CN100426541C - 产生可见光的发光装置 - Google Patents

产生可见光的发光装置 Download PDF

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CN100426541C
CN100426541C CNB2005100984177A CN200510098417A CN100426541C CN 100426541 C CN100426541 C CN 100426541C CN B2005100984177 A CNB2005100984177 A CN B2005100984177A CN 200510098417 A CN200510098417 A CN 200510098417A CN 100426541 C CN100426541 C CN 100426541C
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CN1929155A (zh
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蔡凯雄
李冠达
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Bonlumi Technoloyg Co., Ltd.
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PHOTOELECTRIC TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

一种产生可见光的发光装置，包括：一发光芯片，其能发出波长250nm～420nm的紫光与紫外光；一有机萤光层，系将一有机聚合物藉由真空蒸镀、涂布、网版印刷、平版印刷、溅镀、点注、浇注、或贴合等方法形成于该发光芯片之表面上而制得；以及一内含复数个纳米级晶粒之封装层，其中，该发光芯片所发出的光能激发该有机萤光层，该有机萤光层受激发后会发出波长380nm～800nm的一第二光，该第二光与未经吸收的紫外光在该封装层中进行混合而形成一混合光，该混合光经该封装层中所含的该些纳米级晶粒聚光、折射后更能均匀地混合，进而可从该封装层向外发射出均匀性佳的白光、红光、绿光、蓝光、黄光、橙光、靛光、或紫光等可见光。

Description

产生可见光的发光装置
技术领域
本发明涉及一种发光装置，更特别的是，本发明涉及一种产生可见光的发光装置，其系由紫外光发光二极管激发由不同配比之红色、黄绿色、蓝色萤光体所组成之有机萤光层，并经由混合光而产生均匀性、演色性俱佳的白光、红光、绿光、蓝光、黄光、橙光、靛光、或紫光等可见光。
背景技术
发光二极管的种类繁多，依发光波长分为可见光发光二极管与不可见光(红外光、紫外光)发光二极管等两类。一般可见光发光二极管应用于数字钟、银行汇率看板、交通号志、户外信息看板等方面。不可见光发光二极管应用于信息及通讯产品，如摇控器、红外线无线通讯的讯号发射、自动门、自动冲水装置控制等方面。近年来发光二极管市场成长又以可见光发光二极管(含白光发光二极管)较为明显，特别以白光发光二极管最具高成长，至于不可见光市场规模则较为平稳。
发光二极管的发光原理为当底部的二极管(通常是半导体材料)接受电能的激发后，产生电子与空穴对，当电子与电洞再结合的时候，二极管便发出第一发射光(紫外光或蓝光)。这第一发射光可以被萤光粉吸收并转换成第二发射光(可见光波长范围)，当没有被萤光粉吸收的第一发射光和萤光粉所发射出来的第二发射光混合以后，便得到白光。利用不同萤光粉的搭配，发光二极管也可如日光灯管般具有偏冷色系或暖色系的不同光色。
目前已有一些发光装置系运用紫外光去激发无机萤光体而产生各色可见光，例如白光、红光、绿光、蓝光、黄光、橙光、靛光、紫光等。举例而言，US6555958系运用紫外光去激发Ba2 SiO4:Eu2+等无机萤光体而产生蓝绿光；US6501100系运用紫外光去激发(Sr0.8Eu0.1Mn0.1)2P2O7等无机萤光体而产生白光；US6621211系运用紫外光去激发(Ba，Sr，Ca)2SiO4:Eu2+等无机萤光体而产生白光；US6294800系运用紫外光去激发Ca8Mg(SiO4)4C12:Eu2+，Mn2+等无机萤光体而产生白光；US6616862系运用紫外光至蓝光的光波去激发(Ca，Sr，Ba，Mg)5(PO4)3:Eu2+，Mn2+等无机萤光体而产生黄橙光；US2003067265系运用紫外光去激发A2-2xNa1+xExD2V3O12(其中A可为钙，E可为铕，D可为镁，x为0.01至0.3)等无机萤光体而产生白光；US2003067008系运用紫外光去激发(Sr0.90-099Eu0.01-0.1)4Al14O25等无机萤光体而产生白光；US2004007961系运用紫外光去激发Sr2P2O7:Eu2+，Mn2+等无机萤光体而产生白光。然而，上述前案皆面临无机萤光体反射力弱，装置发光功率不佳等亟待解决的问题。因此，如何发展出一种高效率且能产生可见光之发光装置，则为本发明所要钻研之主要课题。
发明内容
因此，本发明的目的是提供一种产生可见光之发光装置，其系由紫光与紫外光发光二极管激发由不同配比之红色、黄绿色、蓝色萤光体所组成之有机萤光层，当没有被有机萤光层吸收的紫外光和有机萤光层所发射出来的第二光彼此混合以后而产生高功率的白光、红光、绿光、蓝光、黄光、橙光、靛光、或紫光等可见光，以解决上述习知技艺上的问题。
为了达到上述目的，本发明提供一种产生可见光之发光装置，包括：一发光芯片，作为发光光源，该发光光源会发出波长介于250nm～420nm之间的紫光与紫外光；一有机萤光层，该有机萤光层系将一有机聚合物藉由真空蒸镀、涂布、网版印刷、平版印刷、溅镀、点注、浇注、或贴合等方法形成于该发光芯片之表面上而制得；以及一封装层，内含具有均匀扩散功能之复数个纳米级晶粒，该封装层系将该发光芯片及该有机萤光层包覆封装，其中，该发光芯片所发出的紫外光能激发该有机萤光层，该有机萤光层受激发后发出波长介于380nm～800nm之间的一第二光，该第二光与该发光光源之未经该有机萤光层吸收的紫外光在该封装层中进行混合，而形成一混合光，该混合光经该封装层中所含的该些纳米级晶粒聚光、折射后能更加均匀地混合，进而可从该封装层向外发射出均匀性佳的可见光，其中该有机萤光层可由不同配比之红光、黄绿光、蓝光等有机萤光体所组成而使本发明之发光装置能发射出高功率之白光、红光、绿光、蓝光、黄光、橙光、靛光、或紫光等可见光，而有机萤光层材料系下列有机聚合物：
第一类型：三聚氰胺-磺醯胺-甲醛共聚物型(Melamine-Sulphonamide-Formaldehyde CopolymerType)；
第二类型：单胺基三嗪-脲-甲醛-磺醯胺共缩合物型(Aminotriazine-Urea-Formaldehyde-Sulphonamide Type)；或是
第三类型：4，4-双(2-二甲氧基苯乙烯基)联苯型(4，4′-Bis[2-(2-methoxyphenyl)etheny 1]-1，1′-diphenyl Type)。
本发明发光装置的优点为以紫外光激发由不同配比之红光、黄绿光、蓝光等萤光体所组成之有机萤光层，并将没有被该有机萤光层吸收的紫外光和该有机萤光层所发射出来的光彼此混合且经封装层内中之纳米级晶粒的聚光、折射而产生均匀性、演色性俱佳且发光强度更强之白光、红光、绿光、蓝光、黄光、橙光、靛光、或紫光等可见光，以解决先前技术中无机萤光体反射力弱，装置发光功率不佳等问题。
由本发明下述之实施方式及所附之图式，本发明的前述及其它目的、特征、观点及优点将会更加明了。
附图说明
图1系本发明之发光装置的截面图；
图2系本发明发光装置之发光流程方块图；以及
图3系本发明发光装置中含有复数个纳米级晶粒之封装层局部放大的截面图。
图中
10发光芯片
12发光表面
15光源
20有机萤光层
30第二光
35混合光
36可见光
40封装层
42透明树脂
44纳米级晶粒
具体实施方式
下面将参考图式以更加详细的方式描述本发明的较佳实施例。
图1系本发明之发光装置的截面图。如图1所示，发光芯片10作为发光光源，受电极作用后可发出波长为250nm～420nm之间的光，亦即发光光源系发射出紫外光。有机萤光层20系藉由真空蒸镀、涂布、网版印刷、平版印刷、溅镀、点注、浇注、或贴合等方法，将如下所示之一有机聚合物(分为第一类型、第二类型及第三类型)形成于该发光芯片10之发光表面12上而制得，该有机萤光层20之厚度可视设计者之需求而决定其厚薄。有机萤光层材料系下列有机聚合物：
第一类型：三聚氰胺-磺醯胺-甲醛共聚物型(Melamine-Sulphonamide-Formaldehyde Copolymer Type)；
第二类型：单胺基三嗪-脲-甲醛-磺醯胺共缩合物型(Aminotriazine-Urea-Formaldehyde-Sulphonamide Type)；或是
第三类型：4，4-双(2-二甲氧基苯乙烯基)联苯型(4，4′-Bis[2-(2-methoxyphenyl)etheny1]-1，1′-diphenyl Type)。
该发光装置之封装层40系由透明树脂42与复数个纳米级晶粒44彼此均匀地混合而成。该些纳米级晶粒44系为透明或半透明体，其颗粒大小被控制在100纳米以下，且具有聚光及折射光之物理特性。该些纳米级晶粒44在显微镜下观察系呈颗粒状，但在人肉眼观察下系呈粉末状。该发光装置能从该封装层40向外发射出均匀性及演色性均佳的各种可见光36。
图2系本发明发光装置之发光流程方块图，而图3系本发明发光装置中含有复数个纳米级晶粒之封装层局部放大的截面图。如图2及图3所示，当光源15发出254nm～420nm波长的紫外光时，该紫外光激发有机萤光层20而使该有机萤光层发出与该紫外光不同的第二光30，该第二光30的波长系介于380nm～800nm之间，其中，该有机萤光层20系藉由真空蒸镀、涂布、网版印刷、平版印刷、溅镀、点注、浇注、或贴合等方法将上述之有机聚合物(分为第一类型、第二类型及第三类型)形成于该发光芯片10之发光表面12上而制得。由于该有机萤光层20系经冷却与定型而形成于发光芯片10之发光表面12上，故其均匀性及附着性皆极佳，因此能提高发光强度及发光均匀性，而该有机萤光层可由不同配比之红光、黄绿光、蓝光等有机萤光体所组成。然后该第二光30再与未被该有机萤光层20吸收的紫外光相混合而得一混合光35，该混合光35投射于透明封装层40时，由于封装层40中均匀分布着若干数量的具有聚光及折射光的功能之透明纳米级晶粒44，进而使该混合光35在透明封装层40中被混合、聚光、折射再发射出透明封装层40外，因此能得到均匀性、演色性俱佳且发光强度更强的白光、红光、绿光、蓝光、黄光、橙光、靛光、或紫光等可见光36，其中该封装层40系由透明树脂42及透明或半透明的纳米级晶粒44所组成。该封装层40之材料组成的混合比率最佳为90％之透明树脂42对10％之透明或半透明的纳米级晶粒44。该些透明或半透明的纳米级晶粒44系以各种形状表现，例如呈圆形、椭圆形、多角形、或不规则形状的微粒。
对所有熟习此技艺者而言，本发明明显地可以作出多种修改及变化而不脱离本发明的精神和范围。因此，本发明包括该些修改及变化，且其皆被包括在下附之权利要求书的范围及其均等者中。

Claims (5)

1. 一种产生可见光的发光装置，包括：
一发光芯片，作为发光光源，该发光光源会发出波长介于250nm～420nm之间的紫光与紫外光；
一有机萤光层，该有机萤光层系将一有机聚合物藉由真空蒸镀、涂布、网版印刷、平版印刷、溅镀、点注、浇注、或贴合等方法形成于该发光芯片之表面上而制得；以及
一封装层，内含具有均匀扩散功能之复数个纳米级晶粒，该封装层系将该发光芯片及该有机萤光层包覆封装，
其中，该发光芯片所发出的紫外光能激发该有机萤光层，该有机萤光层受激发后发出波长与该紫外光不同的一第二光，该第二光与未经该有机萤光层吸收的该紫外光在该封装层中进行混合而形成一混合光，该混合光经该封装层中所含的该些纳米级晶粒聚光、折射后能更加均匀地混合，进而可从该封装层向外发射出均匀性及演色性均佳的白光、红光、绿光、蓝光、黄光、橙光、靛光、或紫光各色可见光；
其中，该有机聚合物是：
第二类型：单胺基三嗪-脲-甲醛-磺醯胺共缩合物型(Aminotriazine-Urea-Formaldehyde-Sulphonamide Type)；或是
第三类型：4，4-双(2-二甲氧基苯乙烯基)联苯型(4，4′-Bis[2-(2-methoxyphenyl)etheny1]-1，1′-diphenyl Type)。
2. 如权利要求1所述的产生可见光的发光装置，其中，该封装层系由一透明树脂与该些纳米级晶粒彼此混合而成。
3. 如权利要求1或2所述的产生可见光的发光装置，其中，这些纳米级晶粒是透明或半透明体，其颗粒大小被控制在100纳米以下，且具有聚光、折射光之物理特性。
4. 如权利要求1所述的产生可见光的发光装置，其中，该第二光的波长介于380nm～800nm之间。
5. 如权利要求1所述的产生可见光的发光装置，其中，该有机萤光层系由不同配比之红光、黄绿光、蓝光有机萤光体所组成。
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TWI448806B (zh) 2011-09-22 2014-08-11 Delta Electronics Inc 螢光劑裝置及其所適用之光源系統及投影設備
US10688527B2 (en) 2011-09-22 2020-06-23 Delta Electronics, Inc. Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks
US10310363B2 (en) 2011-09-22 2019-06-04 Delta Electronics, Inc. Phosphor device with spectrum of converted light comprising at least a color light
CN111308845B (zh) * 2016-04-19 2022-09-20 台达电子工业股份有限公司 荧光剂装置

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