CH713413B1 - Detektionseinrichtung zur Ermittlung von Positionsinformationen. - Google Patents
Detektionseinrichtung zur Ermittlung von Positionsinformationen. Download PDFInfo
- Publication number
- CH713413B1 CH713413B1 CH00992/07A CH9922007A CH713413B1 CH 713413 B1 CH713413 B1 CH 713413B1 CH 00992/07 A CH00992/07 A CH 00992/07A CH 9922007 A CH9922007 A CH 9922007A CH 713413 B1 CH713413 B1 CH 713413B1
- Authority
- CH
- Switzerland
- Prior art keywords
- sensor
- light
- substrate
- detection device
- gripper
- Prior art date
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000003287 optical effect Effects 0.000 claims description 18
- 238000011156 evaluation Methods 0.000 claims description 7
- 230000001419 dependent effect Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 208000035874 Excoriation Diseases 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH00992/07A CH713413B1 (de) | 2007-06-20 | 2007-06-20 | Detektionseinrichtung zur Ermittlung von Positionsinformationen. |
PCT/CH2008/000274 WO2008154764A1 (fr) | 2007-06-20 | 2008-06-18 | Dispositif de préhension pourvu d'un dispositif de détection pour déterminer des informations de position |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH00992/07A CH713413B1 (de) | 2007-06-20 | 2007-06-20 | Detektionseinrichtung zur Ermittlung von Positionsinformationen. |
Publications (1)
Publication Number | Publication Date |
---|---|
CH713413B1 true CH713413B1 (de) | 2018-07-31 |
Family
ID=39791192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH00992/07A CH713413B1 (de) | 2007-06-20 | 2007-06-20 | Detektionseinrichtung zur Ermittlung von Positionsinformationen. |
Country Status (2)
Country | Link |
---|---|
CH (1) | CH713413B1 (fr) |
WO (1) | WO2008154764A1 (fr) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7596425B2 (en) * | 2003-06-13 | 2009-09-29 | Dainippon Screen Mfg. Co., Ltd. | Substrate detecting apparatus and method, substrate transporting apparatus and method, and substrate processing apparatus and method |
JP4064361B2 (ja) * | 2004-03-15 | 2008-03-19 | 川崎重工業株式会社 | 搬送装置の搬送位置の位置情報取得方法 |
JP4047826B2 (ja) * | 2004-03-25 | 2008-02-13 | 東京エレクトロン株式会社 | 縦型熱処理装置及び移載機構の自動教示方法 |
-
2007
- 2007-06-20 CH CH00992/07A patent/CH713413B1/de not_active IP Right Cessation
-
2008
- 2008-06-18 WO PCT/CH2008/000274 patent/WO2008154764A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2008154764A1 (fr) | 2008-12-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69926659T2 (de) | Verfahren und vorrichtung für die optische Inspektion von Objekten auf einem Substrat | |
EP1618426B1 (fr) | Procede et dispositif pour determiner la position du point focal lors de l'obtention d'une image d'un echantillon | |
EP1970680B1 (fr) | Système de détection optique pour un dispositif de traitement de liquides | |
DE3110287C2 (fr) | ||
DE10237540A1 (de) | Fehlerinspektionsvorrichtung und Herstellungsverfahren einer Halbleitervorrichtung | |
DE10047211A1 (de) | Verfahren und Messgerät zur Positionsbestimmung einer Kante eines Strukturelementes auf einem Substrat | |
EP1821120A2 (fr) | Dispositif optoélectronique et son procédé de fonctionnement | |
DE102009016811A1 (de) | Verfahren zur automatischen Vermessung und zum Einlernen von Lagepositionen von Objekten innerhalb eines Substratprozessiersystems mittels Sensorträger und zugehöriger Sensorträger | |
DE112021002184T5 (de) | Inspektionsvorrichtung und Inspektionsverfahren | |
DE3211928C2 (fr) | ||
DE102014213064A1 (de) | Einrichtung zum Erfassen eines vorausrichtenden Elements an einem Wafer | |
DE102016120715A1 (de) | Verfahren und Vorrichtung zur Verwendung bei der Waferbearbeitung | |
EP2335225B1 (fr) | Détermination automatique du diamètre de pièces de monnaie | |
DE102016122494B4 (de) | Verfahren zum Überprüfen eines Bestückinhalts von elektronischen Bauelementen mittels eines Vergleichs eines 3D-Höhenprofils mit einem Referenz-Höhenprofil, Bestückautomat sowie Computerprogramm zum Überprüfen eines Bestückinhalts | |
DE102007033345A1 (de) | Verfahren zur Korrektur eines Fehlers des Abbildungssystems einer Koordinaten-Messmaschine | |
DE19817714B4 (de) | Verfahren zur Messung der Lage von Strukturen auf einer Maskenoberfläche | |
DE102008010945A9 (de) | Zeigegerät | |
DE19858168A1 (de) | Vorrichtung und Verfahren zur berührungslosen Ermittlung des Pflanzenbewuchses eines Feldabschnittes | |
CH713413B1 (de) | Detektionseinrichtung zur Ermittlung von Positionsinformationen. | |
DE102014010667B4 (de) | Verfahren und Vorrichtung zur Messung der Form einer Wellenfront eines optischen Strahlungsfeldes | |
DE102012110646A1 (de) | Vorrichtung und Verfahren zum Bereitstellen eines Lichtstrahls | |
DE102021118429B4 (de) | Verfahren und Gerät zur 3D-Koordinatenmessung nach dem Autofokusverfahren | |
EP1198694B1 (fr) | Detecteur optique servant a mesurer la distance et l'inclinaison d'une surface | |
EP4329977A2 (fr) | Procédé et système de fabrication de composants microstructurés | |
DE112017002293T5 (de) | System und Verfahren zur Kompensation von Fehlausrichtungen von Beleuchtungsstrahlung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLX | Patent declared invalid from date of grant onwards | ||
AECN | Continuation of proceedings agreed |
Free format text: DAS PATENT WURDE AUFGRUND DES WEITERBEHANDLUNGSANTRAGS VOM 02.05.2019 REAKTIVIERT. |
|
PL | Patent ceased | ||
PL | Patent ceased | ||
PL | Patent ceased |