CN100420096C - Electric connection structure, connector and electric connecting system - Google Patents
Electric connection structure, connector and electric connecting system Download PDFInfo
- Publication number
- CN100420096C CN100420096C CNB2004100475223A CN200410047522A CN100420096C CN 100420096 C CN100420096 C CN 100420096C CN B2004100475223 A CNB2004100475223 A CN B2004100475223A CN 200410047522 A CN200410047522 A CN 200410047522A CN 100420096 C CN100420096 C CN 100420096C
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- chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
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- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
To electrically connect an inside and an outside of a chamber in a narrow pitch, of an electric connection system electrically interconnecting the inside and the outside of the vacuum chamber. The electric connection system comprises via-holes in which conductors are filled and both connected to the conductors; an insulating first substrate having conductive pads spreading on surfaces of both inside and outside of the chamber both connected to the conductor, and blocking holes formed on a barrier; a second base plate having a conductive layer on its whole surface; an inner wiring of the chamber soldered to one end of the conductive layer; first connectors soldered to the other end of the conductive layer, having a spring contact press contacted to the conductive pad spreading on the inside surface of the chamber at the first substrate; and second connectors having the same structure with the first connectors, arranged at the outside of the chamber.
Description
Technical field
The present invention relates to an electric connection structure, a connector and an electrical connection system; This electric connection structure makes the outside and the inboard electrical connection mutually of a Room, and this chamber is separated by a dividing plate and the internal pressure of chamber is conditioned; This connector and this electric connection structure compatibility; This electrical connection system is made up of this electric connection structure and this connector.
Background technology
Generally, in the manufacturing process of the semiconductor chip that contains integrated circuit or similar technology, use and to make its internal pressure be reduced to vacuum chamber or analog near vacuum; Recommend to use structure with the internal and external parts electrical connection of this vacuum chamber or analog.
For example, patent document 1 discloses pressure and airtight terminal, and wherein via hole is arranged on the supporting member of being made by certain composite material, and gas-tight seal is located at this via hole and passes between the lead-in wire of this via hole.
Also have, patent document 2 discloses a splicing ear, and wherein a hole is arranged on the ceramic substrate, and a bronze medal film is located at this hole and passes between the lead in this hole.
[patent document 1]
The open NO.60-100384 of Japan Patent
[patent document 2]
The open NO.2000-299149 of Japan Patent
Yet,,, therefore be difficult to arrange to high-density to go between (having little spacing) because two gas-tight seal layers and supporting member are located between each adjacent lead-in wire according to disclosed technology in the patent document 1.According to disclosed technology in the patent document 2,, therefore might reduce the spacing of these lead-in wires to a certain extent because this copper film is thinner than this gas-tight seal.But because the copper coin layer that the predetermined diameter of this lead-in wire and existence contact with this lead-in wire and copper film, and be difficult to further reduce this spacing.
In recent years, such as having used various types of complicated controllers in those above-mentioned vacuum chambers, and increasing lead is used to connect the internal and external parts of these chambers.Therefore, be a challenge with the less inside and the outside installation wiring of spacing in these chambeies.
In view of above situation, the purpose of this invention is to provide; One electric connecting structure, this syndeton can use the spacing littler than conventional art to be electrically connected the internal and external parts of this chamber; A connector, this connector and this electric connection structure compatibility; With an electrical connection system, this system is made up of this electric connection structure and connector.
Summary of the invention
For reaching above purpose, the invention provides an electric connection structure, this structure is electrically connected the outside of a Room with inboard, this chamber is separated by a dividing plate and its internal pressure is conditioned, this electric connection structure has: cover the substrate of an insulation in a hole of this dividing plate, wherein the substrate of this insulation has the connection inner surface of this chamber and outer surface and with the through hole of electric conducting material filling; And conductive spacer, each conductive spacer is distributed in the corresponding outer surface in this chamber and inner surface and is connected with this electric conducting material.
This first electric connection structure of the present invention has the hole of this chamber that the substrate with this insulation covers, and therefore can make this chamber keep highly airtight.The substrate of this insulation mainly is made up of the through hole of filling with electric conducting material, and this electric conducting material is equivalent to this lead-in wire or the lead of description in patent document 1 and 2.Yet gas-tight seal or the copper film of traditional specification requirement around this lead-in wire or lead.The present invention only need in these through holes this electric conducting material and without any need for gas-tight seal or copper film.Therefore, the present invention can realize that high density is electrically connected.
Also have, for reaching above purpose, the invention provides an electric connector, it has: the substrate of an insulation, this substrate have and are formed on a lip-deep conductive layer; Be welded in the lead of an end of this conductive layer; With each spring contacts, this contact is welded in another end of this conductive layer and at their end rubber-like joint.
This electric connector of the present invention is applicable to this electric connection structure of the present invention.When the conductive spacer on the substrate surface of this insulation in the resilient contact of this electric connector and this electric connection structure keeps compressing when contact, can realize more reliably that electricity operates.Also have, this connector of the present invention has used the material through the field test proof that is generally used for connecting up, and these materials comprise: the substrate of this insulation; With this conductive layer that metal is made of such as copper, lead, and elastomeric joint; And the welding material of welding usefulness.They disengage gas hardly and can not act on equipment and the analog that exposes in this chamber conversely during as vacuum chamber in being applied to the chamber.This connector also is applicable to this electric connection structure in this respect.
Also have, for reaching above purpose, the invention provides an electrical connection system, this system makes the internal wiring of a Room be electrically connected mutually with outside wiring, and this chamber is separated by a dividing plate and its internal pressure is conditioned.This electrical connection system has: first substrate of an insulation, this substrate cover a hole of this dividing plate and have the inner surface that is communicated with this chamber and outer surface and with the through hole of electric conducting material filling; And conductive spacer, each conductive spacer is distributed in corresponding inner surface in this chamber and the outer surface one and goes up and be connected with this electric conducting material; First connector, each first connector has second substrate, form a conductive layer on the surface of this second substrate, the internal wiring of this chamber is welded in an end of this conductive layer, and spring contacts is welded in another end of this conductive layer and the termination of this contact is pressed towards this conductive spacer, and this conductive spacer is distributed in the inner surface of this chamber; With second connector, each second connector has the 3rd substrate, form a conductive layer on the surface of the 3rd substrate, the outside wiring of this chamber is welded in an end of this conductive layer, and spring contacts is welded in another end of this conductive layer and the termination of this contact is pressed towards this conductive spacer, and this conductive spacer is distributed on the outer surface of this chamber.
In addition, for reaching above purpose, the invention provides an electric connection structure, this structure makes the outside of a Room be electrically connected mutually with inboard, this chamber is separated by a dividing plate and its internal pressure is conditioned, this electric connection structure has: the substrate of an insulation, and this substrate covers a hole of this dividing plate, and wherein the substrate of this insulation has: be communicated with the outer surface of this chamber and inner surface and with the through hole of electric conducting material filling; Conductive spacer, each conductive spacer are distributed in corresponding inner surface in this chamber and the outer surface one and go up and be connected with this electric conducting material; With on outer surface that is arranged on this chamber and the inner surface and be welded in contact on the adjacent conductive pad, right to constitute contact, each contact is to being configured to compress a plate.
Owing to have this above-mentioned electric connection structure, this electric connection structure can keep the height of this chamber airtight.Also have, owing to be provided with the paired contact that compresses this plate (substrate of this insulation of this connector that describes below), this electric connection structure can form the wiring more intensive than above-mentioned electric connection structure.
Also have, the invention provides a connector with this electric connection structure compatibility, this connector has; The substrate that on two surfaces, all has an insulation of conductive layer; With the lead that is welded in this conductive layer.
Because this connector has a conductive layer on each surface of the substrate of this insulation and each conductor is welded in this conductive layer, so it can be finished than the higher wiring of above-mentioned connector density.
In addition, the invention provides an electrical connection system, this system makes the internal wiring of a Room be electrically connected mutually with outside wiring, this chamber is separated by a dividing plate and the internal pressure of this chamber is conditioned, this electrical connection system has: first substrate of an insulation, this substrate cover the hole on this dividing plate and have the inner surface that is communicated with this chamber and outer surface and with the through hole of electric conducting material filling; One of being distributed in the corresponding inner surface in this chamber and the outer surface goes up and is connected with this electric conducting material for conductive spacer, each conductive spacer; Contact, this each contact are located on the inner surface of this chamber and the outer surface and to be welded in the adjacent conductive pad right to form each contact, and each contact compresses a plate to being configured; First connector, each first connector has second substrate, on this each surface of second substrate a conductive layer is arranged all, and the internal wiring of this chamber is connected in two lip-deep these conductive layers, and this each conductive layer is compressed and be connected to this contact by this contact on this indoor side surface herein; With second connector, each second connector has the 3rd substrate, the 3rd substrate all has conductive layer on two surfaces, and the wiring of the outside of this chamber is welded in these two lip-deep these conductive layers, and this conductive layer is compressed and be connected to this each contact by the contact on this outdoor side surface herein.This electrical connection system can be realized than the above-mentioned more highdensity wiring of this electrical connection system.
As mentioned above, the present invention can keep this chamber height airtight and can realize highdensity wiring.
Description of drawings
Fig. 1 is the front view that shows an extra-high vacuum iris type connector, and this connector is provided with the example product according to electric connection structure of the present invention;
Fig. 2 is the cutaway view along this extra-high vacuum iris type connector of the intercepting of the A-A line among Fig. 1;
Fig. 3 is the cutaway view along this extra-high vacuum iris type connector of the intercepting of the B-B line among Fig. 1;
Fig. 4 is the vertical view that shows a ceramic substrate of this extra-high vacuum iris type connector;
Fig. 5 is the vertical view that will be connected to a board-like connector of this extra-high vacuum iris type connector;
Fig. 6 is the sketch that shows when being seen this board-like connector of arrow C direction from Fig. 5;
Fig. 7 is the cutaway view along this board-like connector of the intercepting of the D-D line among Fig. 5;
Fig. 8 be this ceramic substrate of showing this extra-high vacuum iris type connector with this board-like connector between the schematic drawing that is connected;
Fig. 9 is the vertical view that shows a ceramic substrate of an extra-high vacuum iris type connector, and this connector device has the electric connection structure according to second embodiment of the invention; With
Figure 10 is this ceramic substrate of displayed map 9 and according to the schematic drawing of the syndeton between the board-like connector of second embodiment of the invention.
Embodiment
Each embodiment of various details.
Fig. 1 is the front view that shows an extra-high vacuum iris type connector, this connector is provided with the example according to electric connection structure of the present invention, Fig. 2 is the cutaway view along this extra-high vacuum iris type connector of the intercepting of the A-A line among Fig. 1, and Fig. 3 is the cutaway view along this extra-high vacuum iris type connector of the intercepting of the B-B line among Fig. 1.
As shown in Figure 3, this extra-high vacuum iris type connector 10 mainly is made up of a flange 11, an adapter 12 and a ceramic substrate 13.As shown in Figure 2, this extra-high vacuum iris type connector 10 places the vacuum chamber outside so that a hole 101 of a closed dividing plate 100.This extra-high vacuum iris type connector 10 utilize 4 bolts hole 111 on flange 11 be connected in this vacuum chamber dividing plate 100 so that this dividing plate 100 keep securely contacting with a sealing area, the sealing zone assigns to represent with shadow part in Fig. 1, makes this vacuum chamber keep air-tightness thus.
Fig. 4 is the vertical view of the ceramic substrate 13 of the extra-high vacuum iris type connector 10 shown in the displayed map 1-3.Explain for simplifying, the brazing area 131 shown in Fig. 1 be electrically connected regional 132 and do not distinguished.
Be arranged on the electrical connection zone 132 of ceramic substrate 13 a large amount of conductive spacer 133 bidimensionals.Only there is a surface of ceramic substrate 13 to be shown among Fig. 4, goes up (this lower surface relative) with this top surface shown in Fig. 4 but each identical shaped conductive spacer 133 is arranged in another surface in an identical manner.
In passing, each through hole 134 alternately is arranged on the top and the bottom of each conductive spacer 133, and this conductive spacer 133 becomes flatly to arrange in Fig. 4.This is for preventing that each through hole from leaning on to such an extent that too tightly cause fracture in ceramic substrate 13 each other.
Fig. 5 is the vertical view that will be connected to the board-like connector on this extra-high vacuum iris type connector of describing with reference to figure 1-4, Fig. 6 shows this board-like connector that the arrow C direction from Fig. 5 is looked, and Fig. 7 is the cutaway view along this board-like connector of the intercepting of the D-D line among Fig. 5.Yet a holding wire 22 and spring contacts 23 are not cutd open.
This board-like connector 20 has: a ceramic substrate 21 is arranged to a row large number of signal lines 22 and is arranged to have with these holding wires the spring contacts 23 of equidirectional and spacing.
With the groove 212 of spacing on ceramic substrate 21 cutting identical, stretch by ceramic substrate 21 and opening leading edge 211 towards ceramic substrate 21 with these spring contacts 23.Each conduct electricity template 213 on a surface of ceramic substrate 21 with each groove 212 one to one mode be close to each groove 212 back and be formed.Each conduction template 213 comprises a rectangular area 213a, elongated area 213b and a join domain 213c, and join domain 213c connects rectangular area 213a and elongated area 213b.Each exposed contacts 221 of holding wire 22 is welded in the rectangular area 213a of corresponding conduction template 213.Spring contacts 23 is disposed in the corresponding groove 212 and uses to be brazed in from its termination that the leading edge 211 of ceramic substrate 21 protrudes out a little and respectively conducts electricity the elongated area 213b of template 213.
As shown in Figure 7, spring contacts 23 amplitude bendings broad in the middle are to provide elastic force.Also have, each spring contacts 23 has the termination 231 of a bending, and corresponding conductive spacer 133 contacts on the ceramic substrate 13 of termination 231 and this extra-high vacuum iris type connector shown in Fig. 1-4, so be electrically connected with it.Therefore, the line-spacing (on the horizontal direction at Fig. 4) of the conductive spacer 133 on the line-spacing of board-like connector 20 upper spring contacts 23 and ceramic substrate 13 shown in Figure 4 is identical, and it is identical to be arranged to the quantity (being 10 in this example) of the conductive spacer 133 of horizontal row on the ceramic substrate 13 among the quantity of the spring contacts 23 on a board-like connector 20 and Fig. 4.
Fig. 8 be the ceramic substrate (see figure 4) of the extra-high vacuum iris type connector shown in the displayed map 1-4 with this board-like connector shown in Fig. 5-7 between the sketch map that is connected.
As mentioned above, the extra-high vacuum iris type connector 10 shown in Fig. 1-4 is positioned in the position near a hole of the dividing plate in this vacuum chamber.As shown in Figure 8, the board-like connector 20A (be loaded in this vacuum chamber) identical with the shape of the board-like connector 20 shown in Fig. 5-7, be pressed towards the ceramic substrate 13 of extra-high vacuum iris type connector 10 in the direction of arrow E from the inboard of this vacuum chamber, so that the corresponding conductive spacer 133a on the inner surface 13a of the termination of spring contacts 23 and ceramic substrate 13 is linked to each other.Similarly, be extruded along arrow F direction from the outside of this vacuum chamber with the identical shaped board-like connector 20B of the board-like connector of shown in Fig. 5-7 this 20, so that the corresponding conductive spacer 133b on the outer surface 13b of the termination of spring contacts 23 and ceramic substrate 13 is linked to each other.
As shown in Figure 4,10 conductive spacers 133 by horizontal arrangement on the ceramic substrate 13 of this extra-high vacuum iris type connector.Therefore, 10 spring contacts 23 are disposed on the direction perpendicular to Fig. 8 paper on each board-like connector 20A or the 20B.In addition, 5 conductive spacers 133 vertically are arranged on the ceramic substrate 13 among Fig. 4.Therefore, per 5 the board-like connector 20A of the inside of this vacuum chamber and the board-like connector 20B of this vacuum chamber outside are vertically installed, as shown in Figure 8.In this way, each spring contacts 23 on the board-like connector 20B in the outside of the conductive layer 133b on the outer surface of the conductive layer 133a on the ceramic substrate 13 of the conduction template 213 of the holding wire 22 in the inboard of this vacuum chamber and the outside on the board-like connector 20A of this vacuum chamber inboard, spring contacts 23, this extra-high vacuum iris type connector, the electric conducting material in each through hole 134, this vacuum chamber, this vacuum chamber and respectively conduct electricity template 213 and be connected.
In this way, according to present embodiment, the medial and lateral of this vacuum chamber through filling ceramic substrate 13 each through hole electric conducting material and interconnect, make that might to keep this vacuum chamber height airtight and arrange a large amount of holding wires to high-density.
Secondly, second embodiment of the present invention will be described.
Fig. 9 is the vertical view that shows the ceramic substrate of an extra-high vacuum iris type connector, and this connector is provided with second embodiment of the invention one electric connection structure.
This extra-high vacuum iris type connector of second embodiment of the invention only is that first embodiment with above-mentioned is different on ceramic substrate, and therefore will only illustrate and describe this ceramic substrate herein.Also have, be easy to understand, the parts identical with those parts of ceramic substrate 13 among Fig. 4 use the Reference numeral identical with those parts of this ceramic substrate 13 to mark, even in some difference of aspects such as shape, only describe difference wherein.
The electrical connection zone 132 of the ceramic substrate 13 among Fig. 9 in the horizontal direction with the conductive spacer 133 that contains as many (10) on this ceramic substrate shown in Fig. 4, the twice (10) of (5 conductive spacers) in higher Fig. 4 of being of conduction backing density that vertical direction contains.The conductive spacer of equal number is with two the lip-deep corresponding positions of identical pitch arrangement at this ceramic substrate 13, and interconnects via this electric conducting material of each through hole 134 of filling ceramic substrate 13 at every pair of conductive spacer of two lip-deep corresponding positions of this ceramic substrate 13.These through holes 134 are arranged on the top and the bottom of conductive spacer 133 alternately, and each conductive spacer 133 arranges flatly that in Fig. 9 this has prevented that these through holes 134 from causing the fracture in the ceramic substrate 13.
Each contact 135 is welded among Fig. 9 on the ceramic substrate 13 on the corresponding conductive spacer 133.To be described with reference to Figure 10 each contact 135.
Figure 10 is the schematic drawing that is connected between the board-like connector of this second embodiment of this ceramic substrate and the present invention in the displayed map 9.
Each contact 135 of shape shown in this figure is welded on each conductive spacer 133, this each conductive spacer 133 is positioned on the ceramic substrate on the inside and outside both sides of this vacuum chamber, and every pair of vertical adjacent contact 135 constitutes a spill contact of admitting a board- like connector 20A or 20B on the direction shown in arrow E or the F.Yet with regard to electrical connection, these two paired contacts 135 are independently each other.
Two board- like connector 20A and 20B have a ceramic substrate 21 and holding wire 22, ceramic substrate 21 has and is formed at two lip-deep conduction templates 213 herein, and holding wire 22 is set on two surfaces of ceramic substrate 21, and the lead 221 of these ceramic substrate 21 terminations is welded in conduction template 213.At the top of ceramic substrate 21 and the conduction template 213 on the lower surface be independently each other on circuit.
Though Figure 10 only shows a file of contact 135, according to present embodiment, 10 contacts 135 are disposed in the horizontal direction (perpendicular to Figure 10 paper direction) among Fig. 9.Therefore, a ceramic substrate 21 in board-like connector contains 10 conduction templates 213, is positioned at each conduction template 213 on top surface and the lower surface all perpendicular to the direction of Figure 10 paper.In addition, correspondingly 10 holding wires 22 are disposed on the direction perpendicular to Figure 10 paper.
According to this second embodiment shown in Fig. 9 and 10, these medial and lateral of this vacuum chamber this electric conducting material through filling ceramic substrate 13 each through hole is connected to each other, and makes this vacuum chamber keep highly airtight as the situation of this first embodiment.In addition, because each holding wire is installed on the top surface and lower surface of ceramic substrate 21 of two board- like connector 20A or 20B independently, these holding wires can be arranged with the density higher than this first embodiment.In passing, can increase by an outer cover, cover every pair of contact 135, so that ceramic substrate 21 is used as a guide and protects each contact 135.
Also have, quote as proof though vacuum chamber is used as an example, this chamber of the present invention is not limited to a vacuum chamber, and it can be separated by a dividing plate and its internal pressure is the another kind of chamber that is conditioned.For example, it can be that its internal pressure is adjusted to a kind of chamber that is equal to or higher than the atmospheric pressure level.In addition, property substrate as an illustration, an example has been described a ceramic substrate, and this insulating substrate disengages gas hardly, but the also available other forms of substrate that does not discharge gas replaces.
Claims (3)
1. an electrical connection system, it makes the internal wiring of a Room be electrically connected mutually with outside wiring, and this chamber is conditioned by dividing plate separation and its internal pressure, and this electrical connection system comprises:
First substrate of one insulation, it covers the hole on this dividing plate and comprises: through hole, this through hole are communicated with the inboard, outer surface of this chamber and are filled with electric conducting material; And conductive spacer, each conductive spacer is distributed in corresponding inboard, this chamber and the outer surface one and goes up and be connected with this electric conducting material;
First connector, each first connector comprises: second substrate, be formed with a conductive layer on the one surface, this internal wiring of this chamber is welded in an end of this conductive layer; And spring contacts, another end and its termination that this spring contacts is welded in this conductive layer are pressed towards this each conductive spacer, and this each conductive spacer is distributed on the inner surface of this chamber; With
Second connector, each this second connector comprises: the 3rd substrate, be formed with a conductive layer on the one surface, the outside wiring of this chamber is welded in an end of this conductive layer; And spring contacts, this each spring contacts is welded in another end of this conductive layer, and its termination is pressed towards this each conductive spacer, and this each conductive spacer is distributed on the outer surface of this chamber.
2. electric connection structure, it is electrically connected outer, the inboard of a Room mutually, and this chamber is separated by a dividing plate and its internal pressure is conditioned, and this electric connection structure comprises:
The substrate of one insulation, it covers a hole that is formed on this dividing plate,
Wherein, the substrate of this insulation comprises:
The through hole that the inboard of this chamber and outer surface is communicated with and fills with electric conducting material;
Conductive spacer, this each conductive spacer are distributed in corresponding inboard, this chamber and the outer surface one and go up and be connected with this electric conducting material; With
Contact, this each contact are arranged on this surface, medial and lateral of this chamber and to be welded in the adjacent conductive pad right to form contact, and each contact is to being configured to compress a plate.
3. electrical connection system, it makes the internal wiring of a Room be electrically connected mutually with outside wiring, and this chamber is conditioned by dividing plate separation and its internal pressure, and this electrical connection system comprises:
First substrate of one insulation, it covers the hole in this dividing plate and comprises: through hole is communicated with the inboard of this chamber and outer surface and is filled by electric conducting material; Conductive spacer, each conductive spacer be distributed in this chamber accordingly should the inboard and outer surface in one go up and be connected with this electric conducting material; And contact, this contact is located on the inner surface of this chamber and the outer surface and is welded on the adjacent conductive pad rightly to form each contact, and each contact is to being configured to compress a plate;
First connector, each first connector comprises: second substrate, it all has a conductive layer on two surfaces; With the internal wiring of this chamber, it is welded on these two lip-deep conductive layers, and wherein, this conductive layer is compressed and is connected on the corresponding contact by each contact on this indoor side surface; With
Second connector, each this second connector comprises: the 3rd substrate, it all has a conductive layer on two surfaces; With the outside wiring of this chamber that is welded in these two lip-deep conductive layers, wherein this each conductive layer is compressed and is connected to corresponding contact by each contact on this outdoor side surface.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP143698/2003 | 2003-05-21 | ||
| JP143698/03 | 2003-05-21 | ||
| JP2003143698A JP4266326B2 (en) | 2003-05-21 | 2003-05-21 | Electrical connection structure and electrical connection system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1574466A CN1574466A (en) | 2005-02-02 |
| CN100420096C true CN100420096C (en) | 2008-09-17 |
Family
ID=33531402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100475223A Expired - Fee Related CN100420096C (en) | 2003-05-21 | 2004-05-21 | Electric connection structure, connector and electric connecting system |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4266326B2 (en) |
| KR (1) | KR20040100976A (en) |
| CN (1) | CN100420096C (en) |
| TW (1) | TW200511669A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104471794A (en) * | 2012-07-19 | 2015-03-25 | 泰科电子日本合同会社 | Planar connector |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009001663A1 (en) * | 2009-03-19 | 2010-09-23 | BSH Bosch und Siemens Hausgeräte GmbH | Vacuum cleaner with electrical connection element |
| CN103477501A (en) * | 2011-04-20 | 2013-12-25 | 泰科电子日本合同会社 | Connector and method for manufacturing connector |
| JP5845006B2 (en) * | 2011-06-29 | 2016-01-20 | タイコエレクトロニクスジャパン合同会社 | Electrical connection structure |
| JP5705062B2 (en) * | 2011-08-08 | 2015-04-22 | タイコエレクトロニクスジャパン合同会社 | connector |
| KR102000293B1 (en) * | 2012-09-28 | 2019-07-15 | 타이코에이엠피 주식회사 | Pressure sensor |
| JP2014082094A (en) * | 2012-10-16 | 2014-05-08 | Tyco Electronics Japan Kk | Connector |
| JP6208935B2 (en) * | 2012-10-31 | 2017-10-04 | タイコエレクトロニクスジャパン合同会社 | connector |
| CN107112664B (en) * | 2014-09-16 | 2020-05-19 | 安费诺富加宜（亚洲）私人有限公司 | Hermetically sealed electrical connector assembly |
| CN105322317B (en) * | 2014-11-18 | 2017-08-25 | 中国计量科学研究院 | A kind of vacuum system, multi-stage vacuum system and their feedthrough electrical connection methods |
| CN108649360B (en) * | 2018-06-08 | 2023-09-15 | 无锡华测电子系统有限公司 | Low-frequency interface interconnection structure and manufacturing method thereof |
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- 2003-05-21 JP JP2003143698A patent/JP4266326B2/en not_active Expired - Fee Related
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- 2004-04-21 TW TW093111100A patent/TW200511669A/en unknown
- 2004-05-19 KR KR1020040035476A patent/KR20040100976A/en not_active Application Discontinuation
- 2004-05-21 CN CNB2004100475223A patent/CN100420096C/en not_active Expired - Fee Related
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|---|---|---|---|---|
| CN1253415A (en) * | 1998-10-30 | 2000-05-17 | 汤姆斯-无线电报总公司 | Construction member units piling up in same outer casing |
| CN2364582Y (en) * | 1998-12-29 | 2000-02-16 | 富士康(昆山)电脑接插件有限公司 | Electronic card arrangement |
| JP2000299149A (en) * | 1999-04-13 | 2000-10-24 | Tosei Electro Beam Kk | Connecting terminal and manufacture thereof |
| DE19932849A1 (en) * | 1999-07-14 | 2001-02-08 | Herbert Amrhein | Electrical contact device has an elastic isolating body with elastic contacts fixed within it with pointed protrusions at each end so that arranged between two sets of conductors an efficient pressurized connection is made |
| CN1338117A (en) * | 1999-11-26 | 2002-02-27 | 揖斐电株式会社 | Multilayer circuit board and semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104471794A (en) * | 2012-07-19 | 2015-03-25 | 泰科电子日本合同会社 | Planar connector |
| CN104471794B (en) * | 2012-07-19 | 2017-02-08 | 泰科电子日本合同会社 | Planar connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1574466A (en) | 2005-02-02 |
| TW200511669A (en) | 2005-03-16 |
| KR20040100976A (en) | 2004-12-02 |
| JP2004349073A (en) | 2004-12-09 |
| JP4266326B2 (en) | 2009-05-20 |
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Owner name: TYCO ELECTRONICS JAPAN CO., LTD. Free format text: FORMER NAME: ANPU TYCO ELECTRONICS CO., LTD. |
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Address after: Kawasaki, Kanagawa, Japan Patentee after: Tyco Electronics Corporation Address before: Kanagawa Patentee before: AMP Tech Electronics Co., Ltd. |
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Granted publication date: 20080917 Termination date: 20170521 |