CN100377376C - LED reflection cover manufacturing method - Google Patents
LED reflection cover manufacturing method Download PDFInfo
- Publication number
- CN100377376C CN100377376C CNB2005100594532A CN200510059453A CN100377376C CN 100377376 C CN100377376 C CN 100377376C CN B2005100594532 A CNB2005100594532 A CN B2005100594532A CN 200510059453 A CN200510059453 A CN 200510059453A CN 100377376 C CN100377376 C CN 100377376C
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- Prior art keywords
- reflection
- cover
- lid
- light
- reflection cover
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Abstract
The present invention relates to a reflection cover manufacturing method of a light emitting diode, which designs a reflection cover into an upper part and a lower part. A current blocking layer adheres to the front side of the upper part of the reflection cover. A diversion steel plate is arranged at the back side of the upper part of the reflection cover, and the back side faces upwards. The glue is pasted into the hollow hole in the upper part of the reflection cover via the hole of the diversion steel plate, and the upper part of the reflection cover is roasted. At last, the upper part and the lower part of the reflection cover are combined to form a complete reflection cover.
Description
Technical field
The present invention relates to a kind of manufacture method that reflects lid, particularly relate to a kind of reflection cover manufacturing method that is applicable to light-emitting diode.
Background technology
Light-emitting diode has been widely used in the field of various illuminations and demonstration in recent years.When using light-emitting diode, the additional reflection lid (enclosing cover) of regular meeting is used for protecting and guiding light.Therefore, the reflection lid all can have the part of a light-permeable glue, makes the light-emitting diode that is covered under it, can penetrate light by means of the part of this light-permeable glue.
The manufacture of the light-permeable glue part of known luminescence diode reflective lid is formed by a glue mode.Usually utilize syringe colloid to be injected the hollow bore of reflection lid in the processing procedure.The point glue mode of this kind reflection lid can't accurately be controlled glue amount and speed usually and be easy to generate bubble slowly again.For the assurance of the demand and the quality of volume production, above-mentioned method possibly can't satisfy client's demand.
Therefore, suitable solution is sought at above-mentioned shortcoming in relevant manufacturing commercial city.
Summary of the invention
The reflection cover manufacturing method that the purpose of this invention is to provide a kind of light-emitting diode is so that effectively reduce bubble in the colloid, can accurately control the glue amount and accelerate volume production speed in this processing procedure.
For achieving the above object, the present invention proposes a kind of reflection cover manufacturing method of light-emitting diode, a reflection lid is designed to a reflection cover first half and and reflect and cover Lower Half; Stick an impermeable barrier in reflecting the front of covering the first half; With the back side of this reflection lid up, and frame one water conservancy diversion steel plate covers the back side of the first half in this reflection; The hole that glue is seen through the water conservancy diversion steel plate is brushed the hollow hole part in the reflection lid first half; Toast this reflection lid first half; The last combined reflected lid first half forms a complete reflection lid with the Lower Half of reflection lid.
From the above, use reflection cover manufacturing method of the present invention, cover Lower Half, in vacuum chamber,, light-permeable glue is brushed in the hollow bore of the reflection lid first half in the mode of brush coating by reflecting to cover to be designed to reflect cover the first half and reflect.Reflection cover manufacturing method can effectively reduce bubble in the colloid, can accurately control the glue amount and can accelerate volume production speed.
Description of drawings
Figure 1A-1H represents the manufacturing step according to a kind of LED reflection cover of a preferred embodiment of the present invention;
Fig. 2 represents the application schematic diagram according to a kind of LED reflection cover of a preferred embodiment of the present invention.
The primary clustering symbol description
100: the first half is covered in reflection
102: impermeable barrier
104: hollow hole
106: the water conservancy diversion steel plate
110: light-permeable glue
112: brush coating plate 108: vacuum chamber
114: Lower Half is covered in reflection
114a: hollow hole
120: the reflection lid
124: light-emitting diode
122: printed circuit board (PCB)
Embodiment
For can't accurately control glue amount, the speed that solves known reflection cover manufacturing method existence reaches the shortcoming that is easy to generate bubble slowly, the reflection cover manufacturing method that the present invention proposes a kind of improvement has overcome the problems referred to above.This method will reflect to cover to be designed to reflect cover the first half and reflect covers Lower Half, with the method for brush coating, light-permeable glue is brushed in the hollow bore of the reflection lid first half in vacuum chamber.To reflect at last and cover the first half and reflection and cover Lower Half and be combined into a complete reflection and cover.
Please refer to Figure 1A-1H, its expression is according to the manufacturing step of a kind of LED reflection cover of a preferred embodiment of the present invention.Figure 1A represent one the reflection cover the first half 100, the impermeable barrier 102 of fitting is in its front.Reflection is covered the first half 100 and is had hollow hole part 104 in order to insert light-permeable glue.By will reflecting the reverse side (as Figure 1B) up that covers the first half 100, and water conservancy diversion steel plate 106 (as Fig. 1 C) on the frame.Impermeable barrier 102 can be an adhesive tape, be used for preventing the light-permeable glue inserted therefrom emptying aperture part 104 spill.Water conservancy diversion steel plate 106 has the corresponding hollow hole part 104 of hole.With reference to Fig. 1 D, will reflect and cover the first half 100 brush coating processing procedures and in a vacuum chamber 108, carry out, with brush coating plate 112 light-permeable glue 110 is brushed hollow hole part 104 into the reflection lid first half 100 through the hole of water conservancy diversion steel plate 106.Be difficult for producing bubble when therefore, light-permeable glue 110 is inserted hollow hole part 104.And the processing procedure that cooperates water conservancy diversion steel plates 106 to carry out a glue with brush coating plate 112 can overcome known can't accurately control glue amount and slow-footed shortcoming.The reflection lid first half 100 of finishing brush coating is shown in Fig. 1 E.The first half 100 is covered in reflection be combined into a complete reflection lid (with reference to Fig. 1 E) with its reflection lid Lower Half 114.With reference to Fig. 1 G, then will reflect cover 120 with printed circuit board (PCB) 122 combinations of having assembled light- emitting diode 124, and 120 the hollow hole light-emitting diode 124 that need align is covered in reflection.The light-emitting diode assembly that combination is finished is shown in Fig. 1 H.
Please refer to Fig. 2, its expression is according to the application schematic diagram of a kind of LED reflection cover of a preferred embodiment of the present invention.The LED reflection cover of present embodiment can be applicable to digital display as shown in this figure.Because the reflection lid can resolve into reflection and cover the first half and Lower Half, kind and the color that the first half can be convenient for changing colloid in the byte covered in reflection.For example, the colloid that adds fluorescent material can be converted to white light with blue light, or uses the fluorescent material of other kind and chip to do the glow color variation.
By the invention described above preferred embodiment as can be known, use reflection lid autofrettage of the present invention, cover Lower Half by reflecting to cover to be designed to reflect cover the first half and reflect, in vacuum chamber,, light-permeable glue is brushed in the hollow bore of the reflection lid first half in the mode of brush coating.Reflection cover manufacturing method can effectively reduce bubble in the colloid, can accurately control the glue amount and accelerate volume production speed.
Though the present invention with a preferred embodiment openly as above; but be not that any person skilled in the art is not in breaking away from thinking of the present invention and scope in order to qualification the present invention; should do various changes and improvement, so the scope that protection scope of the present invention is protected with claim is as the criterion.
Claims (4)
1. the reflection cover manufacturing method of a light-emitting diode comprises following steps at least:
One reflection lid is designed to a reflection cover first half and and reflects and cover Lower Half;
Stick the front of an impermeable barrier in this reflection lid first half;
The back side that the first half cover in this reflection up, and frame one water conservancy diversion steel plate reflects the back side of covering the first half in this;
The hole that glue is seen through this water conservancy diversion steel plate is brushed this reflection and is covered hollow hole part in first half;
Toast this reflection lid first half; And
Make up the Lower Half of this reflection lid first half and this reflection lid, to form this reflection lid.
2. according to the reflection cover manufacturing method of the light-emitting diode of claim 1, it is characterized in that, described glue is brushed step in the reflection lid first half, is to carry out in a vacuum chamber.
3. according to the reflection cover manufacturing method of the light-emitting diode of claim 1, it is characterized in that described impermeable barrier is an adhesive tape.
4. according to the reflection cover manufacturing method of the light-emitting diode of claim 1, it is characterized in that the hole of described water conservancy diversion steel plate is the hollow hole part that is aligned in this reflection lid first half.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100594532A CN100377376C (en) | 2005-03-21 | 2005-03-21 | LED reflection cover manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100594532A CN100377376C (en) | 2005-03-21 | 2005-03-21 | LED reflection cover manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1838438A CN1838438A (en) | 2006-09-27 |
| CN100377376C true CN100377376C (en) | 2008-03-26 |
Family
ID=37015743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100594532A Expired - Fee Related CN100377376C (en) | 2005-03-21 | 2005-03-21 | LED reflection cover manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100377376C (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5040868A (en) * | 1989-05-31 | 1991-08-20 | Siemens Aktiengesellschaft | Surface-mountable opto-component |
| CN1380704A (en) * | 2001-04-09 | 2002-11-20 | 株式会社东芝 | Luminescent device |
| CN1426604A (en) * | 2000-04-26 | 2003-06-25 | 奥斯兰姆奥普托半导体有限责任公司 | Radiation emitting semiconductor component with luminescence-converting element |
| CN1455960A (en) * | 2001-01-24 | 2003-11-12 | 日亚化学工业株式会社 | Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor |
-
2005
- 2005-03-21 CN CNB2005100594532A patent/CN100377376C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5040868A (en) * | 1989-05-31 | 1991-08-20 | Siemens Aktiengesellschaft | Surface-mountable opto-component |
| CN1426604A (en) * | 2000-04-26 | 2003-06-25 | 奥斯兰姆奥普托半导体有限责任公司 | Radiation emitting semiconductor component with luminescence-converting element |
| CN1455960A (en) * | 2001-01-24 | 2003-11-12 | 日亚化学工业株式会社 | Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor |
| CN1380704A (en) * | 2001-04-09 | 2002-11-20 | 株式会社东芝 | Luminescent device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1838438A (en) | 2006-09-27 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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Granted publication date: 20080326 Termination date: 20110321 |