CN100344918C - 半导体电子致冷装置专用蒸发腔及其制备方法 - Google Patents
半导体电子致冷装置专用蒸发腔及其制备方法 Download PDFInfo
- Publication number
- CN100344918C CN100344918C CNB2005100125347A CN200510012534A CN100344918C CN 100344918 C CN100344918 C CN 100344918C CN B2005100125347 A CNB2005100125347 A CN B2005100125347A CN 200510012534 A CN200510012534 A CN 200510012534A CN 100344918 C CN100344918 C CN 100344918C
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- China
- Prior art keywords
- evaporation cavity
- semiconductor electronic
- dedicated
- cavity
- electronic refrigerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001704 evaporation Methods 0.000 title claims abstract description 80
- 230000008020 evaporation Effects 0.000 title claims abstract description 80
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000005516 engineering process Methods 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000001125 extrusion Methods 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000005266 casting Methods 0.000 claims abstract description 3
- 238000004512 die casting Methods 0.000 claims abstract description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 238000005057 refrigeration Methods 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 239000000428 dust Substances 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100125347A CN100344918C (zh) | 2005-05-26 | 2005-05-26 | 半导体电子致冷装置专用蒸发腔及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100125347A CN100344918C (zh) | 2005-05-26 | 2005-05-26 | 半导体电子致冷装置专用蒸发腔及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1727812A CN1727812A (zh) | 2006-02-01 |
CN100344918C true CN100344918C (zh) | 2007-10-24 |
Family
ID=35927223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100125347A Expired - Fee Related CN100344918C (zh) | 2005-05-26 | 2005-05-26 | 半导体电子致冷装置专用蒸发腔及其制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN100344918C (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101881567B (zh) * | 2010-07-01 | 2013-03-20 | 郭琛 | 半导体电子致冷装置专用圆柱形蒸发腔及其制备方法 |
CN105627687B (zh) * | 2014-12-01 | 2019-02-01 | 青岛海尔特种电冰柜有限公司 | 半导体制冷设备中制冷剂的过压保护方法 |
CN105716316B (zh) * | 2014-12-01 | 2019-03-05 | 青岛海尔特种电冰柜有限公司 | 半导体制冷设备 |
CN105716452B (zh) * | 2014-12-01 | 2019-03-05 | 青岛海尔特种电冰柜有限公司 | 热交换装置及半导体制冷设备 |
CN105627798B (zh) * | 2014-12-01 | 2018-12-18 | 青岛海尔特种电冰柜有限公司 | 热交换装置及半导体制冷设备 |
CN105716454B (zh) * | 2014-12-01 | 2019-05-31 | 青岛海尔特种电冰柜有限公司 | 热管散热式热交换装置的组装方法 |
CN105716456B (zh) * | 2014-12-01 | 2018-12-18 | 青岛海尔特种电冰柜有限公司 | 热交换装置及半导体制冷设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4467861A (en) * | 1982-10-04 | 1984-08-28 | Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr | Heat-transporting device |
JPH1054624A (ja) * | 1996-08-12 | 1998-02-24 | Calsonic Corp | 熱電冷却装置 |
US6058711A (en) * | 1996-08-12 | 2000-05-09 | Centre National D'etudes Spatiales | Capillary evaporator for diphasic loop of energy transfer between a hot source and a cold source |
US6351951B1 (en) * | 1998-03-30 | 2002-03-05 | Chen Guo | Thermoelectric cooling device using heat pipe for conducting and radiating |
CN2804729Y (zh) * | 2005-05-26 | 2006-08-09 | 王双玲 | 改进的半导体电子致冷装置专用蒸发腔 |
-
2005
- 2005-05-26 CN CNB2005100125347A patent/CN100344918C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4467861A (en) * | 1982-10-04 | 1984-08-28 | Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr | Heat-transporting device |
JPH1054624A (ja) * | 1996-08-12 | 1998-02-24 | Calsonic Corp | 熱電冷却装置 |
US6058711A (en) * | 1996-08-12 | 2000-05-09 | Centre National D'etudes Spatiales | Capillary evaporator for diphasic loop of energy transfer between a hot source and a cold source |
US6351951B1 (en) * | 1998-03-30 | 2002-03-05 | Chen Guo | Thermoelectric cooling device using heat pipe for conducting and radiating |
CN2804729Y (zh) * | 2005-05-26 | 2006-08-09 | 王双玲 | 改进的半导体电子致冷装置专用蒸发腔 |
Also Published As
Publication number | Publication date |
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CN1727812A (zh) | 2006-02-01 |
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Owner name: LUQUAN JIWEI ELECTRICAL CO., LTD. Free format text: FORMER OWNER: WANG SHUANGLING Effective date: 20090911 |
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Denomination of invention: Dedicated evaporation cavity of semiconductor electronic refrigerator, and preparation method Effective date of registration: 20111230 Granted publication date: 20071024 Pledgee: Hebei Information Industry Investment Co., Ltd. Pledgor: Luquan Jiwei Electric Appliance Co., Ltd. Registration number: 2011990000532 |
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