CN100371770C - A focusing device in laser ablation microanalysis - Google Patents
A focusing device in laser ablation microanalysis Download PDFInfo
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- CN100371770C CN100371770C CNB2006100575409A CN200610057540A CN100371770C CN 100371770 C CN100371770 C CN 100371770C CN B2006100575409 A CNB2006100575409 A CN B2006100575409A CN 200610057540 A CN200610057540 A CN 200610057540A CN 100371770 C CN100371770 C CN 100371770C
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- 238000000608 laser ablation Methods 0.000 title claims abstract description 19
- 238000004452 microanalysis Methods 0.000 title 1
- 238000004458 analytical method Methods 0.000 claims abstract description 18
- 238000002679 ablation Methods 0.000 claims abstract description 9
- 238000005259 measurement Methods 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 8
- 238000006073 displacement reaction Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004445 quantitative analysis Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
本发明涉及为激光烧蚀微区分析提供的一种聚焦装置，由激光三角测量系统、信号采集处理系统和样品移动定位系统组成。本发明采用激光三角测量原理，半导体激光器作为光发射源，CCD传感器作为光接收元件，三角测量结果经分析处理获得被分析样品与烧蚀用激光聚焦镜头的相对位置，并与给定的聚焦位置进行比较，利用比较结果控制步进电机驱动样品工作台完成烧蚀用激光在被分析样品表面的自动准确聚焦。
The invention relates to a focusing device provided for laser ablation micro-area analysis, which is composed of a laser triangulation measurement system, a signal collection and processing system and a sample moving positioning system. The invention adopts the principle of laser triangulation measurement, the semiconductor laser is used as the light emitting source, and the CCD sensor is used as the light receiving element. The triangulation measurement result is analyzed and processed to obtain the relative position of the analyzed sample and the laser focusing lens for ablation, and compares with the given focus position The comparison is made, and the comparison result is used to control the stepper motor to drive the sample workbench to complete the automatic and accurate focusing of the ablation laser on the surface of the analyzed sample.
Description
Technical Field
The device provides a simple and accurate focusing device for laser ablation micro-area analysis, and mainly relates to the field of material component analysis.
Background
In recent decades, laser ablation has been widely applied in the field of material composition analysis, and is now widely applied in the fields of mining and metallurgy, geology, archaeology, environment, chemical industry, biomedicine, and the like. The analysis object can be a solid phase sample micro-selection area and a particle sample, can also be a gas phase sample and a liquid phase sample, and can also be used for analyzing a conductor, a non-conductor or a high-temperature melting sample, the sample does not need to be pretreated or only needs to be simply treated, the spatial resolution is 5-10 um, and the detection limit is in ppt magnitude.
In laser ablation micro-area analysis, laser can be directly used as an analysis instrument of a sample atom/ionization source, such as LA-OES/MS, or used as a sample evaporation source, and Inductively Coupled Plasma (ICP), microwave Induced Plasma (MIP) or empty cathode discharge (HCD) is used as an instrument of an atom/ionization source, such as LA-ICP/MIP/HCD-MS. In these instruments, the purpose of laser ablation is to focus the laser on the sample surface, to couple the laser energy efficiently into the sample, and to generate a stable and sensitive emission spectrum or a stable and uniform sample volume for quantitative analysis.
Laser parameters such as laser mode, laser energy and repetition rate, which affect the quantitative analysis result, can be optimized to obtain relatively good reproducibility. The focus position of the laser on the sample surface directly affects the energy coupled into the sample, and it is difficult to ensure the accuracy of the focus position of the laser on the sample surface in the existing commercial instruments or other focusing devices disclosed in laser ablation devices, because in the existing focusing methods, the focus position is usually adjusted by observing the clarity of the sample in the micro-imaging CCD through the human eye, see the documents laser ablation in analytical chemistry-a review, richard e.russo, xiaolei mao, haiche liu ect, talanta,57 (2002) 427. The problems with this focusing method are:
1) The CCD microscopic imaging light path and the laser output light path are the same light path, the laser focal length depends on the laser wavelength, and the focusing point of the laser beam and the optical imaging focusing point are not at the same position;
2) The method is suitable for samples with smooth surfaces and is not suitable for samples with uneven surfaces.
Disclosure of Invention
The invention aims to provide a distance measuring automatic focusing device for solving the problem of the insufficient focusing method in laser ablation micro-area analysis.
The main technical scheme of the invention is to adopt a laser triangulation principle, a semiconductor laser is used as a light source, a CCD sensor is used as a light receiving detector, and a stepping motor drives an automatic focusing device of a sample worktable.
The technical scheme of the invention is that the focusing device comprises a laser triangulation system, a data acquisition and processing system and a sample moving and positioning system:
the laser triangulation system consists of a laser, a transmitting lens, a receiving lens and a detector, light emitted by the laser is converged by the transmitting lens and then irradiates the surface of an analyzed sample, light reflected by the surface of the analyzed sample is imaged on the detector through the receiving lens, and displacement X is generated from a reference surface to the surface of the analyzed sample along the direction of incident light, so that the displacement X' is generated on an image spot of the detector, and further the change of an output signal of the detector is generated. The displacement X of the sample to be analyzed and the displacement X' of the image spot of the detector meet the principle of triangular measurement, and the calculation formula of the relative distance S between the sample to be analyzed and the laser lens for ablation is as follows:
S＝S0±X
if the surface of the sample to be analyzed moves downwards from the position of the reference surface, taking "-, and otherwise, taking the" + "sign, L, L' -respectively representing the object distance and the image distance at the reference surface, wherein alpha is the structural parameter of the system, and S0 is the distance from the laser focusing lens to the reference surface;
the signal acquisition and processing system consists of a detector driving and acquisition circuit and a computer, wherein the detector driving and acquisition circuit acquires the change of the output signal of the detector, the computer processes the signal output by the detector driving and acquisition circuit, calculates the relative distance between the sample to be analyzed and the laser lens for ablation according to the formula, and compares the relative distance with a given focusing position;
the sample moving and positioning system is composed of a sample workbench, and the sample moving and positioning system adjusts the position of the sample workbench to realize the moving and positioning of the analyzed sample according to the comparison result of the computer.
Another technical solution of the present invention is that, in the above-mentioned sample moving and positioning system, in addition to the sample stage, the system further includes a motion control card, a stepping motor and a driving circuit, the comparison result of the computer is transmitted to the motion control card, and the motion control card controls the stepping motor and the driving circuit to drive the sample stage to move to a given focusing position, so as to realize automatic focusing of the sample to be analyzed.
In still another aspect of the present invention, the laser is a semiconductor laser.
In another embodiment of the present invention, the detector is a CCD sensor.
In still another aspect of the present invention, the emitting lens and the focusing lens of the laser for ablation are the same lens.
Compared with the prior art, the invention has the following advantages:
1) The whole focusing process is automatically completed by the focusing device without manual participation, and the method is accurate and high in efficiency.
2) The semiconductor laser has good directionality, high optical power, high measurement resolution and high measurement precision, so that the focusing precision is high, and the reproducibility of the laser ablation micro-area analysis result is improved.
3) The laser ablation micro-area analysis method can be suitable for focusing of uneven samples and can be used for on-line focusing, and the application range of laser ablation micro-area analysis is widened.
Drawings
FIG. 1 is a schematic view of a focusing device in laser ablation micro-area analysis according to the present invention.
Detailed Description
The following is a further detailed description with reference to the accompanying drawings.
As can be seen from the attached figure 1, the invention comprises a laser triangulation system, a signal acquisition and processing system and a sample moving and positioning system.
The laser triangulation system consists of a semiconductor laser 1, an emitting lens 2, a receiving lens 4 and a CCD sensor 5, light emitted by the semiconductor laser 1 is converged by the emitting lens 2 and then irradiates the surface of an analyzed sample 3, and light reflected by the analyzed sample 3 is focused on the CCD sensor 5 through the receiving lens 4. The distance measurement principle is as follows:
the semiconductor laser 1 is converged and irradiated on a 0 point (hereinafter referred to as an object light point) of a reference surface, and is imaged on a 5 photoelectric center 0' point (hereinafter referred to as an image light point) of a CCD sensor through a receiving lens group 4. The output of the CCD sensor 5 is zero at this time. When the laser beam is irradiated on the sample 3 to be analyzed, the object light spot will be displaced X in the incident light direction, causing the image light spot to be displaced X', which in turn causes a change in the output signal of the CCD sensor 5. The displacement X of the sample to be analyzed and the displacement X' of the image spot of the detector meet the principle of triangulation, and the calculation formula of the relative distance S between the sample to be analyzed 3 and the laser lens for ablation is as follows:
S＝S0±X
if the surface of the analyzed sample 3 moves downwards from the position of the reference surface, taking "-"; otherwise take the "+" sign. L, L' — the object and image distances at the reference plane, respectively. α is a structural parameter of the system. And S0 is the distance from the laser focusing lens to the reference surface. Therefore, the displacement X of the sample to be analyzed can be obtained by accurately measuring X', and the distance S between the sample to be analyzed and the laser focusing lens for ablation can be obtained.
The signal acquisition processing system consists of a CCD sensor driving and acquisition circuit 6 and a computer 7, wherein the computer 7 processes signals output by the CCD sensor driving and acquisition circuit 6, calculates the relative distance between the sample 3 to be analyzed and the laser lens for ablation, and compares the relative distance with a given focusing position.
The sample moving and positioning system consists of a motion control card 8, a stepping motor and drive circuit 9 and a sample worktable 10, the comparison result obtained by the computer is transmitted to the motion control card 8, and the motion control card 8 controls the stepping motor and drive circuit 9 to drive the sample worktable 10 to move to a given focusing position.
Claims (5)
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2006100575409A CN100371770C (en) | 2006-03-14 | 2006-03-14 | A focusing device in laser ablation microanalysis |
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| CNB2006100575409A CN100371770C (en) | 2006-03-14 | 2006-03-14 | A focusing device in laser ablation microanalysis |
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| CN1815295A CN1815295A (en) | 2006-08-09 |
| CN100371770C true CN100371770C (en) | 2008-02-27 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101413788B (en) * | 2007-10-19 | 2010-11-24 | 财团法人工业技术研究院 | Surface topography measuring method and device thereof |
| RU2447468C2 (en) * | 2010-04-02 | 2012-04-10 | Учреждение Российской академии наук Конструкторско-технологический институт научного приборостроения Сибирского отделения РАН | Method for automatic focusing of operating radiation on 3d optical surface |
| CN103411958B (en) * | 2013-08-08 | 2014-06-18 | 哈尔滨工业大学 | Device and method for dynamic testing of material ablation rate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003073812A (en) * | 2001-08-28 | 2003-03-12 | Masaki Yamamoto | Laser ablation device |
| JP2004090081A (en) * | 2002-09-03 | 2004-03-25 | Japan Science & Technology Corp | Method and apparatus for controlling laser ablation in solution |
| US20040102764A1 (en) * | 2000-11-13 | 2004-05-27 | Peter Balling | Laser ablation |
| EP1482342A1 (en) * | 1999-10-07 | 2004-12-01 | Agilent Technologies Inc. (a Delaware Corporation) | Apparatus and method for autofocus |
| US20050061779A1 (en) * | 2003-08-06 | 2005-03-24 | Walter Blumenfeld | Laser ablation feedback spectroscopy |
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- 2006-03-14 CN CNB2006100575409A patent/CN100371770C/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1482342A1 (en) * | 1999-10-07 | 2004-12-01 | Agilent Technologies Inc. (a Delaware Corporation) | Apparatus and method for autofocus |
| US20040102764A1 (en) * | 2000-11-13 | 2004-05-27 | Peter Balling | Laser ablation |
| JP2003073812A (en) * | 2001-08-28 | 2003-03-12 | Masaki Yamamoto | Laser ablation device |
| JP2004090081A (en) * | 2002-09-03 | 2004-03-25 | Japan Science & Technology Corp | Method and apparatus for controlling laser ablation in solution |
| US20050061779A1 (en) * | 2003-08-06 | 2005-03-24 | Walter Blumenfeld | Laser ablation feedback spectroscopy |
Non-Patent Citations (1)
| Title |
|---|
| An auto-focus system for reproducible focusing in laserablation inductively coupled plasma mass spectrometry. HERVE COUSIN et al.Spectrochimica Acta,Vol.50B No.1. 1995 * |
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Assignee: Beijing NCS Analytical Instruments Co., Ltd. Assignor: Central Iron & Steel Research Institute Contract fulfillment period: 2007.12.15 to 2013.12.15 contract change Contract record no.: 2008990000631 Denomination of invention: Focusing device for laser ablation microarea analysis Granted publication date: 20080227 License type: Exclusive license Record date: 2008.10.8 |
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Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.12.15 TO 2013.12.15; CHANGE OF CONTRACT Name of requester: BEIJING NAKE ANALYTICAL INSTRUMENT CO., LTD. Effective date: 20081008 |
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Address after: No. 13, sorghum Bridge, Beijing, Beijing, Haidian District Patentee after: The detection technology of NCS Limited by Share Ltd Address before: No. 13, sorghum Bridge, Beijing, Beijing, Haidian District Patentee before: NCS Testing Technology Co., Ltd. |
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