CH613474A5 - - Google Patents

Info

Publication number
CH613474A5
CH613474A5 CH794375A CH794375A CH613474A5 CH 613474 A5 CH613474 A5 CH 613474A5 CH 794375 A CH794375 A CH 794375A CH 794375 A CH794375 A CH 794375A CH 613474 A5 CH613474 A5 CH 613474A5
Authority
CH
Switzerland
Application number
CH794375A
Inventor
Christian Sivertz
Anthony J Basilone
Original Assignee
London Laboratories
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by London Laboratories filed Critical London Laboratories
Publication of CH613474A5 publication Critical patent/CH613474A5/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
CH794375A 1974-06-20 1975-06-18 CH613474A5 (xx)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48133274A 1974-06-20 1974-06-20
US05/521,338 US3963842A (en) 1974-06-20 1974-11-06 Deposition of copper

Publications (1)

Publication Number Publication Date
CH613474A5 true CH613474A5 (xx) 1979-09-28

Family

ID=27046920

Family Applications (1)

Application Number Title Priority Date Filing Date
CH794375A CH613474A5 (xx) 1974-06-20 1975-06-18

Country Status (14)

Country Link
US (1) US3963842A (xx)
JP (1) JPS5116235A (xx)
AR (1) AR213613A1 (xx)
AU (1) AU497522B2 (xx)
BR (1) BR7503834A (xx)
CA (1) CA1060284A (xx)
CH (1) CH613474A5 (xx)
DE (1) DE2527096C3 (xx)
FR (1) FR2275566A1 (xx)
GB (1) GB1518301A (xx)
HK (1) HK25482A (xx)
IE (1) IE41295B1 (xx)
IN (1) IN143978B (xx)
IT (1) IT1040660B (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3148280A1 (de) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
JPS58134458U (ja) * 1982-03-03 1983-09-09 佐藤 忠吉 水質管理装置
JPH0430539Y2 (xx) * 1984-10-31 1992-07-23
GB2206128B (en) * 1987-06-23 1991-11-20 Glaverbel Copper mirrors and method of manufacturing same
US5419926A (en) * 1993-11-22 1995-05-30 Lilly London, Inc. Ammonia-free deposition of copper by disproportionation

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB152835A (en) * 1919-09-05 1920-10-28 John David Smith Improvements in the deposition of copper on non-conducting surfaces
US2783193A (en) * 1952-09-17 1957-02-26 Motorola Inc Electroplating method
US2900274A (en) * 1953-12-16 1959-08-18 Owens Corning Fiberglass Corp Method of providing glass filaments with a coating of silver
US2759845A (en) * 1954-10-25 1956-08-21 Metropolitan Mirror And Glass Processes of precipitating copper from copper sulfate solutions and precipitating media for so doing
US2922737A (en) * 1956-05-08 1960-01-26 Moudry Zdenek Vaclav Methods for producing colloidal oligodynamic metal compositions
US2977244A (en) * 1958-02-01 1961-03-28 Pilkington Brothers Ltd Method of depositing metallic copper
FR1225702A (fr) * 1958-02-01 1960-07-04 Pilkington Brothers Ltd Procédé pour le dépôt de cuivre métallique
GB859448A (en) * 1958-03-11 1961-01-25 Pilkington Brothers Ltd Improvements in or relating to metallising
US2967112A (en) * 1958-03-11 1961-01-03 Pilkington Brothers Ltd Method and apparatus for applying metal-depositing solutions
US2963383A (en) * 1959-05-14 1960-12-06 Kay Chemicals Inc Spray silvering procedures
US3093509A (en) * 1959-09-28 1963-06-11 Wein Samuel Process for making copper films
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3615732A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3645749A (en) * 1970-06-04 1972-02-29 Kollmorgen Corp Electroless plating baths with improved deposition rates

Also Published As

Publication number Publication date
HK25482A (en) 1982-06-18
GB1518301A (en) 1978-07-19
DE2527096C3 (de) 1984-09-20
CA1060284A (en) 1979-08-14
DE2527096B2 (de) 1978-07-13
IN143978B (xx) 1978-03-04
FR2275566B1 (xx) 1980-12-12
IT1040660B (it) 1979-12-20
AR213613A1 (es) 1979-02-28
DE2527096A1 (de) 1976-01-08
US3963842A (en) 1976-06-15
JPS5116235A (en) 1976-02-09
US3963842B1 (xx) 1988-08-23
FR2275566A1 (fr) 1976-01-16
AU8215175A (en) 1976-12-23
JPS5631353B2 (xx) 1981-07-21
BR7503834A (pt) 1976-07-06
IE41295B1 (en) 1979-12-05
IE41295L (en) 1975-12-20
AU497522B2 (en) 1978-12-14

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Legal Events

Date Code Title Description
PL Patent ceased