CH570702A5 - - Google Patents
Info
- Publication number
- CH570702A5 CH570702A5 CH1462474A CH1462474A CH570702A5 CH 570702 A5 CH570702 A5 CH 570702A5 CH 1462474 A CH1462474 A CH 1462474A CH 1462474 A CH1462474 A CH 1462474A CH 570702 A5 CH570702 A5 CH 570702A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/141—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being on at least the sidewalls of the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2400863A DE2400863B2 (de) | 1974-01-09 | 1974-01-09 | Verfahren zur Kontaktierung der Elektroden eines scheibenförmigen Halbleiterelementes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH570702A5 true CH570702A5 (cg-RX-API-DMAC7.html) | 1975-12-15 |
Family
ID=5904412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1462474A CH570702A5 (cg-RX-API-DMAC7.html) | 1974-01-09 | 1974-10-31 |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH570702A5 (cg-RX-API-DMAC7.html) |
| DE (1) | DE2400863B2 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2257147A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2801287C3 (de) * | 1978-01-13 | 1981-03-26 | Brown, Boveri & Cie Ag, 6800 Mannheim | Lackdosiervorrichtung |
| DE3137570A1 (de) * | 1980-09-25 | 1983-03-31 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zum direkten verbinden von kupferteilen mit oxidkeramiksubstraten |
| US7443014B2 (en) * | 2005-10-25 | 2008-10-28 | Infineon Technologies Ag | Electronic module and method of assembling the same |
-
1974
- 1974-01-09 DE DE2400863A patent/DE2400863B2/de not_active Withdrawn
- 1974-10-31 CH CH1462474A patent/CH570702A5/xx not_active IP Right Cessation
-
1975
- 1975-01-07 FR FR7500378A patent/FR2257147A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2257147A1 (en) | 1975-08-01 |
| DE2400863B2 (de) | 1980-04-24 |
| DE2400863A1 (de) | 1975-07-17 |
| FR2257147B1 (cg-RX-API-DMAC7.html) | 1978-07-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased | ||
| PL | Patent ceased |