CN100443942C - Side-touched cell-phone camera mould set machining method - Google Patents
Side-touched cell-phone camera mould set machining method Download PDFInfo
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- CN100443942C CN100443942C CNB2006100884281A CN200610088428A CN100443942C CN 100443942 C CN100443942 C CN 100443942C CN B2006100884281 A CNB2006100884281 A CN B2006100884281A CN 200610088428 A CN200610088428 A CN 200610088428A CN 100443942 C CN100443942 C CN 100443942C
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Abstract
A method for manufacturing mobile phone video camera module in side contact type includes cutting off soft protective film corresponding to glue application region but holding film at protection region, sticking relevant positioning points on comparison module on printed circuit board with element in module, coating glue on contact position of soft protective film with printed circuit board, placing module coated with glue on tray for curing glue in air drying oven at temperature of 80-85deg.c for 2-2.5 hour, cutting soft protection film on positions with no circuit and element on printed circuit board then tearing them off.
Description
Technical field
The present invention relates to side contacts insertion slot type cell-phone camera module production and processing technology.
Background technology
Along with popularizing of cell-phone camera function, more and more to the mobile phone cam demand, traditional mentality of designing contacts with the installation that method for designing adopts the flexible PCB matching connector to carry out module, often little in batches, because of mobile phone upgrades very fast, the flexible PCB profile that different styles may need can be very different, so just need constantly to upgrade the design of flexible PCB, increased the processing cost of cell-phone camera module in the new product development stage, the mentality of designing the best way that addresses this is that is to carry out standardization, so a kind of novel connector---insertion slot type has occurred.Its purpose is exactly that the installation of shooting module is convenient as plug-and-socket.Present existing slot mainly contains two types: 1. side touch, 2. end touch, see Fig. 1.Its principle of work difference just is in the way of contact, contact class in the end has been done shell fragment in the socket bottom, socket is welded on the mobile phone printing hard circuit board by the mode of paster, the printing hard circuit board is made in the bottom of shooting module, make the conduction gold plated contact in the part of socket contact on the printing hard circuit board, by pegging graft, finish installation.The surface of contact of side joint touch contacts by selenodont contact in printing hard circuit board side.
At the slot type connector of side joint touch, because this contact point is in the side, the shape of printed circuit board (PCB) has local depression again, and colloid is easy to flow down in a glue process, or overflows in bake process.By common processing technology, be difficult to the excessive glue phenomenon of control, if colloid sticks on the contact of printing hard circuit board, its wiping is difficulty relatively, causes the module disabler, sees Fig. 2.
Summary of the invention
The objective of the invention is to design a kind of side-touched cell-phone camera mould set machining method, to remove the influence of the excessive glue phenomenon that occurs in the some glue process to the contact, side.
According to technical scheme provided by the invention, side-touched cell-phone camera mould set machining method comprises:
A, hollow out: the position corresponding to glue application region on the soft diaphragm is hollowed out, and the position of protected location keeps;
B, pad pasting: corresponding anchor point on the soft diaphragm contrast module after will hollowing out is attached on the printed circuit board (PCB) that has components and parts in the module;
C, some glue: utilize point gum machine that colloid is coated in the position that soft diaphragm contacts with printed circuit board (PCB) equably, camera lens 1 is installed on module then;
D, baking: the module that will put colloid is contained in the pallet, sends into air-dry baking oven, toasts 2～2.5 hours down at 80 ℃～85 ℃, and colloid is solidified;
E, striping: after baking finishes, with icking tool soft diaphragm is scratched along the part that does not have circuit and components and parts on the printed circuit board (PCB), and torn off.
In some cases, before hollowing out, should prepare diaphragm earlier: material is a polyimide, and thickness is about 0.3mm.And, before hollowing out, also should prepare printed circuit board (PCB) simultaneously earlier: design, connect up according to electrical property needs and module internal space, make jigsaw, carry out mounting and welding of components and parts then.
Behind pad pasting, before the some glue, remove earlier bubble: the module that will post film is put into baking oven, carries out preliminary drying one time, and the preliminary drying temperature is 120～130 ℃, and the gas that produces in the pad pasting is discharged.
Behind pad pasting, before the some glue, first cleaning: the surface of wiping image sensor in the die trial group gently with the instrument that dips in a little anhydrous alcohol, till cannot see floating dust.
Advantage of the present invention is: can be under the situation that does not change process environments; before a glue, increase by a procedure; with soft diaphragm the contact point obstruct of printed circuit board (PCB) is opened; not wellability according to the different viscosities colloid; paste the heat-resisting Obstruct membrane of one deck on printed circuit board (PCB), catch ring epoxy resins colloid is because the back that is heated flows into the contact of printed circuit board (PCB) side, after the end to be baked; soft diaphragm is torn along the limit, avoided the excessive of colloid.
Description of drawings
Fig. 1 is side contacts shooting module outside drawing.
Fig. 2 is side contacts cell-phone camera modular structure figure.
Fig. 3 is the excessive glue situation enlarged drawing of A among Fig. 2.
Fig. 4 is the pad pasting constitutional diagram of printed circuit board (PCB).
Embodiment
Side-touched cell-phone camera mould set machining method comprises:
1, prepares printed circuit board (PCB) 6 earlier, according to electrical property needs and module internal spatial design, wiring, because of the size of image module 12 less, be about 9mm * 9mm, so generally in process, a lot of circuit boards are made on the big plank, stay certain clearance between each platelet, also be called jigsaw.Mount image sensor 12, electric capacity 11, resistance etc. through chip mounter then.
2, prepare diaphragm: soft diaphragm 4 used materials are polyimide, and thickness is about 0.3mm.The present invention has mainly utilized the polyimide energy high temperature resistant, stable, on-deformable characteristics.
3, hollow out: the position corresponding to glue application region 2 on the soft diaphragm 4 is hollowed out, and the position of protected location keeps; Can adopt the job operation of printed circuit board (PCB) 6 to make jigsaw figure, unnecessary place is hollowed out, available cutter film is made template, cuts.
4, pad pasting: corresponding anchor point on the soft diaphragm 4 contrast modules after will hollowing out is attached on the printed circuit board (PCB) 6 that has components and parts in the module; Colloid had adsorbability and viscosity preferably below the material of soft diaphragm 4 required, and the bubble of noting mounting in the process is handled.Specifically can adopt in the following method: with transfer paper soft diaphragm 4 is taken off, contrast corresponding anchor point, slight then is down sticking from one side.
5, cleaning: can influence vision just as lens surface has had dust, the dirt on image sensor 12 surfaces in the module has very big influence to imaging effect, the surface of cleaning image sensor 12 is exactly in order to obtain clean picture, therefore before camera lens 1 is installed, should clean the surface of image sensor 12 earlier.During cleaning, available cotton swab dips in the surface that a little anhydrous alcohol is wiped examination image sensor 12 gently, after nuzzling up, observes the degree of cleaning under 10 power microscopes, till can't see tangible floating dust.
6, remove bubble: the module that will put colloid 8 is contained in the pallet, send into air-dry baking oven, after posting, carry out preliminary drying one time, its temperature is greater than about 50 ℃ of the bake out temperature of colloid 8, generally at 120～130 ℃, purpose is during with pad pasting, the air scavenge that is present in 6 of soft diaphragm 4 and printed circuit board (PCB)s is fallen, and soft diaphragm 4 is well fitted with printed circuit board (PCB) 6 contact, and guarantees tight; When baking, because the cause of being heated, gas wherein can well volatilize away, reaches the purpose of getting rid of gas.
7, some glue: utilize point gum machine that colloid is coated in the position that soft diaphragm 4 contacts with printed circuit board (PCB) 6 equably, camera lens 1 is installed on module then; Point glue is exactly that camera lens in the module 1 and printed circuit board (PCB) 6 are sticked together, for image sensor 12 forms the darkroom, light is through the refraction of camera lens 1 surface imaging at image sensor 12, carry out light signal collection and conversion by image sensor 12 then, output to the digital processing chip of mobile phone through socket, carry out analyzing and processing.
Colloid roughly can divide two classes: 1. UV colloid is exactly the light binding body, is cured through ultraviolet irradiation, and time ratio is very fast, but cost is higher; 2. thermosetting colloid, general composition is an epoxy resin, through heating colloid is cured, and because it is with low cost, and effect is relatively good, and the properties of product of production are more stable, and doing over again property is higher, also adopts this colloid in this technology.
When carrying out the module assembling, because non-contact-point on module bottom and the side circuit board, so, do not influence the usability of product even the glue that overflows is more serious yet.But side joint touches the insertion slot type module of end contact at a glue and after entering baking oven, because the flowability of colloid, excessive glue is more serious, and is also bigger to the contact performance influence of side and bottom contact, be easy to cause loose contact, serious even scrapping of causing entire module.Among Fig. 25 is for overflowing the colloid in side contacts district 3.
Gluing process: utilize that special spot gluing equipment---point gum machine is finished, see Fig. 4.The head of point gum machine is a gum outlet 7, and the gum outlet 7 of point gum machine is similar to the syringe needle of syringe, and the colloid 8 that modulates is placed in the cavity 9, and the rear portion utilizes pipeline 10 to connect pressurized air, controls compressed-air actuated pressure by air valve, thus the amount that the control colloid flows out.
In a glue, according to different colloid viscositys, adjust the pressure that of air valve, the flow of control point gum machine colloid, can operate as normal being as the criterion, open valve port, colloid 8 is extruded the gum outlet 7 of point gum machine, be coated in the part that soft diaphragm 4 contacts with printed circuit board (PCB) 6 equably, general only need being coated in camera lens 1 has that osculatory that contacts to get final product, camera lens 1 is installed then, by special carrier that the bottom and the printed circuit board (PCB) 6 of camera lens 1 is fixing, put in the special pallet; Note not main points too many of colloid 8, the concentration of colloid 8 can not be too rare.
8, baking: baking mainly is to reinforce for colloid, because the colloid of bonding camera lens 1 and printed circuit board (PCB) 6 is the thermosetting colloid, is difficult to solidify under physical environment, generally wants week age.Baking can be accelerated the volatilization of colloid 8 internal solvents, makes printed circuit board (PCB) 6 and camera lens 1 bonding firm.Bake process is exactly that the module that will put colloid 8 is contained in the special pallet, sends into air-dry baking oven, toasts 2～2.5 hours down at 80～85 ℃, and colloid 8 has just solidified.
9, striping: after baking finishes, prevent that the soft diaphragm 4 of excessive glue from also having finished mission, colloid 8 has also solidified, and the side contacts district 3 of product side is not because the protection of soft diaphragm 4 is subjected to the covering of colloid 8 like this, and contact performance is very good.When removing soft diaphragm 4, with icking tool with soft diaphragm 4 careful along there not being the part of circuit to scratch on the printed circuit board (PCB) 6, tear off gently.
In whole assembling process, gluing process is complicated, and is also very big to the quality influence of product, if control badly, is easy to produce light leak and oxidative phenomena, reduces the serviceable life of product.Therefore, the control to gluing process is very crucial technology.Camera lens 1 is formed by being positioned at top lens barrel and being positioned at following lens mount 13 usually.
After this process modification, because soft diaphragm 4 has blocked the problem that colloid 8 flows to the side contacts district 3 that is positioned at half hole, side, thereby improved the yield rate that product adds man-hour.
Claims (8)
1, side-touched cell-phone camera mould set machining method is characterized in that:
A, hollow out: the position corresponding to glue application region on the soft diaphragm is hollowed out, and the position of protected location keeps;
B, pad pasting: corresponding anchor point on the soft diaphragm contrast module after will hollowing out is attached on the printed circuit board (PCB) that has components and parts in the module;
C, some glue: utilize point gum machine that colloid is coated in the position that soft diaphragm contacts with printed circuit board (PCB) equably, camera lens is installed on module then;
D, baking: the module that will put glue is contained in the pallet, sends into air-dry baking oven, toasts 2～2.5 hours down at 80 ℃～85 ℃, and colloid is solidified;
E, striping: after baking finishes, with icking tool soft diaphragm is scratched along the part that does not have circuit and components and parts on the printed circuit board (PCB), and torn off.
2, side-touched cell-phone camera mould set machining method as claimed in claim 1 is characterized in that, before hollowing out, prepare diaphragm earlier: material is a polyimide, and thickness is about 0.3mm.
3, side-touched cell-phone camera mould set machining method as claimed in claim 1, it is characterized in that, before hollowing out, prepare printed circuit board (PCB) earlier: design, connect up according to electrical property needs and module internal space, make jigsaw, carry out mounting and welding of components and parts then.
4, side-touched cell-phone camera mould set machining method as claimed in claim 1 is characterized in that, behind pad pasting, the some glue before, remove earlier bubble: the module that will post film is put into baking oven, carry out preliminary drying one time, the preliminary drying temperature is 120～130 ℃, and the gas that produces in the pad pasting is discharged.
5, side-touched cell-phone camera mould set machining method as claimed in claim 1, it is characterized in that, behind pad pasting, before the some glue, first cleaning: the surface of wiping image sensor in the die trial group gently with the instrument that dips in a little anhydrous alcohol, till cannot see floating dust.
6, side-touched cell-phone camera mould set machining method as claimed in claim 4 is characterized in that, before removing bubble back, some glue, and cleaning earlier: the surface of wiping image sensor in the die trial group with the instrument that dips in a little anhydrous alcohol, till cannot see floating dust.
7, side-touched cell-phone camera mould set machining method as claimed in claim 6 is characterized in that, during cleaning, dip in the surface that a little anhydrous alcohol is wiped the examination image sensor gently with cotton swab, after nuzzling up, under 10 power microscopes, observe the degree of cleaning, till cannot see tangible floating dust.
8, side-touched cell-phone camera mould set machining method as claimed in claim 1 is characterized in that, when glue, in the cavity of point gum machine colloid is arranged, and the rear portion of point gum machine utilizes pipeline to connect pressurized air, and the head of point gum machine is a gum outlet; In a glue, open valve port, colloid is extruded the gum outlet of point gum machine, be coated in the part that soft diaphragm contacts with printed circuit board (PCB) equably, and utilize air valve to control compressed-air actuated pressure, the amount that flows out with the control colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNB2006100884281A CN100443942C (en) | 2006-08-23 | 2006-08-23 | Side-touched cell-phone camera mould set machining method |
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| CNB2006100884281A CN100443942C (en) | 2006-08-23 | 2006-08-23 | Side-touched cell-phone camera mould set machining method |
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| CN1940615A CN1940615A (en) | 2007-04-04 |
| CN100443942C true CN100443942C (en) | 2008-12-17 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101335779B (en) * | 2008-07-23 | 2011-03-09 | Tcl天一移动通信（深圳）有限公司 | Welding construction of mobile phone camera and implementing method |
| CN101547226B (en) * | 2009-04-17 | 2011-07-20 | 宁波舜宇光电信息有限公司 | Image blurring solving process in mobile phone module reliability test |
| CN102615028B (en) * | 2012-04-09 | 2014-03-26 | 青岛海信移动通信技术股份有限公司 | Dispensing method and portable mobile terminal |
| CN108943686B (en) * | 2018-09-06 | 2020-10-13 | 聊城国奥信息技术有限公司 | Intelligent mobile phone film pasting instrument |
| CN114916152A (en) * | 2022-04-21 | 2022-08-16 | 昆山丘钛微电子科技股份有限公司 | Method for sealing bracket by camera module |
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| US6943423B2 (en) * | 2003-10-01 | 2005-09-13 | Optopac, Inc. | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
| CN2779431Y (en) * | 2005-02-04 | 2006-05-10 | 沈阳敏像科技有限公司 | Minitype camera module |
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Patent Citations (8)
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|---|---|---|---|---|
| CN2473629Y (en) * | 2001-04-27 | 2002-01-23 | 深圳市宝安区西乡镇臣田唐锋电器厂 | Photo-film picture sensor module for camara and photograph |
| US20030137599A1 (en) * | 2002-01-18 | 2003-07-24 | Jone Su | DIY-assembled easy digital camera |
| JP2004179830A (en) * | 2002-11-26 | 2004-06-24 | Miyota Kk | Miniature camera module |
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| US6943423B2 (en) * | 2003-10-01 | 2005-09-13 | Optopac, Inc. | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
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Granted publication date: 20081217 Termination date: 20120823 |