CN100406619C - Electrolytic recycling device - Google Patents
Electrolytic recycling device Download PDFInfo
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- CN100406619C CN100406619C CNB038001101A CN03800110A CN100406619C CN 100406619 C CN100406619 C CN 100406619C CN B038001101 A CNB038001101 A CN B038001101A CN 03800110 A CN03800110 A CN 03800110A CN 100406619 C CN100406619 C CN 100406619C
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- etch processes
- solution
- regeneration
- processes solution
- treatment unit
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
- C25F7/02—Regeneration of process liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/21—Manganese oxides
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/02—Electrodes; Manufacture thereof not otherwise provided for characterised by shape or form
- C25B11/03—Electrodes; Manufacture thereof not otherwise provided for characterised by shape or form perforated or foraminous
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- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
Abstract
An electrolytic recycling device capable of minimizing insoluble sludge produced when etching fluid containing metal ions is recycled in a recycling tank having electrodes therein and eliminating the need of specially installing a sludge removal means such as a sludge removal tank, characterized in that the inside of the recycling tank (12) is divided into a plurality of compartments (12a to 12h) so that the etching fluid supplied from the supply side of the recycling tank sequentially flows in an outlet direction while alternately changing a flowing direction to upper side and lower side, the electrodes (16, 16, 16) are disposed in the compartments (12b, 12d, 12f) where the etching fluid flows upward among the plurality of compartments, and agitating means for agitating the etching fluid are installed at the portions in the compartments (12a to 12h) where the flow of the etching fluid stagnates.
Description
Technical field
The present invention relates to a kind of electrolytic regeneration treatment unit, more specifically relate to a kind of in having the regeneration tank of electrode regeneration comprise the electrolytic regeneration treatment unit of etch processes solution of metal ion.
Background technology
So-called accumulation circuit card is used as the multilayer circuit board of semiconductor device or analogue sometimes.
When making this accumulation circuit card, for example, in the resin layer that is formed at the lip-deep pre-determined thickness in core substrate two sides, form via hole, with the conductive pattern that forms on the core substrate that is exposed to basal surface, after this, metal level forms by going up on the whole surface of resin layer (inner wall surface that comprises via hole) to electroplate, and carries out patterning subsequently to form conductive pattern and via hole on this electrodeposition of metals.Identical operations can repeat the multilayer circuit board that is laminated to a plurality of conductive patterns on the core substrate two sides until obtaining having.
Pile up in the manufacturing process of circuit card at this,,, carry out surperficial roughening and handle on the surface of resin layer, to form small roughness in order to ensure the tight contact between resin layer and the electrodeposition of metals if metal level forms by electroplating on resin layer.
In this surface roughening is handled, comprise the etching solution such as the permanganate water solution of metal ion, comprise chromic solution, wait as etching solution with the etching resin layer.
The etch capabilities that comprises this etching solution of metal ion weakens by carry out surperficial roughening processing on the surface of resin layer.But carry out electrolysis treatment by the etching solution that etch capabilities is weakened, etch capabilities is renewable.
Japanese Patent publication No.10-245443 has proposed a kind of device as shown in Figure 5 as this electrolytic regeneration treatment unit.
In the electrolysis treatment process in regeneration tank 108, except the regenerative response of the etching solution that is used to regenerate, side reaction takes place to produce soluble sludge.For example, if permanganate water solution is used as etching solution, the surperficial roughening of resin substrate 102 is by Mn in etch processes groove 104
7+Be reduced into Mn
6+And realize.What produced in etch processes groove 104 comprises Mn
6+Etch processes solution flow into regeneration tank 108, wherein Mn
6+By electrode 110,110 .. is oxidized to Mn once more by electrolysis treatment
7+And treatment soln is back to etch processes groove 104 once more.Therefore, Mn
6+In the electrolysis treatment process, pass through electrode 110,110, the oxidized and regeneration of ...But since limited regeneration efficiency, some Mn
6+There is not regeneration Mn
7+, and produce Manganse Dioxide (MnO
2).
Manganse Dioxide (the MnO that so makes
2) be circulated to etch processes groove 104 and be circulated to regeneration tank 108 as soluble sludge (the following sludge that is called simply) subsequently, and assemble gradually, cause pipeline to stop up and therefore influence unfriendly the surperficial roughening of resin substrate 102 usually.
Therefore, electrolytic processing apparatus 100 shown in Figure 5 has sludge and removes groove 200, and wherein the sludge in the etch processes solution precipitates and is removed.Sludge is removed the circulation line 204 of groove 200 by having recycle pump 202,206 are connected on the regeneration tank 108, sludge in the regeneration tank 108 is fed to sludge with etch processes solution and removes groove 200 like this, therefore makes the treatment soln of therefrom removing sludge can be back to regeneration tank 108.
In electrolytic processing apparatus shown in Figure 5 100, the gathering of sludge in etch processes groove 104 and regeneration tank 108 can be avoided by providing sludge to remove groove 200, and the latter can make the sludge precipitation in the etch processes solution and be removed.
But the sludge that has precipitated and accumulated in the sludge removal groove 200 must regularly be removed from groove.This removal is the operation of a trouble, and since hard by the sludge piece that precipitates and the accumulative sludge forms, so the sludge removal is difficult.
In addition, sludge is removed the outfit inevitable requirement increasing electrolytic processing apparatus 100 of groove 200.
Therefore, need a kind ofly can to reduce the new regeneration tank 108 that produces sludge as far as possible such demand of sludge being removed groove 200 of eliminating.
Summary of the invention
Therefore, an object of the present invention is to provide a kind of electrolytic regeneration treatment unit that can reduce in having the regeneration tank of electrode the amount of the soluble sludge that is produced when regeneration comprises the etch processes solution of metal ion as far as possible, need not to be equipped with the sludge removal device in addition like this such as sludge is removed groove.
The present inventor furthers investigate in order to address the above problem, found that, by the etch processes solution that flows into regeneration tank alternately being flowed up and down and the stagnation part that electrode makes progress mobile etch processes solution and stirs and mix etch processes solution with contact being set, the amount of the sludge that can reduce in regeneration tank as far as possible to be produced, and therefore realize the present invention.
Therefore, according to the present invention, a kind of electrolytic regeneration treatment unit of the etch processes solution that comprises metal ion of being used to regenerate is provided, comprise that its inside is divided into situation current downflow that a plurality of compartments make that the described etch processes solution supplied with by feed-side alternately changes up and down at flow direction to shift to the regeneration tank of outlet side continuously, be arranged on make progress electrode and being used in those compartments of mobile of the wherein etch processes solution that is selected from described a plurality of compartments and stir the whipping appts that is arranged on the position that the compartment etching solution stagnates of etching solution.
In the present invention, the preferred electrode that uses annode area greater than cathode area, especially, the preferred electrode that uses the negative electrode that comprises the anode formed by cylindrical mesh element and form by the rod element of insertion mesh element, wherein mesh element and rod element are on the vertical position of flow direction.
In addition, the flow direction by etch processes solution therein by downward direction change into upward to the position near whipping appts is provided, can avoid soluble sludge the flow direction of etch processes solution change that part of on gathering.Comprise that nozzle can be advantageously used for these whipping apptss with the whipping appts that etch processes solution is injected regeneration tank.
Preferably, provide circulation passage also this etch processes solution to be back to regeneration tank once more, and nozzle is arranged in this circulation passage from regeneration tank, to take out etch processes solution.
Utilization is according to electrolytic regeneration device of the present invention, and the amount of the soluble sludge that is produced in regeneration tank is compared with conventional equipment and can greatly be descended.
Because produce soluble sludge such as Manganse Dioxide (MnO
2) electrode be arranged to upwards mobile etch processes solution of contact, simultaneously whipping appts is arranged on the soluble sludge that makes on electrode in etch processes solution that part of of stagnation to be produced and does not accumulate in basically in the regeneration tank, and soluble sludge can be easily removed by being arranged on circulation line simple sludge removal device such as strainer or analogue midway.
As a result, in electrolytic regeneration device according to the present invention, need not to provide in addition special sludge removal device such as sludge to remove groove, might reduce the electrolytic regeneration device size like this.
Description of drawings
Fig. 1 is the view that can be used for explaining according to an example of electrolytic regeneration treatment unit of the present invention;
Fig. 2 is the orthographic plan that shows electrolytic regeneration treatment unit shown in Figure 1;
Fig. 3 is the skeleton view that is used for the electrode of electrolytic regeneration treatment unit shown in Figure 1;
Fig. 4 is the viewgraph of cross-section that can be used for explaining nozzle bore, and described hole is used for as being used for the whipping appts of electrolytic regeneration treatment unit shown in Figure 1 etch processes solution is injected regeneration tank;
Fig. 5 is the view that can be used for interpretation routine electrolytic regeneration treatment unit;
Fig. 6 is the figure that advances the speed that shows along with electrolytic lasting permanganate;
Fig. 7 is the figure that shows the regeneration rate of the relative current density of permanganate.
Embodiment
Fig. 1 is the view that shows according to an example of electrolytic regeneration treatment unit of the present invention.Electrolytic regeneration treatment unit 10 shown in Figure 1 comprises regeneration tank 12, it is divided into a plurality of compartment 12a-12h that arrange to outlet side from feed-side (wherein being used on the surface of resin substrate supplying with etch processes solution after roughening handles in the etching solution that comprises metal ion such as permanganate water solution).
Regeneration tank is by two kinds of division plate 14a, and 14b is divided into these compartments 12a 12h.Division plate 14a has the upper end of giving prominence on the fluid surface of etch processes solution, and the location makes and forms passage so that the lower end of etch processes solution process between the lower end of regeneration tank and basal surface.On the other hand, division plate 14b has the lower end that closely contacts with regeneration tank 12 basal surfaces and the location makes etch processes solution can flow through the upper end that the upper end enters next compartment.
In regeneration tank shown in Figure 1 12, the etch processes solution that has flowed into the compartment 12a that inner wall surface and division plate 14a by regeneration tank 12 form flows into compartment 12b by the gap that forms again between the basal surface of the lower end of division plate 14a and regeneration tank 12, the etch processes solution among the compartment 12a flows on downward direction like this.
In the compartment 12b that forms by division plate 14a and division plate 14b, the etch processes solution stream that flows into this compartment by the gap that forms under the lower end of the division plate 14a upper end of crossing division plate 14b enters the compartment 12c that is formed by division plate 14b and division plate 14a, and the etch processes solution among the compartment 12b is upwards flowing upward like this.
Therefore, regeneration tank is divided into compartment 12a → 12h, wherein each compartment is by two kinds of division plate 14a, 14b separate to make flowed into compartment 12a etch processes solution in order 12a → 12b → 12c → 12d → 12e → 12f → 12g → 12h flow to outlet (flowing to compartment 12h) continuously, wherein alternately change up or down of flow direction.
In regeneration tank shown in Figure 1 12, electrode 16 is arranged on wherein etch processes solution each the compartment 12b of mobile that makes progress, and 12d is among the 12f.These electrodes 16 comprise anode of being made up of cylindrical mesh element 16a and the negative electrode of being made up of the rod element 16b that inserts mesh element 16a as shown in Figure 3.Rod element 16b is, for example, polyfluortetraethylene pipe, the one part surface is coated with conductor.Cylindrical mesh element 16a is made up of laths of metal or mesh.Therefore, electrode 16 structure makes the anodic area be made up of the mesh element 16a area greater than the negative electrode of being made up of rod element 16b.These electrodes 16 shown in Figure 3 are arranged on each compartment 12b, 12d, and among the 12f, wherein mesh element 16a and rod element 16b are in vertical position along the flow direction of mobile etch processes solution upwards and put.The big I of the ratio of annode area and cathode area and electric current changes according to the selection treatment capacity of etch processes solution, but in order to handle Manganse Dioxide (MnO
2), the ratio of annode area and cathode area is preferably set to about 20: 1, and is as described below.
Be arranged on each compartment 12b, 12d, the electrode 16 among the 12f can be used as a plurality of electrodes shown in Figure 2 16,16,16 and provides.
At regeneration tank shown in Figure 1 12, the etch processes solution that has flowed into compartment 12a flows to outlet (flowing to compartment 12h) through the compartment that continues under the situation that flow direction alternately changes up or down.
If the flow direction of etch processes solution by upward to changing into downward direction, or by downward direction change into upward to, stagnate part therein the velocity of flow of etch processes solution obviously descend flow in produce.The sludge that is included in the etch processes solution is often stagnated precipitation in the part at these.
In this respect, in regeneration tank shown in Figure 1 12, the flow direction that the whipping appts that is used to stir etch processes solution is set at etch processes solution wherein by upward to changing into downward direction, or by downward direction change into upward to these stagnate part near.In this whipping appts, pipeline 20 is along the basal surface setting of regeneration tank 12, near and that part of pipeline 20 the flow stagnation place that is arranged in wherein etch processes flow of solution direction change, nozzle bore 20a, 20a is formed in the pipeline 20 of basal surface side of regeneration tank 12, as shown in Figure 4, flowed into compartment 12h and regenerated regeneration etching solution by pump 18 pressurizations and inject etch processes solution and stir the solution that is reproduced.
The regeneration etching solution is by these nozzle bores 20a, and the basal surface that 20a is injected into regeneration tank 12 can prevent precipitation and the gathering of sludge on the basal surface of regeneration tank 12 like this.
Be formed with these nozzle bores 20a on it, the pipeline 20 of 20a is typically provided to and each compartment and the division plate 14a of etch processes solution stream between next compartment wherein as shown in Figure 2, and 14b is parallel, and near the basal surface of regeneration tank 12.Pipeline 20 so arrange be because the flow direction of etch processes solution often at division plate 14a, near the 14b and near the bottom surface of regeneration tank 12 by downward direction change into upward to, and sludge is often in these local precipitations with assemble.
Because from the nozzle bore 20a on the pipeline 20, the injection solution of 20a is in order just to stir at regenerated etch processes solution and therefore to prevent the sludge precipitation and accumulate on the basal surface of regeneration tank 12 and inject, the etch processes solution that is included in the compartment except that compartment 12h of regeneration tank 12 can be used for by the nozzle bore 20a on the pipeline 20,20a injects, shown in the dotted line among Fig. 1.
This electrolytic regeneration device 10 shown in Figure 1 is arranged to be connected with treatment unit 30, and the latter carries out etching on the surface at resin substrate in processes such as surperficial roughening processing.In this treatment unit 30, provide etching solution that treatment trough 32 is used for the storage bag metal ion such as permanganate water solution or analogue on the surfaces of process at resin substrate such as surperficial roughening processing, to carry out etching.Outside treatment trough 32, provide overflow groove 34 to be used to accept to flow to etching solution outside the treatment trough 30.Compartment 12h regenerated regeneration etching solution by electrolytic regeneration device 10 is back to overflow groove 34 by pipeline 36.
The etching solution and the regeneration etching solution that have flowed into overflow groove 34 pass through pipeline 38, and pump 40 and strainer 42 are back to treatment trough 32.The effect of strainer 42 is the toners that separate in the etching solution that flows into overflow groove 34 and the etching solution of regenerating.
Utilize treatment unit shown in Figure 1 30 and electrolytic regeneration device 10, if etch processes solution regenerate in regeneration tank 12 by electrolysis, the generation of sludge especially less and the amount of the sludge that is produced can reduce to about 1/10 of conventional etch processes groove 104 shown in Figure 5.Therefore, in treatment unit shown in Figure 1 30 and electrolytic regeneration device 10, device as the sludge that is used for removing regeneration etching solution and etching solution, can use the simple device midway such as the strainer 42 that are arranged on pipeline 38, etching solution and regeneration etching solution that described pipeline 38 is used for flowing into overflow groove 34 are back to treatment trough 32, and need not to provide special device sludge as shown in Figure 5 to remove groove 200 or analogue in addition to treatment trough 12.
Therefore, utilize treatment unit shown in Figure 1 30 and electrolytic regeneration device 10, sludge removal work only is to change strainer 42 simply, and can get rid of removal and precipitated and accumulated in sludge and remove the required conventional difficulty work of sludge piece in the groove 200, and can reduce device size.
Following according to table 1 and 2 and Fig. 6 and 7 effect of the present invention is described.These tables and figure have provided resulting experimental result when comprising the etching solution of permanganate water solution as metal ion and use electrolytic regeneration device electrical treating shown in Figure 1.
Table 1 has shown for (the primary state of different electrolysis time length, after 2,4 and 6 hours), depend on whether there is nozzle 20a, the variation of the variation (advancing the speed) of the permanganate content of the amount of 20b and stirring (etching solution is by the flow velocity of device) and the amount of sludge.Under all conditions, always there is vertical division plate.In condition 1, do not use nozzle 20a, 20b, and etching solution is set at 67 liters/minute by the flow velocity that installs.In condition 2, similarly, do not use nozzle 20a, 20b, but etching solution increases to 150 liters/minute by the flow velocity that installs.In condition 3, use nozzle 20a, 20b, and etching solution is set at 67 liters/minute by the flow velocity that installs.In condition 4, use nozzle 20a, 20b, and etching solution increases to 150 liters/minute by the flow velocity that installs.The result of Fig. 6 indicator gauge 1.
From these experimental results as can be seen, regeneration rate, that is, advancing the speed of permanganate content can be flow through the speed of regeneration electrode and increase by the stagnation part that stirs this solution by increase.But only can not remove sludge fully by the stirring action that produces that flows through regeneration electrode.On the other hand, by nozzle 20a, 20b and the stirring action that produces can obviously reduce the amount of the sludge that is produced.
Table 2 has provided resulting regeneration efficiency according to experimental result when ratio (ratio of the electrode area of negative electrode 16b and anode 16a) that changes electrode and anodic current density, and Fig. 7 has provided the result of permanganate regeneration rate and current density relation.Wherein the cathode/anode ratio be 1: 20 situation and wherein the cathode/anode ratio be on the peak value of regeneration rate, not have significant difference between 1: 10 the situation.In order to use the current density of wide region as far as possible, the cathode/anode ratio is preferably 1: 20 but in fact.
Industrial applicibility
As mentioned above, utilize according to electrolytic regeneration device of the present invention, if etch processes solution carries out electrolytic regeneration, can produce soluble sludge as few as possible, therefore, the sludge removal device can obtain simplifying and sludge removal work also can be simplified, and can reduce device size like this.
Claims (6)
1. the electrolytic regeneration treatment unit of the etch processes solution that comprises metal ion of being used to regenerate comprises:
Regeneration tank, its inside is divided into a plurality of compartments by the first kind division plate and the second type division plate, wherein first kind division plate has the upper end of giving prominence on the fluid surface of etch processes solution, and the location makes the lower end that forms passage between the lower end of U regeneration tank and the basal surface; The second type division plate has the lower end and the location that closely contact with the regeneration tank basal surface makes etch processes solution can flow through the upper end that the upper end enters next compartment;
Be arranged on make progress electrode in those compartments of mobile of the wherein etch processes solution that is selected from described a plurality of compartments; And
Be used for stirring the whipping appts that the described compartment etching solution of being arranged on of etch processes solution mobile is stagnated the part place.
2. according to the electrolytic regeneration treatment unit of claim 1, wherein said electrode comprise anode and negative electrode and wherein the anodic area greater than the area of negative electrode.
3. according to the electrolytic regeneration treatment unit of claim 1 or 2, wherein said electrode comprises anode of being made up of cylindrical mesh element and the shaft-like negative electrode that inserts mesh element and wherein said mesh element and the rod element fluid surface perpendicular to etch processes solution.
4. according to the electrolytic regeneration treatment unit of claim 1, the flow direction that wherein said whipping appts is set at etch processes solution wherein by downward direction change into upward to the position near.
5. according to the electrolytic regeneration treatment unit of claim 1, wherein said whipping appts has the nozzle that is used for etch processes solution is injected described regeneration tank.
6. according to the electrolytic regeneration treatment unit of claim 5, wherein provide circulation passage to be used for etch processes solution is taken out and etch processes solution is back to regeneration tank and wherein said nozzle is set in the circulation passage from described regeneration tank.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002029713 | 2002-02-06 | ||
| JP029713/2002 | 2002-02-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1498291A CN1498291A (en) | 2004-05-19 |
| CN100406619C true CN100406619C (en) | 2008-07-30 |
Family
ID=27677892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB038001101A Expired - Lifetime CN100406619C (en) | 2002-02-06 | 2003-02-05 | Electrolytic recycling device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4326341B2 (en) |
| KR (1) | KR100972998B1 (en) |
| CN (1) | CN100406619C (en) |
| TW (1) | TWI287589B (en) |
| WO (1) | WO2003066939A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5364126B2 (en) * | 2011-05-24 | 2013-12-11 | 上村工業株式会社 | Electrolytic regeneration processing unit and electrolytic regeneration processing apparatus including the same |
| CN102251254B (en) * | 2011-06-24 | 2014-01-08 | 深圳市惠尔能科技有限公司 | Circular treatment equipment for recovery of copper from microetching liquid and special eddy flow electrolysis unit thereof |
| CN102995094A (en) * | 2011-09-19 | 2013-03-27 | 代芳 | Method for stabilizing metal ion concentration in electroplating bath |
| CN106835257B (en) * | 2017-01-19 | 2018-09-25 | 南京麦文环保设备工程有限责任公司 | The full-automatic compounding system of copper-bath for copper-plating technique |
| CN106757294B (en) * | 2017-01-19 | 2018-09-25 | 南京麦文环保设备工程有限责任公司 | A method of for supplementing copper sulphate in copper plating groove |
| CN109628948A (en) * | 2019-01-04 | 2019-04-16 | 苏州创峰光电科技有限公司 | Regenerating unit |
| CN110438506A (en) * | 2019-07-08 | 2019-11-12 | 深圳市裕展精密科技有限公司 | The regenerative preparation of decoating liquid |
| CN112323131A (en) * | 2020-11-03 | 2021-02-05 | 重庆圣盈达科技开发有限公司 | Method for removing bubbles on surface of electroplated workpiece |
| CN112281163A (en) * | 2020-11-23 | 2021-01-29 | 江苏上达电子有限公司 | PI etching solution electrolytic regeneration system |
| EP4105362A1 (en) | 2021-06-16 | 2022-12-21 | Atotech Deutschland GmbH & Co. KG | Method for oxidizing manganese species in a treatment device and treatment device |
| EP4105361A1 (en) | 2021-06-16 | 2022-12-21 | Atotech Deutschland GmbH & Co. KG | Method for oxidizing manganese species in a treatment device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0291445A2 (en) * | 1987-05-11 | 1988-11-17 | ATOTECH Deutschland GmbH | Process and apparatus for regenerating permanganate etch solutions |
| CN1072737A (en) * | 1991-10-28 | 1993-06-02 | 日铁矿业株式会社 | Handle the method for etching reagent |
| JPH10245443A (en) * | 1997-03-06 | 1998-09-14 | Victor Co Of Japan Ltd | Surface roughening device |
| WO2001090442A1 (en) * | 2000-05-19 | 2001-11-29 | Atotech Deutschland Gmbh | Cathode for electrochemical regeneration of permanganate etching solutions |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2827210B2 (en) * | 1988-01-19 | 1998-11-25 | 凸版印刷株式会社 | Regeneration method of ferric chloride etching waste liquid |
| JP3783972B2 (en) * | 1996-02-22 | 2006-06-07 | ペルメレック電極株式会社 | Cyanide water treatment method |
-
2003
- 2003-02-05 JP JP2003566278A patent/JP4326341B2/en not_active Expired - Lifetime
- 2003-02-05 WO PCT/JP2003/001187 patent/WO2003066939A1/en active Application Filing
- 2003-02-05 CN CNB038001101A patent/CN100406619C/en not_active Expired - Lifetime
- 2003-02-05 KR KR1020037013039A patent/KR100972998B1/en active IP Right Grant
- 2003-02-06 TW TW092102438A patent/TWI287589B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0291445A2 (en) * | 1987-05-11 | 1988-11-17 | ATOTECH Deutschland GmbH | Process and apparatus for regenerating permanganate etch solutions |
| CN1072737A (en) * | 1991-10-28 | 1993-06-02 | 日铁矿业株式会社 | Handle the method for etching reagent |
| JPH10245443A (en) * | 1997-03-06 | 1998-09-14 | Victor Co Of Japan Ltd | Surface roughening device |
| WO2001090442A1 (en) * | 2000-05-19 | 2001-11-29 | Atotech Deutschland Gmbh | Cathode for electrochemical regeneration of permanganate etching solutions |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100972998B1 (en) | 2010-07-30 |
| KR20040082946A (en) | 2004-09-30 |
| TWI287589B (en) | 2007-10-01 |
| JPWO2003066939A1 (en) | 2005-06-02 |
| JP4326341B2 (en) | 2009-09-02 |
| WO2003066939A1 (en) | 2003-08-14 |
| TW200302881A (en) | 2003-08-16 |
| CN1498291A (en) | 2004-05-19 |
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