CH596733A5 - - Google Patents

Info

Publication number
CH596733A5
CH596733A5 CH1246975A CH1246975A CH596733A5 CH 596733 A5 CH596733 A5 CH 596733A5 CH 1246975 A CH1246975 A CH 1246975A CH 1246975 A CH1246975 A CH 1246975A CH 596733 A5 CH596733 A5 CH 596733A5
Authority
CH
Switzerland
Application number
CH1246975A
Inventor
Kjell Arne Cederberg
Jiri Kamil Dr Phil Konicek
Hans Rune Malm
Original Assignee
Perstorp Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perstorp Ag filed Critical Perstorp Ag
Publication of CH596733A5 publication Critical patent/CH596733A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1388—Temporary protective conductive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CH1246975A 1974-09-27 1975-09-25 CH596733A5 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7412169A SE7412169L (sv) 1974-09-27 1974-09-27 Forfarande vid framstellning av genomgaende hal i ett laminat

Publications (1)

Publication Number Publication Date
CH596733A5 true CH596733A5 (ko) 1978-03-15

Family

ID=20322242

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1246975A CH596733A5 (ko) 1974-09-27 1975-09-25

Country Status (9)

Country Link
US (1) US4023998A (ko)
JP (1) JPS5842640B2 (ko)
CH (1) CH596733A5 (ko)
DE (1) DE2541282C2 (ko)
FR (1) FR2286578A1 (ko)
GB (1) GB1502975A (ko)
IT (1) IT1042430B (ko)
NL (1) NL7510374A (ko)
SE (1) SE7412169L (ko)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432763A (en) * 1977-08-18 1979-03-10 Hitachi Ltd Method of making print wire board
US4323421A (en) * 1978-04-28 1982-04-06 Bell Telephone Laboratories, Incorporated Fabrication of conductor-clad composites using molding compounds and techniques
US4393111A (en) * 1980-02-15 1983-07-12 Bell Telephone Laboratories, Incorporated Fabrication of conductor-clad composites using molding compounds and techniques
DE3008143C2 (de) * 1980-03-04 1982-04-08 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen von gedruckten Leiterplatten mit Lochungen, deren Wandungen metallisiert sind
JPS60244091A (ja) * 1984-05-18 1985-12-03 富士通株式会社 バリ除去方法
JPS627194A (ja) * 1985-07-04 1987-01-14 旭化成株式会社 スル−ホ−ル回路
US5004521A (en) * 1988-11-21 1991-04-02 Yamaha Corporation Method of making a lead frame by embossing, grinding and etching
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
US5528826A (en) * 1994-04-04 1996-06-25 Hughes Aircraft Company Method of constructing high yield, fine line, multilayer printed wiring board panel
GB9420182D0 (en) * 1994-10-06 1994-11-23 Int Computers Ltd Printed circuit manufacture
US5590854A (en) * 1994-11-02 1997-01-07 Shatz; Solomon Movable sheet for laminar flow and deicing
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board
TNSN97123A1 (fr) * 1996-07-18 1999-12-31 Droz Francois Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
CA2387803C (en) 1999-12-09 2010-02-09 Valspar Sourcing, Inc. Abrasion resistant coatings
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
JP2003158358A (ja) * 2001-11-26 2003-05-30 Hitachi Via Mechanics Ltd レーザー穴あけ加工方法及び装置
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
US7618514B2 (en) * 2006-02-03 2009-11-17 United Technologies Corporation Photo-etched EDM electrode
EP2191701B1 (en) 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Entry sheet, method of manufacturing thereof and methods for drilling holes in printed circuit boards
CN103317298A (zh) * 2013-05-08 2013-09-25 孙树峰 飞秒激光辅助抑制微切削零件毛刺形成的方法
EP3011810A4 (en) * 2013-06-21 2017-04-05 Sanmina Corporation Method of forming a laminate structure having a plated through-hole using a removable cover layer
EP2853619A1 (en) 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Method for treatment of recessed structures in dielectric materials for smear removal
US10244640B2 (en) * 2014-02-21 2019-03-26 Mitsui Mining & Smelting Co., Ltd. Copper clad laminate provided with protective layer and multilayered printed wiring board
CN104923925B (zh) * 2015-05-12 2017-11-17 中国科学院微电子研究所 一种降低激光热效应的玻璃通孔制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653997A (en) * 1970-06-22 1972-04-04 North American Rockwell Conditioning and shaping solution for circuit boards
US3719536A (en) * 1971-02-12 1973-03-06 Alumet Corp Mechanochemical sheet metal blanking system
US3936548A (en) * 1973-02-28 1976-02-03 Perstorp Ab Method for the production of material for printed circuits and material for printed circuits

Also Published As

Publication number Publication date
FR2286578B1 (ko) 1980-04-11
DE2541282A1 (de) 1976-04-08
SE7412169L (sv) 1976-03-29
IT1042430B (it) 1980-01-30
JPS5160955A (en) 1976-05-27
FR2286578A1 (fr) 1976-04-23
JPS5842640B2 (ja) 1983-09-21
US4023998A (en) 1977-05-17
DE2541282C2 (de) 1983-11-17
NL7510374A (nl) 1976-03-30
GB1502975A (en) 1978-03-08

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Legal Events

Date Code Title Description
PL Patent ceased