CN100371770C - A focusing device in laser ablation microanalysis - Google Patents

A focusing device in laser ablation microanalysis Download PDF

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CN100371770C
CN100371770C CNB2006100575409A CN200610057540A CN100371770C CN 100371770 C CN100371770 C CN 100371770C CN B2006100575409 A CNB2006100575409 A CN B2006100575409A CN 200610057540 A CN200610057540 A CN 200610057540A CN 100371770 C CN100371770 C CN 100371770C
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姚宁娟
陈吉文
杨志军
沈学静
王海舟
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Detection Technology Of Ncs Ltd By Share Ltd
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Abstract

本发明涉及为激光烧蚀微区分析提供的一种聚焦装置,由激光三角测量系统、信号采集处理系统和样品移动定位系统组成。本发明采用激光三角测量原理,半导体激光器作为光发射源,CCD传感器作为光接收元件,三角测量结果经分析处理获得被分析样品与烧蚀用激光聚焦镜头的相对位置,并与给定的聚焦位置进行比较,利用比较结果控制步进电机驱动样品工作台完成烧蚀用激光在被分析样品表面的自动准确聚焦。

The invention relates to a focusing device provided for laser ablation micro-area analysis, which is composed of a laser triangulation measurement system, a signal collection and processing system and a sample moving positioning system. The invention adopts the principle of laser triangulation measurement, the semiconductor laser is used as the light emitting source, and the CCD sensor is used as the light receiving element. The triangulation measurement result is analyzed and processed to obtain the relative position of the analyzed sample and the laser focusing lens for ablation, and compares with the given focus position The comparison is made, and the comparison result is used to control the stepper motor to drive the sample workbench to complete the automatic and accurate focusing of the ablation laser on the surface of the analyzed sample.

Description

Focusing device in laser ablation micro-area analysis
Technical Field
The device provides a simple and accurate focusing device for laser ablation micro-area analysis, and mainly relates to the field of material component analysis.
Background
In recent decades, laser ablation has been widely applied in the field of material composition analysis, and is now widely applied in the fields of mining and metallurgy, geology, archaeology, environment, chemical industry, biomedicine, and the like. The analysis object can be a solid phase sample micro-selection area and a particle sample, can also be a gas phase sample and a liquid phase sample, and can also be used for analyzing a conductor, a non-conductor or a high-temperature melting sample, the sample does not need to be pretreated or only needs to be simply treated, the spatial resolution is 5-10 um, and the detection limit is in ppt magnitude.
In laser ablation micro-area analysis, laser can be directly used as an analysis instrument of a sample atom/ionization source, such as LA-OES/MS, or used as a sample evaporation source, and Inductively Coupled Plasma (ICP), microwave Induced Plasma (MIP) or empty cathode discharge (HCD) is used as an instrument of an atom/ionization source, such as LA-ICP/MIP/HCD-MS. In these instruments, the purpose of laser ablation is to focus the laser on the sample surface, to couple the laser energy efficiently into the sample, and to generate a stable and sensitive emission spectrum or a stable and uniform sample volume for quantitative analysis.
Laser parameters such as laser mode, laser energy and repetition rate, which affect the quantitative analysis result, can be optimized to obtain relatively good reproducibility. The focus position of the laser on the sample surface directly affects the energy coupled into the sample, and it is difficult to ensure the accuracy of the focus position of the laser on the sample surface in the existing commercial instruments or other focusing devices disclosed in laser ablation devices, because in the existing focusing methods, the focus position is usually adjusted by observing the clarity of the sample in the micro-imaging CCD through the human eye, see the documents laser ablation in analytical chemistry-a review, richard e.russo, xiaolei mao, haiche liu ect, talanta,57 (2002) 427. The problems with this focusing method are:
1) The CCD microscopic imaging light path and the laser output light path are the same light path, the laser focal length depends on the laser wavelength, and the focusing point of the laser beam and the optical imaging focusing point are not at the same position;
2) The method is suitable for samples with smooth surfaces and is not suitable for samples with uneven surfaces.
Disclosure of Invention
The invention aims to provide a distance measuring automatic focusing device for solving the problem of the insufficient focusing method in laser ablation micro-area analysis.
The main technical scheme of the invention is to adopt a laser triangulation principle, a semiconductor laser is used as a light source, a CCD sensor is used as a light receiving detector, and a stepping motor drives an automatic focusing device of a sample worktable.
The technical scheme of the invention is that the focusing device comprises a laser triangulation system, a data acquisition and processing system and a sample moving and positioning system:
the laser triangulation system consists of a laser, a transmitting lens, a receiving lens and a detector, light emitted by the laser is converged by the transmitting lens and then irradiates the surface of an analyzed sample, light reflected by the surface of the analyzed sample is imaged on the detector through the receiving lens, and displacement X is generated from a reference surface to the surface of the analyzed sample along the direction of incident light, so that the displacement X' is generated on an image spot of the detector, and further the change of an output signal of the detector is generated. The displacement X of the sample to be analyzed and the displacement X' of the image spot of the detector meet the principle of triangular measurement, and the calculation formula of the relative distance S between the sample to be analyzed and the laser lens for ablation is as follows:
Figure C20061005754000051
S=S0±X
if the surface of the sample to be analyzed moves downwards from the position of the reference surface, taking "-, and otherwise, taking the" + "sign, L, L' -respectively representing the object distance and the image distance at the reference surface, wherein alpha is the structural parameter of the system, and S0 is the distance from the laser focusing lens to the reference surface;
the signal acquisition and processing system consists of a detector driving and acquisition circuit and a computer, wherein the detector driving and acquisition circuit acquires the change of the output signal of the detector, the computer processes the signal output by the detector driving and acquisition circuit, calculates the relative distance between the sample to be analyzed and the laser lens for ablation according to the formula, and compares the relative distance with a given focusing position;
the sample moving and positioning system is composed of a sample workbench, and the sample moving and positioning system adjusts the position of the sample workbench to realize the moving and positioning of the analyzed sample according to the comparison result of the computer.
Another technical solution of the present invention is that, in the above-mentioned sample moving and positioning system, in addition to the sample stage, the system further includes a motion control card, a stepping motor and a driving circuit, the comparison result of the computer is transmitted to the motion control card, and the motion control card controls the stepping motor and the driving circuit to drive the sample stage to move to a given focusing position, so as to realize automatic focusing of the sample to be analyzed.
In still another aspect of the present invention, the laser is a semiconductor laser.
In another embodiment of the present invention, the detector is a CCD sensor.
In still another aspect of the present invention, the emitting lens and the focusing lens of the laser for ablation are the same lens.
Compared with the prior art, the invention has the following advantages:
1) The whole focusing process is automatically completed by the focusing device without manual participation, and the method is accurate and high in efficiency.
2) The semiconductor laser has good directionality, high optical power, high measurement resolution and high measurement precision, so that the focusing precision is high, and the reproducibility of the laser ablation micro-area analysis result is improved.
3) The laser ablation micro-area analysis method can be suitable for focusing of uneven samples and can be used for on-line focusing, and the application range of laser ablation micro-area analysis is widened.
Drawings
FIG. 1 is a schematic view of a focusing device in laser ablation micro-area analysis according to the present invention.
Detailed Description
The following is a further detailed description with reference to the accompanying drawings.
As can be seen from the attached figure 1, the invention comprises a laser triangulation system, a signal acquisition and processing system and a sample moving and positioning system.
The laser triangulation system consists of a semiconductor laser 1, an emitting lens 2, a receiving lens 4 and a CCD sensor 5, light emitted by the semiconductor laser 1 is converged by the emitting lens 2 and then irradiates the surface of an analyzed sample 3, and light reflected by the analyzed sample 3 is focused on the CCD sensor 5 through the receiving lens 4. The distance measurement principle is as follows:
the semiconductor laser 1 is converged and irradiated on a 0 point (hereinafter referred to as an object light point) of a reference surface, and is imaged on a 5 photoelectric center 0' point (hereinafter referred to as an image light point) of a CCD sensor through a receiving lens group 4. The output of the CCD sensor 5 is zero at this time. When the laser beam is irradiated on the sample 3 to be analyzed, the object light spot will be displaced X in the incident light direction, causing the image light spot to be displaced X', which in turn causes a change in the output signal of the CCD sensor 5. The displacement X of the sample to be analyzed and the displacement X' of the image spot of the detector meet the principle of triangulation, and the calculation formula of the relative distance S between the sample to be analyzed 3 and the laser lens for ablation is as follows:
S=S0±X
if the surface of the analyzed sample 3 moves downwards from the position of the reference surface, taking "-"; otherwise take the "+" sign. L, L' — the object and image distances at the reference plane, respectively. α is a structural parameter of the system. And S0 is the distance from the laser focusing lens to the reference surface. Therefore, the displacement X of the sample to be analyzed can be obtained by accurately measuring X', and the distance S between the sample to be analyzed and the laser focusing lens for ablation can be obtained.
The signal acquisition processing system consists of a CCD sensor driving and acquisition circuit 6 and a computer 7, wherein the computer 7 processes signals output by the CCD sensor driving and acquisition circuit 6, calculates the relative distance between the sample 3 to be analyzed and the laser lens for ablation, and compares the relative distance with a given focusing position.
The sample moving and positioning system consists of a motion control card 8, a stepping motor and drive circuit 9 and a sample worktable 10, the comparison result obtained by the computer is transmitted to the motion control card 8, and the motion control card 8 controls the stepping motor and drive circuit 9 to drive the sample worktable 10 to move to a given focusing position.

Claims (5)

1.激光烧蚀微区分析中的一种聚焦装置,其特征是,它包括:1. A focusing device in laser ablation micro-area analysis, characterized in that it comprises: 激光三角测量系统,由激光器(1),发射透镜(2),接收透镜(4),和探测器(5)组成,激光器(1)发出的光经发射透镜(2)会聚后照射在被分析样品(3)表面处,由被分析样品(3)表面反射回来的光线经接收透镜(4)成像于探测器(5),从基准面到被分析样品(3)表面沿入射光方向发生位移X,从而引起探测器(5)像斑发生位移X′,进而引起探测器(5)输出信号的变化,被分析样品位移X和探测器像斑位移X′满足三角测量原理,被分析样品(3)和发射透镜(2)的相对距离S的计算公式为:The laser triangulation measurement system consists of a laser (1), a transmitting lens (2), a receiving lens (4), and a detector (5). At the surface of the sample (3), the light reflected from the surface of the analyzed sample (3) is imaged on the detector (5) through the receiving lens (4), and the displacement occurs along the direction of the incident light from the reference plane to the surface of the analyzed sample (3) X, thus causing the detector (5) image spot to shift X′, which in turn causes the output signal of the detector (5) to change. The analyzed sample displacement X and the detector image spot displacement X′ satisfy the principle of triangulation, and the analyzed sample ( 3) and the calculation formula of the relative distance S of the emitting lens (2) is: Xx == Xx ′′ LL LL ′′ sinsin αα -- Xx ′′ coscos αα S=S0±XS=S0±X 若被分析样品(3)表面由基准面位置下移,式中取″-″,反之取″+″号,L、L′-分别是基准面处物距和像距,α是系统的结构参数,S0为发射透镜(2)到基准面的距离;If the surface of the analyzed sample (3) moves down from the position of the datum plane, take "-" in the formula, otherwise take "+" sign, L, L'- are the object distance and image distance at the datum plane respectively, and α is the structure of the system Parameter, S0 is the distance from the emission lens (2) to the reference plane; 信号采集处理系统,由探测器驱动和采集电路(6)和计算机(7)组成,探测器驱动和采集电路(6)采集探测器(5)输出信号的变化,计算机(7)处理探测器驱动和采集电路(6)输出的信号,计算被分析样品(3)和烧蚀用激光透镜的相对距离,并与给定的聚焦位置进行比较;The signal acquisition and processing system is composed of a detector drive and acquisition circuit (6) and a computer (7). The detector drive and acquisition circuit (6) collects changes in the output signal of the detector (5), and the computer (7) processes the detector drive. and the signal output by the acquisition circuit (6), calculate the relative distance between the analyzed sample (3) and the laser lens for ablation, and compare it with the given focus position; 样品移动定位系统,由样品工作台(10)组成,根据计算机(7)的比较结果,调整样品工作台(10)的位置实现被分析样品(3)的移动定位。The sample moving and positioning system is composed of a sample workbench (10). According to the comparison result of the computer (7), the position of the sample workbench (10) is adjusted to realize the moving and positioning of the analyzed sample (3). 2.如权利要求1所述的激光烧蚀微区分析中的一种聚焦装置,其特征是,所述的样品移动定位系统中还包括运动控制卡(8)和步进电机及驱动电路(9),计算机(7)的比较结果输送给运动控制卡(8),运动控制卡(8)控制步进电机及驱动电路(9)驱动样品工作台(10)移动到给定的聚焦位置,从而实现被分析样品的自动聚焦。2. a kind of focusing device in the laser ablation micro-area analysis as claimed in claim 1, is characterized in that, also comprises motion control card (8) and stepper motor and driving circuit ( 9), the comparison result of the computer (7) is sent to the motion control card (8), and the motion control card (8) controls the stepper motor and the drive circuit (9) to drive the sample workbench (10) to move to a given focus position, Thereby automatic focusing of the sample to be analyzed is realized. 3.如权利要求1或2所述的激光烧蚀微区分析中的一种聚焦装置,其特征是所述的激光器(1)是半导体激光器。3. A focusing device in laser ablation micro-area analysis according to claim 1 or 2, characterized in that said laser (1) is a semiconductor laser. 4.如权利要求1或2所述的激光烧蚀微区分析中的一种聚焦装置,其特征是,所述的探测器(5)为CCD传感器。4. A focusing device in laser ablation micro-area analysis according to claim 1 or 2, characterized in that said detector (5) is a CCD sensor. 5.如权利要求3所述的激光烧蚀微区分析中的一种聚焦装置,其特征是所述的探测器(5)为CCD传感器。5. A focusing device in laser ablation micro-area analysis according to claim 3, characterized in that said detector (5) is a CCD sensor.
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EP1482342A1 (en) * 1999-10-07 2004-12-01 Agilent Technologies Inc. (a Delaware Corporation) Apparatus and method for autofocus
US20040102764A1 (en) * 2000-11-13 2004-05-27 Peter Balling Laser ablation
JP2003073812A (en) * 2001-08-28 2003-03-12 Masaki Yamamoto Laser ablation device
JP2004090081A (en) * 2002-09-03 2004-03-25 Japan Science & Technology Corp Method and apparatus for controlling laser ablation in solution
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