CN106757294B - A method of for supplementing copper sulphate in copper plating groove - Google Patents
A method of for supplementing copper sulphate in copper plating groove Download PDFInfo
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- CN106757294B CN106757294B CN201710037406.0A CN201710037406A CN106757294B CN 106757294 B CN106757294 B CN 106757294B CN 201710037406 A CN201710037406 A CN 201710037406A CN 106757294 B CN106757294 B CN 106757294B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
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Abstract
The invention discloses a kind of methods for supplementing copper sulphate in copper plating groove, belong to electroplating technology technical field, it is intended to provide a kind of method for supplementing copper sulphate in copper plating groove that can improve electroplating quality, its technical solution is as follows, a method of for supplementing copper sulphate in copper plating groove, including step 1, feeding simultaneously stores；Step 2, the input of electroplate liquid；Step 3, copper powder addition；Step 4 generates copper-bath；Step 5, solution overflow；Step 6, solution cycle；Step 7, solution output.The present invention is suitable for the supplement of the copper during coordination galvanization groove processing, ensures the plating concentration in electroplating bath, and then improve the electroplating quality of unplated piece.
Description
Technical field
The present invention relates to electroplating technologies, more particularly to a kind of method for supplementing copper sulphate in copper plating groove.
Background technology
Using insoluble anode copper sulphate plating in, due to be not from anodic solution copper, with plating
It carries out, the copper concentration in plating bath is reduced.In order to make the copper concentration reduced be restored to the copper concentration suitable for plating, supply oxidation
Supply salt of the mantoquitas such as copper, copper carbonate, Kocide SD as copper ion.
The Chinese patent of Publication No. CN204727977U discloses a kind of circuit board electroplating copper device, it includes electro-coppering
Cylinder, molten copper bucket, outlet tube and return duct；Copper billet is equipped in the molten copper bucket；The described outlet tube connection electro-coppering cylinder and molten
Copper bucket, return duct are connected to electro-coppering cylinder and molten copper bucket, and the electroplate liquid in electro-coppering cylinder enters molten copper bucket by outlet tube, then through reflux
Pipe enters electro-coppering cylinder.
It is copper billet used by above-mentioned this circuit board electroplating copper device, and meltage of the copper billet in molten copper bucket when dissolving
It is limited by the contact area of copper billet so that directly output can cause copper reaction not enough to make the dense of copper sulphate completely in molten copper bucket
Degree is inadequate, influences processing quality.
Invention content
The object of the present invention is to provide a kind of method for supplementing copper sulphate in copper plating groove, having makes copper oxide reaction more
Add fully to improve the concentration of copper sulphate, and then keeps the workpiece quality after plating more preferable.
The present invention above-mentioned technical purpose technical scheme is that：One kind is for supplementing in copper plating groove
The method of copper sulphate, including
Step 1, feeding simultaneously store：The copper oxide copper powder in storage vat is drawn into feed bin by vacuum feeder and is deposited
Storage；
Step 2, the input of electroplate liquid：By the copper-bath in electroplating bath by inlet tube under the action of magnetic drive pump
It is input in the input terminal of dissolving tank；
Step 3, copper powder addition：When the concentration inductor that dissolving tank is located at input terminal detects that the copper sulphate of step 2 is molten
When liquid is less than setting value, the copper oxide copper powder in feed bin is inputted by PLC controller control servomotor driving auger conveyor
To in dissolving tank with copper-bath hybrid reaction；
Step 4 generates copper-bath：After copper oxide copper powder in step 3 is added, pass through the blender pair of input terminal
Copper-bath stirs, and copper oxide copper powder is reacted with the sulfuric acid solution contained in copper-bath generates copper-bath；
Step 5, solution overflow：With increasing for input terminal copper-bath, copper-bath is located at input from dissolving tank
Overflow launder successively overflow of the overflow launder at end to output end；
Step 6, solution cycle：Concentration inductor in overflow launder senses the copper-bath in corresponding overflow launder
When setting value is not achieved in concentration, the copper-bath in the overflow launder is flowed back by circulation pipe under the action of circulation magnetic pump
Into the overflow launder of input terminal；
Step 7, solution output：The copper-bath being flowed into step 6 in the overflow launder of output end is passed through
Outlet tube is input under the action of magnetic drive pump in electroplating bath.
By using above-mentioned technical proposal, when the copper-bath concentration in dissolving tank is relatively low, by the oxidation in feed bin
Copper copper powder, which is reacted by quantitative being added in dissolving tank of servo motor with sulfuric acid solution, generates copper-bath, and then improves sulphur
The concentration of sour copper solution, and copper-bath is flowed in a manner of overflow in dissolving tank so that and copper oxide copper powder can obtain
Can copper oxide copper powder and copper-bath be quickly subjected to hybrid reaction to sufficient reaction time and blender, added
The fast response time；The dense of the copper-bath in each overflow launder can be detected during copper-bath overflow simultaneously
Degree just can be flowed back the copper-bath in corresponding overflow launder again by circulation magnetic pump once standard is not achieved in concentration
To continuing to react with copper oxide cylinder powder in the overflow launder of input terminal, the concentration of copper-bath is enable to be improved so that from
Output end, which is output to the copper-bath in electroplating bath, can approach the concentration of setting, and then the copper sulphate improved in electroplating bath is molten
The concentration of liquid is to improve electroplating quality.
Further, in step 5, copper-bath is carried out by filter plate in the overflow launder close to output end
Filtering.
By using above-mentioned technical proposal, the copper-bath in overflow launder is filtered by filter plate so that
It is more pure it to be output to the copper-bath in electroplating bath from outlet tube, and then when unplated piece is electroplated, Neng Gou great
Other impurities other than big reduction copper removal, which adhere to, influences electroplating quality on unplated piece.
Further, in step 5, copper-bath is drained on filter plate to prevent foam by buffer board
It generates.
By using above-mentioned technical proposal, copper-bath is slowly guided solution to filter plate by buffer board
On, foam is generated to avoid copper-bath from directly falling vertically, and then a large amount of foam is not likely to produce on filter plate
And influence the filter effect of filter plate.
Further, in step 4, when electrode-type liquid-level meter detects that the amount of copper-bath is reduced, to input terminal
Overflow launder add sulfuric acid solution.
By using above-mentioned technical proposal, the amount of solution in overflow launder, Jin Er are constantly monitored using electrode-type liquid-level meter
When copper-bath is inadequate, it can timely add sulfuric acid solution and enter in overflow launder, so that copper-bath can continue
Property overflow and be output in electroplating bath from outlet tube, and then keep the lasting supply of copper-bath in electroplating bath and steady
Determine the concentration of copper sulphate, and then improves electroplating quality.
Further, in step 2, the copper-bath that inlet tube flows through is filtered by filter vat.
It can will be in electroplating bath by using above-mentioned technical proposal, when the copper-bath in electroplating bath is exported from inlet tube
Some impurity bring into together, the impurity in copper-bath can be filtered by cartridge filter, so that entering
Copper-bath in dissolving tank is more pure.
Further, in step 7, the copper-bath that outlet tube flows through is filtered by cartridge filter.
By using above-mentioned technical proposal, during copper-bath is input to electroplating bath, again to copper-bath
Further filtering so that the copper-bath entered in electroplating bath later can be more pure by layering, in turn
The electroplating efficiency of copper-bath in electroplating bath is not easily susceptible to influence, and improves electroplating quality.
Further, in step 4, the copper-bath in each overflow launder carries out jet stream by aerator, stirs
It mixes.
By using above-mentioned technical proposal, copper-bath is carried out at aeration by aerator in each overflow launder
Reason so that the jet stream of aerator impacts copper-bath, stirs, so that copper-bath is mixed with copper oxide copper powder
Close more uniform, the copper oxide copper powder enable and the quick hybrid reaction of sulfuric acid solution, quickening reaction time.
Further, the gas in step 4 in dissolving tank is concentrated into discharge.
By using above-mentioned technical proposal, due to the setting of aerator, the air pressure in dissolving tank increases, will be in dissolving tank
Gas carry out concentration discharge, so as to by dissolving tank some volatilize gases can be handled by concentration, reduce pair
The pollution of environment.
Further, generated waste residue is discharged to waste liquid by scum pipe from isopipe root and empties in step 4
It stands.
By using above-mentioned technical proposal, with overflow launder use can in the slot bottom precipitated impurities of overflow launder, impurity
In the presence of the degree of purity of copper-bath can be influenced, and reduce the solution amount of storage in overflow launder, by scum pipe by these
Impurity, which is discharged to waste liquid and empties station, to be focused on, and the pollution to environment is reduced.
In conclusion the invention has the advantages that：
Copper oxide copper powder adds precision by the rotating cycle and corner of servo motor to control, and then can cry accurately
Control the concentration of copper sulphate in dissolving tank；
Timely sulfuric acid can be added in dissolving tank by electrode-type liquid-level meter to ensure that copper-bath can continue
Carry out overflow and be output in electroplating bath；
The copper-bath that predetermined value can be not achieved in concentration by solution cycle is back in the overflow launder of input point again
It is reacted, to improve the concentration of copper-bath, and then improves electroplating quality.
Description of the drawings
Fig. 1 is the step flow chart in embodiment 1；
Fig. 2 is in embodiment 1 for embodying copper powder feeding device, agitation and filtration device, solution circulating device, following in solution
Connection relationship diagram between loop device；
Fig. 3 is in embodiment 1 for embodying connection relationship diagram between vacuum feeder, screw(-type) feeder, dissolving tank；
Fig. 4 is in embodiment 1 for embodying screw(-type) feeder internal structure schematic diagram；
Fig. 5 is in embodiment 1 for embodying the connection relationship diagram between dissolving tank and electroplating bath；
Fig. 6 is in embodiment 1 for embodying the structural schematic diagram inside dissolving tank；
Fig. 7 is the enlarged drawing in the portions A in Fig. 6；
Fig. 8 is in embodiment 1 for embodying the position relationship schematic diagram between buffer board and groove；
Fig. 9 is the enlarged drawing in the portions B in Fig. 8；
Figure 10 is the structural schematic diagram for embodying solution inner circulation device in embodiment 1；
Figure 11 is the structural schematic diagram for embodying acid adding bucket in embodiment 1；
Figure 12 is the enlarged drawing in the portions C in Figure 11；
Figure 13 is the structural schematic diagram for embodying aerator in embodiment 2.
In figure, 1, storage vat；11, vacuum feeder；12, screw(-type) feeder；121, feed bin；122, feed pipe；1221, spiral shell
Rasp bar；1222, servo motor；1223, conveying pipeline；12231, air inlet；1224, air blower；2, dissolving tank；21, input terminal；
22, output end；23, demarcation strip one；231, fan body；232, flabellum；233, buffer board；24, demarcation strip two；241, groove；242、
Spoiler；25, overflow launder；251, scum pipe；252, shut-off valve；253, waste liquid empties station；254, electrode-type liquid-level meter；26, it stirs
Mix device；27, outlet tube；271, magnetic drive pump one；272, filter vat one；28, inlet tube；281, magnetic drive pump two；282, filter vat two；
3, circulation pipe；31, ball valve；32, liquid pump；33, concentration inductor；34, PLC controller；4, filter plate；5, acid adding bucket；51, it hinders
Baffle；52, drive rod；53, fixed link；54, slot；6, aerator；61, aeration tube；62, safety valve；63, compression pump；64, it revolves
Wind turbine；65, exhaust pipe；7, electroplating bath；8, alarm.
Specific implementation mode
Below in conjunction with attached drawing, invention is further described in detail.
Wherein identical parts are presented with like reference characters.It should be noted that word used in the following description
Language "front", "rear", "left", "right", "up" and "down" refer to the direction in attached drawing, word " bottom surface " and " top surface ", "inner" and
"outside" refers respectively to the direction towards or away from geometric center of specific component.
Embodiment 1：A method of for supplementing copper sulphate in copper plating groove, as shown in Fig. 2, including copper powder feeding device,
Agitation and filtration device, solution circulating device, solution inner circulation device.
As shown in Fig. 2 and 6 and 7, agitation and filtration device includes dissolving tank 2, and the left end of dissolving tank 2 is input terminal 21, right end
For output end 22, several demarcation strips 1 are provided in dissolving tank 2, if dissolving tank 2 is separated by these demarcation strips 1
A dry overflow launder 25, connect with dissolving tank 2 in the lower end of its demarcation strip 1 and both sides, the upper end of demarcation strip 1 and
There are gaps between the upper end of dissolving tank 2；It is provided with demarcation strip 2 24 between two adjacent demarcation strips 1, the demarcation strip
2 24 are fixedly connected with the upper end of dissolving tank 2, and there are gaps between demarcation strip 2 24 and the slot bottom of dissolving tank 2.In this reality
It applies in example, the height of demarcation strip 1 is reduced successively from input terminal 21 to output end 22, and copper-bath can be made easier
In overflow to the overflow launder 25 on right side.It is rotatably connected to several fans in the lower end of the upper end of demarcation strip 1, demarcation strip 2 24
Body 231（As shown in Figure 7）, and the torsional direction of the flabellum 232 on two neighboring fan body 231 is opposite, the purpose is to energy
Enough make copper-bath upper out-of-date from fan body 231, fan body 231 can be driven to rotate, and it is adjacent between fan body 231 turn
Dynamic direction on the contrary, make the flow direction of copper-bath on the contrary, making the more uniform of copper-bath mixing in turn.It is dissolving
Blender 26 there are one being fixedly connected on the overflow launder 25 of 2 input terminal 21 of slot.
As shown in FIG. 8 and 9, it is also set in the output end 22 of dissolving tank 2 and between the demarcation strip 1 of output end 22
It is equipped with one piece of demarcation strip 2 24, the lower part of the demarcation strip 2 24 is provided with a filter plate 4, which is arranged in demarcation strip two
24 close to the side of output end 22, and filter plate 4 is completely covered by the gap between 2 slot bottom of demarcation strip 2 24 and dissolving tank；In this point
Side setting fluted 241 of the partition board 2 24 far from filter plate 4, it is solid in demarcation strip one 23 upper end adjacent with the demarcation strip 2 24
Surely it is connected with a buffer board 233, which tilts down to 22 direction of output end and extend in groove 241, and delays
There are the gap circulated for copper-bath between punching 233 and groove 241, the cross sectional shape of the groove 241 be it is arc-shaped, i.e.,
Groove 241 is arc groove, and circular arc is excessive between the lower wall and demarcation strip 2 24 of groove 241.In the lower wall of groove 241
It is provided with one piece of spoiler 242, which is located at the lower section of buffer board 233.
As illustrated in figs. 10 and 12, the one end for input terminal 21 being located in dissolving tank 2 is additionally provided with acid adding bucket 5, the acid adding bucket 5
Lower end is connected to dissolving tank 2, and is hinged with a piece of barrier plate 51 for closing 5 bottom of acid adding bucket in the bottom of acid adding bucket 5,
When barrier plate 51 closes the bottom of acid adding bucket 5, the side of barrier plate 51 upward is hinged with a drive rod 52, the drive rod
52 are hinged with fixed link 53 far from one end far from barrier plate 51, in order to be fixed to fixed link 53, are leaned in 5 inside of acid adding bucket
The place of nearly upper end is provided with the slot 54 being inserted into for fixed link 53.
As shown in Figures 3 and 4, copper powder feeding device includes that screw(-type) feeder 12 in 2 input terminal 21 of dissolving tank, vacuum is arranged
Feeder 11 and storage vat 1, wherein screw(-type) feeder 12 include the feed bin 121 being arranged on dissolving tank 2, under feed bin 121
The position for bringing out material mouth is provided with horizontally disposed feed pipe 122, and threaded rod 1221 is equipped in feed pipe 122, the screw thread
Bar 1221 is screw thread conveying lever, and threaded rod 1221 is adapted to the inner wall of feed pipe 122, and servo electricity is provided on feed pipe 122
Machine 1222, the servo motor 1222 are fixedly and coaxially connected with threaded rod 1221, feed pipe 122 far from servo motor 1222 one
End is outlet, and the position of the outlet is provided with the conveying pipeline 1223 for the input terminal 21 for extending vertically downward to dissolving tank 2, in conveying
The upper end of pipe 1223 is provided with air inlet 12231, and the position positioned at air inlet 12231 on conveying pipeline 1223 is provided with air blower
1224, the outlet air end of air blower 1224 is connected to air inlet 12231 and makes the outlet air end of air blower 1224 downwards.
As shown in Fig. 2,5 and 8, solution circulating device include be arranged 2 input terminal 21 of dissolving tank inlet tube 28 and be located at
The outlet tube 27 of 2 output end 22 of dissolving tank, inlet tube 28 and outlet tube 27 are connected to electroplating bath 7；It is set on outlet tube 27
It is equipped with magnetic drive pump 1 and filter vat 1；Magnetic drive pump 2 281 and filter vat 2 282 are provided on inlet tube 28.
As shown in figs. 2 and 10, solution inner circulation device includes the circulation pipe 3 for being located at 25 bottom of each overflow launder, and every is followed
Endless tube 3 is homogeneous intercommunicated, and is both provided with ball valve 31 and liquid pump 32 on every circulation pipe 3, in each overflow launder 25
Bottom is provided with concentration inductor 33, and PLC controller 34 is provided on the outer wall of dissolving tank 2, which is S7-
200, concentration inductor 33 is electrically connected with PLC controller 34, and PLC controller 34 is electrically connected with servo motor 1222.
As shown in Figures 2 and 3, it is also set up there are one alarm 8 in the top of dissolving tank 2, input terminal is located in dissolving tank 2
It is provided with electrode-type liquid-level meter 254 in the overflow launder 25 of 21 sides, which is electrically connected with alarm 8.
As shown in Fig. 2, being additionally provided with scum pipe 251, the other end of every scum pipe 251 in the bottom of each overflow launder 25
It is connected to waste liquid and empties station 253, empty 253 statistics of station by waste liquid is collected processing to waste liquid.The top of dissolving tank 2 also
It is provided with exhaust pipe 65.
As shown in Figure 1, specific implementation process：
Step 1, feeding simultaneously store：The copper oxide copper powder in storage vat 1 is passed through by negative pressure by vacuum feeder 11 first
Effect, which is drawn into feed bin 121, to be stored, and copper oxide copper powder is fallen under gravity in feed pipe 122；
Step 2, the input of electroplate liquid：By the electroplate liquid in electroplating bath 7, i.e., copper-bath by inlet tube 28 in magnetic
It is input to the input terminal 21 of dissolving tank 2 under the action of power pump 2 281, makes electroplate liquid in the overflow launder 25 below input terminal 21
Interior storage, and can be filtered from filter vat 2 282 when being flowed through from inlet tube 28, it can be molten by copper sulphate by filter vat 2 282
Impurity in liquid is filtered, so that the copper-bath entered in dissolving tank 2 is more pure；
Step 3, copper powder addition：When the concentration inductor 33 in the overflow launder 25 of input terminal 21 detects in overflow launder 25
The concentration of electroplate liquid when reducing, signal is fed back to PLC controller 34 by concentration inductor 33, and PLC controller 34 is by telecommunications
It number is transferred to servo motor 1222, and then servo motor 1222 is driven to start to work, while also blower 1224 starts work
Make, the rotation of servo motor 1222 drives threaded rod 1221 to rotate, and the rotation of threaded rod 1221 just can be by 121 bottom of feed bin
Copper powder pushes in feed pipe 122 to export direction, and is further pushed into conveying pipeline 1223, due on conveying pipeline 1223
The work of the air blower 1224 at end and the wind energy that generates is enough is entered in conveying pipeline 1223 from air inlet 12231, to by copper powder
Quickly blow downwards, copper powder made to be not easy on the tube wall for being adhered to conveying pipeline 1223, so make addition copper powder amount more
Accurately；
Step 4 generates copper-bath：Copper powder from conveying pipeline 1223 fall after just from the input terminal 21 of dissolving tank 2 into
Enter and reacted into dissolving tank 2 with electroplate liquid, at this point, blender 26 is started to work, to make electroplate liquid be contacted more with copper powder
Completely, copper powder is enable quickly to be dispersed in mixed liquor, it is molten to improve copper sulphate to generate copper sulphate with electroplate liquid fast reaction
The concentration of liquid, after the electroplate liquid in the overflow launder 25 where input terminal 21 slowly increases, electroplate liquid can be from demarcation strip two
24 lower end is passed through, and the electroplate liquid of flowing will drive fan body 231 to rotate, and adjacent fan body 231 rotation direction on the contrary,
Adjacent electroplate liquid is mutually mixed more uniformly, and since copper powder with reacting for electroplate liquid will produce gas,
Gas is discharged from exhaust pipe 65 and is focused on；When electrode-type liquid-level meter 254 detects the electroplate liquid in overflow launder 25 not
When sufficient, can timely set out alarm 8, be entered in overflow launder 25 to remind staff to add sulfuric acid solution, so that
Copper-bath is capable of the overflow of duration and is output in electroplating bath 7 from outlet tube 27, and then keeps the sulfuric acid in electroplating bath 7
The lasting supply of copper solution and the concentration for stablizing copper sulphate, and then improve electroplating quality；
Step 5, solution overflow：With being on the increase for electroplate liquid, electroplate liquid reaches the height of first piece of demarcation strip 1
When spending, electroplate liquid meeting overflow is crossed demarcation strip 1 and is entered in another overflow launder 25, and electroplate liquid is by demarcation strip 1
When end, the electroplate liquid of flowing will drive fan body 231 to rotate, and the rotation direction of adjacent fan body 231 is opposite so that adjacent
Electroplate liquid can be mutually mixed more uniformly；And in this way make successively electroplate liquid in a manner of upper and lower baffling from input terminal 21 to
Output end 22 flows so that electroplate liquid, that is, copper-bath becomes the reaction time that is more pure, and extending copper powder, makes copper
Powder can more fully be utilized and generate copper-bath；When copper-bath flows on buffer board 233, copper sulphate
Solution is moved along buffer board 233 to 241 direction of groove, and then copper-bath can be flowed into groove 241 and flow downward,
It is just overflowed from the upper end of spoiler 242 by the effect of spoiler 242 later and flows to separation along the lower wall of groove 241
The lower end of plate 2 24 is effectively reduced the generation of foam, and then copper-bath is filtered by filter plate 4, will be in copper sulphate
Impurity get rid of so that copper-bath is more pure；
Step 6, solution cycle：When the copper-bath concentration in overflow launder 25 is less than setting value, concentration inductor
33 transmit signals to PLC controller 34, then control the start-up operation of liquid pump 32 by PLC controller 34 and open ball valve 31,
Copper-bath in the lower overflow launder of concentration 25 is input to by circulation pipe 3 in the overflow launder 25 of input terminal 21 so that
The lower copper-bath of concentration can be reacted with copper powder again to improve the concentration of copper-bath；
Step 7, solution output：Then copper-bath is exited into from outlet tube 27 under the action of magnetic drive pump 1
For work to be electroplated in electroplating bath 7, and when outlet tube 27 flows through, electroplate liquid can be filtered by filter vat 1,
So that the copper-bath entered in electroplating bath 7 later can be more pure by layering, and then in electroplating bath 7
The electroplating efficiency of copper-bath be not easily susceptible to influence, and improve electroplating quality.
Step 8, waste residue discharge：With long-term use, some contamination precipitations can be precipitated in each overflow launder 25
Object opens shut-off valve 252, these sediments is washed from overflow launder 25 by the scum pipe 251 of 25 bottom of overflow launder, and lead to
It crosses scum pipe 251 and these sediments are imported into waste liquid empty station and 253 focus on, prevent sediment direct emission and right
Environment pollutes.
When the sulfuric acid solution in dissolving tank 2 is reduced, fixed link 53 is extracted from slot 54, and moves down, to
It drives barrier plate 51 to downwardly turn over by drive rod 52, and then the sulfuric acid solution in acid adding bucket 5 is enable to be added to dissolving tank 2
Input terminal 21 so that sulfuric acid solution can adequately be reacted with copper powder.
Embodiment 2：A method of for supplementing copper sulphate in copper plating groove, difference from example 1 is that, such as scheme
Shown in 13, it is both provided with aerator in each overflow launder 25, which includes aerator 6 and aeration tube 61, aeration
Pipe 61 is fixedly connected with the top of dissolving tank 2, and the lower end of aeration tube 61 is connected to aerator 6, and the other end is connected with safety in turn
Valve 62, compression pump 63 and cyclone cluster 64.
The stage in step 4 is worked by cyclone cluster 64 and generates wind, wind pressure is adjusted by compression pump 63, and peace is then opened
Full valve 62, high pressure gas by safety valve 62, aeration tube 61 to aerator 6, then by aerator 6 be output to copper-bath with
In the mixed liquor of sulfuric acid solution so that copper powder mixes more uniform with mixed liquor, and then increases the contact area of copper powder, improves
Reaction rate, and then the concentration for making full use of copper powder and quickly improving copper-bath can lead to when needing to adjust air inflow
Excess pressure pump 63 controls the unlatching of aeration tube 61 and combined state to be adjusted by safety valve 62.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, people in the art
Member can as needed make the present embodiment the modification of not creative contribution after reading this specification, but as long as at this
It is all protected by Patent Law in the right of invention.
Claims (7)
1. a kind of method for supplementing copper sulphate in copper plating groove, it is characterized in that：Including
Step 1, feeding simultaneously store：The copper oxide copper powder in storage vat (1) is drawn into feed bin by vacuum feeder (11)
(121) storage in；
Step 2, the input of electroplate liquid：By the copper-bath in electroplating bath (7) by inlet tube (28) magnetic drive pump effect
Under be input in the input terminals (21) of dissolving tank (2)；
Step 3, copper powder addition：When the concentration inductor (33) that dissolving tank (2) is located at input terminal (21) detects the sulphur of step 2
When sour copper solution is less than setting value, drive auger conveyor by feed bin by PLC controller (34) control servomotor (1222)
(121) the copper oxide copper powder in is input in dissolving tank (2) and copper-bath hybrid reaction；
Step 4 generates copper-bath：After copper oxide copper powder in step 3 is added, pass through the blender of input terminal (21)
(26) copper-bath is stirred, it is molten that copper oxide copper powder reacts generation copper sulphate with the sulfuric acid solution contained in copper-bath
Liquid；
Step 5, solution overflow：With increasing for input terminal (21) copper-bath, copper-bath is located at from dissolving tank (2)
Overflow launder (25) overflow successively of the overflow launder (25) of input terminal (21) to output end (22)；In overflowing close to output end (22)
Copper-bath is filtered by filter plate (4) in chute (25), is drained to copper-bath by buffer board (233)
To prevent the generation of foam on filter plate (4)；
Step 6, solution cycle：Concentration inductor (33) in overflow launder (25) senses the sulphur in corresponding overflow launder (25)
When setting value is not achieved in sour copper solution concentration, by the copper-bath in the overflow launder (25) by circulation pipe (3) in cycle magnetic
It is back in the overflow launder (25) of input terminal (21) under the action of power pump；
Step 7, solution output：The copper-bath in the overflow launder (25) of output end (22) will be flowed into step 6
It is input under the action of magnetic drive pump in electroplating bath (7) by outlet tube (27).
2. a kind of method for supplementing copper sulphate in copper plating groove according to claim 1, it is characterized in that：In step 4
In, when electrode-type liquid-level meter (254) detects that the amount of copper-bath is reduced, to the overflow launder (25) plus sulphur of input terminal (21)
Acid solution.
3. a kind of method for supplementing copper sulphate in copper plating groove according to claim 1, it is characterized in that：In step 2
In, the copper-bath flowed through to inlet tube (28) is filtered by filter vat.
4. a kind of method for supplementing copper sulphate in copper plating groove according to claim 1, it is characterized in that：In step 7
In, the copper-bath flowed through to outlet tube (27) is filtered by cartridge filter.
5. a kind of method for supplementing copper sulphate in copper plating groove according to claim 1, it is characterized in that：In step 4
In, the copper-bath in each overflow launder (25) carries out jet stream, stirring by aerator (6).
6. a kind of method for supplementing copper sulphate in copper plating groove according to claim 5, it is characterized in that：It will be in step 4
Gas in dissolving tank (2) concentrates discharge.
7. a kind of method for supplementing copper sulphate in copper plating groove according to claim 6, it is characterized in that：In step 4
Generated waste residue is discharged to waste liquid by scum pipe (251) from overflow launder (25) bottom and empties station (253).
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| CN107130287B (en) * | 2017-06-02 | 2020-04-10 | 上海九高智能技术有限公司 | Online concentration detection and dosing integrated device for electroplating bath solution |
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| CN112844111A (en) * | 2021-01-22 | 2021-05-28 | 广西贺州市桂东电子科技有限责任公司 | Device for automatically preparing electrolyte and using method thereof |
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Denomination of invention: A method for replenishing copper sulfate in copper plating bath Effective date of registration: 20200807 Granted publication date: 20180925 Pledgee: Bank of China Limited by Share Ltd. Nanjing City South Branch Pledgor: NANJING MAVIN EP EQUIPMENT & ENGINEERING Co.,Ltd. Registration number: Y2020980004778 |