CN2785144Y - 白光发光二极管 - Google Patents

白光发光二极管 Download PDF

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Publication number
CN2785144Y
CN2785144Y CNU2004200900007U CN200420090000U CN2785144Y CN 2785144 Y CN2785144 Y CN 2785144Y CN U2004200900007 U CNU2004200900007 U CN U2004200900007U CN 200420090000 U CN200420090000 U CN 200420090000U CN 2785144 Y CN2785144 Y CN 2785144Y
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light
crystal
white light
cathode
light emitting
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杨显铭
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PHOTOELECTRIC TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

本实用新型提供一种白光发光二极管，特指一种可发出演色性佳，白光显现更均匀的发光二极管。本实用新型白光发光二极管，乃包含：侧部形成凹部的阴极支架；阳极支架系架设于阴极支架之相邻边；在凹部中连接有一发光LED晶体；高分子有机聚合物做为有机荧光层，系被蒸镀连接于发光LED晶体之发光表面上；阴极导线；阳极导线；封装层包覆于上述组件所组成，俾以发挥该发光二极管向外发射出的混合光(白光)其颜色均匀性及演色性佳。

Description

白光发光二极管
所属技术领域
本实用新型提供一种白光发光二极管，特指一种可发出演色性佳，白光显现更均匀的发光二极管(LED)。
背景技术
按台湾专利公告第383508号发光装置、公告号第385063号新白光LED、公告号第556365号一种制作白光发光二极管光源之方法、公告号第465123号高功率白色发光二极管等专利案，其萤光层均是利用无机聚合物构成(如YAG黄色萤光层)，但由于萤光层以涂布方法于发光元件(LED)之表面及周围时，其均匀性及附着性无法有效控制，故被激发出之混合光(白光)，彼此间混合不均匀，例如白光可能是中间偏蓝，周围偏黄，人眼看出去可能是白光，但当该混合光投射在纯白纸上，则呈现中央蓝，周围偏黄的结果。
因此，如何开创出一种演色性佳及均匀性佳的白光发光二极管乃是本案钻研之课题。
发明内容
本实用新型之主要目的，即在提供一种白光发光二极管，该发光二极管向外发射出的混合光颜色均匀性及演色性佳。
本实用新型一种白光发光二极管，乃包含：侧部形成凹部的阴极支架；阳极支架系架设于阴极支架之相邻边；在凹部中连接有一发光LED晶体(chip)；高分子有机聚合物做为有机萤光层，被蒸镀连接于发光LED晶体之发光表面上；阴极导线，其二连接端分别连接于阴极支架上端以及发光LED晶体表面上所凸设之负极接点上；阳极导线，其二连接端分别连接于阳极支架上端以及发光LED晶体表面上所凸设之正极接点上；由封装层包覆上述组件，其结构由透明树脂与纳米级晶粒均匀混合而成。
其中，所述的阳极支架与阴极支架为导电金属材料，其下端之接脚不被封装层包覆。
所述有机萤光层材料的化学结构式为：
(CHCHSC2CONC6H5)2C10H7。
本实用新型发光LED晶片受电极作用，可发出波长介于340nm～495nm之间的光，以做为光源。
本实用新型借着有机萤光体，如有机发光聚合物被蒸镀于蓝光发光组件的发光表面上，以及有机萤光体被封装于具有聚光及折射光特性的封装层中，进一步使本实用新型之白光发光二极管向外发射出的混合光颜色均匀性及演色性佳。
下面结合附图及实施例详述本实用新型。
附图说明
附图1为本实用新型之断面图。
附图2图为本实用新型封装层之局部放大断面图。
附图3为本实用新型发光的方块流程图。
主要组件符号说明：
光源—————15
有机萤光层——16
负极接点———161
正极接点———162
阴极导线———17
阳极导线———19
阴极支架———20
凹部—————22
阳极支架———30
接脚—————301、201
封装层————40
透明树脂———42
奈米级晶粒——44
LED晶体 ———50
发光表面———52
第二光————60
具体实施方式
附图1为本实用新型之断面图、附图2为本实用新型封装层之局部放大断面图、以及附图3本实用新型发光的方块流程图所示，本实用新型提供一种白光发光二极管，乃包含：
侧部形成凹部22的阴极支架20；
阳极支架30系架设于阴极支架20之相邻边；
在凹部22中连接有一发光LED晶体50(chip)；
高分子有机聚合物做为有机萤光层16，被蒸镀连接于发光LED晶体50之发光表面52上；
阴极导线17，其二连接端分别连接于阴极支架20上端以及发光LED晶体50表面上所凸设之负极接点161上；
阳极导线19，其二连接端分别连接于阳极支架30上端以及发光LED晶体50表面上所凸设之正极接点162上；
封装层40包覆于上述元件，其结构由透明树脂42与纳米级晶粒44均匀混合而成。
依据前述之主要特征，其中阳极支架30与阴极支架20为导电金属材料，其下端之接脚301、201不被封装层40包覆。
依据前述之主要特征，其中有机萤光层16之化学结构式为：(CHCHSC2CONC6H5)2C10H7。
依据前述之主要特征，其中发光LED晶体50受电极作用，可发出波长介于340nm～495nm之间的光，以做为光源15。
如图1、图3所示，接脚301、201被施以电极，经过阴、阳极导线17、19以及正、负极接点162、161的电传导，使发光LED晶体50被激发出波长介于340nm～495nm之间的光，亦即光源15发出的光，其可包含紫外光、紫光、蓝光或蓝绿光。有机萤光层16其化学结构式为：(CHCHSC2CONC6H5)2C10H7(双噻吩苯胺酮单苯)，系一种有机聚合物合成材料。在高温高压及真空环境下呈气化状的有机萤光体，可被蒸镀附着在发光LED晶体面50(chip)的发光表面52，俾以形成有机萤光层16，其厚度最好控制500A°～5000A°之间，可根据设计需求而决定其厚薄。封装层40其透明树脂42中均匀混合有透明或半透明的纳米级晶粒44，其中，所述的透明树脂为通用制造二极管中的习用透明胶状物。纳米级晶粒44在纳米显微镜观察下系呈晶粒状，但在肉眼观察系呈粉末状。
光源15发出介于340nm～495nm波长的光时，光源15激发有机萤光层16，使有机萤光层16被激发出另一与光源15不同的第二光60，第二光60波长可介于530nm～580nm之间，被定义为黄绿～黄橙色光，由于有机萤光层16系蒸镀于发光LED晶体50之发光表面52上，因此均匀性及附着性极佳，故可提高发光强度及发光之均匀性。该第二光60再与部份未激发有机萤光层16的光源15相混合，可得混合光35，该混合光35被定义为白光，该混合光35投射于封装层40时，由于封装层40中透明树脂42中均匀分布有透明或半透明的纳米级晶粒44，如图2所示，其封装层40材料组成的混合比为：树脂90％、晶粒10％，树脂与晶粒均匀混合，透明或半透明的纳米级晶粒44以各种形状表现，如圆形、椭圆形、棱形、多角度或不规则形状的纳米级微粒形态。透明或半透明的纳米级晶粒44其物理特性是得以聚光及折射光的作用，进一步使混合光35在封装层40中，非常均匀的被折射混合再发射出封装层40外，即可视得均匀性、高强度及演色性极佳的白光36者。
综上所述，在发光表面上，被蒸镀连结一层均匀的有机萤光层，以及封装层内部混合了纳米级晶粒，使本实用新型所发出的白光其均匀性及演色性及发光强度更佳。

Claims (3)

1、一种白光发光二极管，有LED发光晶体，特征在于：
一侧部形成凹部的阴极支架；
一阳极支架系架设于阴极支架之相邻边；
在所述凹部中连接一发光LED晶体；
有机聚合物被蒸镀连接于发光LED晶体之表面上做为有机萤光层；
阴极导线，其二连接端分别连接于阴极支架上端以及发光LED晶体表面上所凸设之负极接点上；
阳极导线，其二连接端分别连接于阳极支架上端以及发光LED晶体表面上所凸设之正极接点上；
由透明树脂与纳米级晶粒均匀混合而成的封装层，包覆上述组件。
2.根据权利要求1所述之白光发光二极管，其特征在于：阳极支架与阴极支架为导电金属材料，其下端之接脚不被封装层包覆。
3.根据权利要求1所述之白光发光二极管，其特征在于：发光LED晶体受电极作用，发出介于340nm～495nm之间波长的光做为光源。
CNU2004200900007U 2004-09-30 2004-09-30 白光发光二极管 Expired - Lifetime CN2785144Y (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100426541C (zh) * 2005-09-06 2008-10-15 亿镫光电科技股份有限公司 产生可见光的发光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100426541C (zh) * 2005-09-06 2008-10-15 亿镫光电科技股份有限公司 产生可见光的发光装置

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