Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
  • H01L23/5385—Assembly of a plurality of insulating substrates
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
• Non-Metallic Protective Coatings For Printed Circuits (AREA)
• Insulated Metal Substrates For Printed Circuits (AREA)
• Structure Of Printed Boards (AREA)
• Manufacturing Of Electric Cables (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Combinations Of Printed Boards (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=5959463

Family Applications (1)

Country Status (7)

Families Citing this family (2)

Family Cites Families (5)

• 1975
  • 1975-10-17 DE DE2546736A patent/DE2546736C3/de not_active Expired
• 1976
  • 1976-09-07 CH CH1131376A patent/CH604376A5/xx not_active IP Right Cessation
  • 1976-09-13 GB GB37801/76A patent/GB1548980A/en not_active Expired
  • 1976-10-06 US US05/730,285 patent/US4097685A/en not_active Expired - Lifetime
  • 1976-10-13 IT IT28250/76A patent/IT1077067B/it active
  • 1976-10-15 SE SE7611484A patent/SE7611484L/xx not_active Application Discontinuation
  • 1976-10-18 JP JP51124796A patent/JPS5279264A/ja active Pending

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