CN100350482C - Disk-like substrate sputtering device, substrate chucking method in the device, method of producing disk-like recording medium using the device - Google Patents
Disk-like substrate sputtering device, substrate chucking method in the device, method of producing disk-like recording medium using the device Download PDFInfo
- Publication number
- CN100350482C CN100350482C CNB038055317A CN03805531A CN100350482C CN 100350482 C CN100350482 C CN 100350482C CN B038055317 A CNB038055317 A CN B038055317A CN 03805531 A CN03805531 A CN 03805531A CN 100350482 C CN100350482 C CN 100350482C
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- China
- Prior art keywords
- substrate
- jut
- supporting portion
- depressed part
- cover
- Prior art date
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- Expired - Fee Related
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
Abstract
The invention relates to a substrate chucking method, etc., wherein in a sputtering device, a disk-like substrate having no center hole is stably closely contacted with a holder and thereby held. Specifically, a disk-like substrate having a substantially cylindrical projection in the center of the back surface is used, and in a sputtering device, this projection is inserted in a recess formed in a substrate support and having a cylindrical inner surface, and is fixed therein by a fixing means disposed in the recess, the back surface of the substrate being closely contacted with a flat surface and thereby supported, the flat surface being the substrate support formed around the recess.
Description
Technical field
The present invention relates to a kind of on disc wafer film forming sputter equipment, more specifically, relate to a kind of when using this device formation film the clip mechanism or the clip method of clip employed this disc wafer in this device.In addition, the invention still further relates to a kind of manufacture method of using the discoid recording medium of the discoid recording medium that this sputter equipment makes CD etc.
Background technology
Known various by on discoid substrate, forming the recording medium that various films are made, the medium that particularly has discoid shape, for example, the CD of DVD such as CD dish, DVD-ROM, DVD-R such as CD, CD-R, CD-RW dish etc. and the photomagneto disk of MO, MD etc. etc.These dishes are by to for example the lamination film is made by carrying out various processing such as sputter process, rotary coating processing on the made substrate of the starting material of polycarbonate etc.
As the raw-material substrate of described dish usually when it is supplied in the central the position be formed with through hole.The film that carries out afterwards forms in the operation, moves into or take out of the manipulations such as location of substrate in film formation device or the film formation device etc. by using this medium pore.But, owing to there is this medium pore, for example tend to when film forming, cause the thickness of the film on substrate or the distribution variation of quality.Therefore, cover this medium pore, carry out film forming under the little state thereby exist film formation process influence to try one's best at it by using lid to wait.
For example, when making the DVD dish, utilize rotary coating to handle the film of formation such as ultraviolet ray (UV) hardening resin one of is constituted layer as it and form.Particularly, at first, substrate is installed in makes its center consistent on the rotating panoramic table with the rotation center of this panoramic table.So, run through the turning axle of this medium pore by use, perhaps will be fixed into the operations such as medium pore place that are configured in this dish with the concentric lid of the rotation center of this panoramic table, the location of carrying out the relative panoramic table of substrate is with fixing.
Then, along with the rotation of this panoramic table, near described medium pore or the lid edge part resin that in the time of the side shifting of dish neighboring, drips continuously.The resin that is dripped is by forming resin film along with the centrifugal force that revolution the produced diffusion of panoramic table on substrate surface.
In this case, owing to except dripping resin, do not have other way in a position of leaving rotation center, so cause the distribution of film thickness therefrom.But the red laser light beam that is generally used in the prior art writing down and reading etc. makes this be distributed in the permissible range because wavelength is long.And from now in order to improve the recording density of CD, when using the short for example blue laser beams of wavelength, need to form the higher film of homogeneity.
In addition, use sputtering method and form as the metallic film of reflectance coating etc. etc.In the method, disc wafer is fixed and held in the vacuum tank relative with a target (target) by medium pore part and outer peripheral portion thereof by the anchor clamps covering.Usually, on this target, apply certain voltage, and between target and substrate, discharge and the generation plasma thus.The target configuration atomic/element of this target surface by the ion in this plasma by sputter, and by this sputtering particle attached to forming film on the substrate surface.
At this moment, when the anchor clamps that are used for fixing substrate contact with substrate surface, can when forming film, between this film and anchor clamps, produce paradoxical discharge.Here because discharge from the contact point between anchor clamps and this film surface by discharge holding poly-electric charge on film or the chucking surface.And, when anchor clamps when discharge space stretches out because its existence can make electric field distortion, exert an influence thereby can distribute to film thickness.Therefore, preferably between substrate surface and anchor clamps, keep a certain amount of slight gap usually, or preferably do not use these anchor clamps as much as possible.
The applicant proposes solution of the above problems, promptly as using the use that can improve the method for film thickness in the method for spin coating operation that the manufacturing process of the substrate in hole is not set at central part.When using this kind substrate, can reduce the anchor clamps that when sputter, are used for fixing substrate, and can easily between substrate surface and anchor clamps, keep a certain amount of interval, and can easily reduce paradoxical discharge.
Summary of the invention
In this sputtering method, in order to make that remaining between target and the substrate is stable and discharge uniformly, preferably the comparative electrode with ground potential is configured to be parallel to this target surface.Therefore with dispose relative of substrate holder of ground potential with target surface.And in order to make the electric field in the discharge space not be subjected to disturbance, and substrate back is close to mutually with the surface of substrate holder.
Make substrate temperature raise owing to the incident of ion etc. or the radiation heat of plasma in the time of in this sputtering method.Because the polycarbonate as baseplate material is thermo-labile, so need to suppress the rising of sputter time substrate temperature.Normally be close to the rising that suppresses substrate temperature by using through the substrate holder and the substrate back of water cooling etc.
But, when there is not medium pore in substrate center, depends merely in the substrate neighboring and fixedly be difficult to make substrate be close to substrate holder.Even the present invention is directed to this problem a kind of clip method that makes that the disc wafer that do not have medium pore can stably be close to respect to substrate holder is proposed.And propose the concrete sputter equipment of implementing this clip method, and the manufacture method of using the discoid recording medium of this sputter equipment.
To achieve these goals, the present invention proposes a kind of sputter equipment that is used for forming on substrate surface at vacuum tank film, wherein employed substrate is for having the disc wafer of jut in its back side central authorities, this jut has its diameter of formation along with become the big conical substantially cylindrical shape of part away from substrate.This sputter equipment comprises: the substrate supporting portion that is made of the tabular surface for the treatment of to be close to the back side of described substrate, with be formed on the depressed part that described substrate supporting portion central part is used to receive described jut, wherein, in described depressed part, dispose the fixed sturcture that is used to keep described jut with pushing, described fixed sturcture pushes the described part taper shape of described jut, so that exert pressure, thereby described jut is pressed in the described depressed part to described jut.
In this sputter equipment, preferably, described fixed sturcture comprises a bulb stopper.In addition, preferably, this sputter equipment also comprises and is used to support a cover support of cover that covers the outer peripheral portion of this substrate surface, and described cover support keeps described cover by magnetic force.
To achieve these goals, the present invention proposes a kind of clip method that is used for forming on substrate surface at vacuum tank clip substrate in the sputter equipment of film, wherein, employed substrate is for having the disc wafer of jut in its back side central authorities, this jut has its diameter of formation along with become the big conical substantially cylindrical shape of part away from substrate.This method may further comprise the steps: described jut is inserted the step in the depressed part with cylindric inside surface; By being configured in the conical step of described part that being used in the described depressed part keeps the fixed sturcture of described jut to push described jut with pushing, so that the dead in line of the axis of described jut and described depressed part, and described jut is biased in the described depressed part along direction of insertion; With the step on the tabular surface that described substrate back is close to be formed on around the described depressed part.
In this clip method, preferably, described fixed sturcture comprises a bulb stopper.In addition, preferably, this method also is included in after the back side of described substrate and described tabular surface be close to, and one cover that is used to cover the outer peripheral portion of this substrate surface is fixed on the step of the neighboring of described tabular surface by magnetic force.
To achieve these goals, the present invention proposes a kind of manufacture method of discoid recording medium, it comprises: preparation has the step of the disc wafer of jut in its back side central authorities, and this jut has its diameter of formation along with become the big conical substantially cylindrical shape of part away from substrate; Described jut is inserted the step that is arranged on the depressed part in the substrate supporting portion that is used for keeping described substrate with cylindric inside surface; By being configured in the conical step of described part that being used in the described depressed part keeps the fixed sturcture of described jut to push described jut with pushing, so that the dead in line of the axis of described jut and described depressed part, and described jut is biased in the described depressed part along direction of insertion; Described substrate back is close to be formed on around the described depressed part, as the step on the tabular surface of described substrate supporting portion; Make described substrate and be used to cover the cover step relative of the outer peripheral portion of this substrate surface with a target; And by produce plasma between substrate surface and described target described target is carried out sputter, thereby the formation element that forms with described target on described substrate surface is the step of the film of principal ingredient.
In this manufacture method, preferably, described fixed sturcture comprises a bulb stopper.In addition, preferably, this method also is included in after the back side of described substrate and described tabular surface be close to, and the described cover that is used to cover the outer peripheral portion of this substrate surface is fixed on the step of the neighboring of described tabular surface by magnetic force.
Description of drawings
Fig. 1 is for being under the relative status diagrammatic cross-section of the two basically at inlet side carrying arm and atmospheric side carrying arm;
Fig. 2 is the view that inlet side carrying arm and the atmospheric side carrying arm state when carrying out the payment of substrate/transfer is shown;
Fig. 3 is the zoomed-in view of a part among Fig. 2;
Fig. 4 is the zoomed-in view of b part among Fig. 2;
Fig. 5 is the view when substrate-side is observed the section of 5-5 along the line among Fig. 4.
Embodiment
Below just describe according to the clip method of substrate of the present invention.For the sputter equipment that can implement this clip method, figure 1 illustrates the roughly cut-open view of inlet side carrying arm and be basically under state and be used to pay the roughly sectional view of substrate to the atmospheric side carrying arm of this substrate holder with the inlet side carrying arm with substrate holder.In addition, the roughly sectional view of the state when carrying out the payment of substrate shown in Figure 2 by above-mentioned parts.Fig. 3 is the zoomed-in view of a part among Fig. 2.Fig. 4 is the zoomed-in view of b part among Fig. 2.The view of Fig. 5 when observing the section of 5-5 along the line from substrate-side.
The back side central part that is used for the film forming face of substrate 10 of the present invention is formed with jut 11.It is consistent with substrate center that this jut has its axis, and its diameter is along with become big conical shape away from substrate.The substrate holder 21 of inlet side carrying arm 20 is made of the cover support 26 that is used to receive/support the substrate supporting portion 22 of this substrate back and be configured in its periphery.Substrate supporting portion 22 has the smooth surface of circular and is provided with in the central that the inside surface of portion is columnar depressed part 23.
As shown in Figure 4 and Figure 5, in depressed part 23, being configured in this axis equably along the bulb stopper 24 that can be provided with drivingly with the perpendicular direction of its cylinder axis is on 3 positions at center.When substrate holder 21 keeps substrates 10, be inserted in this depressed part 23 at the jut 11 of this substrate back, and fix by (as fixed sturcture) bulb stopper 24.At this moment, bulb stopper 24 passes through the elastic force/bias force effect supporting of spring 25 so that the axis of jut 11 is consistent with the axis of depressed part 23.
Because and bulb stopper 24 contacted juts 11 have along with substrate back near and the shape of its variation in diameter, so jut 11 is pushed towards the bottom of depressed part 23 (direction of insertion of jut) by being subjected to 24 applied pressures of bulb stopper.By the acting force along this direction of insertion pushing substrate 10, this substrate back is close on the tabular surface of the circular that forms substrate supporting portion 22 and is held.In addition, because substrate supporting portion 22 carries out temperature control by water cooling etc., so can be by when substrate back is close to it, controlling the temperature of this substrate 10.
For prevent when forming film paradoxical discharge by sputter and avoid them to be in contact with one another and need be between the surface of the inner edge portion of shroud flange 16 and substrate 10 slight gap below formation one predetermined value.Therefore, covering 15 when being bearing on the cover support 26,, need determine the thickness of the thickness of cover body portion 17 and shroud flange 16 corresponding to discharging condition or cover 15 bearing method etc. in order to satisfy these conditions.
In this embodiment, thus make that by the not shown magnet that is arranged in cover support 26 covering 15 is close to the supporting that is fixed on this cover support 26.Therefore, satisfy above-mentioned condition by the thickness of regulating cover body portion 17 and shroud flange 16 in this embodiment.
Atmospheric side carrying arm 30 have absorption and keep substrate surperficial central part absorption axle 31 and cover is positioned at its surface and keeps the cover maintaining part 33 of this cover.Absorption axle 31 and cover maintaining part 33 are fixed on the atmospheric side carrying arm 30, apply magnetic force and its magnet 35 towards these cover maintaining part 33 attractions can be arranged to be driven with respect to this atmospheric side carrying arm 30 mutually covering 15.
The following describes the operation in the time of to be delivered to inlet side carrying arm 20 by the substrate 10 that atmospheric side carrying arm 30 keeps.At first, the inlet side carrying arm 20 that does not keep substrate 10 and cover 15 with by absorption axle 31 and cover maintaining part 33 substrate 10 and the cover 15 atmospheric side carrying arms 30 that are held in a predetermined position are in alignment with each other.Under this state, atmospheric side carrying arm 30 moves and stops at a locations at predetermined place towards inlet side carrying arm 20.At this moment, substrate jut 11 holds in the depressed part 23 of the substrate supporting portion 22 of inlet side carrying arm 20, and its front end is in than more close this depressed part bottom/darker position, bulb stopper 24 positions.
Under this state, remove maintenance by 31 pairs of substrates of absorption axle.Then, substrate jut 11 is because (elasticity) pressure of bulb stopper 24 and being pressed into along its direction of insertion, makes this substrate back be fixed under the state of being close to the tabular surface of substrate supporting portion 22 and keeps.Then, the magnet 35 of atmospheric side carrying arm 30 retreats, so that cover 15 from these cover maintaining part 33 disengagings.Under this state, because the magnetic force by the not shown magnet that is arranged in cover support 26 works and makes and be attracted and remain on this cover support 26 with covering 15 invariant positions covering 15.
Subsequently, atmospheric side carrying arm 30 retreats, and is relative with this inlet side carrying arm 20 and be combined into the spatter film forming chamber with this inlet side carrying arm 20 on the precalculated position by a unshowned target holding unit, thereby is carried out to membrane process.After film formation process finishes, remove the target holding unit and make atmospheric side carrying arm 30 move to the position relative with this inlet side carrying arm 20, with with the step of the payment reversed in order of aforesaid substrate 10, carry out the payment/transfer of substrate 10 from this inlet side carrying arm 20 to atmospheric side carrying arm 30.
By adopting said structure,, also can and make substrate back with substrate holder or cover support 26 surfaces and be close to mutually so that the substrate holder of ground potential 21 is configured to relatively with target surface even use the substrate that does not have medium pore.And by making substrate back be close to mutually with cover support 26 surfaces of carrying out water cooling etc., the temperature that can be suppressed at substrate when carrying out sputter rises.Can also easily make the interval between cover inner periphery portion and the substrate surface be defined as predetermined value and can reduce paradoxical discharge.
In the present embodiment, although the axis direction of the action direction of bulb stopper 24 and depressed part 23 is perpendicular, the present invention is not limited to this, also can apply effect along the direction different with this axis direction.Although disposed three bulb stoppers 24 for a depressed part 23, as long as jut 11 can be firmly held in this depressed part center, then its number is not limited to three.Keep jut 11 though used bulb stopper to fix, so long as have same purpose, this structure just is not necessarily limited to bulb stopper.
In addition, be not only substrate to be pressed into along direction of insertion by bulb stopper, in atmosphere, substrate when being delivered to the inlet side carrying arm, the atmospheric side carrying arm can temporarily be adsorbed this substrate thereby also can take to be provided with the exhausr port that is communicated with depressed part.Although being arranged on the jut of substrate back is along with gradually big away from its diameter of this substrate back, and its axial section is for having ladder/platform shape, as long as but can substrate back be close on the tabular surface of this substrate supporting portion by described vacuum suction etc., just be not necessarily limited to described ladder/platform shape.Can be provided with can be by the jut of the fixing different shape of this bulb stopper.For example, can adopt the jut cylindraceous of the depressed part that leading section with bulb stopper can be fitted into them or jut cylindraceous etc. roughly.
The present invention is not limited in the manufacture method that is used for CD, can also be applicable to the ownership system making method of disc-shaped parts such as the product of removing the operation of central part in the step of back thereon, for example hard disk.
Can keep not existing the disc wafer of medium pore stably to be close on the keeper according to the present invention.Therefore, can be used for not only also having film formation process on the substrate that does not have medium pore, to form film, and can form the more film of homogenising of film thickness, quality by sputtering method in the film formation process of being undertaken by method of spin coating.And, by reducing the number of substrate holder in the sputtering method, can also be reduced to the paradoxical discharge in the membrane process.
Claims (12)
1. sputter equipment that is used on substrate surface, forming film at vacuum tank, employed substrate is for having the disc wafer of jut in its back side central authorities, this jut has its diameter of formation along with become the big conical substantially cylindrical shape of part away from substrate, and this sputter equipment comprises:
The substrate supporting portion that constitutes by the tabular surface for the treatment of to be close to the back side of described substrate and
Be formed on the depressed part that described substrate supporting portion central part is used to receive described jut,
Wherein, in described depressed part, dispose the fixed sturcture that is used to keep described jut with pushing,
Wherein, described fixed sturcture pushes the described part taper shape of described jut, so that exert pressure to described jut, thereby described jut is pressed in the described depressed part.
2. a sputter equipment according to claim 1 is characterized in that, described fixed sturcture comprises a bulb stopper.
3. sputter equipment according to claim 1, it is characterized in that, also comprise the carrying arm that is used for described substrate is delivered to described substrate supporting portion, wherein, when described substrate being delivered to described substrate supporting portion, stop and being positioned under the state of described substrate supporting portion one predetermined space at described carrying arm, described fixed sturcture pushes the part taper shape of described jut, thereby described substrate is delivered to described substrate supporting portion.
4. one kind according to each described sputter equipment in the claim 1 to 3, also comprises being used to support a cover support of cover that covers the outer peripheral portion of this substrate surface, and wherein, described cover support keeps described cover by magnetic force.
5. clip method that is used on substrate surface, forming clip substrate in the sputter equipment of film at vacuum tank, employed substrate is for having the disc wafer of jut in its back side central authorities, this jut has its diameter of formation along with become the big conical substantially cylindrical shape of part away from substrate, and this method may further comprise the steps:
Described jut insertion is had in the depressed part of cylindric inside surface,
Keep the fixed sturcture of described jut to push the described part taper shape of described jut by being configured in being used in the described depressed part with pushing, so that the dead in line of the axis of described jut and described depressed part, and with described jut along direction of insertion be biased in the described depressed part and
Described substrate back is close to is formed on the described depressed part tabular surface on every side.
6. a method according to claim 5 is characterized in that, described fixed sturcture comprises a bulb stopper.
7. method according to claim 6, it is characterized in that, also comprise the carrying arm that is used for described substrate is delivered to described substrate supporting portion, wherein, when described substrate being delivered to described substrate supporting portion, stop and being positioned under the state of described substrate supporting portion one predetermined space at described carrying arm, described fixed sturcture pushes the part taper shape of described jut, thereby described substrate is delivered to described substrate supporting portion.
8. one kind according to each described method in the claim 5 to 7, it is characterized in that, also be included in after the back side of described substrate and described tabular surface be close to, one cover that is used to cover the outer peripheral portion of this substrate surface be fixed on the step of the neighboring of described tabular surface by magnetic force.
9. the manufacture method of a discoid recording medium, it comprises:
Preparation has the disc wafer of jut in its back side central authorities, and this jut has its diameter of formation along with becoming the big conical substantially cylindrical shape of part away from substrate,
Described jut is inserted the depressed part with cylindric inside surface that is arranged in the substrate supporting portion that is used for keeping described substrate,
Keep the fixed sturcture of described jut to push the described part taper shape of described jut by being configured in being used in the described depressed part with pushing, so that the dead in line of the axis of described jut and described depressed part, and described jut is biased in the described depressed part along direction of insertion
Described substrate back is close to be formed on around the described depressed part, on the tabular surface as described substrate supporting portion,
Make described substrate and be used to cover the cover of outer peripheral portion of this substrate surface relative with a target and
By between substrate surface and described target, producing plasma described target is carried out sputter, thereby the formation element that forms with described target is the film of principal ingredient on described substrate surface.
10. a method according to claim 9 is characterized in that, described fixed sturcture comprises a bulb stopper.
11. method according to claim 10, it is characterized in that, also comprise the carrying arm that is used for described substrate is delivered to described substrate supporting portion, wherein, when described substrate being delivered to described substrate supporting portion, stop and being positioned under the state of described substrate supporting portion one predetermined space at described carrying arm, described fixed sturcture pushes the part taper shape of described jut, thereby described substrate is delivered to described substrate supporting portion.
12. one kind according to each described method in the claim 9 to 11, it is characterized in that, also be included in after the back side of described substrate and described tabular surface be close to, the described cover that is used to cover the outer peripheral portion of this substrate surface be fixed on the step of the neighboring of described tabular surface by magnetic force.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002062866A JP3949473B2 (en) | 2002-03-08 | 2002-03-08 | Sputtering apparatus for disk-shaped substrate, substrate chucking method in the apparatus, and manufacturing method of disk-shaped recording medium using the apparatus |
| JP062866/2002 | 2002-03-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1639785A CN1639785A (en) | 2005-07-13 |
| CN100350482C true CN100350482C (en) | 2007-11-21 |
Family
ID=27800174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB038055317A Expired - Fee Related CN100350482C (en) | 2002-03-08 | 2003-03-07 | Disk-like substrate sputtering device, substrate chucking method in the device, method of producing disk-like recording medium using the device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3949473B2 (en) |
| KR (1) | KR100602528B1 (en) |
| CN (1) | CN100350482C (en) |
| TW (1) | TW588349B (en) |
| WO (1) | WO2003077244A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100696554B1 (en) * | 2005-12-16 | 2007-03-19 | 삼성에스디아이 주식회사 | Deposition apparatus |
| TWI421358B (en) * | 2007-08-17 | 2014-01-01 | Hon Hai Prec Ind Co Ltd | Device for fixing backing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101206A (en) * | 1989-09-14 | 1991-04-26 | Fuji Photo Film Co Ltd | Sputtering device |
| JPH07296431A (en) * | 1994-04-26 | 1995-11-10 | Shin Etsu Chem Co Ltd | Mask for film formation |
| JPH1040584A (en) * | 1996-07-22 | 1998-02-13 | Matsushita Electric Ind Co Ltd | Manufacture of disk body such as optical disk |
| JP2000222785A (en) * | 1999-01-29 | 2000-08-11 | Ricoh Co Ltd | Production of optical information recording medium and producing device therefor |
| CN2431622Y (en) * | 2000-07-07 | 2001-05-23 | 上海音桥科技有限公司 | Non-circular CD |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001246643A (en) * | 2000-03-03 | 2001-09-11 | Hitachi Maxell Ltd | Recording medium, injection mold, injection molding machine and molding method |
| JP2002173761A (en) * | 2000-12-06 | 2002-06-21 | Shibaura Mechatronics Corp | Inner mask |
| JP2002269852A (en) * | 2001-03-13 | 2002-09-20 | Ricoh Co Ltd | Optical information recording medium manufacturing device |
-
2002
- 2002-03-08 JP JP2002062866A patent/JP3949473B2/en not_active Expired - Fee Related
-
2003
- 2003-03-07 TW TW092104964A patent/TW588349B/en not_active IP Right Cessation
- 2003-03-07 WO PCT/JP2003/002691 patent/WO2003077244A1/en active IP Right Grant
- 2003-03-07 KR KR1020047013886A patent/KR100602528B1/en not_active IP Right Cessation
- 2003-03-07 CN CNB038055317A patent/CN100350482C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101206A (en) * | 1989-09-14 | 1991-04-26 | Fuji Photo Film Co Ltd | Sputtering device |
| JPH07296431A (en) * | 1994-04-26 | 1995-11-10 | Shin Etsu Chem Co Ltd | Mask for film formation |
| JPH1040584A (en) * | 1996-07-22 | 1998-02-13 | Matsushita Electric Ind Co Ltd | Manufacture of disk body such as optical disk |
| JP2000222785A (en) * | 1999-01-29 | 2000-08-11 | Ricoh Co Ltd | Production of optical information recording medium and producing device therefor |
| CN2431622Y (en) * | 2000-07-07 | 2001-05-23 | 上海音桥科技有限公司 | Non-circular CD |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200304137A (en) | 2003-09-16 |
| JP3949473B2 (en) | 2007-07-25 |
| CN1639785A (en) | 2005-07-13 |
| KR100602528B1 (en) | 2006-07-19 |
| TW588349B (en) | 2004-05-21 |
| WO2003077244A1 (en) | 2003-09-18 |
| JP2003263801A (en) | 2003-09-19 |
| KR20040091105A (en) | 2004-10-27 |
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