CL2012002253A1 - Electro copper refining equipment comprising an electrolytic copper bath, an electrolyte supply part, an additive bath supplying additives, and a tail dissolution bath, continuously supplying aqueous glue solution; and method for electro refining. - Google Patents
Electro copper refining equipment comprising an electrolytic copper bath, an electrolyte supply part, an additive bath supplying additives, and a tail dissolution bath, continuously supplying aqueous glue solution; and method for electro refining.Info
- Publication number
- CL2012002253A1 CL2012002253A1 CL2012002253A CL2012002253A CL2012002253A1 CL 2012002253 A1 CL2012002253 A1 CL 2012002253A1 CL 2012002253 A CL2012002253 A CL 2012002253A CL 2012002253 A CL2012002253 A CL 2012002253A CL 2012002253 A1 CL2012002253 A1 CL 2012002253A1
- Authority
- CL
- Chile
- Prior art keywords
- bath
- electro
- refining
- copper
- tail
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/06—Operating or servicing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Equipamiento de electro refinación del cobre que comprende un baño electrolítico de cobre, una parte de suministro de electrólito, un baño de aditivos suministrando aditivos, y un baño de disolución de cola, suministrando continuamente solución acuosa de cola; y método para la electro refinación.Electro copper refining equipment comprising an electrolytic copper bath, an electrolyte supply part, an additive bath supplying additives, and a tail dissolution bath, continuously supplying aqueous glue solution; and method for electro refining.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010037390A JP5275273B2 (en) | 2010-02-23 | 2010-02-23 | Copper electrolytic purification apparatus and copper electrolytic purification method using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
CL2012002253A1 true CL2012002253A1 (en) | 2012-11-30 |
Family
ID=44506571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CL2012002253A CL2012002253A1 (en) | 2010-02-23 | 2012-08-14 | Electro copper refining equipment comprising an electrolytic copper bath, an electrolyte supply part, an additive bath supplying additives, and a tail dissolution bath, continuously supplying aqueous glue solution; and method for electro refining. |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5275273B2 (en) |
KR (1) | KR101351105B1 (en) |
AU (1) | AU2011219212B2 (en) |
CL (1) | CL2012002253A1 (en) |
WO (1) | WO2011105149A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106011930B (en) * | 2016-07-28 | 2018-09-25 | 河南豫光金铅股份有限公司 | A kind of continuous preparation method of cupric electrolysis refining electrolyte |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR890002750B1 (en) * | 1984-05-31 | 1989-07-26 | 아사코 인코포레이팃드 | Electrolytic method for copper refining |
US5431803A (en) * | 1990-05-30 | 1995-07-11 | Gould Electronics Inc. | Electrodeposited copper foil and process for making same |
JPH08304338A (en) * | 1995-05-08 | 1996-11-22 | Sumitomo Metal Mining Co Ltd | Operation control method of glue addition quantity into electrolyte in copper electrolytic refining |
JP2002055097A (en) * | 2000-08-10 | 2002-02-20 | Sumitomo Metal Mining Co Ltd | Method for determination sulfonic acid type anionic surfactant in copper electrolytic solution |
JP4518262B2 (en) * | 2004-03-23 | 2010-08-04 | 三菱マテリアル株式会社 | High purity electrolytic copper and its manufacturing method |
-
2010
- 2010-02-23 JP JP2010037390A patent/JP5275273B2/en active Active
-
2011
- 2011-01-24 AU AU2011219212A patent/AU2011219212B2/en active Active
- 2011-01-24 KR KR1020117027925A patent/KR101351105B1/en active IP Right Grant
- 2011-01-24 WO PCT/JP2011/051209 patent/WO2011105149A1/en active Application Filing
-
2012
- 2012-08-14 CL CL2012002253A patent/CL2012002253A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
AU2011219212B2 (en) | 2012-11-22 |
JP2011174113A (en) | 2011-09-08 |
WO2011105149A1 (en) | 2011-09-01 |
KR101351105B1 (en) | 2014-01-14 |
KR20120020130A (en) | 2012-03-07 |
JP5275273B2 (en) | 2013-08-28 |
AU2011219212A1 (en) | 2011-12-15 |
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