CN100433954C - Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board - Google Patents
Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board Download PDFInfo
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- CN100433954C CN100433954C CNB2004101030551A CN200410103055A CN100433954C CN 100433954 C CN100433954 C CN 100433954C CN B2004101030551 A CNB2004101030551 A CN B2004101030551A CN 200410103055 A CN200410103055 A CN 200410103055A CN 100433954 C CN100433954 C CN 100433954C
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Abstract
The present invention discloses a technological method for selective plating copper in through holes of a flexible multiple-layer printed circuit board, which is completed by the following steps of through hole electroplating, film press, exposure, imaging, copper plating and film stripping, wherein the flexible multiple-layer printed circuit board drilled with the through hole is carried out the through hole electroplating; a layer of a dry film is pressed on the flexible multiple-layer printed circuit board after the through hole electroplating; the dry film on the position of the through hole is exposed by a principle of negative film exposure; the dry films on other positions are reserved; a hole ring of the through hole on copper foil is imaged; at the time, except the exposed position of the hole ring of the through hole, other parts are all covered with the dry film; thus, when electroplating is carried out, only the through hole is electroplated; the dry film is stripped by a principle of chemical liquid medicine reaction. The commonly electroplated flexible multiple-layer printed circuit board can be bent about 50 thousand times. The flexible multiple-layer printed circuit board adopting the present invention to carry out through hole selective plating can be bent by 6 to 100 thousand times. The bend resistant performance of the flexible multiple-layer printed circuit board is obviously increased.
Description
Technical field
The present invention relates to a kind of printed substrate process method of plating copper.
Background technology
Multiple-plate connected mode is for boring via, then with the via plated with copper in the present flexible multiple layered printing circuit board.Traditional copper electroplating method when being about to the via plated with copper, has also plated copper at whole plate face for whole plate copper facing.Step is: utilize the method for current lead-through that the chemical copper on the conducting hole wall is thickeied behind the electroplates in hole again, this moment is except thickening the copper on the via hole wall, also electroplating layer of copper on the native copper, and the mode that forms electrolysis of this layer copper, the arrangement mode of copper crystal is a graininess, vertically launches, and native copper is handled for the mode of calendering, the arrangement mode of copper crystal is a horizontal spreading, so the not folding of flexible multiple layered printing circuit board that traditional copper facing mode is made, bending property is not good.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of technological process for selective plating copper on through holes of flexible multiple layered printing circuit board, the flexible multiple layered printing circuit board folding that this method is made has good bending.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of technological process for selective plating copper on through holes of flexible multiple layered printing circuit board follows these steps to finish: a. the electroplates in hole: the flexible multi-layer printed panel circuit plate that has bored via carries out the electroplates in hole; B. press mold: press one deck dry film on the flexible multiple layered printing circuit board behind the electroplates in hole; C. exposure: expose with the principle of the egative film exposure dry film with the via position, the dry film of other position keeps; D. video picture: the via orifice ring video picture on the Copper Foil is come out, promptly the dry film on the via is removed; E. copper facing: this moment, other parts all had dry film to cover except that expose via orifice ring position, when electroplating like this, only via were electroplated; F. stripping: dry film is peelled off with the principle of chemical medicinal liquid reaction.
Further technical scheme of the present invention is:
Press mold parameter: pressure: 5-8kg/cm
2, temperature: 100-130 ℃, speed: 0.8-2.2m/min;
Exposure parameter: vacuum pressure: 650-750 millimetres of mercury, exposure metering: 7-10 lattice;
Visualization parameter: temperature: 25-35 ℃, speed: 0.5-2m/min, pressure: 0.5-2.5kg/cm
2
Copper facing parameter: flash: 5-15min, copper facing: 25-35min;
Stripping parameter: temperature: 45-60 ℃, speed: 1-4m/min, bake out temperature: 80-100 ℃, nozzle exit pressure: 1-3kg/cm
2
Useful effect of the present invention: this process will not need the copper-plated local dry film that adopts to cover, can guarantee only copper facing on via like this, can effectively increase the pliability of flexible multiple layered printing circuit board, be used for to increase behind the mobile phone bending number of times of mobile phone, flexible multi-layered printed substrate as common plating can bend about 50,000 times, the flexible multi-layered printed substrate that adopts the present invention to carry out via choosing plating can bend 6-10 ten thousand times, has obviously increased the folding resistance of flexible multiple layered printing circuit board.
Description of drawings
The present invention is described in further detail below in conjunction with the drawings and specific embodiments.
Fig. 1 is for boring the schematic diagram of surperficial one deck wiring board in the flexible multiple layered printing circuit board behind the via;
Fig. 2 presses schematic diagram behind the dry film for surperficial one deck wiring board in the flexible multiple layered printing circuit board;
Fig. 3 is that dry film is removed (promptly after exposure, the video picture) back schematic diagram on the via of surperficial one deck wiring board in the flexible multiple layered printing circuit board;
Fig. 4 is surperficial one deck wiring board via copper facing schematic diagram in the flexible multiple layered printing circuit board;
Fig. 5 is the schematic diagram of removing after the copper facing of surperficial one deck wiring board via in the flexible multiple layered printing circuit board behind the dry film.
Among the figure: the 1-via; The 2-Copper Foil; The 3-base material; The 4-dry film; 5-copper; 6-glue.
Embodiment
Embodiment: referring to Fig. 1 to Fig. 5, a kind of technological process for selective plating copper on through holes of flexible multiple layered printing circuit board follows these steps to finish: a. the electroplates in hole: the flexible multi-layer printed panel circuit plate that has bored via carries out the electroplates in hole; B. press mold: press one deck dry film on the flexible multiple layered printing circuit board behind the electroplates in hole; C. exposure: expose with the principle of the egative film exposure dry film with the via position, the dry film of other position keeps; D. video picture: the via orifice ring video picture on the Copper Foil is come out, promptly the dry film on the via is removed; E. copper facing: this moment, other parts all had dry film to cover except that expose via orifice ring position, when electroplating like this, only via were electroplated; F. stripping: dry film is peelled off with the principle of chemical medicinal liquid reaction.
In this example, press one deck dry film respectively on the copper-clad surface of the upper and lower two superficial layer wiring boards in flexible multiple layered printing circuit board.
Parameter is as follows in the technological process:
The electroplates in hole parameter: activated bath temperature: 41.5 ℃, electroless copper plating: 30 ℃, reducing agent speedization temperature: 31.5 ℃, the microetch temperature: 30 ℃, whole hole temperature: 49 ℃;
Press mold parameter: (pressure: 6kg/cm
2, temperature: 120 ℃, speed: 1.25m/min);
Exposure parameter: vacuum pressure 700 millimetress of mercury, exposure metering: 8 lattice;
Visualization parameter: temperature: 30 ℃, speed: 1.2m/min, pressure: 1.25kg/cm
2
Via copper facing parameter: flash: 10min, copper facing: 30min;
Stripping parameter: temperature: 55 ℃, speed: 2m/min, bake out temperature: 95 ℃, nozzle exit pressure: 1.5kg/cm
2
Claims (2)
1. technological process for selective plating copper on through holes of flexible multiple layered printing circuit board, it is characterized in that: follow these steps to finish: a. the electroplates in hole: the flexible multi-layer printed panel circuit plate that has bored via carries out the electroplates in hole; B. press mold: press one deck dry film on the flexible multiple layered printing circuit board behind the electroplates in hole; C. exposure: expose with the principle of the egative film exposure dry film with the via position, the dry film of other position keeps; D. video picture: the via orifice ring video picture on the Copper Foil is come out; E. copper facing: this moment, other parts all had dry film to cover except that expose via orifice ring position, when electroplating like this, only via were electroplated; F. stripping: dry film is peelled off with the principle of chemical medicinal liquid reaction.
2. technological process for selective plating copper on through holes of flexible multiple layered printing circuit board according to claim 1 is characterized in that:
Press mold parameter: pressure: 5-8kg/cm
2, temperature: 100-130 ℃, speed: 0.8-2.2m/min;
Exposure parameter: vacuum pressure: 650-750 millimetres of mercury, exposure metering: 7-10 lattice;
Visualization parameter: temperature: 25-35 ℃, speed: 0.5-2m/min, pressure: 0.5-2.5kg/cm
2
Copper facing parameter: flash: 5-15min, copper facing: 25-35min;
Stripping parameter: temperature: 45-60 ℃, speed: 1-4m/min, bake out temperature: 80-100 ℃, nozzle exit pressure: 1-3kg/cm
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101030551A CN100433954C (en) | 2004-12-27 | 2004-12-27 | Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101030551A CN100433954C (en) | 2004-12-27 | 2004-12-27 | Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN1798484A CN1798484A (en) | 2006-07-05 |
| CN100433954C true CN100433954C (en) | 2008-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004101030551A Active CN100433954C (en) | 2004-12-27 | 2004-12-27 | Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101340775B (en) * | 2007-07-06 | 2010-06-09 | 鸿富锦精密工业（深圳）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN101437360B (en) * | 2007-11-12 | 2011-12-21 | 富葵精密组件(深圳)有限公司 | Flexible circuit board, preparation method and fixed method thereof |
| CN101442885B (en) * | 2007-11-20 | 2011-06-08 | 富葵精密组件(深圳)有限公司 | Method for preparing circuit board guide hole |
| CN101460017B (en) * | 2007-12-11 | 2011-10-12 | 比亚迪股份有限公司 | Thru-hole electroplating method for printed circuit board |
| CN101588677B (en) * | 2008-05-19 | 2011-03-02 | 比亚迪股份有限公司 | Manufacture method of flexible printed circuit board |
| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN101951735B (en) * | 2010-09-17 | 2012-10-17 | 深圳市崇达电路技术股份有限公司 | Coppering and porefilling process for circuit board |
| KR101201948B1 (en) * | 2012-08-06 | 2012-11-16 | 주식회사 에스아이 플렉스 | The printed circuit board manufacturing method |
| CN106332443B (en) * | 2015-06-29 | 2019-03-08 | 庆鼎精密电子（淮安）有限公司 | The production method of flexible circuit board |
| CN107645830A (en) * | 2017-08-29 | 2018-01-30 | 深南电路股份有限公司 | Two-sided FPC of a kind of ultra-thin copper of ultrasonic probe and preparation method thereof |
| CN112996284A (en) * | 2021-02-18 | 2021-06-18 | 福立旺精密机电（中国）股份有限公司 | BGA (ball grid array) position electroplating blind hole filling process, HDI (high Density interconnection) board obtained by adopting process and electronic product applying HDI board |
Citations (4)
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|---|---|---|---|---|
| CN1172414A (en) * | 1996-07-09 | 1998-02-04 | 夏普公司 | Printed-wiring board and production method thereof |
| CN1210363A (en) * | 1997-08-28 | 1999-03-10 | 华通电脑股份有限公司 | Method for automatically welding package of ball array integrated circuit by coil belt |
| JPH11195849A (en) * | 1997-12-26 | 1999-07-21 | Fujikura Ltd | Flexible printed wiring board and method for manufacturing it |
| CN1494120A (en) * | 2002-10-28 | 2004-05-05 | 华泰电子股份有限公司 | Metal electroplating method of integrated circuit packaging substrate |
-
2004
- 2004-12-27 CN CNB2004101030551A patent/CN100433954C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1172414A (en) * | 1996-07-09 | 1998-02-04 | 夏普公司 | Printed-wiring board and production method thereof |
| CN1210363A (en) * | 1997-08-28 | 1999-03-10 | 华通电脑股份有限公司 | Method for automatically welding package of ball array integrated circuit by coil belt |
| JPH11195849A (en) * | 1997-12-26 | 1999-07-21 | Fujikura Ltd | Flexible printed wiring board and method for manufacturing it |
| CN1494120A (en) * | 2002-10-28 | 2004-05-05 | 华泰电子股份有限公司 | Metal electroplating method of integrated circuit packaging substrate |
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| CN1798484A (en) | 2006-07-05 |
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