CH612612A5 - - Google Patents
Info
- Publication number
- CH612612A5 CH612612A5 CH684478A CH684478A CH612612A5 CH 612612 A5 CH612612 A5 CH 612612A5 CH 684478 A CH684478 A CH 684478A CH 684478 A CH684478 A CH 684478A CH 612612 A5 CH612612 A5 CH 612612A5
- Authority
- CH
- Switzerland
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01038—Strontium [Sr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2823360A DE2823360C3 (de) | 1978-05-29 | 1978-05-29 | Vorrichtung zur Überführung von Gegenständen |
Publications (1)
Publication Number | Publication Date |
---|---|
CH612612A5 true CH612612A5 (pt) | 1979-08-15 |
Family
ID=6040432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH684478A CH612612A5 (pt) | 1978-05-29 | 1978-06-22 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4221533A (pt) |
CH (1) | CH612612A5 (pt) |
DE (1) | DE2823360C3 (pt) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0177561A1 (en) * | 1984-03-22 | 1986-04-16 | Mostek Corp | CHIP SELECTION IN THE AUTOMATIC MOUNTING OF AN INTEGRATED CIRCUIT. |
CN111702543A (zh) * | 2020-07-02 | 2020-09-25 | 潘家祥 | 一种用于曲轴滚压机床加工的上下料设备 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2935081C2 (de) * | 1979-08-30 | 1985-12-19 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung zur Bestückung von Leiterplatten. |
US4364707A (en) * | 1980-05-06 | 1982-12-21 | Advanced Semiconductor Materials Die Bonding Inc. | Object transport apparatus |
NL8201532A (nl) * | 1982-04-13 | 1983-11-01 | Philips Nv | Werkwijze en inrichting voor het controleren van de aanwezigheid respectievelijk afwezigheid van een voorwerp op het uiteinde van een vacuuem-opnemer. |
US4498833A (en) * | 1982-05-24 | 1985-02-12 | Varian Associates, Inc. | Wafer orientation system |
US4520834A (en) * | 1983-11-08 | 1985-06-04 | Dicicco Paolo S | Apparatus for processing articles in a series of process solution containers |
US4557663A (en) * | 1984-01-09 | 1985-12-10 | Westinghouse Electric Corp. | Modular, low cost, pogrammable assembly system |
US4604910A (en) * | 1984-02-22 | 1986-08-12 | Kla Instruments Corporation | Apparatus for accurately positioning an object at each of two locations |
FR2563343B1 (fr) * | 1984-04-19 | 1986-06-13 | Rhone Poulenc Sante | Dispositif pour effectuer des prelevements dans des milieux semi-solides |
GB9624927D0 (en) | 1996-11-29 | 1997-01-15 | Oxford Glycosciences Uk Ltd | Gels and their use |
US5993627A (en) | 1997-06-24 | 1999-11-30 | Large Scale Biology Corporation | Automated system for two-dimensional electrophoresis |
US6554991B1 (en) | 1997-06-24 | 2003-04-29 | Large Scale Proteomics Corporation | Automated system for two-dimensional electrophoresis |
EP0923111B1 (de) * | 1997-12-07 | 2007-05-02 | Oerlikon Assembly Equipment AG, Steinhausen | Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer |
GB9811656D0 (en) | 1998-05-29 | 1998-07-29 | Oxford Glycosciences Uk Ltd | Gels, methods and apparatus for identification and characterization of biomolecules |
US6727970B2 (en) | 2001-06-25 | 2004-04-27 | Avery Dennison Corporation | Method of making a hybrid display device having a rigid substrate and a flexible substrate |
US6856086B2 (en) * | 2001-06-25 | 2005-02-15 | Avery Dennison Corporation | Hybrid display device |
US6811815B2 (en) | 2002-06-14 | 2004-11-02 | Avery Dennison Corporation | Method for roll-to-roll deposition of optically transparent and high conductivity metallic thin films |
US7101141B2 (en) * | 2003-03-31 | 2006-09-05 | Intel Corporation | System for handling microelectronic dies having a compact die ejector |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3648143A (en) * | 1969-08-25 | 1972-03-07 | Harper Associates Inc | Automatic work-repeating mechanism |
AT336926B (de) * | 1972-12-22 | 1977-06-10 | Siemens Ag | Inspektions- und reparatureinrichtung fur dampferzeuger |
US4005782A (en) * | 1974-03-04 | 1977-02-01 | Engineered Metal Products Company, Inc. | Picker |
US4146924A (en) * | 1975-09-22 | 1979-03-27 | Board Of Regents For Education Of The State Of Rhode Island | System for visually determining position in space and/or orientation in space and apparatus employing same |
US4119211A (en) * | 1976-10-22 | 1978-10-10 | Western Electric Company, Inc. | Method and apparatus for transferring articles while re-establishing their orientation |
-
1978
- 1978-05-29 DE DE2823360A patent/DE2823360C3/de not_active Expired
- 1978-06-22 CH CH684478A patent/CH612612A5/xx not_active IP Right Cessation
- 1978-08-07 US US05/931,336 patent/US4221533A/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0177561A1 (en) * | 1984-03-22 | 1986-04-16 | Mostek Corp | CHIP SELECTION IN THE AUTOMATIC MOUNTING OF AN INTEGRATED CIRCUIT. |
EP0177561A4 (en) * | 1984-03-22 | 1989-03-22 | Mostek Corp | CHIP SELECTION WITH AUTOMATIC ASSEMBLY OF INTEGRATED CIRCUIT. |
CN111702543A (zh) * | 2020-07-02 | 2020-09-25 | 潘家祥 | 一种用于曲轴滚压机床加工的上下料设备 |
Also Published As
Publication number | Publication date |
---|---|
DE2823360C3 (de) | 1981-06-25 |
US4221533A (en) | 1980-09-09 |
DE2823360B2 (de) | 1980-10-23 |
DE2823360A1 (de) | 1979-12-06 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |