CN100373608C - Wire-frame type semiconductor package part and its wire frame - Google Patents
Wire-frame type semiconductor package part and its wire frame Download PDFInfo
- Publication number
- CN100373608C CN100373608C CNB2005100025391A CN200510002539A CN100373608C CN 100373608 C CN100373608 C CN 100373608C CN B2005100025391 A CNB2005100025391 A CN B2005100025391A CN 200510002539 A CN200510002539 A CN 200510002539A CN 100373608 C CN100373608 C CN 100373608C
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- wire
- semiconductor package
- honeycomb duct
- package part
- type semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The present invention relates to a wire-frame type semiconductor package part and a wire frame thereof. The wire-frame type semiconductor package part comprises a wire frame, at least one chip seat, a plurality of tube legs, at least one chip and packaging glue parts, wherein tube legs are distributed and arranged at the periphery of the chip seats; one surface of each of the chip seats is provided with multiple grooves and guide channels. All the grooves are communicated with the edges of the chip seats by at least one guide channel. All the guide channels are communicated with the edges of the chip seats by at least one guide channel; the chips are connected with the surface of the chip seats, and the surface is not provided with the grooves and the guide channels; the chips are electrically connected to the tube legs; the chips are covered with the packaging glue parts; the grooves and the guide channels are exposed out of the packaging glue parts. When surplus overflow of glue occurs, the present invention can make the overflow of the glue enter the guide channels along each edge of the chip seats by the present invention; then, the overflow of the glue is filled in the space of the grooves, the overflow of the glue is thoroughly avoided, the process of eliminating the overflow of the glue is simplified, and the cost is saved; further, the combined intensity of the packaging glue parts and the wire frame can be enhanced.
Description
Technical field
The invention relates to a kind of wire-frame type semiconductor package part and lead frame thereof, particularly about a kind of wire-frame type semiconductor package part and lead frame thereof with excessive glue honeycomb duct.
Background technology
Tradition is the semiconductor package part of chip bearing member with lead frame (Lead Frame), quad flat formula semiconductor package part (Quad Flat Package for example, QFP) or quad flat non-pin (Quad Flat Non-leaded, QFN) semiconductor package part etc., production method all is to have the sticking semiconductor chip of putting on the lead frame of chip carrier (Die Pad) and a plurality of pin (Lead) one, electrically connect weld pad many pins corresponding on this chip surface by many gold threads (Wire), coat this chip and gold thread and form the semiconductor packaging part with packing colloid with it; Simultaneously, it is surface exposed outside this packing colloid also can to design of making this chip carrier, quickens heat on this chip of dissipation by chip carrier.
Present design the excessive glue shortcoming of shown in Figure 1A, Figure 1B (is example with the QFN semiconductor package part) can occur when forming the mold pressing procedure of packing colloid; This is because when carrying out mold pressing, chip carrier 51 lower surfaces 52 of this lead frame 50 can contact with the bed die next-door neighbour, if the not tight situation of clamping occurs, can cause these chip carrier 51 lower surfaces 52 glue 53 that overflows to occur, this not only influences attractive in appearance, more need to carry out the extra removal glue step of overflowing, increased operation, also may influence the intensity that combines between packing colloid and this lead frame 50.
The U.S. the 6th, 204, No. 553 patent proposes a solution at this problem, it is shown in Fig. 2 A, Fig. 2 B, offer many passages at the lower surface 62 of this chip carrier 61 and enclose and be set to square groove 63 (Groove), these grooves 63 are with equidistant adjacent spaces, and have the identical degree of depth; Therefore when carrying out mold pressing procedure, the excessive glue of chip carrier 61 lower surfaces 62 can be taken in by the groove 63 of these depressions, and the glue that can not continue to overflow is diffused on the surface 62 under the chip carrier 61, and then can solve above-mentioned excessive glue problem.
Yet the prior art still has its shortcoming, because this design can only allow excessive glue insert in the groove 63 of close position, can't mean allocation overflow the flowing of glue do not have diversion function, therefore yet, can cause the glue 65 that overflows in the groove 63 as shown in Figure 3A to distribute unequal phenomenon, still have attractive in appearance and quality problem; There are the degree of depth and the width of this groove 63 all limited again, when excessive glue amount is excessive, might surpass its loading that can hold, shown in Fig. 3 B, the glue 65 that occurs overflowing is too much, spill into the phenomenon of chip carrier 61 lower surfaces 62 again, still need additionally remove the operation of the glue 65 that overflows, so this technology does not thoroughly solve existing excessive glue problem.
Therefore, how to design a kind of wire-frame type semiconductor package part, can thoroughly solve the excessive glue problem of chip carrier lower surface, and then unnecessary excessive glue step of removal and the cost of economization, the problem that presses for solution become.
Summary of the invention
For solving above-mentioned prior art problems, main purpose of the present invention is to provide a kind of wire-frame type semiconductor package part and lead frame thereof of avoiding excessive glue to produce.
An also purpose of the present invention is to provide a kind of wire-frame type semiconductor package part and lead frame thereof of the step of simplifying working process.
Another object of the present invention is to provide a kind of wire-frame type semiconductor package part and lead frame thereof of saving manufacturing cost.
A further object of the present invention is to provide a kind of wire-frame type semiconductor package part and lead frame thereof that improves the bond strength of packing colloid and lead frame.
For reaching above-mentioned and other purpose, wire-frame type semiconductor package part of the present invention comprises: lead frame, have at least one chip carrier and be laid in this chip carrier a plurality of pins on every side, wherein, one surface of this chip carrier offers many grooves and many honeycomb ducts, and each bar groove all is communicated to the edge of this chip carrier by at least one honeycomb duct; At least one chip connects and puts the surface that does not offer groove and honeycomb duct on this chip carrier, and the packing colloid that is electrically connected to these a plurality of pins and coats this chip, makes this groove and honeycomb duct expose outside outside this packing colloid.
In addition, lead frame of the present invention comprises: at least one chip carrier, and a surface of this chip carrier offers many grooves and many honeycomb ducts, and each bar groove all is communicated to the edge of this chip carrier by at least one honeycomb duct; And a plurality of pins, be laid in this chip carrier around.
Between above-mentioned groove be communicated with and enclose be set to one with the shape corresponding shape of this chip carrier, and each groove all is communicated to the edge of this chip carrier by two honeycomb ducts, just make each limit of this chip carrier bottom surface all have at least one honeycomb duct that is communicated to this groove.
Simultaneously, above-mentioned groove has the identical degree of depth and width with honeycomb duct, and the degree of depth of this honeycomb duct is this chip carrier thickness half, and generally speaking, the degree of depth of this honeycomb duct can be designed to 0.05mm to 0.15mm, is preferably 0.1mm; Simultaneously, the width of this honeycomb duct is 0.03mm to 0.2mm, and preferable then is 0.1mm.
Therefore, when wire-frame type semiconductor package part of the present invention and lead frame thereof carry out existing mold pressing procedure, when if unnecessary excessive glue occurring, this honeycomb duct can guide flowing of the glue that overflows, this groove can be in order to fill excessive glue, and then make excessive glue enter in the honeycomb duct along each edge of chip carrier, recharge space at this groove; Simultaneously, because these many honeycomb ducts and groove all are interconnected, but so filling mean allocation of these excessive glue, can be attached to the surface of chip carrier, and then by dredging to the glue that overflows, thoroughly avoid the overflowing generation of glue has been simplified the operation of removing the glue that overflows, has been provided cost savings, and then also can improve the bond strength of packing colloid and lead frame.
Description of drawings
Figure 1A is the signal of the cutaway view glue excessive with it of existing QFN semiconductor package part;
Figure 1B is the upward view of the semiconductor package part of Figure 1A;
Fig. 2 A is the cutaway view of the semiconductor package part of the 6th, 204, No. 553 patented inventions of the U.S.;
Fig. 2 B is the upward view of the semiconductor package part of Fig. 2 A;
Fig. 3 A and Fig. 3 B are the upward views behind the excessive glue of the semiconductor package part of Fig. 2 A;
Fig. 4 A is a semiconductor package part cutaway view of the present invention;
Fig. 4 B is the upward view of the semiconductor package part of Fig. 4 A;
Fig. 5 is another chip carrier upward view that the present invention designs; And
Fig. 6 is another chip carrier upward view that the present invention designs.
Embodiment
Embodiment 1
As Fig. 4 A, shown in Fig. 4 B, wire-frame type semiconductor package part of the present invention comprises a lead frame 10, this lead frame 10 has a square shaped core bar 11 and is laid in this chip carrier 11 a plurality of pin ones 2 on every side, wherein, the bottom surface 110 of this chip carrier 11 offers many grooves 15 and honeycomb duct 16, it is the bottom view as Fig. 4 B, make these grooves 15 be communicated with and enclose be set to corresponding with the shape of this chip carrier 11 square, and each groove 15 all is communicated to the edge of this chip carrier 11 by two honeycomb ducts 16, just makes each limit of these chip carrier 11 bottom surfaces 110 all have at least one honeycomb duct that can be communicated to this groove 15 16.
This semiconductor package part also comprises and connects the chip of putting at this chip carrier 11 end faces 20, this chip 20 be by many for example the bonding wire 21 of gold thread be electrically connected to pairing a plurality of pin one 2, and then can utilize mold pressing procedure, coat this chip 20, bonding wire 21 and part pin one 2 with packing colloid 25, the bottom surface of exposing this pin one 2 and chip carrier 11 makes these many grooves 15 all expose outside outside this packing colloid 25 with honeycomb duct 16.
Therefore, by above-mentioned design, when carrying out existing mold pressing procedure, this honeycomb duct 16 can be in order to guide flowing of the glue 30 that overflows, this groove 15 can be in order to filling the glue 30 that overflows, and then the order glue 30 that overflows enters in the honeycomb duct 16 along each edge of chip carrier 11, recharges the space at this groove 15; Simultaneously, owing to should many honeycomb ducts 16 all be interconnected with groove 15, so the filling meeting of these excessive glue 30 is very average, can not stick to the surface of chip carrier 11, can thoroughly solve existing excessive glue problem by to the dredging of excessive glue.
Above-mentioned groove 15 has the identical degree of depth and width with honeycomb duct 16, and the degree of depth of this honeycomb duct 16 is these chip carrier 11 thickness half.Generally speaking, the degree of depth of this honeycomb duct 16 can be designed to 0.05mm to 0.15mm, and its degree of depth is 0.1mm preferably; Simultaneously, the width of this honeycomb duct 16 is 0.03mm to 0.2mm, and width is that 0.1mm is best.
Therefore, lead frame 10 of the present invention comprises: at least one chip carrier 11, a surface of this chip carrier 11 offer many grooves 15 and honeycomb duct 16, and each groove 15 all is communicated to the edge of this chip carrier 11 by at least one honeycomb duct 16; And a plurality of this chip carrier 11 pin ones 2 on every side that are laid in.
In sum, wire-frame type semiconductor package part of the present invention and lead frame thereof are when occurring overflowing glue, flowing of the bootable excessive glue of this honeycomb duct, this groove can be filled excessive glue, and then makes excessive glue enter in the honeycomb duct along each edge of chip carrier, recharges the space at this groove; Simultaneously, because these many honeycomb ducts and groove all are interconnected, but so filling mean allocation of these excessive glue, can be attached to the surface of chip carrier, and then by dredging to the glue that overflows, thoroughly avoid the overflowing generation of glue has been simplified the operation of removing the glue that overflows, has been provided cost savings, and then also can improve the bond strength of packing colloid and lead frame.
Claims (32)
1. wire-frame type semiconductor package part is characterized in that semiconductor package part comprises:
Lead frame has at least one chip carrier and is laid in this chip carrier a plurality of pins on every side, and wherein, a surface of this chip carrier offers many grooves and many honeycomb ducts, and each bar groove all is communicated to the edge of this chip carrier by at least one honeycomb duct;
At least one chip connects and puts the surface that does not offer groove and honeycomb duct on this chip carrier, and is electrically connected to this a plurality of pins; And
Coat the packing colloid of this chip, make this groove and honeycomb duct expose outside outside this packing colloid.
2. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, these many grooves are to enclose to put out a zone on the surface of this chip carrier.
3. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, these many grooves be on the surface of this chip carrier, enclose be set to square.
4. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, is interconnected between these many grooves.
5. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, each groove all is communicated with two honeycomb ducts.
6. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that each honeycomb duct all extends internally from the edge of this chip carrier.
7. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, this honeycomb duct is in order to guide flowing of the glue that overflows.
8. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, this groove is in order to fill excessive glue.
9. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, this groove has the identical degree of depth with this honeycomb duct.
10. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, this groove has identical width with this honeycomb duct.
11. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, the degree of depth of this honeycomb duct is half of this chip carrier thickness.
12. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, the degree of depth of this honeycomb duct is 0.05mm to 0.15mm.
13. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, the degree of depth of this honeycomb duct is 0.1mm.
14. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, the width of this honeycomb duct is 0.03mm to 0.2mm.
15. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, the width of this honeycomb duct is 0.1mm.
16. wire-frame type semiconductor package part as claimed in claim 1 is characterized in that, this chip electrically connects by a plurality of pins of bonding wire and this.
17. wire-frame type semiconductor package part as claimed in claim 16 is characterized in that, this bonding wire is a gold thread.
18. a lead frame is characterized in that, this lead frame comprises:
At least one chip carrier, a surface of this chip carrier offers many grooves and many honeycomb ducts, and each bar groove all is communicated to the edge of this chip carrier by at least one honeycomb duct; And
A plurality of pins, be laid in this chip carrier around.
19. lead frame as claimed in claim 18 is characterized in that, these many grooves enclose on the surface of this chip carrier puts out a zone.
20. lead frame as claimed in claim 18 is characterized in that, these many grooves on the surface of this chip carrier, enclose be set to square.
21. lead frame as claimed in claim 18 is characterized in that, is interconnected between these many grooves.
22. lead frame as claimed in claim 18 is characterized in that, each groove all is communicated with two honeycomb ducts.
23. lead frame as claimed in claim 18 is characterized in that, each honeycomb duct all extends internally from the edge of this chip carrier.
24. lead frame as claimed in claim 18 is characterized in that, this honeycomb duct is in order to guide flowing of the glue that overflows.
25. lead frame as claimed in claim 18 is characterized in that, this groove is in order to fill excessive glue.
26. lead frame as claimed in claim 18 is characterized in that, this groove has the identical degree of depth with this honeycomb duct.
27. lead frame as claimed in claim 18 is characterized in that, this groove has identical width with this honeycomb duct.
28. lead frame as claimed in claim 18 is characterized in that, the degree of depth of this honeycomb duct is half of this chip carrier thickness.
29. lead frame as claimed in claim 18 is characterized in that, the degree of depth of this honeycomb duct is 0.05mm to 0.15mm.
30. lead frame as claimed in claim 18 is characterized in that, the degree of depth of this honeycomb duct is 0.1mm.
31. lead frame as claimed in claim 18 is characterized in that, the width of this honeycomb duct is 0.03mm to 0.2mm.
32. lead frame as claimed in claim 18 is characterized in that, the width of this honeycomb duct is 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100025391A CN100373608C (en) | 2005-01-20 | 2005-01-20 | Wire-frame type semiconductor package part and its wire frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100025391A CN100373608C (en) | 2005-01-20 | 2005-01-20 | Wire-frame type semiconductor package part and its wire frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1808713A CN1808713A (en) | 2006-07-26 |
| CN100373608C true CN100373608C (en) | 2008-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100025391A Active CN100373608C (en) | 2005-01-20 | 2005-01-20 | Wire-frame type semiconductor package part and its wire frame |
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| CN (1) | CN100373608C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8044418B2 (en) | 2006-07-13 | 2011-10-25 | Cree, Inc. | Leadframe-based packages for solid state light emitting devices |
| US7960819B2 (en) | 2006-07-13 | 2011-06-14 | Cree, Inc. | Leadframe-based packages for solid state emitting devices |
| CN101740539B (en) * | 2008-11-07 | 2011-11-30 | 矽品精密工业股份有限公司 | Square planar pin-free encapsulating unit and manufacturing method and lead frame thereof |
| JP6244060B2 (en) * | 2016-01-06 | 2017-12-06 | 新電元工業株式会社 | Semiconductor device mounting table and in-vehicle device |
| CN108615715A (en) * | 2018-07-11 | 2018-10-02 | 日月光半导体（昆山）有限公司 | Semiconductor package and lead frame strip used by same |
| CN111769082B (en) * | 2020-07-06 | 2022-07-01 | 瑞声声学科技(深圳)有限公司 | ASIC chip and manufacturing method |
| CN113506749B (en) * | 2021-09-08 | 2021-11-12 | 南通汇丰电子科技有限公司 | Chip stacking body and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918511A (en) * | 1985-02-01 | 1990-04-17 | Advanced Micro Devices, Inc. | Thermal expansion compensated metal lead frame for integrated circuit package |
| US6204553B1 (en) * | 1999-08-10 | 2001-03-20 | Walsin Advanced Electronics Ltd. | Lead frame structure |
| US6472729B1 (en) * | 1998-01-22 | 2002-10-29 | Oki Electric Industry Co., Ltd. | Semiconductor device |
| US6650020B2 (en) * | 2001-06-29 | 2003-11-18 | Matsushia Electric Industrial Co., Ltd. | Resin-sealed semiconductor device |
-
2005
- 2005-01-20 CN CNB2005100025391A patent/CN100373608C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918511A (en) * | 1985-02-01 | 1990-04-17 | Advanced Micro Devices, Inc. | Thermal expansion compensated metal lead frame for integrated circuit package |
| US6472729B1 (en) * | 1998-01-22 | 2002-10-29 | Oki Electric Industry Co., Ltd. | Semiconductor device |
| US6204553B1 (en) * | 1999-08-10 | 2001-03-20 | Walsin Advanced Electronics Ltd. | Lead frame structure |
| US6650020B2 (en) * | 2001-06-29 | 2003-11-18 | Matsushia Electric Industrial Co., Ltd. | Resin-sealed semiconductor device |
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| Publication number | Publication date |
|---|---|
| CN1808713A (en) | 2006-07-26 |
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