AU2003220560A1 - Method and apparatus for heating polishing pad - Google Patents

Method and apparatus for heating polishing pad

Info

Publication number
AU2003220560A1
AU2003220560A1 AU2003220560A AU2003220560A AU2003220560A1 AU 2003220560 A1 AU2003220560 A1 AU 2003220560A1 AU 2003220560 A AU2003220560 A AU 2003220560A AU 2003220560 A AU2003220560 A AU 2003220560A AU 2003220560 A1 AU2003220560 A1 AU 2003220560A1
Authority
AU
Australia
Prior art keywords
polishing pad
heating polishing
heating
pad
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003220560A
Other languages
English (en)
Inventor
Linda Jiang
Anjun Jerry Jin
Tony Luong
Tuan Nguyen
Xuyen Pham
Katgenhalli Y. Ramanujam
Joseph P. Simon
Sridharan Srivatsan
David Wei
Ren Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2003220560A1 publication Critical patent/AU2003220560A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/10—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a rigid member, e.g. pressure bar, table, pressing or supporting the belt over substantially its whole span
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2003220560A 2002-03-29 2003-03-28 Method and apparatus for heating polishing pad Abandoned AU2003220560A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/112,628 2002-03-29
US10/112,628 US6896586B2 (en) 2002-03-29 2002-03-29 Method and apparatus for heating polishing pad
PCT/US2003/009465 WO2003082521A1 (en) 2002-03-29 2003-03-28 Method and apparatus for heating polishing pad

Publications (1)

Publication Number Publication Date
AU2003220560A1 true AU2003220560A1 (en) 2003-10-13

Family

ID=28453390

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003220560A Abandoned AU2003220560A1 (en) 2002-03-29 2003-03-28 Method and apparatus for heating polishing pad

Country Status (7)

Country Link
US (1) US6896586B2 (enExample)
EP (1) EP1497076A4 (enExample)
JP (1) JP2005526383A (enExample)
CN (1) CN100361784C (enExample)
AU (1) AU2003220560A1 (enExample)
TW (1) TWI258399B (enExample)
WO (1) WO2003082521A1 (enExample)

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WO2007045267A1 (en) * 2005-10-19 2007-04-26 Freescale Semiconductor, Inc. A system and method for cleaning a conditioning device
US7883393B2 (en) * 2005-11-08 2011-02-08 Freescale Semiconductor, Inc. System and method for removing particles from a polishing pad
JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
US20070227901A1 (en) * 2006-03-30 2007-10-04 Applied Materials, Inc. Temperature control for ECMP process
JP4902433B2 (ja) * 2007-06-13 2012-03-21 株式会社荏原製作所 研磨装置の研磨面加熱、冷却装置
DE102007041209B4 (de) * 2007-08-31 2017-11-23 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Polierkopf, der Zonenkontrolle verwendet
US20090287340A1 (en) * 2008-05-15 2009-11-19 Confluense Llc In-line effluent analysis method and apparatus for CMP process control
US8550880B2 (en) * 2008-12-10 2013-10-08 Lam Research Corporation Platen and adapter assemblies for facilitating silicon electrode polishing
JP5547472B2 (ja) * 2009-12-28 2014-07-16 株式会社荏原製作所 基板研磨装置、基板研磨方法、及び基板研磨装置の研磨パッド面温調装置
CN102528651B (zh) * 2010-12-21 2014-10-22 中国科学院微电子研究所 化学机械抛光设备及其预热方法
JP2012148376A (ja) * 2011-01-20 2012-08-09 Ebara Corp 研磨方法及び研磨装置
JP5628067B2 (ja) * 2011-02-25 2014-11-19 株式会社荏原製作所 研磨パッドの温度調整機構を備えた研磨装置
CN102785145B (zh) * 2012-08-16 2015-07-29 中国科学院西安光学精密机械研究所 基于控制腐蚀的气囊式研抛装置
CN102794698B (zh) * 2012-08-16 2015-10-21 中国科学院西安光学精密机械研究所 辐射温度场加速腐蚀的研抛装置
US9550270B2 (en) * 2013-07-31 2017-01-24 Taiwan Semiconductor Manufacturing Company Limited Temperature modification for chemical mechanical polishing
JP6161999B2 (ja) * 2013-08-27 2017-07-12 株式会社荏原製作所 研磨方法および研磨装置
CN103612182A (zh) * 2013-11-27 2014-03-05 苏州道众机械制造有限公司 平面带式磨床
US10454752B2 (en) 2015-11-02 2019-10-22 Servicenow, Inc. System and method for processing alerts indicative of conditions of a computing infrastructure
JP6923342B2 (ja) * 2017-04-11 2021-08-18 株式会社荏原製作所 研磨装置、及び、研磨方法
KR102331074B1 (ko) * 2017-04-11 2021-11-25 주식회사 케이씨텍 기판 처리 장치
DE202017105160U1 (de) * 2017-05-18 2018-08-22 Steinemann Technology Ag Bandschleifvorrichtung zum Überwachen eines Schleifbandes
TWI825043B (zh) * 2017-11-14 2023-12-11 美商應用材料股份有限公司 用於化學機械研磨的溫度控制的方法與系統
CN108296341A (zh) * 2018-04-13 2018-07-20 宁波得晴电器科技有限公司 一种缓冲件成型工艺
WO2020005749A1 (en) 2018-06-27 2020-01-02 Applied Materials, Inc. Temperature control of chemical mechanical polishing
TWI885783B (zh) 2019-02-20 2025-06-01 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
TW202522580A (zh) 2019-08-13 2025-06-01 美商應用材料股份有限公司 化學機械研磨系統
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
JP7618681B2 (ja) * 2020-06-29 2025-01-21 アプライド マテリアルズ インコーポレイテッド 化学機械研磨のための蒸気発生の制御
KR102740210B1 (ko) * 2020-06-30 2024-12-10 어플라이드 머티어리얼스, 인코포레이티드 Cmp 온도 제어를 위한 장치 및 방법
CN112677019B (zh) * 2020-12-23 2022-08-23 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 压力检测装置及抛光设备
CN115673953B (zh) * 2022-06-20 2023-10-03 南通鑫耐隔热材料有限公司 一种纤维板加工用抛光打磨装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3128880C2 (de) * 1981-07-22 1987-03-19 Fa. Peter Wolters, 2370 Rendsburg Maschine zum Läppen oder Polieren
US5873769A (en) * 1997-05-30 1999-02-23 Industrial Technology Research Institute Temperature compensated chemical mechanical polishing to achieve uniform removal rates
US5957750A (en) * 1997-12-18 1999-09-28 Micron Technology, Inc. Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
JP3693483B2 (ja) * 1998-01-30 2005-09-07 株式会社荏原製作所 研磨装置
US6020262A (en) * 1998-03-06 2000-02-01 Siemens Aktiengesellschaft Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer
US6000997A (en) * 1998-07-10 1999-12-14 Aplex, Inc. Temperature regulation in a CMP process
US6224461B1 (en) * 1999-03-29 2001-05-01 Lam Research Corporation Method and apparatus for stabilizing the process temperature during chemical mechanical polishing
US6225224B1 (en) * 1999-05-19 2001-05-01 Infineon Technologies Norht America Corp. System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
US6244944B1 (en) * 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6568991B2 (en) * 2001-08-28 2003-05-27 Speedfam-Ipec Corporation Method and apparatus for sensing a wafer in a carrier

Also Published As

Publication number Publication date
EP1497076A1 (en) 2005-01-19
US6896586B2 (en) 2005-05-24
WO2003082521A1 (en) 2003-10-09
TW200402351A (en) 2004-02-16
CN100361784C (zh) 2008-01-16
JP2005526383A (ja) 2005-09-02
TWI258399B (en) 2006-07-21
EP1497076A4 (en) 2008-07-16
CN1665642A (zh) 2005-09-07
US20030186623A1 (en) 2003-10-02

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase