CN100446250C - 一种电感版图结构 - Google Patents
一种电感版图结构 Download PDFInfo
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- CN100446250C CN100446250C CNB2005101110368A CN200510111036A CN100446250C CN 100446250 C CN100446250 C CN 100446250C CN B2005101110368 A CNB2005101110368 A CN B2005101110368A CN 200510111036 A CN200510111036 A CN 200510111036A CN 100446250 C CN100446250 C CN 100446250C
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Priority Applications (1)
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CNB2005101110368A CN100446250C (zh) | 2005-12-01 | 2005-12-01 | 一种电感版图结构 |
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CNB2005101110368A CN100446250C (zh) | 2005-12-01 | 2005-12-01 | 一种电感版图结构 |
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CN1979852A CN1979852A (zh) | 2007-06-13 |
CN100446250C true CN100446250C (zh) | 2008-12-24 |
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CNB2005101110368A Active CN100446250C (zh) | 2005-12-01 | 2005-12-01 | 一种电感版图结构 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102412227A (zh) * | 2011-07-28 | 2012-04-11 | 上海华虹Nec电子有限公司 | 螺旋状电感的地屏蔽结构 |
CN102779807A (zh) * | 2012-01-16 | 2012-11-14 | 中国科学院上海微系统与信息技术研究所 | 一种与rdl工艺兼容的电感元件及制造方法 |
CN109637999B (zh) * | 2018-12-19 | 2020-11-24 | 上海华力集成电路制造有限公司 | 硅基电感结构及其中的封闭线的版图 |
CN111668193A (zh) * | 2020-05-12 | 2020-09-15 | 成都华微电子科技有限公司 | 带有电感线圈的集成电路芯片 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5969950A (en) * | 1998-11-04 | 1999-10-19 | Sun Microsystems, Inc. | Enhanced heat sink attachment |
CN1361550A (zh) * | 2000-12-26 | 2002-07-31 | 株式会社东芝 | 半导体装置 |
CN1536590A (zh) * | 2003-04-04 | 2004-10-13 | 矽统科技股份有限公司 | 具有嵌埋于基底中的屏蔽图案的高品质因子电感器件 |
US6885275B1 (en) * | 1998-11-12 | 2005-04-26 | Broadcom Corporation | Multi-track integrated spiral inductor |
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2005
- 2005-12-01 CN CNB2005101110368A patent/CN100446250C/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5969950A (en) * | 1998-11-04 | 1999-10-19 | Sun Microsystems, Inc. | Enhanced heat sink attachment |
US6885275B1 (en) * | 1998-11-12 | 2005-04-26 | Broadcom Corporation | Multi-track integrated spiral inductor |
CN1361550A (zh) * | 2000-12-26 | 2002-07-31 | 株式会社东芝 | 半导体装置 |
CN1536590A (zh) * | 2003-04-04 | 2004-10-13 | 矽统科技股份有限公司 | 具有嵌埋于基底中的屏蔽图案的高品质因子电感器件 |
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CN1979852A (zh) | 2007-06-13 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131216 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20131216 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |