CH652737A5 - METALLIC, SILVER-CONTAINING PASTE WITH GLASS AND THEIR USE FOR FASTENING ELECTRONIC COMPONENTS. - Google Patents
METALLIC, SILVER-CONTAINING PASTE WITH GLASS AND THEIR USE FOR FASTENING ELECTRONIC COMPONENTS. Download PDFInfo
- Publication number
- CH652737A5 CH652737A5 CH4606/82A CH460682A CH652737A5 CH 652737 A5 CH652737 A5 CH 652737A5 CH 4606/82 A CH4606/82 A CH 4606/82A CH 460682 A CH460682 A CH 460682A CH 652737 A5 CH652737 A5 CH 652737A5
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- Prior art keywords
- silver
- glass
- metallic
- gold
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5116—Ag or Au
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Description
Die Erfindung soll nun anhand der Zeichnung näher erläutert werden. Die einzige Figur zeigt einen Querschnitt durch eine Siliziumplatte, die mit einem Substrat verbunden ist. The invention will now be explained in more detail with reference to the drawing. The single figure shows a cross section through a silicon plate which is connected to a substrate.
Bei der Suche nach einem Silberpulver für den erfindungs-gemässen Gebrauch wurde gefunden, dass sowohl sphärisches als auch flockenförmiges Pulver geeignet ist, obwohl letzteres ein glänzenderes und mehr metallisches Aussehen erzeugt. Es ist interessant, dass einige frühere Forscher für Silberleiter die Verwendung von Flocken spezifizierten, das bezog sich jedoch auf stromführende «Drähte» und nicht auf Bindemittel, wo die Leitfähigkeit mehr durch die Dicke als durch die Länge bedingt ist. In the search for a silver powder for use in accordance with the invention, it was found that both spherical and flake powder are suitable, although the latter produces a more shiny and more metallic appearance. It is interesting that some previous researchers in silver conductors specified the use of flakes, but this was related to current-carrying “wires” and not binders, where conductivity is more a result of thickness than length.
Befriedigend für den erfindungsgemässen Gebrauch ist Silber mit einer Oberfläche im Bereich von 0.2-1 m2/g und einer Schüttdichte von 2.2-2.8 g/cm3. Silver with a surface area in the range of 0.2-1 m2 / g and a bulk density of 2.2-2.8 g / cm3 is satisfactory for the use according to the invention.
Der zweite wichtige Bestandteil ist Glas, wobei es wesentlich ist, dass es tiefschmelzend ist, so dass es bei einer Temperatur zwischen 425-450°C, bei der die Platten verbunden werden, schmilzt. Das bevorzugte Glas, das ausgewählt wurde, und das diese Erfordernisse erfüllt, hat eine Erweichungstemperatur von 325°C und die folgende Zusammensetzung The second important ingredient is glass, where it is essential that it is low-melting so that it melts at a temperature between 425-450 ° C at which the plates are joined. The preferred glass that has been selected and that meets these requirements has a softening temperature of 325 ° C and the following composition
PbO 95-96% PbO 95-96%
S1O2 0.25-2.5% S1O2 0.25-2.5%
B2O3 Rest. B2O3 rest.
Es wurde gefunden, dass kleine Mengen von ZnO, kleiner als 0.5%, nicht schädlich sind, dass aber Natrum unbedingt vermieden werden soll, da es Silizium angreift. It was found that small amounts of ZnO, less than 0.5%, are not harmful, but sodium should be avoided because it attacks silicon.
Wismutoxid kann auch in tiefschmelzende Gläser eingebaut werden, es ist jedoch härter zu mahlen als Bleioxid und greift Platin an, das bei Vorbereitungsarbeiten gebraucht wird. Deshalb ist ein Ersatz von Blei durch Wismuth nicht angezeigt. Das Glas wird gefrittet und in einem hochreinen Tonerdegefäss zerrieben, bis eine Oberflächendichte von 0.3-0.6 m2/g und eine Schüttdichte von 2.8-3.6 g/cm3 erreicht sind. Im allgemeinen können Gläser verwendet werden, die eine Erweichungstemperatur im Bereich von 325°-425°C aufweisen, und einen thermischen Expansionskoeffizient kleiner als 13 ppm/°C aufweisen, wobei dieser bevorzugt im Bereich von 8-13 ppm/°C liegt. Bismuth oxide can also be built into low-melting glasses, but it is harder to grind than lead oxide and attacks platinum, which is used in preparatory work. It is therefore not advisable to replace lead with bismuth. The glass is fritted and ground in a high-purity clay vessel until a surface density of 0.3-0.6 m2 / g and a bulk density of 2.8-3.6 g / cm3 are reached. In general, glasses can be used which have a softening temperature in the range of 325 ° -425 ° C and a thermal expansion coefficient less than 13 ppm / ° C, which is preferably in the range of 8-13 ppm / ° C.
Damit alle organischen Stoffe verbrannt werden, sollte die Erweichungstemperatur mindestens 325° betragen. Wenn die Erweichungstemperatur höher ist als 425°C, ist das Glas nicht genügend flüssig bei der Temperatur, bei der die Platte aufgebracht wird. Das Glas wird anschliessend mit dem weiter unten beschriebenen Mittel gemischt (80% Festkörperanteil) und in einer Mühle mit drei Kugeln bis zu einer Teil-chengrösse (F.O.G.) von 7-8 Mikron gemahlen. The softening temperature should be at least 325 ° so that all organic substances are burned. If the softening temperature is higher than 425 ° C, the glass is not sufficiently liquid at the temperature at which the plate is applied. The glass is then mixed with the agent described below (80% solids content) and ground in a mill with three balls to a particle size (F.O.G.) of 7-8 microns.
Der Fachmann weiss, dass die Wahl des Mittels nicht kritisch ist, und dass eine grosse Auswahl geeigneter Mittel zur Verfügung steht. Selbstverständlich muss bei der angegebenen Temperatur die Verbrennung vollständig sein. In diesem Fall enthält das gewählte Mittel 12% Athylmetacrylat und 88% Terpinol. Das Silber wird anschliessend in dem gewünschten und weiter unten beschriebenen Verhältnis von Silber zu Glas zur Glaspaste gegeben, wobei das Verhältnis zwischen den Grenzen von 25:75-95:5 liegt. Der totale Prozentanteil der Feststoffe auf einen Anteil im Bereich von 75-85% wird durch die Beigabe von Zusatzmittel erreicht. Ausserhalb dieses Bereichs treten oft rheologische Probleme auf, so dass im allgemeinen ein Feststoffgehalt im Bereich von 80-83% bevorzugt wird. In diesem Bereich besitzt die Paste normalerweise eine Viskosität von 200-220 Poise (22-22 Kcps), gemessen auf einem Brookfield RVT Viskosi- . meter mit einer TF-Spindel wovie 20 RPM und 25°C. Der Gebrauch der Paste erfolgt im wesentlichen nach bekannter The person skilled in the art knows that the choice of the agent is not critical and that a large selection of suitable agents is available. Of course, the combustion must be complete at the specified temperature. In this case the chosen agent contains 12% ethyl methacrylate and 88% terpinol. The silver is then added in the desired ratio of silver to glass to glass paste described below, the ratio being between the limits of 25: 75-95: 5. The total percentage of solids in a range of 75-85% is achieved by adding additives. Rheological problems often occur outside this range, so that a solids content in the range of 80-83% is generally preferred. In this area, the paste usually has a viscosity of 200-220 poise (22-22 Kcps), measured on a Brookfield RVT viscose. meters with a TF spindle like 20 RPM and 25 ° C. The paste is used essentially according to known methods
Praxis. Abhängig von der Anwendung wird ein Punkt, ein Viereck oder ein gestreutes Gebiet der Paste auf das metallisierte oder unbehandelte filmartige Substrat, beispielsweise aus Keramik, aufgetragen, wobei maschinelles Auftragen, Siebdruck oder Stempeltechniken anwendbar sind. Practice. Depending on the application, a dot, a square or a scattered area of the paste is applied to the metallized or untreated film-like substrate, for example made of ceramic, whereby machine application, screen printing or stamping techniques can be used.
Wenn die Paste punktförmig aufgetragen wird, ist die Grösse des Punktes etwa 25% grösser als die Platte. Die Platte wird aufgebracht, indem sie ins Zentrum der feuchten Paste geführt und unter Druck gesetzt wird, so dass die Paste etwa halbwegs auf der Seite der Platte hinauffliesst und unterhalb der Platte ein dünner Film besteht. In einem Ofen wird bei 50-75°C während 20-40 Minuten getrocknet. Das Verbrennen der organischen Stoffe wird durch zyklisches Erhitzen während 2-3 Minuten auf eine maximale Temperatur im Bereich von 325-450°C erreicht, wobei die Zykluszeit etwa 15-20 Minuten dauert. In der Zeichnung ist ein Substrat 10 dargestellt, auf dem eine Platte 12 mit einer Schicht 14 aus silberhaltigem Glas befestigt ist, wobei gut sichtbar ist, dass durch das Setzen der Platte 12 das Glas 14 um die Ecken der Platte 12 und aufwärts geflossen ist. Für Testzwecke wird die Einheit einem simulierten Versiegelungszyklus im Bereich von 430°-525°C unterworfen, davon 15 Minuten bei 430°C. If the paste is applied in a dot shape, the size of the dot is about 25% larger than the plate. The plate is applied by guiding it into the center of the moist paste and putting it under pressure so that the paste flows approximately halfway up the side of the plate and there is a thin film underneath the plate. Dried in an oven at 50-75 ° C for 20-40 minutes. The burning of the organic matter is achieved by cyclical heating for 2-3 minutes to a maximum temperature in the range of 325-450 ° C, the cycle time taking about 15-20 minutes. In the drawing, a substrate 10 is shown, on which a plate 12 with a layer 14 made of silver-containing glass is fastened, it being clearly visible that the glass 14 has flowed around the corners of the plate 12 and upwards by the setting of the plate 12. For testing purposes, the unit is subjected to a simulated sealing cycle in the range of 430 ° -525 ° C, including 15 minutes at 430 ° C.
Die Platte kann auch durch die bekannte Schrubbtechnik oder durch Vibration unter Wärmeeinwirkung befestigt werden. Überraschend ist, dass die mechanische Stärke der Bindung proportional zum Silbergehalt ist. Bei der Anwendung eines standardisierten Drucktestes (Mil. Spec. 883 B, Verfahren 2019.1) wurde ein Bereich von 2 bis 8 kp bei einem Silbergehalt von 30-95% festgestellt. Wie erwartet wird die elektrische Leitfähigkeit mit zunehmendem Silbergehalt verbessert. Beim tieferen Ende ist der Widerstand vergleichbar mit demjenigen handelsüblicher Epoxide 25 * 10-6—35 • 10"6 Ohm • cm (25-35 jx ohm*cm)beispielsweise EPO-TEK P.10, und fällt auf 5-10 jx ohm • cm bei hohem Silbergehalt. Nach dem Metallisieren des Substrats wurden annehmbare Befestigungen bei Silber zu Glas Verhältnissen im Bereich von 25:75 bis 95:5 erreicht. Auf unbehandelter Tonerde werden diese Verhältnisse bevorzugt in einem Bereich von 50:50 bis 90:10 gehalten. Àls «annehmbar» werden hier Werte bezeichnet, die über der Mil.spec. von 1.9 kp liegen. The plate can also be attached by the known scrubbing technique or by vibration under the influence of heat. It is surprising that the mechanical strength of the bond is proportional to the silver content. When using a standardized pressure test (Mil. Spec. 883 B, procedure 2019.1), a range from 2 to 8 kp with a silver content of 30-95% was determined. As expected, the electrical conductivity improves with increasing silver content. At the lower end, the resistance is comparable to that of commercially available epoxies 25 * 10-6—35 • 10 "6 ohms • cm (25-35 jx ohms * cm), for example EPO-TEK P.10, and falls to 5-10 jx ohms • cm with high silver content After the substrate has been metallized, acceptable fixings for silver to glass ratios in the range from 25:75 to 95: 5 have been achieved, and these ratios are preferably kept in a range from 50:50 to 90:10 on untreated alumina Àls “acceptable” are values that are above the mil.spec. Of 1.9 kp.
Da sowohl die Bindungsstärke als auch die Leitfähigkeit mit dem Silbergehalt steigt, stellt sich die Frage nach der Nützlichkeit der Zusammensetzung mit tiefem Silber- und hohem Glasgehalt. Die Antwort richtet sich im allgemeinen nach dem beabsichtigten Gebrauch. Insbesondere wenn die Platte mit mechanischen Schrubbmitteln befestigt wird, werden gute Bindungen mit einem Silberanteil im Bereich von 25-40% erreicht. In Fällen, wo es erwünscht ist, dass die Platte teilweise in der Paste versinkt, wird ein hoher Silberanteil bevorzugt. Bei sehr hohem Silberanteil, beispielsweise zwischen 75-95%, haben Tests ergeben, dass die Paste auf das ungehandelte Substrat aufgetragen und der Chip mit Ultraschall angeklebt werden kann. Es ist nicht beabsichtigt, den Silbergehalt viel über 90% zu erhöhen, da die Adhäsion abzufallen beginnt. Es gibt also mehrere Möglichkeiten, einschliesslich der Elimination gewisser Verfahrensschritte, um beispielsweise Bleifassungen und Platten gleichzeitig aufzubringen. Es ist möglich, ein Teil des Silber durch andere Metalle zu substituieren, dadurch fällt jedoch die Adhäsion und steigt der Widerstand. Beispielsweise wurden bis 10% Ni, bis 60% Sn und bis etwa 20% Cu substituiert, wobei annehmbare Bindungsstärken resultierten, vorausgesetzt, das Erhitzen wurde in Luft durchgeführt und nicht in Stickstoff, und das gesamte Metall: Glas Verhältnis betrug 80:20 (Erhitzen in Stickstoff reduzierte das Bleioxid und zerstörte das Glas). Since both the bond strength and the conductivity increase with the silver content, the question arises as to the usefulness of the composition with low silver and high glass content. The answer generally depends on the intended use. Particularly when the plate is fixed with mechanical scrubbing agents, good bonds with a silver content in the range of 25-40% are achieved. In cases where it is desired that the plate partially sink into the paste, a high silver content is preferred. With a very high silver content, for example between 75-95%, tests have shown that the paste can be applied to the untreated substrate and the chip can be glued on with ultrasound. The silver content is not intended to be increased much above 90% as the adhesion begins to decrease. There are therefore several options, including the elimination of certain process steps, for example to apply lead sockets and plates at the same time. It is possible to substitute some of the silver with other metals, but this will decrease the adhesion and increase the resistance. For example, up to 10% Ni, up to 60% Sn, and up to about 20% Cu were substituted to give acceptable bond strengths, provided the heating was done in air rather than nitrogen and the total metal: glass ratio was 80:20 (heating in nitrogen reduced the lead oxide and destroyed the glass).
s s
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Ó32 737 Ó32 737
Ein wichtiger Gesichtspunkt der Erfindung ist ihre Anwendbarkeit auf grössere integrierte Schaltungen, die zusehends mehr in Gebrauch kommen. Beispielsweise ist bekannt, dass das Gold-Silizium Eutektikum eine spröde intermetallische Verbindung ist, und dass jedes bindende Material die unterschiedlichen thermischen Expansionsgeschwindigkeiten vom Substrat und von der Platte abkommo-dieren muss. Bei kleinen Chips ist dies kein grosses Problem, aber im VLSIC-Bereich kann die Temperatur im Versiegelungszyklus durch thermische Spannungen den Bruch des Chips und der Verbindung verursachen. Da die Zusammensetzung der vorliegenden Erfindung verursachen. Da die Zusammensetzung der vorliegenden Erfindung erweicht wird, aber nicht schmilzt, werden solche thermische Spannungen vermieden, wie thermischen Schock-Tests gezeigt wurde (Mil. spec. Standard 883B, Kondition A). An important aspect of the invention is its applicability to larger integrated circuits that are increasingly in use. For example, it is known that the gold-silicon eutectic is a brittle intermetallic compound, and that each binding material has to decode the different thermal expansion rates from the substrate and from the plate. This is not a big problem with small chips, but in the VLSIC area, the temperature in the sealing cycle can cause the chip and the connection to break due to thermal stresses. Because the composition of the present invention cause. Since the composition of the present invention is softened but does not melt, such thermal stresses are avoided as thermal shock tests have shown (Mil. Spec. Standard 883B, Condition A).
Schliesslich stellt sich noch die Frage, ob es Anwendungen gibt, bei denen es wünschenswert wäre, einen Teil des Silbers durch ein Edelmetall, beispielsweise Gold, zu ersetzen. Es wurde gefunden, dass durch diese Massnahme keine besonderen Vorteile erreichbar sind. Beispielsweise wurde eine standard-Goldpaste gemischt mit einer Paste mit Silber: Glas Verhältnis von 80:20, wobei die Anteile von Ag zu Au im Bereich von 10/90 bis 80/20 lagen. Finally, the question arises whether there are applications in which it would be desirable to replace part of the silver with a noble metal, for example gold. It was found that no special advantages can be achieved through this measure. For example, a standard gold paste was mixed with a paste with a silver: glass ratio of 80:20, the proportions of Ag to Au being in the range from 10/90 to 80/20.
Während die Leitfähigkeit des Bindemittels zum Chip mit höherem Goldgehalt steigende Tendenz zeigte, waren die Resultate unbestimmt, so dass die hohen Kosten für diese Substitution nicht gerechtfertigt sind. Darüberhinaus tendierte die Schiebestärke des Bindemittels bei höherem Goldanteil zu fallen, obwohl sie immer annehmbar war. Es wurde kein Gold-Silizium Eutektikum beobachtet, vermutlich wegen den Eigenschaften des ternären Phasendiagramms von Au-Ag-Si. Es gibt deshalb keinen naheliegenden Grund, der die beachtlichen Aufwendungen für den Ersatz von s Silber durch Gold rechtfertigen würde. While the conductivity of the binder to the chip with a higher gold content showed an increasing tendency, the results were uncertain, so that the high costs for this substitution are not justified. In addition, the sliding strength of the binder tended to decrease with a higher gold content, although it was always acceptable. No gold-silicon eutectic was observed, presumably because of the properties of the Au-Ag-Si ternary phase diagram. There is therefore no obvious reason to justify the considerable expense of replacing silver with gold.
Eine weitere wichtige Anwendung der Erfindung liegt bei der Befestigung von Chip-Kondensatoren auf einem Substrat. Beispielsweise wurde ein 120x90x35 mm Kondensator in einen 5-7 mm Pfad des silberhaltigen Glases gesetzt und io wie beschrieben getrocknet und erhitzt. Die Schiebekraft war 6,2 kp und ein guter elektrischer Kontakt konnte seitlich hergestellt werden. Für die Herstellung von Hybridschaltungen hat dies wichtige Vorteile, nämlich, Schaltungschips und Kondensatoren können in einem Zyklus befestigt, getrocknet 15 und erhitzt werden, wobei eine gute Bindung erreicht wird. Darüberhinaus können anschliessende Verfahrensschritte oder Operationen bei Temperaturen durchgeführt werden, die übliche Lötmassen schmelzen würden. Another important application of the invention is in the attachment of chip capacitors to a substrate. For example, a 120x90x35 mm capacitor was placed in a 5-7 mm path of the silver-containing glass and dried and heated as described. The pushing force was 6.2 kp and good electrical contact could be made laterally. This has important advantages for the production of hybrid circuits, namely that circuit chips and capacitors can be attached, dried and heated in one cycle, whereby a good bond is achieved. In addition, subsequent process steps or operations can be carried out at temperatures that would melt conventional soldering compounds.
Eine weitere Anwendung der Erfindung ist der Lötmit-20 telersatz. Beispielsweise wird f>ei einem bevorzugten Ag:Glas Verhältnis von 80:20 und einem Feststoffgehalt von 80:85% die erfindungsgemässe Zusammensetzung die zu lötende Vorrichtung während dem Erhitzungszyklus «halten», während demgegenüber Lötmittel ein Abgleiten ermöglichen. 25 Vielerlei Änderungen in Details, Verfahrensschritten, Materialien und Anordnungen von Teilen, die beschrieben und illustriert wurden, um die Erfindung zu beschreiben, können durch den Fachmann vorgenommen werden, ohne dass dadurch der Schutzbereich der Patentansprüche über-30 schritten wird. Another application of the invention is the solder-20 replacement. For example, for a preferred Ag: glass ratio of 80:20 and a solids content of 80: 85%, the composition according to the invention will “hold” the device to be soldered during the heating cycle, whereas, on the other hand, solder will allow it to slide off. 25 Various changes in details, method steps, materials and arrangements of parts which have been described and illustrated to describe the invention can be carried out by the person skilled in the art without thereby exceeding the scope of protection of the patent claims.
B B
1 Blatt Zeichnungen 1 sheet of drawings
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28789281A | 1981-08-03 | 1981-08-03 | |
US06/355,719 US4401767A (en) | 1981-08-03 | 1982-03-08 | Silver-filled glass |
Publications (1)
Publication Number | Publication Date |
---|---|
CH652737A5 true CH652737A5 (en) | 1985-11-29 |
Family
ID=26964708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH4606/82A CH652737A5 (en) | 1981-08-03 | 1982-07-29 | METALLIC, SILVER-CONTAINING PASTE WITH GLASS AND THEIR USE FOR FASTENING ELECTRONIC COMPONENTS. |
Country Status (7)
Country | Link |
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CH (1) | CH652737A5 (en) |
DE (1) | DE3227815A1 (en) |
FR (1) | FR2513240B1 (en) |
GB (1) | GB2103250B (en) |
IE (1) | IE53305B1 (en) |
NL (1) | NL8203081A (en) |
PH (1) | PH19754A (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3414065A1 (en) * | 1984-04-13 | 1985-12-12 | Siemens AG, 1000 Berlin und 8000 München | Configuration comprising at least one electronic component fixed on a substrate, and process for fabricating a configuration of this type |
US4699888A (en) * | 1985-09-16 | 1987-10-13 | Technology Glass Corporation | Die/attach composition |
US4906596A (en) * | 1987-11-25 | 1990-03-06 | E. I. Du Pont De Nemours & Co. | Die attach adhesive composition |
GB8730196D0 (en) * | 1987-12-24 | 1988-02-03 | Johnson Matthey Plc | Silver-filled glass |
DE3837300A1 (en) * | 1988-11-03 | 1990-05-23 | Messerschmitt Boelkow Blohm | Method for producing microelectronic circuits and hybrids |
US5180523A (en) * | 1989-11-14 | 1993-01-19 | Poly-Flex Circuits, Inc. | Electrically conductive cement containing agglomerate, flake and powder metal fillers |
DE19816309B4 (en) * | 1997-04-14 | 2008-04-03 | CiS Institut für Mikrosensorik gGmbH | Method for direct mounting of silicon sensors and sensors manufactured thereafter |
DE102012206362B4 (en) | 2012-04-18 | 2021-02-25 | Rohde & Schwarz GmbH & Co. Kommanditgesellschaft | Circuit arrangement for thermally conductive chip assembly and manufacturing process |
CN116018884B (en) * | 2020-10-20 | 2024-10-18 | 株式会社东芝 | Bonded body, ceramic circuit board using the same, and semiconductor device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2385580A (en) * | 1944-07-01 | 1945-09-25 | Du Pont | Vitrifiable flux and bonding composition containing same |
DE1646882B1 (en) * | 1965-07-29 | 1970-11-19 | Du Pont | Precious metal mass to be burned onto ceramic carriers |
SU391187A1 (en) * | 1971-04-06 | 1973-07-25 | PASTE FOR METALIZATION OF CERAMICS | |
US3824127A (en) * | 1971-12-22 | 1974-07-16 | Du Pont | Disc capacitor silver compositions |
JPS5116344A (en) * | 1974-07-31 | 1976-02-09 | Fujikura Kasei Kk | Bodongarasuno netsusenyotoryo |
-
1982
- 1982-07-26 DE DE19823227815 patent/DE3227815A1/en not_active Withdrawn
- 1982-07-27 PH PH27636A patent/PH19754A/en unknown
- 1982-07-29 CH CH4606/82A patent/CH652737A5/en not_active IP Right Cessation
- 1982-07-30 IE IE1840/82A patent/IE53305B1/en unknown
- 1982-07-30 FR FR8213366A patent/FR2513240B1/en not_active Expired
- 1982-07-30 GB GB08222054A patent/GB2103250B/en not_active Expired
- 1982-08-03 NL NL8203081A patent/NL8203081A/en not_active Application Discontinuation
Also Published As
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GB2103250B (en) | 1986-02-26 |
GB2103250A (en) | 1983-02-16 |
FR2513240B1 (en) | 1986-07-25 |
NL8203081A (en) | 1983-03-01 |
IE821840L (en) | 1983-02-03 |
DE3227815A1 (en) | 1983-02-24 |
PH19754A (en) | 1986-06-26 |
IE53305B1 (en) | 1988-10-12 |
FR2513240A1 (en) | 1983-03-25 |
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