, make the upper surface 11 of conductor 17 be embodied as lower surface, its lower surface 12 then is embodied as upper surface, so, remove the practicality can increase support plate, also can increase the heat-sinking capability of electronic installation, because of the extension 17h of conductor 17 more near chip, and because of having extension 17h the area of conductor 17 contact chips is increased, thereby can promote the heat-sinking capability of support plate.In addition, distance piece can be embodied as suitable article such as plastic plate, ceramic wafer, copper coin, alloy sheets, printed circuit board (PCB), chip or support plate, and distance piece can be electrically connected with extraneous by demand.Also the hole that can the extension of conductor be prolonged have penetration state by demand or the recess of depression to increase the bonding area of extension and packaging body, in view of the above, can promote the quality of electronic installation.
Therefore, allly belong to numerical value change or equivalent elements displacement, or the equivalence that specification, claims and accompanying drawing are done according to the present invention changes and modify, all should be included in the scope of patent protection of the present invention.

Claims (18)

1, a kind of electronic installation, it includes:
At least one basic part, chip, support plate, packaging body, electric-conductor and another electric-conductor; It is characterized in that:
Described chip engages with described basic part, and described chip is electrically connected with described basic part by described electric-conductor;
Described support plate is arranged on the described chip, and described support plate includes an insulator and at least one conductor; Described insulator has one first upper surface, first lower surface and abutment wall at least, described conductor has a upper surface, a lower surface and side at least, wherein, described conductor is coated by described insulator, make the side of described conductor have at least a part to be embedded in the described insulator, the part of described conductor exposes to the power supply of described insulator first upper surface and connects usefulness, and described conductor dbus is crossed described another electric-conductor and is electrically connected with described chip;
Described packaging body is sealed described basic part, described chip, described support plate, described electric-conductor and described another electric-conductor.
2, a kind of electronic installation as claimed in claim 1 is characterized in that: the side of described support plate conductor has at least a part to expose abutment wall outside at described support plate insulator.
3, a kind of electronic installation as claimed in claim 1 is characterized in that: the lower surface of described support plate conductor exposes the first lower surface outside at described support plate insulator.
4, a kind of electronic installation as claimed in claim 1 is characterized in that: described some protrusion of support plate conductor also exposes in described support plate insulator exterior.
5, a kind of electronic installation as claimed in claim 1 is characterized in that: described support plate conductor also includes extension, and described extension has at least a part to engage with described support plate insulator.
6, a kind of electronic installation as claimed in claim 1, it is characterized in that: also include a distance piece at least, described distance piece is arranged on described chip and described support plate between the two, and described distance piece is plastic plate, ceramic wafer, metallic plate, printed circuit board (PCB), chip or another support plate.
7, a kind of electronic installation as claimed in claim 1 is characterized in that: also include another chip at least, described another chip is arranged on the described support plate.
8, a kind of electronic installation as claimed in claim 1 is characterized in that: described basic part is circuit board or lead foot support, and described electric-conductor, described another electric-conductor are conductor wire or conduction protuberance.
9, a kind of electronic installation as claimed in claim 1, it is characterized in that: described support plate is arranged on the acting surface of described chip, and a part that makes described chip acting surface is exposed in described support plate externally fed connection usefulness, the basic part of described electronic installation has at least one penetration state holding area, described chip is placed in the described penetration state holding area, described electric-conductor and described another electric-conductor are conductor wire, described electric-conductor is electrically connected described chip with described basic part, described another electric-conductor is electrically connected described support plate with described chip; Described packaging body is sealed described support plate, described chip, described electric-conductor, described another electric-conductor and described basic part, and described chip engages with described basic part by the part of described packaging body.
10, a kind of electronic installation as claimed in claim 1, it is characterized in that: described support plate has at least one holding area, and described holding area can be penetration state or non-penetration state.
11, a kind of electronic installation as claimed in claim 1 is characterized in that: described support plate insulator directly is engaged in described chip.
12, a kind of electronic installation as claimed in claim 1, it is characterized in that: described support plate has recess, and described support plate is convex shape or recess.
13, a kind of electronic installation as claimed in claim 1 is characterized in that: also include a plurality of electric-conductors, the conductor dbus of described support plate crosses described a plurality of electric-conductor and described chip, described basic part electrically connect, and described a plurality of electric-conductors are conductor wire.
14, a kind of electronic installation, it includes:
At least one basic part, chip, support plate, packaging body, electric-conductor and another electric-conductor; It is characterized in that:
Described chip engages with described basic part, and described chip is electrically connected with described basic part by described electric-conductor;
Described support plate is arranged on the described chip, and described support plate includes an insulator and at least one conductor; Described insulator has one first upper surface, second upper surface, first lower surface and abutment wall at least, and described abutment wall is at described first upper surface and described second upper surface between the two; Described conductor has a upper surface, a lower surface and side at least, wherein, the lower surface of described conductor has at least a part to engage with second upper surface of described insulator, make described conductor can be arranged on second upper surface of described insulator, and described conductor dbus is crossed described another electric-conductor and is electrically connected with described chip;
Described packaging body is sealed described basic part, described chip, described support plate, described electric-conductor and described another electric-conductor.
15, a kind of electronic installation as claimed in claim 14 is characterized in that: also include a plurality of electric-conductors, the conductor dbus of described support plate is crossed described a plurality of electric-conductor and is electrically connected with described chip, described basic part, and described a plurality of electric-conductors are conductor wire.
16, a kind of electronic installation as claimed in claim 14 is characterized in that: described support plate conductor also includes extension, and described extension has at least a part to engage with described support plate insulator.
17, a kind of electronic installation as claimed in claim 14, it is characterized in that: also include a distance piece at least, described distance piece is arranged on described chip and described support plate between the two, and described distance piece is plastic plate, ceramic wafer, metallic plate, printed circuit board (PCB), chip or another support plate.
18, a kind of electronic installation as claimed in claim 14 is characterized in that: described basic part is circuit board or lead foot support, and described electric-conductor, described another electric-conductor are conductor wire or conduction protuberance.
CNB200510105464XA 2005-09-28 2005-09-28 Electronic device Expired - Fee Related CN100447997C (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010038151A1 (en) * 2000-03-09 2001-11-08 Yoshikazu Takahashi Semiconductor device and the method for manufacturing the same
US20020125556A1 (en) * 2001-03-09 2002-09-12 Oh Kwang Seok Stacking structure of semiconductor chips and semiconductor package using it
CN1499595A (en) * 2002-11-08 2004-05-26 ����ŷ�������ʽ���� Semiconductor device and its mfg. method
US20040145051A1 (en) * 2003-01-27 2004-07-29 Klein Dean A. Semiconductor components having stacked dice and methods of fabrication
CN1606152A (en) * 2003-10-07 2005-04-13 罗姆股份有限公司 Semiconductor device and method of fabricating the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010038151A1 (en) * 2000-03-09 2001-11-08 Yoshikazu Takahashi Semiconductor device and the method for manufacturing the same
US20020125556A1 (en) * 2001-03-09 2002-09-12 Oh Kwang Seok Stacking structure of semiconductor chips and semiconductor package using it
CN1499595A (en) * 2002-11-08 2004-05-26 ����ŷ�������ʽ���� Semiconductor device and its mfg. method
US20040145051A1 (en) * 2003-01-27 2004-07-29 Klein Dean A. Semiconductor components having stacked dice and methods of fabrication
CN1606152A (en) * 2003-10-07 2005-04-13 罗姆股份有限公司 Semiconductor device and method of fabricating the same

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