CN100338750C - 用于在电线端部形成线球的带有电极的装置 - Google Patents
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Abstract
一种用于在电线(2)的从细管(3)伸出的端部形成线球的带有电极的装置,包括一个带有末端(9)的第一电极(6)和至少一个另外的电极(7;8)。该第一电极(6)和该至少一个另外的电极(7;8)电连接。第一电极(6)的末端(9)和电线(2)的端部之间的距离小于该至少一个另外的电极(7;8)上的任何点和电线(2)的端部之间的距离。
Description
技术领域
本发明涉及用于在电线端部形成线球的带有电极的装置。
背景技术
这种装置用在所谓的引线接合器(Wire Bonder)上。引线接合器是一种在半导体芯片安装到基片之后利用其布线的设备。引线接合器具有一个细管,它夹在电极臂(horn)的末端。细管用于将电线固定到半导体芯片上的接点和基片上的接点并且引导这两个接点之间的电线。在形成半导体芯片上的接点和基片上的接点之间的电线连接时,首先将从细管突出的电线的端部熔制成线球。随后,利用压力和超声波将线球固定到半导体芯片上的接点。为此目的,超声波从超声换能器施加于电极臂。这种处理过程称为球焊。然后电线被拉至需要的长度,形成电线圈并焊接于基片上的接点。该处理过程的最后部分称为楔焊。在将电线固定到基片上的接点之后,扯断电线可以开始下一个接合。
为了将从细管突出的电线的端部形成线球,在电线和电极之间施加高DC电压从而产生熔融电线的电火花。电线和电极之间产生电离空气的电击穿以及形成电火花时的电压称为击穿电压。
目前,市场上流行的用于在电线端部形成线球的装置公知的有三种。基于图1-3说明这三种类型。对于第一种(图1),扁平电极1从引导电线2的细管3下面的一侧旋转。利用电极和电线的这种布置,在电线的纵向形成电火花4。因此电火花4相对于电线对称形成。这种类型的优点在于所形成的线球的对称性相当高。另一方面,缺点在于电极的旋入和旋出浪费时间。而且,电极的旋入和旋出刺激接合头的摆动。
对于第二种类型(图2),具有末端的电极1在细管下面横向偏移地布置。利用这种布置,电火花4相对于电线的纵向轴线不对称地形成,该电火花趋向于导致不对称的线球的形成。但是,这些线球的不对称性具有主要的方向。这使得可能和其他手段一起减小不对称性。另外,相比于第一种类型,这种布置需要更高的击穿电压。由于到位于装置下面的将连接指状件固定在基片上的下夹板的垂直距离相同,这导致更加经常地发生下夹板上的放电。
对于第三种类型(图3),电极1是旋转对称的环形电极。在形成线球之后,细管3下降经过电极。这种布置的优点在于形成电火花所必须的电压低于第一种类型。缺点在于形成电火花4的位置经常变化。利用这种布置形成的线球具有不对称的趋势,不过这些不对称没有主要方向。
用于形成线球的另一种装置从欧洲专利申请EP562 224可获知。该装置具有三个点状电极,它们单独地电控制以便调整流经各个电极的电流。类似的装置可从US4,594,493获知。这些装置同时产生三个或四个电火花。但是,电极相互之间的定位是一个复杂的作业,因为必须要确保真正形成三个或四个电火花。
用于形成线球的其他装置从US4,909,427和US5,037,023可获知。US5,037,023揭示了不同电极的使用,其中第一电极用于形成线球,第二对电极用于局部地熔融电线的绝缘部分。第一电极和第二对电极不是结合在一起来形成线球,它们是依次进入它们的工作位置来独立地进行它们的作业。
发明内容
本发明的目的在于改进用于在电线端部形成线球的装置,其特征在于击穿电压尽可能低,并且利用该装置形成的线球的尺寸变化尽可能小。
本发明的装置具有一个带有末端的第一电极和至少一个另外的电极。所有的电极相互机械地刚性连接。第二电极,或者另外的电极,影响电线端部和电极之间形成的电场的级数(progression)。所有的电极电连接在一起并因而处于同一个电势上。而且,它们形成并布置为在任何情况下第一电极的末端和电线之间的距离小于第二电极或所有其他电极和电线之间的距离。这样可以确保只形成单一的电火花,即在电线和第一电极的末端之间。该至少一个另外的电极的优点在于相比于在先技术形成明显较低的击穿电压。从而,可以减小电极和下夹板之间的距离而不会增加放电的危险。因此,为了形成线球,不必非要抬高细管,从而循环时间降低。
该至少一个另外的电极可以是开放的,即可以具有开放端,有或者没有末端。但是,有利地该至少一个另外的电极是封闭电极,例如环形电极。封闭电极的优点在于击穿电压的分散小于开放电极,这导致线球尺寸的较小的变化。
附图说明
下面,根据附图更加详细地说明本发明的实施例。附图并非按照比例绘制。
附图中:
图1-3是用于在电线端部形成线球的在先技术的三种装置;
图4-7是用于在电线端部形成线球的本发明的装置的三种不同实施例;以及
图8是等效电框图。
具体实施方式
图4示出可以用在引线接合器上的用于在电线2的端部形成线球的本发明的装置的第一实施例的透视图。如在序言中所述,电线2由细管3引导。在接合周期的开始,电线2的一端从细管3的末端5伸出。现在需要将该电线端形成线球。该装置具有三个电极6-8,它们相互机械地刚性连接并且电连接在一起并因而具有相同的电势。第一电极6成型有末端9。当细管3被抬高并且相对于装置位于将要形成线球的位置时,第一电极6的末端9位于细管3的末端下面横向偏移。图4中,第一电极6的末端9位于细管3的一侧,即右侧。第二电极7和第三电极8比第一电极6长并且延伸到细管3的另一侧,在图4的例子中延伸到细管3的左侧。第二电极7上的任何点和电线2的端部之间的距离以及第三电极8上的任何点和电线2的端部之间的距离大于第一电极6的末端9和电线2的端部之间的最大距离。为此,必须考虑到从细管3伸出的电线段的长度受到一定的波动并且该电线段可以指向任何方向。
第二和第三电极7和8成型为没有棱边,因为电场中的峰值会形成在棱边上。不过这种限制仅仅对于装置的电场较大的区域有效。因此这种限制不会应用到电极7和8的最大程度地离开细管3的末端5的那些部分。因此第二和第三电极的横截面优选地为圆形。
图5示出用在引线接合器上的装置的侧视图。引线接合器包括具有电极臂11的接合头10,在该电极臂的末端夹持有细管3。电极臂11相对于接合头10可以沿垂直方向12移动。所谓的下夹板13位于装置下面,利用该下夹板,其上安装有半导体芯片16的基片15的连接指状件14固定在位。在所示的例子中,三个电极6-8位于一个平面内(仅有电极7可见),该平面平行于下夹板13的表面17。但是,也可以将两个电极7和8布置在不同于第一电极6的平面内。电极6-8通过绝缘体18固定于接合头10。细管3下降到半导体芯片16上的接点上。
图6示出用于在电线2的端部形成线球的本发明的装置的第二实施例的透视图。该装置只有相互机械地刚性连接的第一电极6和第二电极7。第一电极6也具有末端9。第二电极7为环形并且因此是封闭电极。两个电极6和7位于一个平面内,该平面在细管3的末端5的下面并平行于下夹板13的表面17(图5)。环形电极7的中心位于细管3的末端5的下面。第一电极6比从细管3伸出的电线部分的最大长度长。因此电火花4总是产生在第一电极6的末端9和电线2之间。电极7的环的边缘优选地圆整,即成型为没有棱边。不过,这一特征在图6中不可见。
图7示出用于在电线2的端部形成线球的本发明的装置的第三实施例的透视图。该装置也只有相互机械地刚性连接的第一电极6和第二电极7。第一电极6也具有末端9。第二电极7包括平行于第一电极6的两个部分19,这两个部分由圆弧20连接。因此,第二电极7也是封闭电极。这两个电极6和7位于一个平面内,该平面在细管3的末端5的下面并平行于下夹板13的表面17(图5)。这两个电极6和7同样地尺寸确定为电火花4总是产生在第一电极6的末端9和电线2之间。
形成线球之后,细管3下降到开放电极7和8之间(实施例1)或者经过封闭电极7(实施例2和3)到达半导体芯片16上的附接线球的对应接点上。
图8示出等效电框图。电线2和第一实施例的电极6-8或者第二和第三实施例的电极6和7通过公知的火花发生器21连接。基本上,火花发生器包括一个恒定电流源。为了在电线端部和第一电极6之间形成电火花4,必须电离它们之间的空气,直到发生放电并因此形成电火花4。为此,在恒定电流源上积聚逐渐增大的直流电压直到发生放电。主要有两个因素决定所形成的线球的大小。一个因素是电能,当积聚直流电时,该电能产生并存储在恒定电流源和电极6-8之间的连接电缆中。一旦形成电火花4,该电能释放到被形成的线球内。第二个因素是从形成电火花直到线球形成过程结束恒定电流源输送的电流量,它可以由额定电流强度和持续时间控制。积聚在连接电缆内并且在形成电火花时存储并随后释放的电能不能控制。本发明的装置具有如下优点,尤其是当第二电极7是封闭电极时,一方面,击穿电压,另一方面,它的分散比在先技术相当低。击穿电压的极大减小的变化精确地导致存储在连接电缆中的电能的变化的减小直到放电并因此还导致所形成的线球尺寸的减小。
Claims (2)
1.用于在电线(2)的从细管(3)伸出的端部形成线球的带有电极的装置,该装置包括一个带有末端(9)的第一电极(6)和至少一个另外的电极(7;8),该第一电极(6)和该至少一个另外的电极(7;8)相互机械地刚性连接并且电连接,其中第一电极(6)的末端(9)和电线(2)的端部之间的距离小于该至少一个另外的电极(7;8)上的任何点和电线(2)的端部之间的距离,使得仅仅在第一电极(6)的末端(9)和电线(2)之间形成电火花(4)。
2.如权利要求1所述的装置,包括仅仅一个单一的另外的电极(7),它具有封闭的形式。
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US20040211814A1 (en) * | 2003-04-23 | 2004-10-28 | Jackson Hsieh | Wire bonding capillary for an image sensor |
WO2016178285A1 (ja) * | 2015-05-03 | 2016-11-10 | 株式会社カイジョー | ワイヤボンダ用ボール形成装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4594493A (en) * | 1983-07-25 | 1986-06-10 | Fairchild Camera & Instrument Corp. | Method and apparatus for forming ball bonds |
US5037023A (en) * | 1988-11-28 | 1991-08-06 | Hitachi, Ltd. | Method and apparatus for wire bonding |
US5263631A (en) * | 1992-03-26 | 1993-11-23 | Esec Sa | Contact-making system for semiconductor wire connections |
US5957371A (en) * | 1996-10-17 | 1999-09-28 | Kabushiki Kaisha Shinkawa | Method and apparatus for forming a ball in wire bonding |
US5958259A (en) * | 1996-10-17 | 1999-09-28 | Kabushiki Kaisha Shinkawa | Method for forming a ball in wire bonding |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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NL8005922A (nl) * | 1980-10-29 | 1982-05-17 | Philips Nv | Werkwijze voor het vormen van een draadverbinding. |
US4595493A (en) * | 1984-08-17 | 1986-06-17 | American Cyanamid Company | Process for the flotation of base metal sulfide minerals in acid, neutral or mildly alkaline circuits |
US4909427A (en) * | 1989-05-17 | 1990-03-20 | Plaisted Alan H | Bonding wire ball formation |
-
2003
- 2003-05-28 TW TW092114380A patent/TWI229022B/zh not_active IP Right Cessation
- 2003-06-05 US US10/455,657 patent/US6739494B2/en not_active Expired - Fee Related
- 2003-06-05 DE DE10326351A patent/DE10326351B4/de not_active Expired - Fee Related
- 2003-06-17 KR KR10-2003-0039076A patent/KR20030097664A/ko not_active Application Discontinuation
- 2003-06-19 CN CNB031490085A patent/CN100338750C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4594493A (en) * | 1983-07-25 | 1986-06-10 | Fairchild Camera & Instrument Corp. | Method and apparatus for forming ball bonds |
US5037023A (en) * | 1988-11-28 | 1991-08-06 | Hitachi, Ltd. | Method and apparatus for wire bonding |
US5263631A (en) * | 1992-03-26 | 1993-11-23 | Esec Sa | Contact-making system for semiconductor wire connections |
US5957371A (en) * | 1996-10-17 | 1999-09-28 | Kabushiki Kaisha Shinkawa | Method and apparatus for forming a ball in wire bonding |
US5958259A (en) * | 1996-10-17 | 1999-09-28 | Kabushiki Kaisha Shinkawa | Method for forming a ball in wire bonding |
Also Published As
Publication number | Publication date |
---|---|
CN1472786A (zh) | 2004-02-04 |
US6739494B2 (en) | 2004-05-25 |
TW200404026A (en) | 2004-03-16 |
DE10326351B4 (de) | 2007-12-13 |
KR20030097664A (ko) | 2003-12-31 |
TWI229022B (en) | 2005-03-11 |
US20030234271A1 (en) | 2003-12-25 |
DE10326351A1 (de) | 2004-01-15 |
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