CN100361784C - 加热抛光垫的设备 - Google Patents

加热抛光垫的设备 Download PDF

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Publication number
CN100361784C
CN100361784C CNB038123959A CN03812395A CN100361784C CN 100361784 C CN100361784 C CN 100361784C CN B038123959 A CNB038123959 A CN B038123959A CN 03812395 A CN03812395 A CN 03812395A CN 100361784 C CN100361784 C CN 100361784C
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CN
China
Prior art keywords
polishing pad
temperature
fluid
platform
manifold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038123959A
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English (en)
Chinese (zh)
Other versions
CN1665642A (zh
Inventor
X·范
T·阮
周仁
D·魏
蒋彤
K·Y·拉马努亚姆
J·P·西蒙
T·罗
S·斯里瓦特桑
A·J·金
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Lam Research Corp
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Lam Research Corp
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Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN1665642A publication Critical patent/CN1665642A/zh
Application granted granted Critical
Publication of CN100361784C publication Critical patent/CN100361784C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/10—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a rigid member, e.g. pressure bar, table, pressing or supporting the belt over substantially its whole span
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CNB038123959A 2002-03-29 2003-03-28 加热抛光垫的设备 Expired - Fee Related CN100361784C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/112,628 2002-03-29
US10/112,628 US6896586B2 (en) 2002-03-29 2002-03-29 Method and apparatus for heating polishing pad

Publications (2)

Publication Number Publication Date
CN1665642A CN1665642A (zh) 2005-09-07
CN100361784C true CN100361784C (zh) 2008-01-16

Family

ID=28453390

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038123959A Expired - Fee Related CN100361784C (zh) 2002-03-29 2003-03-28 加热抛光垫的设备

Country Status (7)

Country Link
US (1) US6896586B2 (enExample)
EP (1) EP1497076A4 (enExample)
JP (1) JP2005526383A (enExample)
CN (1) CN100361784C (enExample)
AU (1) AU2003220560A1 (enExample)
TW (1) TWI258399B (enExample)
WO (1) WO2003082521A1 (enExample)

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WO2007045267A1 (en) * 2005-10-19 2007-04-26 Freescale Semiconductor, Inc. A system and method for cleaning a conditioning device
US7883393B2 (en) * 2005-11-08 2011-02-08 Freescale Semiconductor, Inc. System and method for removing particles from a polishing pad
JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
US20070227901A1 (en) * 2006-03-30 2007-10-04 Applied Materials, Inc. Temperature control for ECMP process
JP4902433B2 (ja) * 2007-06-13 2012-03-21 株式会社荏原製作所 研磨装置の研磨面加熱、冷却装置
DE102007041209B4 (de) * 2007-08-31 2017-11-23 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Polierkopf, der Zonenkontrolle verwendet
US20090287340A1 (en) * 2008-05-15 2009-11-19 Confluense Llc In-line effluent analysis method and apparatus for CMP process control
US8075703B2 (en) 2008-12-10 2011-12-13 Lam Research Corporation Immersive oxidation and etching process for cleaning silicon electrodes
JP5547472B2 (ja) * 2009-12-28 2014-07-16 株式会社荏原製作所 基板研磨装置、基板研磨方法、及び基板研磨装置の研磨パッド面温調装置
CN102528651B (zh) * 2010-12-21 2014-10-22 中国科学院微电子研究所 化学机械抛光设备及其预热方法
JP2012148376A (ja) * 2011-01-20 2012-08-09 Ebara Corp 研磨方法及び研磨装置
JP5628067B2 (ja) * 2011-02-25 2014-11-19 株式会社荏原製作所 研磨パッドの温度調整機構を備えた研磨装置
CN102794698B (zh) * 2012-08-16 2015-10-21 中国科学院西安光学精密机械研究所 辐射温度场加速腐蚀的研抛装置
CN102785145B (zh) * 2012-08-16 2015-07-29 中国科学院西安光学精密机械研究所 基于控制腐蚀的气囊式研抛装置
US9550270B2 (en) * 2013-07-31 2017-01-24 Taiwan Semiconductor Manufacturing Company Limited Temperature modification for chemical mechanical polishing
JP6161999B2 (ja) * 2013-08-27 2017-07-12 株式会社荏原製作所 研磨方法および研磨装置
CN103612182A (zh) * 2013-11-27 2014-03-05 苏州道众机械制造有限公司 平面带式磨床
US10454752B2 (en) 2015-11-02 2019-10-22 Servicenow, Inc. System and method for processing alerts indicative of conditions of a computing infrastructure
JP6923342B2 (ja) * 2017-04-11 2021-08-18 株式会社荏原製作所 研磨装置、及び、研磨方法
KR102331074B1 (ko) * 2017-04-11 2021-11-25 주식회사 케이씨텍 기판 처리 장치
DE202017105160U1 (de) * 2017-05-18 2018-08-22 Steinemann Technology Ag Bandschleifvorrichtung zum Überwachen eines Schleifbandes
TWI825043B (zh) * 2017-11-14 2023-12-11 美商應用材料股份有限公司 用於化學機械研磨的溫度控制的方法與系統
CN108296341A (zh) * 2018-04-13 2018-07-20 宁波得晴电器科技有限公司 一种缓冲件成型工艺
KR20250004341A (ko) 2018-06-27 2025-01-07 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마의 온도 제어
TWI885783B (zh) 2019-02-20 2025-06-01 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
TWI872101B (zh) 2019-08-13 2025-02-11 美商應用材料股份有限公司 Cmp溫度控制的裝置及方法
CN115066316B (zh) * 2020-06-29 2024-09-27 应用材料公司 控制化学机械抛光的蒸汽产生
KR20250004369A (ko) * 2020-06-30 2025-01-07 어플라이드 머티어리얼스, 인코포레이티드 Cmp 온도 제어를 위한 장치 및 방법
CN112677019B (zh) * 2020-12-23 2022-08-23 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 压力检测装置及抛光设备
CN115673953B (zh) * 2022-06-20 2023-10-03 南通鑫耐隔热材料有限公司 一种纤维板加工用抛光打磨装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5873769A (en) * 1997-05-30 1999-02-23 Industrial Technology Research Institute Temperature compensated chemical mechanical polishing to achieve uniform removal rates
CN1230014A (zh) * 1998-03-06 1999-09-29 西门子公司 半导体晶片的化学机械平面化的改进的方法和装置
US6000997A (en) * 1998-07-10 1999-12-14 Aplex, Inc. Temperature regulation in a CMP process
CN1274949A (zh) * 1999-05-19 2000-11-29 因芬尼昂技术北美公司 在半导体晶片化学机械抛光时输送抛光液的系统
US6224461B1 (en) * 1999-03-29 2001-05-01 Lam Research Corporation Method and apparatus for stabilizing the process temperature during chemical mechanical polishing
US6352470B2 (en) * 1999-08-31 2002-03-05 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3128880C2 (de) * 1981-07-22 1987-03-19 Fa. Peter Wolters, 2370 Rendsburg Maschine zum Läppen oder Polieren
US5957750A (en) * 1997-12-18 1999-09-28 Micron Technology, Inc. Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
JP3693483B2 (ja) * 1998-01-30 2005-09-07 株式会社荏原製作所 研磨装置
US6568991B2 (en) * 2001-08-28 2003-05-27 Speedfam-Ipec Corporation Method and apparatus for sensing a wafer in a carrier

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5873769A (en) * 1997-05-30 1999-02-23 Industrial Technology Research Institute Temperature compensated chemical mechanical polishing to achieve uniform removal rates
CN1230014A (zh) * 1998-03-06 1999-09-29 西门子公司 半导体晶片的化学机械平面化的改进的方法和装置
US6000997A (en) * 1998-07-10 1999-12-14 Aplex, Inc. Temperature regulation in a CMP process
US6224461B1 (en) * 1999-03-29 2001-05-01 Lam Research Corporation Method and apparatus for stabilizing the process temperature during chemical mechanical polishing
CN1274949A (zh) * 1999-05-19 2000-11-29 因芬尼昂技术北美公司 在半导体晶片化学机械抛光时输送抛光液的系统
US6352470B2 (en) * 1999-08-31 2002-03-05 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates

Also Published As

Publication number Publication date
AU2003220560A1 (en) 2003-10-13
TW200402351A (en) 2004-02-16
EP1497076A1 (en) 2005-01-19
US20030186623A1 (en) 2003-10-02
TWI258399B (en) 2006-07-21
WO2003082521A1 (en) 2003-10-09
CN1665642A (zh) 2005-09-07
EP1497076A4 (en) 2008-07-16
JP2005526383A (ja) 2005-09-02
US6896586B2 (en) 2005-05-24

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