CN100361208C - Optical reading device - Google Patents
Optical reading device Download PDFInfo
- Publication number
- CN100361208C CN100361208C CNB2004800204287A CN200480020428A CN100361208C CN 100361208 C CN100361208 C CN 100361208C CN B2004800204287 A CNB2004800204287 A CN B2004800204287A CN 200480020428 A CN200480020428 A CN 200480020428A CN 100361208 C CN100361208 C CN 100361208C
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- Prior art keywords
- outer cover
- laser instrument
- bonding agent
- temperature
- temperature conductivity
- Prior art date
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
- G11B7/127—Lasers; Multiple laser arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optical Head (AREA)
- Semiconductor Lasers (AREA)
Abstract
In an optical reading device (1), a laser (3), a laser mounting stem (5), a cover (7), and an adhesive (9) for bonding the stem (5) and the cover (7) form a continuous structure, and these members (3), (5), (7), (9) are formed of a material having a thermal conductivity of 0.5W/mK or more. The heat of the laser (3) can be efficiently released to the outside of the housing (7) through the continuous structures (5), (7), and (9). The temperature rise of the laser of the optical reading device is less, and the reliability and the service life of the reading device can be improved.
Description
Technical field
The present invention relates to for example optical readers such as reading/writing station, the optical take-up apparatus of light media such as CD-ROM, CD-R, CD-RW, CD-RAM, DVD-ROM, DVD-R, DVD-RW, DVD-RAM, Blue-Ray disk.
Background technology
In optical medium reading/writing station, when bonding outer cover (housing) and base (stem), use bonding agent usually, but also do not inquire into the temperature conductivity of employed bonding agent up to now.Therefore,, heat release can't be successfully carried out, thereby the harmful effect that produces by heating can be caused from being cut off as the laser instrument of pyrotoxin heat release route to outer cover, chassis (chassis) etc.Especially often use as the temperature conductivity of the bonding portion of the outer cover of polyarylene sulfide (polyarylene sulfide) resin combination of thermoplastic resin and base and outer cover lowlyer, thereby become the structure that shows thermal resistance.
Along with popularizing and the high speed of reading device of once-type, the output power of semiconductor laser also uprises gradually, so the heating of self heat release of semiconductor laser and peripheral electronic component has also reached the degree of can not ignore to the harmful effect of laser instrument vibration.Because the heat that is accumulated in device inside can cause the decline of reading reliability, the shortening of laser life-span, the deterioration of laser instrument vibration performance itself, become more and more important so be used to suppress the heating design of semiconductor heating.
Open in the 2003-43428 communique the spy, the hot optical effect light parts that form on the package casing by being fixed on below substrate are disclosed, it is characterized in that with thermal conductivity bonding agent adhere this substrate and this package casing, wherein mentioning required temperature conductivity is, bonding agent is more than the 1W/mK, and package casing is more than the 10W/mK.In addition, the structure as the hot optical effect light parts of target product is different from optical take-up apparatus.
Open in the 2002-296568 communique the spy, reflection type liquid crystal display element is disclosed, it is by the reflective liquid crystal display unit, with the plate composition that cools off and fix this reflective liquid crystal display unit, described reflective liquid crystal display unit is by silicon wafer substrate, transparency carrier and the liquid crystal layer that is sealed between these two substrates are formed, it is characterized in that this is used to cool off and fixing plate and the gap between this reflective liquid crystal display unit is 50 μ m-500 μ m, and the silicone gel agent and the thick bonding agent of 50 μ m-500 μ m that are had the temperature conductivity more than 0.5 W/mK respectively give set.But the structure of reflection type liquid crystal display element is different from optical take-up apparatus.
Open in the 2003-50326 communique the spy, the optical waveguide element is disclosed, it is characterized in that having the temperature controlling unit of the optical waveguide chip that on substrate, is formed with the temperature variant optical waveguide circuit of light transmission characteristic and this optical waveguide chip, and by making this temperature controlling unit and above-mentioned optical waveguide chip laminate, the bonding agent of regulating the composition surface of parts with composition surface that is arranged on above-mentioned optical waveguide chip and said temperature directly carries out above-mentioned optical waveguide chip and said temperature adjusting parts bonding.The temperature conductivity of use therein bonding agent is recited as more than the 0.4W/mK, but the structure of optical waveguide element is different from optical take-up apparatus.
Open in the 2003-39731 communique the spy, the light write head is disclosed, wherein on the optical axis of the light that the light-emitting component of light-emitting device array chip is launched, has lens arra, in the substrate of the substrate that above-mentioned light-emitting device array chip is installed, has heating radiator in addition, it is characterized in that in above-mentioned heating radiator, on the installed surface of aforesaid substrate, be provided with the rib of many convexs at the length direction of heating radiator, and on the rib of above-mentioned heating radiator, be fixed with aforesaid substrate with fixed mechanism.But the structure of this light write head is different from optical take-up apparatus.
Open in the flat 10-293940 communique the spy, optical take-up apparatus is disclosed with keeping container, it is characterized in that by temperature conductivity being that resin combination more than the 1W/mK forms, but keep the joint between the container not disclose any content for actual heater and heating radiator when setting up light picker.
Except above-mentioned, in the semi-conductive heat releases such as transistor that utilize heating radiator, use heat conduction railway grease usually, but this only limits to the heating radiator that is made of the high metal of temperature conductivity.
Summary of the invention
In view of above-mentioned present situation, the object of the present invention is to provide not have thermal resistance optical reader part, that reliability is high that can rise to the temperature of laser instrument and bring influence.
The inventor etc. study to achieve these goals and repeatedly, found that by in optical reader, to the continuous members of outer cover, using material with the above temperature conductivity of 0.5W/mK from laser instrument as pyrotoxin, the temperature that can suppress optical reader rises, comprise the bonding agent that is used for going up the fixing metal base in the described material, thereby finished the present invention at outer cover (being also referred to as sliding bottom, base station or pick-up).
According to the present invention, optical reader can be provided, it is characterized in that all using material and form continuous structure with the above temperature conductivity of 0.5W/mK from laser instrument to outer cover.
Also have, comprise laser instrument and outer cover in the continuous structure.So-called " continuous " is meant that the heat of laser instrument can transmit by member, comprise physics contact, utilize the joint, integrally formed etc. of engagement members such as bonding agent, screw.
In this optical reader, the heat of laser instrument can be discharged by outer cover by continuous structure.
According to the present invention, the optical reader outer cover can be provided, it is formed by the polyarylene sulfide resin combination with the above temperature conductivity of 0.5W/mK, and described composition is that to be selected from fusing point be that metal, fusing point more than 400 ℃ is that more than one of metal below the polyarylene sulfide fusing point and graphite form by adding in polyarylene sulfide.
Description of drawings
Fig. 1 is the sectional view as the optical reader of one embodiment of the present invention.
Fig. 2 is the sectional view along A-A of Fig. 1.
Embodiment
Below, with reference to description of drawings the present invention.Fig. 1 is the sectional view as the optical reader of one embodiment of the present invention, and Fig. 2 is the sectional view of Fig. 1 along A-A.
In the optical reader 1 of Fig. 1, laser instrument 3 is by chimeric and remain on laser instrument and install with on the base 5.In addition, base 5 engages with outer cover 7 by thermal conductivity bonding agent 9 and is fixed.In addition, the flange of laser instrument 3 engages with outer cover 7 by common bonding agent 11.In this device 1, from laser instrument 3, base 5, to the outer cover 7 that connects by bonding agent 9, form continuous structure, the laser instrument 3, base 5, outer cover 7, the bonding agent 9 that constitute this structure are all formed by the material with the above temperature conductivity of 0.5W/mK.Therefore, the heat that is produced by laser instrument can be discharged into the outside of outer cover effectively.Also have, during temperature conductivity deficiency 0.5W/mK, the high efficiency heat release of hopeless formation.
In the past, owing to do not consider the temperature conductivity of the bonding agent 9 of 7 of bonding base 5 and outer covers fully, so by laser instrument 3 to base 5, by base 5 to outer cover 7, then smooth and easy inadequately to the conduction of the heat of outer cover 7 outsides, thereby caused the temperature rising of (base 5 inner and outer cover 7 inside) around the laser instrument 3.
Therefore, in the present embodiment, as the bonding agent 9 that engages 7 of base 5 and outer covers, use has above, more preferably above, the material of the further preferred above temperature conductivity of 3.0W/mK again of above, the further preferred 1.8W/mK of 1.0W/mK of above, the preferred 0.9W/mK of 0.5W/mK, can form thus through base 5 by the hot-fluid road of laser instrument 3 to outer cover 7, thereby prevent deterioration in characteristics because of thermogenetic laser instrument 3.
Open in the flat 10-293940 communique above-mentioned spy, in the semi-conductive heat releases of finishing with heating radiator such as transistor, usually use heat conduction railway grease etc., but the inventor is through attentively having discovered the required temperature conductivity that possesses of bonding agent as described below, this bonding agent not only can be used to be used as the bonding part of the high metal of the temperature conductivity in the past of heating radiator, but also can be used for the bonding part of resin etc.
Also have, though laser instrument 3 contacts by physics with base 5 and is connected in this embodiment, also can be with joints such as bonding agents, also can be integrally formed.When using bonding agent, can use bonding agent 9 bonding agents identical, high thermal conductivity with bonding base 5 and outer cover 7.
In addition, in this embodiment, the structure that connects is made up of laser instrument 3, base 5, outer cover 7, bonding agent 9, but also can be that engagement member such as bonding agent, screw more than the 0.5W/mK directly is connected with outer cover 7 with laser instrument 3 usefulness temperature conductivitys, constitute continuous structure by laser instrument 3, outer cover 7, engagement member.That is, in device 1, also can use the high material of temperature conductivity as bonding agent 11.In addition, also can make laser instrument 3, outer cover 7 integrally formed.
Below, each member is described.
The base that holds laser instrument is formed by metal usually, so have the above temperature conductivity of 0.5W/mK.In addition, the base that uses among the present invention is not limited to metal as long as be made of the material with the temperature conductivity more than the 0.5W/mK.
The bonding agent that uses among the present invention is so long as have just having no particular limits of the above temperature conductivity of 0.5W/mK.As the kind of operable bonding agent, can enumerate for example epoxy system, silicone-based, acrylic acid hydrocyanic ester system, urethane system, acrylic acid series etc.
In the bonding agent of mentioned kind, wanting to make temperature conductivity is more than the 0.5W/mK, for example, can add the crystallinity silica in these bonding agents; Carbon classes such as carbon fiber, carbon particle, graphite; Metal species such as ceramic-like such as aluminium oxide, magnesium oxide, Al, Cu, Ag are as packing material.The packing material that adds can be a kind of also can be multiple combination, its addition also just has no particular limits so long as do not hinder the scope of the joint performance of bonding agent.In addition, the method for improving the temperature conductivity of bonding agent is not limited to above, also can be any method.Can use known method in the past in the adding of packing material, the mixing.
In addition, also can use commercially available bonding agent with the above temperature conductivity of 0.5W/mK.As the commercially available bonding agent that can use in the present invention, for example can enumerating, SE4450, SE4401 (are eastern レ ダ ウ コ-ニ Application グ シ リ コ-Application society systems; (kind) silicone-based) etc.
The outer cover that uses among the present invention preferably by have more than the 0.5W/mK, more than the preferred 1.0W/mK, more preferably more than the 3.0W/mK, the material of the further preferred above temperature conductivity of 9.0W/mK constitutes, and the kind of material has no particular limits.In addition, also have no particular limits for the structure of outer cover, shape etc.By making the material that constitutes outer cover have above-mentioned temperature conductivity, can realize by the effective heat release of outer cover.
Though its temperature conductivity is higher when constituting outer cover with metal materials such as aluminium diecasting (die cast), zine pressure casting, magnesium die castings, but the outer cover majority of light picker constitutes with the resin combination of being made up of polyarylene sulfide etc., and the common not enough 0.5W/mK of the temperature conductivity of this resin combination can not be directly applied for the present invention.
If will make the temperature conductivity of the resin combination that constitutes outer cover is more than the 0.5W/mK, can join in the resin combination the inorganics of high-termal conductivity such as metal species, pottery, carbon class as packing material.
For example, can enumerate aluminium, copper, iron, stainless steel, zinc, magnesium, gold, silver, tin, lead etc. as metal species.In addition, also can use these alloy.In addition, can use tin-copper, tin-lead, tin-zinc, tin-copper-scolding tin such as Yin.
As the high inorganics of thermal conductivity such as pottery, can enumerate silicas such as aluminium oxide, magnesium oxide, silicon nitride, boron nitride, crystallinity silica, fusing silica etc.
As the carbon class, can enumerate carbon fiber, carbon particle, graphite etc.As graphite flakey, bulk, amorphous etc. are arranged, also can adopt any form, in addition, artificial or natural all can use.
Preferably in polyarylene sulfide, add and be selected from the metal of fusing point more than 400 ℃, fusing point metal and in the graphite more than one below the polyarylene sulfide fusing point.
The shape of above-mentioned additive has no particular limits, also can use unsetting, spherical, laminar, fibrous, needle-like, tree-shaped etc. any.Additive with complicated shape is because bigger with respect to the surface area and the apparent possessive volume of volume, thus be easy to have contact each other, and then be expected to easily make continuous structure.Wherein, the shape of subglobular can obtain the few effect of friction wear of device.
The packing material that is added can be a kind of also can be multiple combination, its addition also just has no particular limits so long as do not hinder resin combination formability etc.In addition, the method for improving the resin combination temperature conductivity is not subjected to above-mentioned restriction, can use any method.Can use known method in the adding of packing material, the mixing.
Constitute the viewpoint of the material of outer cover, be preferably thermoplastic resin from its formability and economy.As operable thermoplastic resin, can enumerate for example polyarylene sulfide resin, syndiotactic polytyrene (SPS), polycarbonate, polyphenylene oxide, polysulfones, polyetherimide etc., preferred polyarylene sulfide resin, preferred especially polyphenylene sulfide (PPS) resin.
The polyarylene sulfide resin can be used the usual way manufacturing, and can be by forming the polyarylene sulfide resin combination with the above temperature conductivity of 0.5W/mK to wherein adding above-mentioned packing material.
Addition to above-mentioned packing material has no particular limits, and can suitably select according to required temperature conductivity.In polyarylene sulfide, add, can use when mixing packing material in the past known method to carry out.
Also have, under the prerequisite of temperature conductivity, also can comprise the additive of tabular packing materials such as particle shape packing material, mica, porcelain earth, clay, talcum such as fibrous packing material such as glass fibre, carbon fiber, lime carbonate, silica, aluminium oxide, palpus crystal class (whisker) in the polyarylene sulfide resin combination with regulation.
In addition, open in the flat 10-293940 communique above-mentioned spy and to mention, can be the maintenance container (outer cover) of light picker as heat liberation board, heating radiator, but in actual the use, can not obtain desirable effect even only improve the temperature conductivity of outer cover, still need be combined to form and be continuous structure with above-mentioned bonding agent etc. with the above temperature conductivity of 0.5W/mK.
In addition, in above-mentioned spy opens prior art one hurdle in the 2003-39731 communique, mentioned and in structure, had the product that just can be used as the member of heat liberation board, heating radiator originally, but in the present invention, be will not to be used as the used member of heat liberation board or heating radiator (outer cover and bonding agent) originally as the material of realizing the heat release purpose, distinct in this.
With regard to optical reader of the present invention, so long as use laser instrument read data and laser instrument to be accommodated in the interior device of outer cover, just there is not other to limit, the optical take-up apparatus that uses in CD, DVD is for example arranged.
Embodiment
Below, more specifically describe the present invention according to embodiment, but the present invention is not subjected to any restriction of these embodiment.
Production Example 1
[manufacturing of outer cover material]
(1) polyphenylene sulfide (PPS) prepolymer is synthetic
To the synthetic groove (1m of the raw material that has paddle
3) middle N-N-methyl-2-2-pyrrolidone N-(NMP) 554kg and the lithium hydroxide (LiOH1H of adding
2O) 100kg is warming up to 140 ℃ with the temperature of synthesizing groove, and remains on 140 ℃, the moisture that contains in the feed hydrogen Lithia is criticized distillation remove.Behind this EO, in temperature being remained 130 ℃ state downhill reaction liquid, be blown into gasiform sulfuretted hydrogen 65Nkl.Synthesize hydrogen lithium sulfide (LiSH) by this operation according to following formula (1).
LiOH+H
2S→LiSH+H
2O……(I)
Then, stop to be blown into sulfuretted hydrogen, synthetic groove is warming up to 205 ℃.Along with intensification, the moisture that generates as accessory substance when being blown into sulfuretted hydrogen is criticized distillation and is removed, the reaction of use following formula (II) to represent simultaneously, thus obtained lithium sulfide (Li
2S) potpourri of 49.62kg (1.08kmol) and N-methylamino butyric acid lithium (LMAB).
2LiSH→Li
2S+LMAB+H
2S↑……(II)
After the reaction end with above-mentioned formula (II) expression, in synthetic groove, drop into p-dichloro-benzenes (PDCB) 154kg (1.05kmol), drop into pure water 29.2kg again,, reactant liquor is cooled to 90 ℃ afterwards at 210 ℃ of precondensates of implementing 3 hours down.And then, to wherein adding PCDB15kg (0.102kmol) and NMP80kg, be modulated to prepolymer.
(2) PPS's is synthetic
Use is under the condition of 15.0kg/hr by the prepolymer of above-mentioned (1) modulation in feeding quantity, in one-level continuous stirring tank reactor (CSTR), is that 3 hours, temperature are to carry out polyreaction, synthetic PPS under 260 ℃ the condition at mean residence time (τ).The reactant liquor that to be discharged by reactor imports 260 ℃ leaving standstill in the groove, and separating reaction liquid and PPS are mutually.Lithium halide for flush away PPS contains in mutually injects cleansing solution (H from the reactive tank outlet mutually to PPS
2The O/NMP mixed liquor contains NH sometimes
4Neutralizing agents such as Cl).To re-injecting above-mentioned cleansing solution mutually from leaving standstill high molecular PPS that trench bottom extracts out, make it contact mixing once more with cleansing solution, in the standing separation groove, separate thus.The washing operation of this PPS of triplicate.The PPS of the washing that is through with is directed in the extruder that has the devolatilization function mutually, removes volatile solvent (mainly being NMP), carry out water-cooled then, carry out granulation (pelletizing) afterwards, thereby obtain the PPS product.The output of product is about 2kg/hr.
(3) manufacturing of PPS compound substance (PPS resin combination)
Combined fiberglass (GF) 10 weight portions and silica 60 weight portions in the PPS30 weight portion that is obtained by above-mentioned (2) are with two extruders acquisition PPS compound substance (a) that mixes.The temperature conductivity of the PPS compound substance (a) that obtains is 0.6W/mK.
In addition, mix following copper powders may, tin-zinc alloy, graphite etc. to measure arbitrarily in the PPS that is obtained by above-mentioned (2), mixing with two extruders obtains PPS compound substance (b)-(d).The temperature conductivity of the PPS compound substance (b)-(d) that obtains is respectively (b) 1.0W/mK, (c) 3.1W/mK and (d) 9.8W/mK.
(b) PPS 55 weight portions
Aluminium oxide 35 weight portions
Magnesium oxide 10 weight portions
(c) PPS 25 weight portions
Tin-zinc alloy 65 weight portions
GF 10 weight portions
(d) PPS 50 weight portions
Cu 15 weight portions
Tin-zinc alloy 15 weight portions
GF 15 weight portions
Also have, among the PPS that uses among the comparative example 1-3, PPS40 weight portion, lime carbonate 30 weight portions, GF30 weight portion.
Embodiment 1-8, comparative example 1-7
(1) uses the PPS compound substance that synthesizes by Production Example 1,, make the light picker outer cover by injection molding forming with different thermal conductivity.
Then, laser diode and brass tubulation seat are installed, are used the bonding agent with different thermal conductivity of following record that base is fixed on the outer cover, thus the optical take-up apparatus shown in the shop drawings 1.
The outer cover that uses in each embodiment and the comparative example and the combination of bonding agent are shown in Table 1.
Bonding agent and the temperature conductivity thereof used in the present embodiment are as follows.
(A) SE4450 (eastern レ ダ ウ コ-ニ Application グ シ リ コ-Application society system) 1.88W/mK
(B) SE4401 (eastern レ ダ ウ コ-ニ Application グ シ リ コ-Application society system) 0.92W/mK
(C) SE9175 (eastern レ ダ ウ コ-ニ Application グ シ リ コ-Application society system) 0.3W/mK
In addition, it is as follows to be used for the flange of bonding laser instrument and the bonding agent of outer cover (bonding agent 11 that is equivalent to Fig. 1) and temperature conductivity thereof.
SE9175 (eastern レ ダ ウ コ-ニ Application グ シ リ コ-Application society system) 0.3W/mK
(2) measuring method of temperature conductivity
The measuring method of the temperature conductivity of outer cover material (PPS compound substance) and bonding agent is as follows.
(i) sample
To use 50T injection molding machine (JSW's system) to be configured as the flat board of 80 * 80 * 3.2mm by the outer cover material that Production Example is made, supply in measurement.
On teflon (registered trademark) thin slice, place the dividing plate (spacer) of the picture frame form of making, inject above-mentioned 2 bonding agent, thereby make the flat board of 80 * 80 * 3.2mm, supply in measurement to dividing plate inside by aluminium sheet.
The (ii) measurement of temperature conductivity
According to ASTM E1530 (plectane heat flow meter method), use UNITHERM (trade mark) 2021 (ANTER society systems), the temperature conductivity under measuring 23 ℃.
(3) measurement of laser temperature rising value
Use is by the optical reader of above-mentioned manufacturing, under 60 ℃ atmosphere, make the optical output power of laser diode keep constant by the APC circuit, and make the laser diode vibration more than 60 minutes, when laser temperature reaches a steady state value with the temperature in the direct Laser Measurement diode of the thermopair outside, thereby obtain the temperature rising value of laser instrument (since 60 ℃).
Be used to measure the optical output power ratings Po=90mW (CW) of the laser diode of temperature rising value, critical value electric current=35mA, operating current=115mA (CW, Po=90mW), operating voltage is that (CW, Po=90mW), operation guarantees that temperature is-10～+ 70 ℃ to 1.85V.
The results are shown in the table 1.The temperature of laser diode surpasses bad (the N weight portion: comparative example) that is judged as of 70 ℃ (the temperature rising value is 10 ℃).
[table 1]
| Embodiment | Comparative example | ||||||||||||||
| 1 | ?2 | ?3 | ?4 | ?5 | ?6 | ?7 | ?8 | ?1 | ?2 | ?3 | ?4 | ?5 | ?6 | ?7 | |
| The temperature conductivity of outer cover material (W/mK) | 0.6 | ?1.0 | ?3.1 | ?9.8 | ?0.6 | ?1.0 | ?3.1 | ?9.8 | ?0.3 | ?0.3 | ?0.3 | ?0.6 | ?1.0 | ?3.1 | ?9.8 |
| The temperature conductivity 1.88W/mK of bonding agent (A) | ○ | ?○ | ?○ | ?○ | ?○ | ||||||||||
| The temperature conductivity 0.92W/mK of bonding agent (B) | ?○ | ?○ | ?○ | ?○ | ?○ | ||||||||||
| The temperature conductivity 0.3W/mK of bonding agent (C) | ?○ | ?○ | ?○ | ?○ | ?○ | ||||||||||
| The temperature rising value of laser instrument (℃) | 9.5 | ?7.2 | ?5.2 | ?3.9 | ?9.8 | ?8.5 | ?6.9 | ?6.6 | ?18 | ?19 | ?20 | ?20 | ?20 | ?19 | ?18 |
As can be known from the results of Table 1, in the temperature conductivity of outer cover material and bonding agent was combination more than the 0.5W/mK, the temperature rising value of laser instrument was below 10, guaranteed that in the operation of laser diode in the temperature range, laser characteristic does not descend.In contrast, if any in outer cover material or the bonding agent or both temperature conductivitys are below the 0.5W/mK, then the temperature rising value of laser instrument has reached 18-20 ℃, the temperature of laser diode well beyond as operation guarantee upper temperature limit+70 ℃, the reliability of reading obviously descends.
Industrial utilizability
Adopt when of the present invention, the temperature of the laser instrument of optical reader rises less, thus reliability, the life-span that can improve reading device.
Claims (3)
1. optical reader, it is characterized in that, use has the material of the above temperature conductivity of 0.5W/mK, laser instrument to outer cover is formed continuous structure, and described outer cover is formed by containing the polyarylene sulfide resin combination that is selected from more than one materials in metal species, high-termal conductivity inorganics, the carbon class.
2. optical reader as claimed in claim 1 is characterized in that, described continuous structure is installed with base, outer cover and bonding described laser instrument installation by laser instrument, laser instrument and formed with the bonding agent of base and described outer cover.
3. optical reader as claimed in claim 1 or 2, it is characterized in that, the described polyarylene sulfide resin combination that is selected from more than one materials in metal species, high-termal conductivity inorganics, the carbon class that contains is, contains to be selected from the metal of fusing point more than 400 ℃, fusing point metal below the polyarylene sulfide fusing point and more than one the polyarylene sulfide resin combination in the graphite.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003197515 | 2003-07-16 | ||
| JP197515/2003 | 2003-07-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1823375A CN1823375A (en) | 2006-08-23 |
| CN100361208C true CN100361208C (en) | 2008-01-09 |
Family
ID=34074341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800204287A Expired - Fee Related CN100361208C (en) | 2003-07-16 | 2004-06-28 | Optical reading device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2005008647A1 (en) |
| KR (1) | KR101121618B1 (en) |
| CN (1) | CN100361208C (en) |
| WO (1) | WO2005008647A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4538416B2 (en) * | 2006-02-03 | 2010-09-08 | 株式会社日立メディアエレクトロニクス | Optical pickup device, manufacturing method thereof, and optical drive device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05304341A (en) * | 1992-04-27 | 1993-11-16 | Sony Corp | Heat spreader for laser package |
| CN1252882A (en) * | 1997-04-18 | 2000-05-10 | 吴羽化学工业株式会社 | Optical pickup device holding container |
| CN1300055A (en) * | 1999-12-02 | 2001-06-20 | 株式会社三协精机制作所 | Optical pick-up device and mfg. method thereof |
| JP2002032923A (en) * | 2000-07-14 | 2002-01-31 | Nippon Kagaku Yakin Co Ltd | Optical pickup device for optical recording medium driving device |
| JP2002129015A (en) * | 2000-10-25 | 2002-05-09 | Dainippon Ink & Chem Inc | Polyarylene sulfide resin composition and optical pickup parts |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0739545B2 (en) * | 1986-03-19 | 1995-05-01 | 大日本インキ化学工業株式会社 | Polyarylensulfide resin composition |
| JPH03275109A (en) * | 1990-03-26 | 1991-12-05 | Dainippon Ink & Chem Inc | Filter base material |
-
2004
- 2004-06-28 CN CNB2004800204287A patent/CN100361208C/en not_active Expired - Fee Related
- 2004-06-28 WO PCT/JP2004/009104 patent/WO2005008647A1/en active Application Filing
- 2004-06-28 KR KR1020067000946A patent/KR101121618B1/en not_active IP Right Cessation
- 2004-06-28 JP JP2005511801A patent/JPWO2005008647A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05304341A (en) * | 1992-04-27 | 1993-11-16 | Sony Corp | Heat spreader for laser package |
| CN1252882A (en) * | 1997-04-18 | 2000-05-10 | 吴羽化学工业株式会社 | Optical pickup device holding container |
| CN1300055A (en) * | 1999-12-02 | 2001-06-20 | 株式会社三协精机制作所 | Optical pick-up device and mfg. method thereof |
| JP2002032923A (en) * | 2000-07-14 | 2002-01-31 | Nippon Kagaku Yakin Co Ltd | Optical pickup device for optical recording medium driving device |
| JP2002129015A (en) * | 2000-10-25 | 2002-05-09 | Dainippon Ink & Chem Inc | Polyarylene sulfide resin composition and optical pickup parts |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060111899A (en) | 2006-10-30 |
| CN1823375A (en) | 2006-08-23 |
| JPWO2005008647A1 (en) | 2007-04-19 |
| KR101121618B1 (en) | 2012-03-13 |
| WO2005008647A1 (en) | 2005-01-27 |
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