CN100362445C - Test set of electronic component connection socket - Google Patents
Test set of electronic component connection socket Download PDFInfo
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- CN100362445C CN100362445C CNB2005100334997A CN200510033499A CN100362445C CN 100362445 C CN100362445 C CN 100362445C CN B2005100334997 A CNB2005100334997 A CN B2005100334997A CN 200510033499 A CN200510033499 A CN 200510033499A CN 100362445 C CN100362445 C CN 100362445C
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- amplifier
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Abstract
The present invention relates to a test set of a connection socket of an electronic component, which is used for verifying the welding conditions of all connection points between a connection socket of an electronic component and a host board. Resistance value judging units and measurement connecting pins are used for verifying whether the grounding resistance values of the connection points are default values or not, a lamp number display module is used for switching corresponding display states, and users can directly verify the condition that whether the connection points have cold welding or empty welding, etc. via lamp numbers in order to increase detection efficiency.
Description
[technical field]
The present invention is applied to the test of electronic component gang socket relevant for a kind of measurement jig, refers in particular to a kind of ground connection resistance by resistance decision circuitry affirmation tie point, in order to confirm the measurement jig of tie point welded condition.
[background technology]
The computer executable platform is kept for the upgradeable space of user mostly when design at present, and therefore many upgradeable elements all utilize exclusive gang socket to be connected with motherboard at present, to make things convenient for the operation of the following upgrading of user.
The making flow process of motherboard, utilize surface mounting technology (Surface MountingTechnology mostly, SMT) come treatment element and printed circuit board (PCB) (Printed Circuit Board, PCB) Welding Problems between, but when the surface mounting technology operation the required tin cream that uses, printing machine (SolderPaste Printer), put part machine (Stencil Pick ﹠amp; Place Reflow Oven) or even the setting of process parameter, all may influence the making quality of surface mounting technology.For example, tin cream viscosity deficiency, or the time of mistake tin stove is too fast, all may cause the situation of cold welding or empty weldering to produce, but the situation of general cold welding or empty weldering, and can't utilize naked eyes to examine easily and know, when motherboard arrived test phase by the time, unsettled situation has taken place can be discovered.
Therefore when the motherboard arrival test phase that completes, but produce and can't start shooting or unstable situation and need maintenance when confirming problem, all can confirm whether to have the situation of cold welding or empty weldering mostly earlier.For instance, confirm that with existing mode whether the gang socket of electronic component on the motherboard has cold welding or empty weldering is example, the slip-stick artist need one by one measurement gang socket and motherboard between the ground connection resistance of hundreds of tie points, could confirm whether above-mentioned hundreds of tie points have time to weld or the situation of cold welding.
In addition, when host board fault needs repairing, and element that needs repairing or circuit just are positioned near the gang socket, and need earlier gang socket is taken off earlier, when maintenance is finished and gang socket welding gone back, still need to confirm one by one again the ground connection resistance of hundreds of tie points.
Therefore, be used at present between the gang socket and motherboard of detected electrons element, the mode of the welding situation of hundreds of tie points will spend many valuable time; And the affirmation work of hundreds of tie points also may and need be carried out again because of a carelessness slightly; And the ground connection resistance of each tie point can be along with the label and the model of electronic component, or even same model but different tie point and the ground connection resistance of having nothing in common with each other.Therefore the slip-stick artist needs to spend the time of twice, utilizes to measure another normal motherboard and comparison one by one, just can finish affirmation work.
[summary of the invention]
Fundamental purpose of the present invention is to provide a kind of measurement jig of electronic component gang socket, when confirming the welding situation of tie point between gang socket and the motherboard, the demonstration situation of cresset display module is checked in utilization, just can confirm whether to have the situation of cold welding or empty weldering rapidly.
For reaching above-mentioned purpose, the present invention discloses a kind of measurement jig of electronic component gang socket, includes following modules: measure pin, resistance judging unit, reach the cresset display module.Wherein, measure pin and tie point electrical couplings, and the resistance judging unit will produce respective output voltages according to the ground connection resistance of tie point, utilize the cresset display module to switch show state according to output voltage again, with the welding situation of prompting user tie point.
The present invention also discloses a kind of test module of electronic component gang socket, and in order to confirm the welding situation of the some tie points between gang socket and motherboard, this test module comprises: a machine plate has one first relative side and one second side; This first side of this machine plate is provided with some measurement pins, and this measures pin and this tie point electrical couplings; This second side of this machine plate is provided with some resistance judging units, this resistance judging unit and this measure pin and electrically connect, and this resistance judging unit is in order to the test voltage that receives a power-supply unit and provide and some ground connection resistances of this tie point, and some resistance decision circuitry that this resistance judging unit sees through its inside are judged respectively this ground connection resistance, and whether an its corresponding default value is identical, to produce a corresponding output voltage; This second side of this machine plate is provided with some cresset display modules, this cresset display module and this resistance judging unit electrically connect, this cresset display module according to this output voltage respectively respectively this cresset display module switch to corresponding to the show state of this output voltage respectively.
Compared to prior art, the present invention can reduce test procedure and shorten detection time.
[description of drawings]
Fig. 1 for the present invention with the gang socket of central processing unit testing mechanism synoptic diagram as first embodiment.
Fig. 2 is the testing mechanism synoptic diagram that the first embodiment of the present invention is specialized the circuit of resistance judging unit.
Fig. 3 for the present invention with the gang socket of central processing unit testing mechanism synoptic diagram as second embodiment.
Fig. 4 for the present invention with the gang socket of central processing unit user mode figure as second embodiment.
[embodiment]
See also shown in Figure 1ly, testing mechanism includes power-supply unit 20, switch element 30, gang socket 200 and measurement jig 100, and in the present embodiment, this gang socket 200 can be the gang socket of central processing unit.See through switch element 30 and switch and make power-supply unit 20 provide test voltage to arrive measurement jig 100, and utilize its internal judgment circuit to confirm the ground connection resistance of gang socket 200, whether normal, as tie point 10 standard of defectives such as free weldering or cold welding whether.
And measurement jig 100 mainly comprises: (A) measure pin 40; (B) the resistance judging unit 50; Reach (C) cresset display module 60, be described in detail as follows respectively:
(A) measure pin 40 in order to tie point 10 electrical couplings, when measuring pin 40 through gang socket 200 and tie point 10 electrical couplings, at this moment, measuring pin 40 is same contact with tie point 10, therefore when measurement jig 100 needs the ground connection resistance of tie point 10, can see through measurement pin 40 and obtain.
Above-mentioned tie point 10, refer between gang socket 200 and the motherboard, utilize and weld one of hundreds of tie points 10 that are coupled, wherein each tie point 10 all respectively has a ground connection resistance, though this ground connection resistance can be according to the specification of central processing unit or different contact and difference, but the same tie point 10 in the same model motherboard, when the situation that does not have empty weldering or cold welding took place, the ground connection resistance did not have too big error.Measure the size of pin 40, identical with the pin definition of the central processing unit of desiring to be plugged in gang socket 200.
(B) resistance judging unit 50 is connected with measurement pin 40, and when receiving the test voltage that power-supply unit 20 and switch element 30 provided, according to the ground connection resistance that pin 40 tie point that provides 10 is provided, utilize its inner resistance decision circuitry, whether the ground connection resistance of confirming tie point 10 is between default value (on the motherboard stable prior to a situation by the slip-stick artist of the practice on the practice, obtain the ground connection resistance of tie point 10, and produce respective output voltages default value as the ground connection resistance).
The test voltage of 30 controllable power feeding units of switch element, 20 outputs, therefore, the user can utilize switch element 30, and whether the control test procedure is carried out.And switch element 30 can be integrated with power-supply unit 20 and be arranged at measurement jig 100 inside.
The setting of the decision circuitry in the resistance judging unit 50 according to the difference of each tie point 10 ground connection resistance, and needs design respectively.Therefore under general situation, the quantity of the resistance judging unit 50 on the measurement jig 100, identical with the quantity of the tie point 10 of desire test, and can test all tie points 10 simultaneously.
See also Fig. 2, resistance judging unit 50 is made up of first resistance 51, capacitor 52, second resistance 53, the 3rd resistance 54, amplifier 55 and the 4th resistance 56.Wherein first resistance 51 connects the negative input end and the capacitor 52 of switch element 30, measurement pin 40, amplifier 55, capacitor 52 connects first resistance 51, measures the negative input end and an earth terminal of pin 40, amplifier 55, and second resistance 53 connects the positive input terminal and the 3rd resistance 54 of switch element 30, amplifier 55; The 3rd resistance 54 connects the positive input terminal and the earth terminal of second resistance 53, amplifier 55, amplifier 55 connects capacitor 52, measurement pin 40, first resistance 51, second resistance 53, the 3rd resistance 54 and the 4th resistance 56, the four resistance 56 and connects amplifier 55 output terminals and cresset display modules 60.
And, the setting of resistance judging unit 50, must reach following condition, when measuring ground connection resistance that pin 40 produces between default value, be sent to amplifier 55 negative input ends and the magnitude of voltage that is sent to positive input terminal, via the output voltage behind amplifier 55 and the 4th resistance 56, need to drive cresset display module 60 and show; When ground connection resistance during not between default value, then output voltage can not drive cresset display module 60 and shows.
About the set-up mode of first resistance 51, capacitor 52, second resistance 53, the 3rd resistance 54, be by with default value again via suitable calculating, to dispose the optimum value of above-mentioned each element.Therefore when the said elements configuration is finished, output voltage will only can produce corresponding variation according to the ground connection resistance of tie point 10.
(C) cresset display module 60 connects resistance judging units 50, and according to the output voltage of resistance judging unit 50, switches corresponding show state.
As described in above-listed, when tie point 10 there is no the situation of cold welding or empty weldering, cresset display module 60 can corresponding show state; Cresset display module 60 is understood accordingly not show state when tie point 10 is cold welding or empty weldering, wherein, so-called show state, generally all so that cresset display module 60 is luminous and produce green cresset, and show state not, generally all so that cresset display module 60 is luminous or produce red cresset and represent, so user's state that can directly see through cresset display module 60 is judged the welding quality of gang socket 200.
Therefore on the practice, gang socket 200 has a plurality of tie points 10, if all tie points 10 of detection one by one still need spend many times, so the present invention more proposes, and can detect the measurement jig 100 of a plurality of tie points 10 simultaneously.
See also shown in Figure 3ly, it is by using the disclosed functional modules of many group first embodiment simultaneously, in order to confirm whether a plurality of tie points 10 have the situation of cold welding or empty weldering to produce in the gang socket 200.
See also shown in Figure 4ly, below will illustrate that measurement jig 100 is used in the state on the motherboard by Fig. 3, Fig. 4.
After gang socket 200 utilizes welding manner and motherboard coupling, the user sees through a plurality of measurement pins 40 in the measurement jig 100 (first measures pin 401 to n measures pin 40n) in the gang socket 200 after a plurality of tie points 10 (first tie point 101 is to n tie point 10n) electrical couplings, the test voltage of utilizing switch element 30 that power-supply unit 20 is provided is sent to a plurality of resistance judging units 50 (the first resistance judging unit 501 is to n resistance judging unit 50n), promptly can confirm the ground connection resistance of a plurality of tie points 10 respectively, whether between default value, and generation respective output voltages, and a plurality of cresset display modules 60 (the first cresset display module 601 is to n cresset display module 60n) can divide other to switch show state according to respective output voltages; Switch to the state of demonstration when a plurality of cresset display modules 60, represent its corresponding a plurality of tie points 10 to there is no the state of cold welding or empty weldering, opposite, when a plurality of cresset display modules 60 switch to the state that does not show, promptly represent the state that may not have cold welding or empty weldering.
Claims (19)
1. the measurement jig of an electronic component gang socket, in order to confirm the welding situation of the tie point between gang socket and motherboard, this measurement jig comprises:
One measures pin, with this tie point electrical couplings;
One resistance judging unit, be electrically connected at this measurement pin, a test voltage that provides according to a power-supply unit and a ground connection resistance of this tie point see through its inner resistance decision circuitry and judge whether this ground connection resistance is identical with a default value, and produce a corresponding output voltage; And
One cresset display module is electrically connected at this resistance judging unit, according to this output voltage, this cresset display module is switched to show state corresponding to this output voltage.
2. the measurement jig of electronic component gang socket according to claim 1 is characterized in that: this measurement jig more comprises this power-supply unit in order to produce this test voltage.
3. the measurement jig of electronic component gang socket according to claim 1 is characterized in that: this power-supply unit is selected from the combination that is made of power supply unit, alternating current converter, UPS, circumscribed battery and button cell one of them.
4. the measurement jig of electronic component gang socket according to claim 1 is characterized in that: this measurement jig more comprises a switch element, whether exports this resistance judging unit in order to control this test voltage.
5. the measurement jig of electronic component gang socket according to claim 1 is characterized in that: this resistance judging unit includes a capacitor, one first resistance, one second resistance, one the 3rd resistance, one the 4th resistance and an amplifier.
6. the measurement jig of electronic component gang socket according to claim 5 is characterized in that: this first resistance connects negative input end and this capacitor of this switch element, this measurement pin, this amplifier; This capacitor connects the negative input end and an earth terminal of this first resistance, this measurement pin, this amplifier; This second resistance connects the positive input terminal and the 3rd resistance of this switch element, this amplifier; The 3rd resistance connects positive input terminal and this earth terminal of this second resistance, this amplifier; This amplifier connects this first resistance, this capacitor, this measurement pin, this second resistance, the 3rd resistance and the 4th resistance; The 4th resistance connects this amplifier out and this cresset display module.
7. the measurement jig of electronic component gang socket according to claim 1 is characterized in that: this default value is the ground connection resistance of the same tie point in the normal motherboard.
8. the measurement jig of electronic component gang socket according to claim 1 is characterized in that: when this ground connection resistance of this tie point was identical with this default value, this cresset display module was switching to show state.
9. the measurement jig of electronic component gang socket according to claim 1 is characterized in that: when this ground connection resistance of this tie point and this default value were inequality, this cresset display module was switching to not show state.
10. the test module of an electronic component gang socket, in order to confirm the welding situation of the some tie points between gang socket and motherboard, this test module comprises:
One machine plate has one first relative side and one second side;
Some measurement pins are arranged at this first side of this machine plate, with this tie point electrical couplings;
Some resistance judging units, be arranged at this second side of this machine plate, measuring pin with this electrically connects, in order to receive a test voltage that a power-supply unit provides and some ground connection resistances of this tie point, and see through some resistance decision circuitry of its inside, whether an its corresponding default value is identical to judge respectively this ground connection resistance, to produce a corresponding output voltage; And
Some cresset display modules are arranged at this second side of this machine plate, electrically connect with this resistance judging unit, according to this output voltage respectively respectively this cresset display module switch to corresponding to the show state of this output voltage respectively.
11. the test module of electronic component gang socket according to claim 10 is characterized in that: this second side of this machine plate more comprises this power-supply unit, in order to produce this test voltage.
12. the test module of electronic component gang socket according to claim 10 is characterized in that: this power-supply unit be selected from the combination that constituted by power supply unit, alternating current converter, UPS, circumscribed battery and button cell one of them.
13. the test module of electronic component gang socket according to claim 10 is characterized in that: this second side of this machine plate more comprises a switch element, whether exports this resistance judging unit in order to control this test voltage.
14. the test module of electronic component gang socket according to claim 10 is characterized in that: this resistance judging unit includes some capacitors, some first resistance, some second resistance, some the 3rd resistance, some the 4th resistance and some amplifiers.
15. the test module of electronic component gang socket according to claim 14 is characterized in that: this first resistance connects negative input end and this capacitor of this switch element, this measurement pin, this amplifier; This capacitor connects the negative input end and an earth terminal of this first resistance, this measurement pin, this amplifier; This second resistance connects the positive input terminal and the 3rd resistance of this switch element, this amplifier; The 3rd resistance connects positive input terminal and this earth terminal of this second resistance, this amplifier; This amplifier connects this first resistance, this capacitor, this measurement pin, this second resistance, the 3rd resistance and the 4th resistance; The 4th resistance connects this amplifier out and this cresset display module.
16. the test module of electronic component gang socket according to claim 10 is characterized in that: this default value is the ground connection resistance of same tie point in the normal motherboard.
17. the test module of electronic component gang socket according to claim 10, it is characterized in that: when its corresponding this default value of this ground connection resistance of this resistance judging unit respectively is identical, respectively this cresset display module with this resistance judging unit respectively is electrically connected is switching to show state.
18. the test module of electronic component gang socket according to claim 10, it is characterized in that: when its corresponding this default value of this ground connection resistance of this resistance judging unit respectively is inequality, respectively this cresset display module with this resistance judging unit respectively is electrically connected is switching to not show state.
19. the test module of electronic component gang socket according to claim 10 is characterized in that: this measurement pin pin specification according to this gang socket is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100334997A CN100362445C (en) | 2005-03-14 | 2005-03-14 | Test set of electronic component connection socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100334997A CN100362445C (en) | 2005-03-14 | 2005-03-14 | Test set of electronic component connection socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1834844A CN1834844A (en) | 2006-09-20 |
| CN100362445C true CN100362445C (en) | 2008-01-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100334997A Expired - Fee Related CN100362445C (en) | 2005-03-14 | 2005-03-14 | Test set of electronic component connection socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100362445C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100582680C (en) * | 2006-12-05 | 2010-01-20 | 鸿富锦精密工业（深圳）有限公司 | Detecting instrument |
| US8648606B2 (en) * | 2010-06-03 | 2014-02-11 | Lear Corporation | Ground monitor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11207485A (en) * | 1998-01-23 | 1999-08-03 | Tokyo Gas Co Ltd | Air tight testing device for welding plug |
| JPH11295373A (en) * | 1998-04-10 | 1999-10-29 | Sumitomo Wiring Syst Ltd | Cable inspecting apparatus |
| EP1217077A2 (en) * | 2000-12-22 | 2002-06-26 | Pfizer Products Inc. | Novel bioluminescent assays and bacterial strains useful therein |
| CN1501064A (en) * | 2002-11-15 | 2004-06-02 | ������˹���ϲ��Լ����������ι�˾ | Accelerated weathering apparatus having sealed weathering chamber |
-
2005
- 2005-03-14 CN CNB2005100334997A patent/CN100362445C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11207485A (en) * | 1998-01-23 | 1999-08-03 | Tokyo Gas Co Ltd | Air tight testing device for welding plug |
| JPH11295373A (en) * | 1998-04-10 | 1999-10-29 | Sumitomo Wiring Syst Ltd | Cable inspecting apparatus |
| EP1217077A2 (en) * | 2000-12-22 | 2002-06-26 | Pfizer Products Inc. | Novel bioluminescent assays and bacterial strains useful therein |
| CN1501064A (en) * | 2002-11-15 | 2004-06-02 | ������˹���ϲ��Լ����������ι�˾ | Accelerated weathering apparatus having sealed weathering chamber |
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| Publication number | Publication date |
|---|---|
| CN1834844A (en) | 2006-09-20 |
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Granted publication date: 20080116 Termination date: 20130314 |