CN100377627C - Circuit board for preventing adjacent welding-pad from short circuit - Google Patents
Circuit board for preventing adjacent welding-pad from short circuit Download PDFInfo
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- CN100377627C CN100377627C CNB2006100514833A CN200610051483A CN100377627C CN 100377627 C CN100377627 C CN 100377627C CN B2006100514833 A CNB2006100514833 A CN B2006100514833A CN 200610051483 A CN200610051483 A CN 200610051483A CN 100377627 C CN100377627 C CN 100377627C
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- circuit board
- weld pad
- baffle plate
- pad
- weld
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 33
- 230000004888 barrier function Effects 0.000 claims description 33
- 239000006071 cream Substances 0.000 claims description 29
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 abstract description 48
- 239000000758 substrate Substances 0.000 description 38
- 230000004927 fusion Effects 0.000 description 13
- 238000013461 design Methods 0.000 description 11
- 239000004020 conductor Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 3
- 239000011469 building brick Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
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Abstract
The present invention relates to a structure of a circuit board, which comprises a basal plate, at least two welding pads, an insulating layer and a baffle plate, wherein the welding pads are arranged on the upper surface of the basal plate; the basal plate is covered with the insulating layer which is provided with an opening hollowed out, and two welding pads are just exposed; the baffle plate is also arranged on the upper surface of the basal plate and is positioned between the two welding pads.
Description
Technical field
The present invention relates to the Welding Structure of circuit board, particularly relate to a kind of circuit board that prevents the adjacent welding-pad short circuit.
Background technology
Along with the fast development of electronics technology, the electronic product of various different demands according to the consumer is also and then constantly weeded out the old and bring forth the new.The consumption market makes various individualized electronic products be in great demand, wherein with the electronic equipment of portable product, as products such as mobile phone, PDA (personal digital assistant), digital camera, Liquid Crystal Module main flow especially.And the designer trends of above-mentioned electronic product also are used as the main inducing that stimulates consumer and buy with lighting, slimming, low priceization, high-quality, high-accuracyization.
In addition, general electronic products more tends to become strong greatly for the function that makes self, and further attract consumer's desire to purchase, therefore can increase various function in conjunction with more module, so generally except adding display, main circuit board, internal memory, also add the function diversification more that camera module or network operation module make its electronic product.
Often need to connect at above-mentioned different intermodule, therefore when circuit connects, use cable or flexible circuit board usually, connect these modules by the mode of welding by circuit.But because modern electronic product causes Welding Structure more subtilized more towards compactization.So in order to realize the installation of high-density line in narrower and small small product size, be formed at weld pad on the circuit board except having meticulousr size, its arrangement is also more intensive.
It should be noted that when the weld pad on the circuit board is tending towards the high density arrangement, in welding process, the normal appearance because spacing is too small and the welding tin cream is crossed multi-overflow, and cause the problem that is short-circuited between weld pad.This kind become the principal element that the circuit board fraction defective raises because the short circuit problem that is caused is merged in the tin cream overflow.
Common circuit board Welding Structure is shown in Fig. 1 a and Fig. 1 b, and it has represented the front and the generalized section of the Welding Structure 10 on the circuit board respectively, and wherein the generalized section of Fig. 1 b is the cutting profile along Fig. 1 a middle conductor aa '.As shown in FIG., this Welding Structure has comprised substrate 100, insulating barrier 101, two weld pads 102 and tin creams 103.Wherein substrate 100 is made of a circuit board.
In general, on substrate 100 surfaces, make the huge and complicated circuit pattern that distributes of number, and link,, required weld pad 102 is set at the end of partial circuit pattern in order to make this circuit board set up signal with other electronic building brick.As shown in FIG., these weld pads 102 are formed at substrate 100 surfaces.In addition, be subjected to extraneous contamination or infringement, on the surface of substrate 100, often, be coated with an insulating barrier 101 with the screen painting or the etched mode of developing in order to prevent circuit pattern.On this insulating barrier 101 and hollow out out an opening 105, so that expose weld pad 102.Common open design shown in Fig. 1 b, except exposing weld pad 102, also can be exposed substrate 100 surfaces of weld pad 102 peripheries.In case in the time of this circuit board and other circuit board will being carried out welding procedure, on these weld pads 102, coat tin cream 103 earlier, in order to the usefulness of follow-up fusion weld.
Then, with reference to Fig. 1 c and Fig. 1 d, it has represented the Welding Structure 10 of this piece circuit board and front and the generalized section that another piece circuit board welds respectively, and wherein the generalized section of Fig. 1 d is the cutting profile along Fig. 1 c middle conductor bb '.
As shown in FIG., behind the tin cream on the fusion weld pad 102 103, another piece circuit board can be covered on the Welding Structure 10 of this piece circuit board.As shown in FIG., corresponding Welding Structure 11 also can be set, the weld pad 112 that comprises substrate 110 and be made in substrate 110 surfaces on circuit board.After passing through the pressure welding program again, the weld pad 112 of circuit board Welding Structure 11 sees through tin cream 103 and is fixedly linked on corresponding weld pad 102.
It should be noted that because the spacing of 102 of adjacent welding-pads is quite little, so the tin cream 103 of fusion may overflows and merge on substrate 100 surfaces between two adjacent weld pads 102, thereby cause 102 phenomenons that are short-circuited of above-mentioned weld pad.
Except above-mentioned open design, on the partial circuit plate, the opening on the insulating barrier only can come out weld pad.Shown in Fig. 2 a to Fig. 2 d, this part icon has shown that promptly the insulating barrier upper shed only exposes the situation on weld pad surface.Shown in Fig. 2 a and Fig. 2 b, it has represented the front and the generalized section of the Welding Structure 20 on the circuit board respectively, and wherein the generalized section of Fig. 2 b is the cutting profile along Fig. 2 a middle conductor cc '.As shown in FIG., this Welding Structure has comprised substrate 200, insulating barrier 201, two weld pads 202 and tin creams 203.
Wherein on substrate 200 surfaces, make the huge and complicated circuit pattern that distributes of number, and, required weld pad 202 is set at the end of partial circuit pattern.As shown in FIG., these weld pads 202 are formed at substrate 200 surfaces.In addition, on the surface of substrate 200, be coated with an insulating barrier 201.Hollow out so that expose weld pad 202 on this insulating barrier 201.This design shown in Fig. 2 b, only can be exposed two adjacent weld pads 202.In case in the time of this circuit board and other circuit board will being carried out welding procedure, on these weld pads 202, coat tin cream 203 earlier, in order to the usefulness of follow-up fusion weld.
Then, with reference to Fig. 2 c and Fig. 2 d, it has represented the Welding Structure 20 of this piece circuit board and front and the generalized section that another piece circuit board welds respectively, and wherein the generalized section of Fig. 2 d is the cutting profile along Fig. 2 c middle conductor dd '.
As shown in FIG., behind the tin cream on the fusion weld pad 202 203, another piece circuit board 21 can be overlaid on the Welding Structure 20 of this piece circuit board.As shown in FIG., corresponding Welding Structure is set, the weld pad 212 that comprises substrate 210 and be made in substrate 210 surfaces on circuit board.After the pressure welding program, the weld pad 212 on the circuit board sees through tin cream 203 and is fixedly linked on corresponding weld pad 202.
It should be noted that because the spacing of 202 of two weld pads is quite little, so the tin cream 203 of fusion may overflows and be blended on insulating barrier 201 surfaces between the adjacent welding-pad 202, thereby cause 202 phenomenons that are short-circuited of two weld pads.
In addition, in Fig. 1 d and Fig. 2 d, weld pad 102 and weld pad 202 are in carrying out welding process, when fusing together by tin cream 103,203, tin cream 103,230 just can produce solder overflow because of merging, and flows to above-mentioned shown in Fig. 1 d on the substrate surface between two weld pads 102.Same, in Fig. 2 d, when weld pad 202 merges with weld pad 212 welding, also can flow on two surface of insulating layer between the weld pad 202 because of the tin cream thawing.Above-mentioned situation will cause tin cream therefore all to merge, and cause circuit board when testing electrical property, detect the circuit board problem of short-circuit because of the tin that overflows merges, and make the rate of finished products of circuit board reduce widely.
Hence one can see that, the shortcoming that above-mentioned excessive tin produced, be because the cause that does not have overflow that object can the backstop tin cream to merge between two weld pads, so be short-circuited and improve the circuit board rate of finished products in order to reduce circuit board, this solder overflow of current solution is an important direction really.
Summary of the invention
Purpose of the present invention promptly is to provide a kind of circuit board that prevents the adjacent welding-pad short circuit, and stops with a baffle plate and to melt the tin overflow on this weld pad, avoids thus being short-circuited between two weld pads.
In a kind of circuit board pad structure of the present invention, it comprises a circuit board, one first weld pad, one second weld pad and a baffle plate.First weld pad is arranged on the circuit board, and second weld pad also is arranged on the circuit board, and in a side of first weld pad, and baffle plate is arranged on the circuit board, and between first weld pad and second weld pad.
In another embodiment of the present invention, the structure of a circuit board comprises a substrate, at least two weld pads, an insulating barrier and baffle plates in addition.Wherein these weld pads are made in upper surface of base plate, and insulating barrier also covers on the substrate, and this insulating barrier has one and hollows out opening, just in time exposes two weld pads, and baffle plate also is arranged at upper surface of base plate, and between two weld pads.
In one embodiment of this invention, wherein above-mentioned opening can expose first weld pad of circuit board surface, the periphery and the baffle plate thereof of second weld pad.And baffle plate and insulating barrier are made of same material.And baffle plate is a polyimides (PI) material.
In one embodiment of this invention, wherein the thickness of baffle plate is about more than the 25 μ m, and baffle plate thickness is greater than thickness of insulating layer.Wherein the distance of baffle plate and weld pad is greater than 0.1mm.
In another embodiment of the present invention, its split shed can expose first weld pad, second weld pad and the baffle plate thereof of circuit board surface.
In another embodiment of the present invention, wherein circuit board is a flexible circuit board, and is applied to the electric power connection line in the electronic product.And this electronic product is a LCD, and circuit board is in order to link the LED-backlit source in the LCD.
In one embodiment of this invention, wherein baffle plate and insulating barrier can be made simultaneously.
In order further to understand feature of the present invention and technology contents, with reference to following about detailed description of the present invention and accompanying drawing, yet accompanying drawing is not to be used for the present invention is limited only in order to reference and explanation to be provided.
Description of drawings
Fig. 1 a is the welded front schematic view on the known circuits plate;
Fig. 1 b is the welded side schematic view on the known circuits plate;
Fig. 1 c is the Welding Structure of known circuits plate and the front schematic view that another circuit board welds;
Fig. 1 d is the Welding Structure of known circuits plate and the side schematic view that another circuit board welds;
Fig. 2 a is the welded front schematic view on known other circuit board;
Fig. 2 b is the welded side schematic view on known other circuit board;
Fig. 2 c knows the Welding Structure of other circuit board and the front schematic view that another circuit board welds;
Fig. 2 d knows the Welding Structure of other circuit board and the side schematic view that another circuit board welds;
Fig. 3 a is the welded front schematic view on the circuit board of the present invention;
Fig. 3 b is the welded side schematic view on the circuit board of the present invention;
Fig. 3 c is the Welding Structure of circuit board of the present invention and the front schematic view that another circuit board welds;
Fig. 3 d is the Welding Structure of known circuits plate and the side schematic view that another circuit board welds;
Fig. 4 a is the welded front schematic view on the circuit board of another embodiment of the present invention;
Fig. 4 b is the welded side schematic view on the circuit board of another embodiment of the present invention;
Fig. 4 c is Welding Structure of circuit board of another embodiment of the present invention and the front schematic view that another circuit board welds; And
Fig. 4 d is the Welding Structure of circuit board of known another embodiment and the side schematic view that another circuit board welds.
Embodiment
The present invention discloses the Welding Structure of a circuit board, and particularly a kind of circuit board that prevents the adjacent welding-pad short circuit stops with a baffle plate and to melt the tin overflow on this weld pad, avoids thus being short-circuited between two weld pads.Shown in relevant of the present invention being described in detail as follows.
First embodiment
According to Fig. 3 a one 3d, shown the pad structure of disclosed circuit board.Shown in Fig. 3 a and Fig. 3 b, it has represented the front and the generalized section of the pad structure on the circuit board respectively, and wherein the generalized section of Fig. 3 b is the cutting profile along Fig. 3 a middle conductor ee '.This pad structure 30 comprises a substrate 300, one first weld pad 302, one second weld pad 3021 and a baffle plate 306.Wherein substrate 300 is made of a circuit board.
In general, on substrate 300 surfaces, make the huge and complicated circuit pattern that distributes of number, and link in order to make this circuit board set up signal with other electronic building brick, end at the partial circuit pattern is provided with required weld pad, as first weld pad 302 in the present embodiment and second weld pad 3021.In addition, be subjected to extraneous contamination or infringement, on the surface of substrate 300, often, be coated with an insulating barrier 301, make insulating barrier 301 constitute the top layer of substrate 300 with the screen painting or the etched mode of developing in order to prevent circuit pattern.
Shown in Fig. 3 b, hollow out out an opening 305 on the above-mentioned insulating barrier 301, so that expose first weld pad 302 and second weld pad 3021.And baffle plate 306 also is arranged at substrate 300 upper surfaces, and between above-mentioned two weld pads 302,3021.Common open design except exposing adjacent first weld pad 302 and second weld pad 3021, also can be exposed substrate 300 surfaces of baffle plate 306 and above-mentioned weld pad 302,3021 peripheries shown in Fig. 3 b.
In case in the time of this circuit board and other circuit board will being carried out welding procedure, will coat tin cream 303 on these weld pads 302,3021 earlier, in order to the usefulness of follow-up fusion weld.
Then, with reference to Fig. 3 c and 3d, it has represented the Welding Structure 30 of this piece circuit board and front and the generalized section that another piece circuit board Welding Structure is welded respectively, and wherein the generalized section of Fig. 3 d is the cutting profile along Fig. 3 c middle conductor ff '.
As shown in FIG., behind the tin cream 303 on the fusion weld pad 302,3021, another piece circuit board Welding Structure 31 can be covered on the Welding Structure 30 of this piece circuit board.As shown in FIG., corresponding Welding Structure 31 is set on circuit board Welding Structure 30 of the present invention, comprises a substrate 310 and the weld pad 312 that is made in substrate 310 surfaces.After through the pressure welding program, the weld pad 312 on the Welding Structure 31 sees through tin cream 303 and is fixedly linked on corresponding weld pad 302,3021.
It should be noted that, because the present invention has the design of baffle plate 306, and the thickness of baffle plate 306 is greater than the thickness of insulating barrier 301, so although the spacing of 302,3021 of adjacent welding-pads is quite little, by stopping of baffle plate 306, the tin cream 303 that can make fusion can be because of overflow be blended on substrate 300 surfaces between the adjacent welding- pad 302,3021, and then causes 302,3021 phenomenons that are short-circuited of adjacent welding-pad.
Subsidiary one carry be, baffle plate 306 of the present invention and insulating barrier 301 are made of same material, baffle plate 306 is polyimides (PI) in the present embodiment.Baffle plate 306 can be made simultaneously with insulating barrier 301, but baffle plate 306 need reach higher thickness for several layers than insulating barrier more than 301 making.Wherein the thickness of baffle plate 306 is more than 25 μ m, and the distance of 302,3021 of baffle plate 306 and weld pads is respectively greater than 0.1mm.
In the present embodiment, circuit board can be a flexible circuit board, and is applied to the electric power connection line in the electronic product.And described electronic product is a LCD, and this circuit board is in order to link the LED-backlit source in the LCD.
Second embodiment
Except the mentioned open design of second embodiment, on the partial circuit plate, the opening on the insulating barrier only comes out weld pad and baffle plate.Shown in Fig. 4 a-4d, this part icon has shown that promptly the insulating barrier upper shed only exposes the situation of weld pad and baffle surface.
Shown in Fig. 4 a and Fig. 4 b, it has represented welded front and generalized section on the circuit board respectively, and wherein the generalized section of Fig. 4 b is the cutting profile along Fig. 4 a middle conductor gg '.As shown in FIG., this Welding Structure 40 comprises substrate 400, insulating barrier 401, at least two weld pads 402, a baffle plate 406 and tin creams 403.
On substrate 400 surfaces, as making earlier the huge and complicated circuit pattern that distributes of number among first embodiment, and, required weld pad 402 is set at the end of partial circuit pattern.As shown in FIG., two weld pads 402 on substrate 400 surfaces, have been made.In addition, coating one insulating barrier 401 on the surface of substrate 400.On this insulating barrier 401, hollow out out an opening 405, so that expose weld pad 402 and baffle plate 406.This open design is only exposed adjacent weld pad 402 and baffle plate 406 and 400 surfaces of substrate between the two thereof shown in Fig. 4 b.Wherein baffle plate 406 can be made simultaneously with insulating barrier 401.Above-mentioned baffle plate 406 is polyimides (PI) material.
In case in the time of this circuit board and other circuit board will being carried out welding procedure, will coat tin cream 403 on these weld pads 402 earlier, in order to the usefulness of follow-up fusion weld.
Then, with reference to Fig. 4 c and 4d, it has represented the Welding Structure 40 of this piece circuit board and front and the generalized section that another piece circuit board welds respectively, and wherein the generalized section of Fig. 4 d is the cutting profile along Fig. 4 c middle conductor hh '.
As shown in FIG., behind the tin cream on the fusion weld pad 402 403, another piece circuit board can be covered on the Welding Structure 40 of this piece circuit board.As shown in FIG., corresponding Welding Structure 41 also is set, the weld pad 412 that comprises substrate 410 and be made in substrate 410 surfaces on circuit board.After the pressure welding program, the weld pad 412 on the circuit board 41 sees through tin cream 403 and is fixedly linked on corresponding weld pad 402.
Because the present invention has the design of baffle plate 406, and the thickness of baffle plate 406 is greater than the thickness of insulating barrier 401, so although the tin cream 403 of fusion produces overflow, only can flow on substrate 400 surfaces between two weld pads 402 and the baffle plate 406, and the phenomenon that tin cream merges each other mutually can not take place, and then the short circuit problem of 402 of adjacent welding-pads takes place.
In sum, the present invention has promptly solved the known circuits plate structure in welding process by the design of baffle plate, because of tin cream overflow and fusion, thereby causes detecting the circuit board problem of short-circuit.Like this, under the design that does not influence circuit board high density spacing, baffle design promptly can promote the rate of finished products of this circuit board widely.
Though the present invention's preferred embodiment illustrates as above, it is not only to terminate in the foregoing description in order to limit the present invention's spirit and invention entity.Therefore, the modification of being made in not breaking away from spirit of the present invention and scope all should be included in the following claim scope.
Claims (7)
1. circuit board pad structure comprises:
One circuit board;
One first weld pad is arranged on the described circuit board;
One second weld pad is arranged on the described circuit board, and is positioned at a side of described first weld pad;
One baffle plate is arranged on the described circuit board, and between described first weld pad and described second weld pad, baffle plate is used to stop the tin cream overflow on first and second weld pads and merges; And
One insulating barrier, this insulating barrier forming circuit plate top layer, insulating barrier has an opening, and first weld pad, second weld pad and baffle plate be arranged in opening,
Wherein said opening can expose the periphery of first weld pad of circuit board surface, the periphery and the baffle plate of second weld pad.
2. circuit board pad structure as claimed in claim 1, wherein said baffle plate and insulating barrier can be made simultaneously.
3. circuit board pad structure as claimed in claim 1, wherein said baffle plate and insulating barrier are made of same material.
4. circuit board pad structure as claimed in claim 1, wherein said baffle plate is a polyimide material.
5. circuit board pad structure as claimed in claim 1, the thickness of wherein said baffle plate is more than 25 μ m.
6. circuit board pad structure as claimed in claim 5, the thickness of wherein said baffle plate is greater than thickness of insulating layer.
7. circuit board pad structure as claimed in claim 1, the distance between wherein said baffle plate and weld pad is greater than 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100514833A CN100377627C (en) | 2006-02-28 | 2006-02-28 | Circuit board for preventing adjacent welding-pad from short circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100514833A CN100377627C (en) | 2006-02-28 | 2006-02-28 | Circuit board for preventing adjacent welding-pad from short circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1819742A CN1819742A (en) | 2006-08-16 |
| CN100377627C true CN100377627C (en) | 2008-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100514833A Active CN100377627C (en) | 2006-02-28 | 2006-02-28 | Circuit board for preventing adjacent welding-pad from short circuit |
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| CN (1) | CN100377627C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101597478B1 (en) * | 2012-01-20 | 2016-02-24 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | Resin composition, layered product, multilayered printed wiring board, multilayered flexible wiring board, and process for producing same |
| CN103079341B (en) * | 2012-12-24 | 2016-08-03 | 广东欧珀移动通信有限公司 | The structure of the anti-solder shorts of pcb board and there is the pcb board of this structure |
| CN109686752A (en) * | 2018-12-21 | 2019-04-26 | 深圳市华星光电半导体显示技术有限公司 | Block of pixels and display equipment |
| CN109698160B (en) * | 2018-12-27 | 2020-09-25 | 厦门天马微电子有限公司 | Array substrate, manufacturing method thereof, display panel and display device |
| CN109904174B (en) | 2019-02-28 | 2021-01-08 | 京东方科技集团股份有限公司 | Circuit backboard of display panel, preparation method of circuit backboard and display panel |
| CN110610932A (en) * | 2019-08-27 | 2019-12-24 | 华东光电集成器件研究所 | Method for preventing conductive band of thick film integrated circuit from breaking |
| CN112993122A (en) * | 2020-09-24 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Substrate, manufacturing method thereof and display panel |
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|---|---|---|---|---|
| JPH06152121A (en) * | 1992-11-04 | 1994-05-31 | Harima Chem Inc | Method for coating printed board with solder |
| CN1256067A (en) * | 1998-01-29 | 2000-06-07 | Smk株式会社 | Circuit board |
| JP2000183486A (en) * | 1998-12-16 | 2000-06-30 | Internatl Business Mach Corp <Ibm> | Connecting member |
| CN1574321A (en) * | 2003-05-23 | 2005-02-02 | 台湾积体电路制造股份有限公司 | Bond pad scheme for cu process |
-
2006
- 2006-02-28 CN CNB2006100514833A patent/CN100377627C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06152121A (en) * | 1992-11-04 | 1994-05-31 | Harima Chem Inc | Method for coating printed board with solder |
| CN1256067A (en) * | 1998-01-29 | 2000-06-07 | Smk株式会社 | Circuit board |
| JP2000183486A (en) * | 1998-12-16 | 2000-06-30 | Internatl Business Mach Corp <Ibm> | Connecting member |
| CN1574321A (en) * | 2003-05-23 | 2005-02-02 | 台湾积体电路制造股份有限公司 | Bond pad scheme for cu process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1819742A (en) | 2006-08-16 |
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Effective date of registration: 20180427 Address after: Hongkong Chinese Tsuen Tai Chung Road No. 8 TCL industrial center 13 floor Patentee after: Huaxing Optoelectronic International (Hong Kong) Co.,Ltd. Address before: Hsinchu City, Taiwan, China Patentee before: AU OPTRONICS Corp. |
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Effective date of registration: 20231219 Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL Huaxing Photoelectric Technology Co.,Ltd. Address before: Hongkong Chinese Tsuen Tai Chung Road No. 8 TCL industrial center 13 floor Patentee before: Huaxing Optoelectronic International (Hong Kong) Co.,Ltd. |