CH554600A - Halbleiterbauelement. - Google Patents

Halbleiterbauelement.

Info

Publication number
CH554600A
CH554600A CH1491173A CH1491173A CH554600A CH 554600 A CH554600 A CH 554600A CH 1491173 A CH1491173 A CH 1491173A CH 1491173 A CH1491173 A CH 1491173A CH 554600 A CH554600 A CH 554600A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
CH1491173A
Other languages
German (de)
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH554600A publication Critical patent/CH554600A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01039—Yttrium [Y]
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    • H01L2924/01042—Molybdenum [Mo]
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    • H01L2924/01043—Technetium [Tc]
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    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
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    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Contacts (AREA)
CH1491173A 1972-11-21 1973-10-23 Halbleiterbauelement. CH554600A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2257078A DE2257078A1 (de) 1972-11-21 1972-11-21 Halbleiterbauelement mit druckkontakt

Publications (1)

Publication Number Publication Date
CH554600A true CH554600A (de) 1974-09-30

Family

ID=5862361

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1491173A CH554600A (de) 1972-11-21 1973-10-23 Halbleiterbauelement.

Country Status (12)

Country Link
US (1) US3837000A (xx)
JP (1) JPS4984179A (xx)
AT (1) AT350109B (xx)
BE (1) BE807603A (xx)
CA (1) CA1006988A (xx)
CH (1) CH554600A (xx)
DE (1) DE2257078A1 (xx)
FR (1) FR2207358B1 (xx)
GB (1) GB1384850A (xx)
IT (1) IT1001906B (xx)
NL (1) NL7312226A (xx)
SE (1) SE395985B (xx)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079409A (en) * 1973-11-27 1978-03-14 Licentia Patent-Verwaltungs G.M.B.H. Thyristor with pressure contacting
US3992717A (en) * 1974-06-21 1976-11-16 Westinghouse Electric Corporation Housing for a compression bonded encapsulation of a semiconductor device
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
DE2838997A1 (de) * 1978-09-07 1980-03-20 Bbc Brown Boveri & Cie Verfahren zur herstellung eines dichten gehaeuses fuer einen scheibenfoermigen, mindestens einen pn-uebergang aufweisenden halbleiterkoerper
DE2915862C2 (de) * 1979-04-19 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenförmigem Gehäuse
EP0048768B1 (en) * 1980-09-29 1986-01-22 Kabushiki Kaisha Toshiba A semiconductor device with a semiconductor element soldered on a metal substrate
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
JPS5921062A (ja) * 1982-07-26 1984-02-02 Mitsubishi Electric Corp サイリスタ
BR8500047A (pt) * 1984-01-09 1985-08-13 Westinghouse Electric Corp Dispositivo semicondutor de potencia aglutinado por compressao
JPS62269322A (ja) * 1986-05-17 1987-11-21 Toshiba Corp 電力用半導体装置
JP2594278B2 (ja) * 1986-07-30 1997-03-26 ビービーシー ブラウン ボヴェリ アクチェンゲゼルシャフト 加圧接続型ｇｔｏサイリスタ
DE3880730D1 (de) * 1987-03-25 1993-06-09 Bbc Brown Boveri & Cie Halbleiterbauelement mit einer steuerelektrode.
EP0325774B1 (de) * 1988-01-27 1992-03-18 Asea Brown Boveri Ag Abschaltbares Leistungshalbleiterbauelement
US5406120A (en) * 1992-10-20 1995-04-11 Jones; Robert M. Hermetically sealed semiconductor ceramic package
JP3291977B2 (ja) * 1995-05-31 2002-06-17 三菱電機株式会社 圧接型半導体素子及びその製造方法並びに圧接型半導体装置
DE19843309A1 (de) 1998-09-22 2000-03-23 Asea Brown Boveri Kurzschlussfestes IGBT Modul
CN101479839A (zh) * 2006-04-24 2009-07-08 株式会社村田制作所 电子元件、使用该电子元件的电子元件装置及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1374321A (fr) * 1961-03-28 1964-10-09 Siemens Ag Dispositif à semi-conducteurs
NL289148A (xx) * 1961-08-12
FR1378015A (fr) * 1961-09-02 1964-11-13 Siemens Ag Dispositif à semi-conducteur
FR1378018A (fr) * 1961-10-31 1964-11-13 Siemens Ag Dispositif semi-conducteur
US3447236A (en) * 1966-02-11 1969-06-03 Western Electric Co Method of bonding an electrical part to an electrical contact
US3463976A (en) * 1966-03-21 1969-08-26 Westinghouse Electric Corp Electrical contact assembly for compression bonded electrical devices
US3492545A (en) * 1968-03-18 1970-01-27 Westinghouse Electric Corp Electrically and thermally conductive malleable layer embodying lead foil
US3562605A (en) * 1969-02-10 1971-02-09 Westinghouse Electric Corp Void-free pressure electrical contact for semiconductor devices and method of making the same

Also Published As

Publication number Publication date
US3837000A (en) 1974-09-17
CA1006988A (en) 1977-03-15
AT350109B (de) 1979-05-10
NL7312226A (xx) 1974-05-24
FR2207358B1 (xx) 1978-02-10
ATA702773A (de) 1978-10-15
SE395985B (sv) 1977-08-29
BE807603A (fr) 1974-03-15
GB1384850A (en) 1975-02-26
IT1001906B (it) 1976-04-30
JPS4984179A (xx) 1974-08-13
FR2207358A1 (xx) 1974-06-14
DE2257078A1 (de) 1974-05-30

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