CN100446176C - Substrate processing device, substrate processing method and substrate manufacture method - Google Patents
Substrate processing device, substrate processing method and substrate manufacture method Download PDFInfo
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- CN100446176C CN100446176C CNB2006101403344A CN200610140334A CN100446176C CN 100446176 C CN100446176 C CN 100446176C CN B2006101403344 A CNB2006101403344 A CN B2006101403344A CN 200610140334 A CN200610140334 A CN 200610140334A CN 100446176 C CN100446176 C CN 100446176C
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Abstract
The object of the present invention is to provide a substrate processing device, substrate processing method and substrate manufacture method. The substrate processing device can make the substrate holding the declinning state, and use a medicine liquid having a temperature higer than normal temperature to equably process a medicine liquid treatment to the declinning substrate. when the substrate pass the lower side of the heater, the heater heats the substrate surface to a temperature near to the temperature of the medicine liquid supplied by a medicine liquid nozzle. The medicine liquid nozzle supplies a medicine liquid having a temperature higer than normal temperature to the substrate surface. The medicine liquid supplied to the substrate surface is used to process a medicine liquid treatment to the substrate surface. Because the substrate is heated to a temperature near to the temperature of the medicine liquid used by the medicine liquid treatment before processing the medicine liquid treatment, the rising difference between the temperature of the upside and underside of the substrate surface that have been supplied medicine liquid, and the temperature of the substrate surface are quickly made to approximately uniform.
Description
Technical field
The invention relates to a kind of imaging liquid that utilizes, etching solution, soups such as stripper, on substrate, carry out video picture, etching, the substrate board treatment that soup is handled such as peel off, substrate processing method using same, and utilize these substrate board treatments, the manufacture method of the substrate of substrate processing method using same, particularly substrate is being kept under the state that tilts about a kind of being suitable for, and utilization is higher than the soup of the temperature of normal temperature, carry out the substrate board treatment of the soup processing of substrate, substrate processing method using same, and utilize these substrate board treatments, the manufacture method of the substrate of substrate processing method using same.
Background technology
In the manufacturing engineering of the display panel substrate that such board devices such as liquid crystal indicator or plasm display device are used, in order on substrate, to form circuit pattern and colour filter etc., and utilizing soups such as imaging liquid, etching solution, stripper, the soup of carry out video picture, etching, peeling off etc. is handled.Usually, carry out the engineering that these soups are handled, be known as wet process (wet process).Mostly wet process is in process chamber, utilizes mobile devices such as roller (roller) conveyer to keep substrate, and from nozzle and sprayer (spray) etc. to the surperficial supply of chemical of substrate and carry out.
When mobile devices such as utilizing roller path like this kept substrate and carries out wet process, known was to adopt the horizontal method of shipment that makes substrate move and keep under level.In horizontal method of shipment, when from nozzle and sprayer etc. during to the surperficial supply of chemical of substrate, soup roughly is carried on the surface of substrate equably, roughly carries out equably so the soup of substrate is handled.But, maximize as substrate, then gathering of soup will take place in the central portion at substrate, the uniformity that can not keep soup to handle.
To this, known have a kind of inclination method of shipment (patent documentation 1) that substrate is moved and keeping under the state of the angle that horizontal direction is inclined to regulation.As utilize the inclination method of shipment, even then substrate maximizes, can be on the surface of substrate yet the gathering of the such soup of occurred level method of shipment.
[patent documentation 1] Japanese patent laid-open 11-74247 communique
Utilize the inclination method of shipment make substrate keep to horizontal direction be inclined to regulation angle state and carry out under the situation of wet process, the surperficial downside of the substrate of inclination is compared with upside, carrying out that the soup on the downside is handled is slow.Its reason is considered to, and the soup of supplying with to the surface of substrate transmits on the surface of the substrate that tilts and from upside under the downward effluent, makes the soup (patent documentation 1) that exists the purity variation that flows down from upside on the downside on surface of substrate of inclination.
In the wet process of for example etching etc., for the chemical reaction that promotes to cause, be that soup is warmed to than after the also high temperature of normal temperature sometimes by soup, be re-supplied on the surface of substrate.Under the inclination method of shipment, when the soup of such utilization temperature also high than normal temperature when carrying out wet process, discovery is being compared with the wet process of the soup that utilizes normal temperature down, the obviously slow problem that becomes that the soup on the surperficial downside of the substrate that tilts is handled.
Summary of the invention
Problem of the present invention is that substrate is kept the state of inclination, and utilizes the soup of the temperature that is higher than normal temperature, the substrate that tilts is carried out soup equably handle.And problem of the present invention is that the soup that carries out substrate is equably handled, and the high substrate of quality bills of materials.
Substrate board treatment of the present invention is a kind of substrate mobile device that comprises, the substrate board treatment of chemicals feeder, wherein, the substrate mobile device moves substrate and is keeping under the state of the angle that horizontal direction is inclined to regulation, the substrate that chemicals feeder is kept to the substrate mobile device is supplied with the soup of the temperature that is higher than normal temperature, and, has heating apparatus, it is before the chemicals feeder supply of chemical, this by the substrate that the substrate mobile device is moved or keeps, is warmed to the close temperature of temperature of the soup of supplying with chemicals feeder.
And, substrate processing method using same of the present invention is a kind of state that substrate is kept horizontal direction is inclined to the angle of regulation, and substrate supplied with the soup of the temperature be higher than normal temperature and carry out the substrate processing method using same that the soup of substrate is handled, wherein, before the soup that carries out substrate is handled, substrate is moved under the state of the angle that horizontal direction is inclined to regulation or keep work, and substrate is warmed to the close temperature of temperature of the soup that is utilized when handling with soup.
In horizontal method of shipment, when when the soup of the temperature that is higher than normal temperature is supplied with on the surface of substrate, soup roughly is carried on the surface of substrate equably, so the temperature on the surface of substrate roughly rises equably.Therewith relatively, in known inclination method of shipment,, find that the temperature on the surface of substrate is not to rise equably when when the soup of the temperature that is higher than normal temperature is supplied with on the surface of substrate, but the surperficial downside of the substrate that tilts with upside by contrast, the rising of the temperature of substrate is slow.The temperature rising difference of the upside on the surface of this substrate and downside is considered to one of significantly slow reason of carrying out that the soup of substrate downside handles.In the present invention, before handling at the soup that carries out substrate, substrate is warmed to the close temperature of temperature of handling the soup that is utilized with soup, and the upside on surface of the substrate of having supplied with soup and the temperature rising difference of downside are dwindled, make the temperature on the surface of substrate become roughly even rapidly.
For substrate being warmed to the close temperature of temperature of handling the soup that is utilized with soup, can utilize for example heater, also can be to surface or the back side or the two sides supply warm water or the warm wind of substrate.In addition, to handle the soup utilized different with soup, also can supply with the soup of having heated to the surface of substrate or the back side or two sides.Under any situation, all substrate can be moved under the state of the angle that horizontal direction is inclined to regulation or is keeping, and this substrate of easily heating.
In addition, in substrate board treatment of the present invention, heating apparatus is warmed to the downside of the substrate of inclination the also high temperature of upside of the substrate that tilts.And substrate processing method using same of the present invention is the also high temperature of upside that the downside of the substrate that will tilt is warmed to the substrate that tilts.By in advance the downside of the substrate that tilts being warmed to the temperature also high than upside, and at the surperficial downside of the substrate that tilts, make temperature to upside slow being supplied of rising, so that the temperature on the surface of substrate more promptly becomes roughly even.
Substrate board treatment of the present invention is a kind of substrate board treatment that comprises substrate mobile device and chemicals feeder, wherein, the substrate mobile device moves substrate and is keeping under the state of the angle that horizontal direction is inclined to regulation, the substrate that chemicals feeder is kept to the substrate mobile device is supplied with the soup of the temperature that is higher than normal temperature, and, have the device that the temperature difference to the soup of the upside of the substrate that tilts and downside suppresses.
And, substrate processing method using same of the present invention is a kind ofly being kept substrate under the state of the angle that horizontal direction is inclined to regulation, and supply with the soup of the temperature be higher than normal temperature and carry out the substrate processing method using same that the soup of substrate is handled to substrate, wherein, temperature difference to the soup of the upside of the substrate that tilts and downside suppresses, and the soup that carries out substrate is handled.
In horizontal method of shipment, when when the soup of the temperature that is higher than normal temperature is supplied with on the surface of substrate, it is roughly even that the temperature of the soup of substrate surface becomes.Therewith relatively, transport in the method,, find the temperature of soup of substrate surface and inhomogeneous, but at the surperficial downside of the substrate that tilts, the temperature of soup is than the upside step-down when when the soup of the temperature that is higher than normal temperature is supplied with on the surface of substrate in known inclination.This be because, the soup of supplying with to the surface of substrate along the inclination of substrate and from upside under the downward effluent during, drawn heat and made the decline of downside temperature by substrate and ambient air, the temperature difference of the upside of this substrate and the soup of downside is considered to one of significantly slow reason of carrying out that the soup of substrate downside handles.In the present invention, suppress, and the soup that carries out substrate handles by temperature difference to the soup of the upside of the substrate that tilts and downside, and make that the soup of substrate handles become roughly even.
For the temperature difference to the soup of the upside of the substrate that tilts and downside suppresses, can supply with the soup of having heated from the back side to the downside of the substrate that for example tilts, or utilize heater to heat from the back side the downside of the substrate that tilts.In addition, also can surround the surface and the back side of substrate, and make the adiabatic of substrate on every side by utilizing heat-insulating material to wait.Under any situation, substrate is being held under the state of the angle that horizontal direction is inclined to regulation, and the temperature difference of the soup of the upside of the substrate that tilts of control and downside like a cork.
The manufacture method of substrate of the present invention is to utilize above-mentioned a certain substrate board treatment or substrate processing method using same to carry out wet process.Owing to substrate is held in the state of inclination, and utilizes the soup of the temperature that is higher than normal temperature, the soup processing of the substrate of inclination is carried out equably, so but the high substrate of quality bills of materials.
As utilize substrate board treatment of the present invention and substrate processing method using same, can be before the soup that carries out substrate be handled, by substrate being warmed to the close temperature of temperature of handling the soup that is utilized with soup, and the upside of the substrate surface of having supplied with soup and the temperature rising difference of downside are dwindled, so can make the temperature on surface of substrate promptly roughly even.Therefore, can make substrate keep the state of inclination, and utilize the soup of the temperature that is higher than normal temperature, the soup of the substrate that has tilted is equably handled.
In addition, as utilize substrate board treatment of the present invention and substrate processing method using same, then by the downside of the substrate that will tilt, be warmed to the also high temperature of upside of the substrate that tilts, can supply slow that the temperature of downside of the substrate of inclination rises, make the temperature on surface of substrate more promptly roughly even.Therefore, the soup processing of the substrate of inclination is carried out more equably.
In addition, as utilize substrate board treatment of the present invention and substrate processing method using same, then by the temperature difference of the soup of the upside of the substrate that suppresses and downside, and the soup that carries out substrate handles, and the carrying out that the soup of substrate is handled is roughly even.Therefore, substrate is kept under the state of inclination, and utilize the soup of the temperature that is higher than normal temperature, the soup of the substrate that tilts is equably handled.
As utilize the manufacture method of substrate of the present invention, and can make under the state that substrate keeps tilting, and utilize the soup of the temperature that is higher than normal temperature, the soup of the substrate that tilts is equably handled, so can the high substrate of quality bills of materials.
Description of drawings
Figure 1 shows that the summary pie graph of the substrate board treatment that utilizes the 1st example of the present invention.
Fig. 2 is the front elevation of the heater of substrate board treatment shown in Figure 1.
Figure 3 shows that the summary pie graph of the substrate board treatment that utilizes the 2nd example of the present invention.
Figure 4 shows that the summary pie graph of the substrate board treatment that utilizes the 3rd example of the present invention.
Figure 5 shows that the summary pie graph of the substrate board treatment that utilizes the 4th example of the present invention.
Figure 6 shows that the summary pie graph of the substrate board treatment that utilizes the 5th example of the present invention.
Fig. 7 is the front elevation of the heater of substrate board treatment shown in Figure 6.
Figure 8 shows that the summary pie graph of the substrate board treatment that utilizes the 6th example of the present invention.
Figure 9 shows that the flow chart of an example of manufacturing engineering of the TFT substrate of liquid crystal indicator.
Figure 10 shows that the flow chart of an example of manufacturing engineering of the filter substrate of liquid crystal indicator.
1: substrate 10: roller
11: heater 12: the warm water nozzle
13a, 13b: hot gas cutter 21,22,22a, 22b: liquid nozzle
23: heater 24: adiabatic chamber
Embodiment
Figure 1 shows that the summary pie graph of the substrate board treatment that utilizes the 1st example of the present invention.The formation of substrate board treatment comprises a plurality of rollers 10, heater 11 and liquid nozzle 21.
Above the substrate 1 that moves utilizing roller 10, be across the breadth with the direction of the substrate moving direction orthogonal of substrate 1, be provided with heater 11.Heater 11 is made of plate heater such as for example ceramic heater or halogen heater, when the below of substrate 1 by heater 11, with the surface of substrate 1, is heated to the close temperature of temperature of the soup of being supplied with liquid nozzle 21 described later.
In addition, at the downside of substrate moving direction, utilize the top of the substrate 1 that roller 10 kept, near the upside of the substrate 1 that tilts, the breadth across the substrate moving direction of this substrate 1 is provided with liquid nozzle 21 abreast with substrate 1.Liquid nozzle 21 for example is to make jet hole be slot-shaped or at a distance of the interval of stipulating and be provided with along long side direction in long sleeve pipe (casing) on constituting.Stop the rotation of roller 10, substrate 1 is being held under the state of the angle θ that horizontal direction only is inclined to regulation, and never illustrated soup supply source is supplied with the soup that has been warmed to the temperature that is higher than normal temperature to liquid nozzle 21.Liquid nozzle 21 is from the upside of jet hole to the surface of substrate 1, supply of chemical equably in the long side direction scope.Supplied to the soup of upside on the surface of substrate 1, along the inclination of substrate 1 and the downside to the surface of substrate 1 flow down.The soup that utilization is supplied with to the surface of substrate 1 comes that soup is carried out on the surface of substrate 1 to be handled.
Fig. 2 is the front elevation of the heater of substrate board treatment shown in Figure 1.In this example, as shown in Figure 2, heater 11 is not parallel with substrate 11, and more is provided with near the form of downside with the upside than the substrate 1 that tilts.By this, heater 11 can be warmed to the also high temperature of upside on the surface of the substrate 1 that tilts with the downside on the surface of the substrate 1 that tilts.
In addition, heater 11 also can not resemble and be provided with Fig. 2, the substitute is the thermal source of the inside of heater 11 is cut apart, and makes the temperature of downside of the heater 11 of inclination set also highly than upside.
And, in Fig. 1 and Fig. 2, it is the top that heater 11 is arranged on the substrate 1 that is carried on the roller 10, substrate 1 is begun to heat from the surface, but also heater can be arranged on below or the top and the below of the substrate 1 that is carried on the roller 10, substrate 1 is begun to heat from the back side or from the two sides.
Figure 3 shows that the summary pie graph of the substrate board treatment that utilizes the 2nd example of the present invention.This example can replace the heater 11 of example shown in Figure 1, and warm water nozzle 12 and hot gas cutter 13a, 13b are set.Other inscape is identical with example shown in Figure 1.
Above the substrate 1 that moves utilizing roller 10, along with the breadth of the direction of the substrate moving direction orthogonal of substrate 1, be provided with warm water nozzle 12 abreast with substrate 1.Warm water nozzle 12 for example is to make jet hole be slot-shaped and be provided with at a distance of the interval of regulation or along long side direction on long tube on constituting.Never illustrated warm water supply source is supplied with the warm water that has been warmed to the temperature close with the temperature of the soup of being supplied with from liquid nozzle 21 to warm water nozzle 12.Warm water nozzle 21 is supplied with warm water from jet hole equably in the scope of the surface of substrate 1 at long side direction.The warm water that utilization is supplied with to the surface of substrate 1 makes the surface of substrate 1 be warmed to the close temperature of temperature with the soup of being supplied with from liquid nozzle 21.
In addition,, utilize roller 10 and the top and the below of the substrate 1 that moves at the downside of substrate moving direction, with the breadth of the direction of the substrate moving direction orthogonal of substrate 1 in, be provided with hot gas cutter 13a, 13b abreast with substrate 1. Hot gas cutter 13a, 13b form the compression chamber in the inside of for example long sleeve pipe, and are slot-shaped along long side direction and the gas passage that communicates with the compression chamber is set and constitutes.Never illustrated gas supply source thermotropism air knife 13a, 13b supply with the gas that is warmed to the temperature close with the temperature of the soup of being supplied with from liquid nozzle 21. Hot gas cutter 13a, 13b be from the top of gas passage, to the surface or the back side of substrate 1, along with the direction of substrate moving direction opposition side, in the scope of long side direction, blow jet body equably with the incident angle of regulation.Utilization is blown the gas of spray to the surface institute of substrate 1, and the temperature that the surface of substrate 1 is warmed to is close with the temperature of the soup supplied with from liquid nozzle 21 and being dried.
In addition, in Fig. 3, it is the top that warm water nozzle 12 is arranged on the substrate 1 that roller 10 carried, and substrate 1 is begun to heat from the surface, but also warm water nozzle 12 can be arranged on below or the top and the below of the substrate 1 that roller 10 carried, and substrate 1 is begun to heat from the back side or from the two sides.
And, be warmed under the situation of required temperature on the surface that only utilizes hot gas cutter 13a, 13b with substrate 1, can omit warm water nozzle 12.
Figure 4 shows that the summary pie graph of the substrate board treatment that utilizes the 3rd example of the present invention.The formation of substrate board treatment comprises a plurality of rollers 10 and liquid nozzle 21,22a, 22b.The formation of roller 10 and liquid nozzle 21 and action, identical with example shown in Figure 1.
As shown in Figure 4, above the substrate 1 that moves utilizing roller 10 and below, with the breadth of the direction of the substrate moving direction orthogonal of substrate 1 in, be provided with liquid nozzle 22a, 22b abreast with substrate 1.Liquid nozzle 22a, 22b are in long sleeve pipe for example, are slot-shaped or at a distance of the interval of regulation jet hole are set and constitute along long side direction.Never illustrated soup supply source is supplied with the soup that is warmed to the temperature close with the temperature of the soup of being supplied with from liquid nozzle 21 to liquid nozzle 22a, 22b.Liquid nozzle 22a, 22b be from surface or the back side of jet hole to substrate 1, supplies with the soup of having been heated in the scope of long side direction equably.The soup that quilt that utilization is supplied with to the surface and the back side of substrate 1 has been heated, and make the surface of substrate 1 be warmed to the close temperature of temperature with the soup of being supplied with from liquid nozzle 21.
In discussed above example, heater 11, warm water nozzle 12 and hot gas cutter 13a, 13b, or liquid nozzle 22a, 22b only be provided with 1 layer, but they also can be provided with more than 2 layers along the substrate moving direction.
As utilize example discussed above, then by before handling at the soup of substrate, substrate is warmed to the close temperature of temperature of handling the soup that is utilized with soup, and the rising difference of the temperature of the upside on surface of the substrate of having supplied with soup and downside is dwindled, so can make the temperature on surface of substrate promptly roughly even.Therefore, can make substrate keep the state of inclination, and utilize the soup of the temperature that is higher than normal temperature, the substrate that tilts be carried out soup equably handle.
In addition, as utilize example shown in Figure 2, then by the downside of the substrate that will tilt, be warmed to the also high temperature of upside of the substrate that tilts, can supply slow that the temperature of downside of the substrate of inclination rises, make the temperature on surface of substrate more promptly roughly even.Therefore, can carry out soup more equably to the substrate that tilts handles.
Figure 5 shows that the summary pie graph of the substrate board treatment that utilizes the 4th example of the present invention.The formation of substrate board treatment comprises a plurality of rollers 10 and liquid nozzle 21,22.The formation of roller 10 and liquid nozzle 21 and action, identical with example shown in Figure 1.
Above the substrate 1 that utilizes roller 10 to be kept, near the upside of the substrate 1 that tilts, the breadth across the substrate moving direction of substrate 1 is provided with liquid nozzle 21 abreast with substrate 1.Liquid nozzle 21 for example is in long sleeve pipe on constituting, and makes jet hole be slot-shaped or at a distance of the interval of stipulating and be provided with along long side direction.Stop the rotation of roller 10, make substrate 1 keep horizontal direction only is inclined to the state of the angle θ of regulation, and never illustrated soup supply source is supplied with the soup that has been warmed to the temperature that is higher than normal temperature to liquid nozzle 21.Liquid nozzle 21 is from the upside of jet hole to the surface of substrate 1, supply of chemical equably in the long side direction scope.Supplied to the soup of upside on the surface of substrate 1, along the inclination of substrate 1 and the downside to the surface of substrate 1 flow down.The soup that utilization is supplied with to the surface of substrate 1 carries out soup to the surface of substrate 1 and handles.
In addition, below the substrate 1 that utilizes roller 10 to be kept, near the centre of the upside of the substrate 1 that tilts and downside, the breadth across the substrate moving direction of this substrate 1 is provided with liquid nozzle 22 abreast with substrate 1.The formation of liquid nozzle 22 is identical with liquid nozzle 21.Never illustrated soup supply source is supplied with the soup that has been warmed to the temperature close with the temperature of the soup of being supplied with from liquid nozzle 21 to liquid nozzle 22.Liquid nozzle 22 from jet hole between the upside and downside at the back side of substrate 1, supply of chemical equably in the scope of long side direction.The soup of supplying with to the back side of substrate 1, along the inclination of substrate 1 and the downside to the back side of substrate 1 flow down.The soup that utilization is supplied with to the back side of substrate 1 is heated the downside of the substrate 1 of inclination, with the temperature difference of the soup of being supplied with from liquid nozzle 21 of the upside on the surface that suppresses this substrate 1 and downside.
In addition, in example shown in Figure 5,22 of liquid nozzles are provided with 1 layer, but liquid nozzle 22 also can be provided with more than 2 layers along the direction with substrate moving direction orthogonal.
Figure 6 shows that the summary pie graph of the substrate board treatment that utilizes the 5th example of the present invention.In this example, replace the liquid nozzle 22 of example shown in Figure 5, and replace heater 23.Other inscape is identical with example shown in Figure 5.
Below the substrate 1 that utilizes roller 10 to be kept, near the downside of the substrate 1 that tilts, the breadth across the substrate moving direction of this substrate 1 is provided with heater 23.Heater 23 is made of plate heaters such as for example ceramic heater or halogen heater.Utilize heater 23, the downside of the substrate 1 of inclination is heated, with the temperature difference of the soup of being supplied with from liquid nozzle 21 of the upside on the surface that suppresses this substrate 1 and downside.
Fig. 7 is the front elevation of the heater of substrate board treatment shown in Figure 6.In this example, as shown in Figure 7, heater 23 is not parallel with substrate 1, but closely is being provided with the downside of the substrate 1 that tilts.By this, heater 23 can be warmed to higher temperature with the downside of the substrate 1 that tilts.
In addition, can heater 23 be provided with as shown in Figure 7 yet, the thermal source of the inside of heater 23 be cut apart, and make the temperature of downside of the heater 23 of inclination set for higher and replace.And, heater 23 with the direction of substrate moving direction orthogonal on also can be provided with more than 2 layers.
Figure 8 shows that the summary pie graph of the substrate board treatment that utilizes the 6th example of the present invention.The formation of substrate board treatment comprises a plurality of rollers 10, liquid nozzle 21 and adiabatic chamber 24.The formation of roller 10 and liquid nozzle 21 and action, identical with example shown in Figure 5.In addition, Figure 8 shows that the perspective state of substrate 1, roller 10 and the liquid nozzle 21 of the inside of adiabatic chamber 24.
As shown in Figure 8, around the substrate 1 that utilizes roller 10 to be kept, be provided with adiabatic chamber 24.Adiabatic chamber 24 has the adiabatic wall that is made of heat-insulating material etc., adopts a kind of surface that surrounds substrate 1 by adiabatic wall all to reach all the constituting in the back side.On the adiabatic wall of the substrate moving direction of adiabatic chamber 24, be provided with and be used to not shown opening that substrate 1 is passed through.Utilize this adiabatic wall 24, make substrate 1 around by adiabatic, can prevent that soup from being captured heat by ambient air, make fluid temperature be unlikely decline, so that the temperature difference of the soup of being supplied with from liquid nozzle 21 of the upside on the surface of substrate 1 and downside is suppressed.
As utilize example discussed above, then can be suppressed, and the soup that carries out substrate handles, and the carrying out that the soup of substrate is handled is roughly even by the temperature difference of the soup of the upside of the substrate that tilts and downside.Therefore, can make substrate keep the state of inclination, and utilize the soup of the temperature that is higher than normal temperature, the soup of the substrate that tilts is equably handled.
By utilizing substrate board treatment of the present invention or substrate processing method using same to carry out wet process, can make substrate keep the state of inclination, and utilize the soup of the temperature be higher than normal temperature, the substrate that tilts is carried out soup equably handle, so can the high substrate of quality bills of materials.
For example, Figure 9 shows that the flow chart of an example of manufacturing engineering of the TFT substrate of liquid crystal indicator.Form in the engineering (step 101) at film, utilize sputtering method or plasma chemical vapour growth (CVC) method etc., on glass substrate, form as liquid crystal drive with films such as the electric conductor film of transparency electrode or insulator films.In photoresist (resist) coating engineering (step 102), utilize the roller coating process to wait and apply photosensitive resin material (photoresist), and in film formation engineering (step 101), form photoresist film on the formed film.In exposure engineering (step 103), utilize near exposure device and projection aligner etc., with the pattern transfer of mask to photoresist film.In video picture engineering (step 104), utilize injection (shower) visualization method etc. that imaging liquid is supplied on the photoresist film, remove the part of not wanting of photoresist film.In etching engineering (step 105), utilize wet etching, remove film form in the formed film of engineering (step 101) not by part that photoresist film covered.In peeling off engineering (step 106), the photoresist after the effect of the mask in the etching engineering (step 105) finished utilizes stripper to peel off.Before or after above-mentioned each engineering, can implement the washing/drying engineering of substrate according to needs.With these engineerings repeatedly for several times, on glass substrate, to form tft array.
And, Figure 10 shows that the flow chart of an example of manufacturing engineering of the filter substrate of liquid crystal indicator.Form in the engineering (step 201) in black matrix (black matrix), processing such as utilize photoresist coating, exposure, video picture, etching, peel off forms black matrix on glass substrate.Form in the engineering (step 202) at colored pattern, utilize decoration method, pigment dispersing method, print process, electricity method etc., on glass substrate, form colored pattern.Carry out this project repeatedly and form the colored pattern of R, G, B.Form in the engineering (step 203) at diaphragm, formation diaphragm on colored pattern, and in ELD formation engineering (step 204), formation ELD on diaphragm.Before above-mentioned each engineering, midway or afterwards, according to needing, implement the washing/drying engineering of substrate.
In the manufacturing engineering of TFT substrate shown in Figure 9, in video picture engineering (step 104), etching engineering (step 105) and peel off in the engineering (step 106), when carrying out the manufacturing engineering of filter substrate shown in Figure 10, in black matrix form that engineering (step 201) and colored pattern form video picture, the etching of engineering (step 202) and the processing of peeling off in, can use substrate board treatment of the present invention or substrate processing method using same.
Claims (20)
1, a kind of substrate board treatment comprises for a kind of:
The substrate mobile device, it moves substrate and is keeping under the state of the angle that horizontal direction is inclined to regulation, and
Chemicals feeder, its substrate that is kept to the aforesaid base plate mobile device is supplied with the substrate board treatment of the soup of the temperature that is higher than normal temperature, it is characterized in that possessing: heating apparatus, it is before aforementioned chemicals feeder supply of chemical, the substrate that will be moved or keep by the aforesaid base plate mobile device, be warmed to the close temperature of temperature of the soup of supplying with aforementioned chemicals feeder, and the downside of the substrate that tilts is also high than the temperature of the upside of the substrate that tilts.
2, substrate board treatment as claimed in claim 1 is characterized in that wherein said heating apparatus has heater.
3, substrate board treatment as claimed in claim 1 is characterized in that wherein said heating apparatus has device from warm wind to substrate that supply with warm water or.
4, substrate board treatment as claimed in claim 1, it is different with aforementioned chemicals feeder to it is characterized in that wherein said heating apparatus has, and supplies with the device of the soup heated to substrate.
5, a kind of substrate processing method using same is for a kind of
Substrate is being kept horizontal direction is inclined to the state of the angle of regulation, and
Substrate is supplied with the soup of the temperature that is higher than normal temperature and carried out the soup processing of substrate
Substrate processing method using same, it is characterized in that:
Before the soup that carries out substrate is handled, substrate is moved under the state of the angle that horizontal direction is inclined to regulation or keeping, and substrate is warmed to the close temperature of temperature of handling the soup utilized with soup, and the temperature of the upside of the substrate that tilts of the downside of the substrate that tilts is also high.
6, substrate processing method using same as claimed in claim 5 is characterized in that utilizing heater to heat substrate.
7, substrate processing method using same as claimed in claim 5 is characterized in that supplying with warm water or warm wind and substrate being heated to substrate.
8, substrate processing method using same as claimed in claim 5 is characterized in that handling the soup utilized differently with soup, supplies with the soup of having heated and substrate is heated to substrate.
9, a kind of manufacture method of substrate is characterized in that utilizing each the described substrate board treatment among the claim 1-4, carries out wet process.
10, a kind of manufacture method of substrate is characterized in that utilizing each the described substrate processing method using same among the claim 5-8, carries out wet process.
11, a kind of substrate board treatment comprises for a kind of
The substrate mobile device, it moves substrate and is keeping under the state of the angle that horizontal direction is inclined to regulation,
Chemicals feeder, its substrate that is kept to the aforesaid base plate mobile device is supplied with the substrate board treatment of the soup of the temperature that is higher than normal temperature, it is characterized in that:
Has the device that the temperature difference to the soup of the upside of the substrate that tilts and downside suppresses.
12, substrate board treatment as claimed in claim 11 is characterized in that: suppress the device of the temperature difference of aforementioned soup, have device from the soup of having heated to the downside of the substrate that tilts that supply with.
13, substrate board treatment as claimed in claim 11 is characterized in that: suppress the device of the temperature difference of aforementioned soup, have the heater that the downside of the substrate that tilts is heated.
14, substrate board treatment as claimed in claim 11 is characterized in that: suppress the device of the temperature difference of aforementioned soup, have and will carry out adiabatic device around the substrate.
15, a kind of substrate processing method using same is being kept substrate for a kind of under the state of the angle that horizontal direction is inclined to regulation, and
Supply with the soup of the temperature that is higher than normal temperature and carry out the soup processing of substrate to substrate
Substrate processing method using same, it is characterized in that:
Temperature difference to the soup of the upside of the substrate that tilts and downside suppresses, and the soup that carries out substrate is handled.
16, substrate processing method using same as claimed in claim 15 is characterized in that handling the soup utilized differently with soup, supplies with the soup of having heated to the downside of the substrate that tilts, with the temperature difference of the soup of the upside of the substrate that suppresses to tilt and downside.
17, substrate processing method using same as claimed in claim 15 is characterized in that the downside of the substrate that will tilt utilizes heater to heat, with the temperature difference of the soup of the upside of the substrate that suppresses to tilt and downside.
18, substrate processing method using same as claimed in claim 15, it is characterized in that will substrate around carry out thermal insulation, with the temperature difference of the soup of the upside of the substrate that suppresses to tilt and downside.
19, a kind of manufacture method of substrate is characterized in that utilizing each the described substrate board treatment among the claim 11-14, carries out wet process.
20, a kind of manufacture method of substrate is characterized in that utilizing each the described substrate processing method using same among the claim 15-18, carries out wet process.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005342639A JP4557872B2 (en) | 2005-11-28 | 2005-11-28 | Substrate processing apparatus, substrate processing method, and substrate manufacturing method |
| JP2005342639 | 2005-11-28 | ||
| JP2005342641 | 2005-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1975983A CN1975983A (en) | 2007-06-06 |
| CN100446176C true CN100446176C (en) | 2008-12-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101403344A Expired - Fee Related CN100446176C (en) | 2005-11-28 | 2006-11-27 | Substrate processing device, substrate processing method and substrate manufacture method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4557872B2 (en) |
| CN (1) | CN100446176C (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008277556A (en) * | 2007-04-27 | 2008-11-13 | Shibaura Mechatronics Corp | Processing apparatus for substrate |
| JP2009216325A (en) * | 2008-03-11 | 2009-09-24 | Shimada Phys & Chem Ind Co Ltd | Dryer assembly |
| JP5906035B2 (en) * | 2011-07-28 | 2016-04-20 | 株式会社Ｓｃｒｅｅｎホールディングス | Coating device |
| CN103794428A (en) * | 2011-12-31 | 2014-05-14 | 四川虹欧显示器件有限公司 | Etching device and etching method |
| CN105140167A (en) * | 2015-07-28 | 2015-12-09 | 合肥鑫晟光电科技有限公司 | Carrying device, wet etching equipment and application method of wet etching equipment |
| CN108109946A (en) * | 2018-01-16 | 2018-06-01 | 昆山成功环保科技有限公司 | A kind of etching apparatus |
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| US6000862A (en) * | 1995-10-12 | 1999-12-14 | Dainippon Screen Mfg. Co. Ltd. | Substrate developing method and apparatus |
| CN1531029A (en) * | 2003-03-12 | 2004-09-22 | 大日本屏影象制造株式会社 | Placode treating method and treater |
| CN1574251A (en) * | 2003-06-03 | 2005-02-02 | 大日本网目版制造株式会社 | Substrate etching method and etching disposal device |
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| JPH034587A (en) * | 1989-06-01 | 1991-01-10 | Senju Metal Ind Co Ltd | Method and device for cleaning printed board |
| JPH0325938A (en) * | 1989-06-23 | 1991-02-04 | Nec Kyushu Ltd | Manufacturing equipment for semiconductor device |
| JP2562815Y2 (en) * | 1992-03-31 | 1998-02-16 | 株式会社芝浦製作所 | Substrate cleaning device |
| JPH09155307A (en) * | 1995-12-04 | 1997-06-17 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
| JPH09276773A (en) * | 1996-04-10 | 1997-10-28 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| JP2850118B2 (en) * | 1996-12-03 | 1999-01-27 | 東京化工機株式会社 | Transport processing equipment |
| JP3535706B2 (en) * | 1997-08-28 | 2004-06-07 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JPH11111673A (en) * | 1997-10-07 | 1999-04-23 | Shibaura Mechatronics Corp | Etching method and treatment equipment |
| JP2000271551A (en) * | 1999-03-25 | 2000-10-03 | Kawasaki Steel Corp | Method for removing liquid attached to object |
| JP3629386B2 (en) * | 1999-07-23 | 2005-03-16 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
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| JP2004330180A (en) * | 2003-04-17 | 2004-11-25 | Hitachi High-Tech Electronics Engineering Co Ltd | Apparatus and method for treating substrate, and method for producing substrate |
| JP2005015913A (en) * | 2003-06-03 | 2005-01-20 | Dainippon Screen Mfg Co Ltd | Etching treatment method and etching treatment device for substrate |
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| US6000862A (en) * | 1995-10-12 | 1999-12-14 | Dainippon Screen Mfg. Co. Ltd. | Substrate developing method and apparatus |
| CN1531029A (en) * | 2003-03-12 | 2004-09-22 | 大日本屏影象制造株式会社 | Placode treating method and treater |
| CN1574251A (en) * | 2003-06-03 | 2005-02-02 | 大日本网目版制造株式会社 | Substrate etching method and etching disposal device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1975983A (en) | 2007-06-06 |
| JP4557872B2 (en) | 2010-10-06 |
| JP2007149986A (en) | 2007-06-14 |
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