CH549869A - Kuehlvorrichtung fuer ein scheibenfoermiges, gekapseltes halbleiterbauelement. - Google Patents
Kuehlvorrichtung fuer ein scheibenfoermiges, gekapseltes halbleiterbauelement.Info
- Publication number
- CH549869A CH549869A CH511373A CH511373A CH549869A CH 549869 A CH549869 A CH 549869A CH 511373 A CH511373 A CH 511373A CH 511373 A CH511373 A CH 511373A CH 549869 A CH549869 A CH 549869A
- Authority
- CH
- Switzerland
- Prior art keywords
- disc
- shaped
- cooling device
- conductor component
- enclosed semi
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722220682 DE2220682C3 (de) | 1972-04-27 | Kühlvorrichtung für ein scheibenförmiges, gekapseltes Halbleiterbauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH549869A true CH549869A (de) | 1974-05-31 |
Family
ID=5843453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH511373A CH549869A (de) | 1972-04-27 | 1973-04-10 | Kuehlvorrichtung fuer ein scheibenfoermiges, gekapseltes halbleiterbauelement. |
Country Status (4)
-
1973
- 1973-04-10 CH CH511373A patent/CH549869A/xx not_active IP Right Cessation
- 1973-04-25 AT AT367673A patent/AT320797B/de not_active IP Right Cessation
- 1973-04-26 FR FR7315132A patent/FR2182133B3/fr not_active Expired
- 1973-04-26 IT IT4967273A patent/IT980359B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| FR2182133A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-12-07 |
| FR2182133B3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-07-23 |
| DE2220682B2 (de) | 1975-06-05 |
| DE2220682A1 (de) | 1973-11-08 |
| AT320797B (de) | 1975-02-25 |
| IT980359B (it) | 1974-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CH558234A (de) | Werkzeugwechselvorrichtung. | |
| CH551690A (de) | Halbleiteranordnung. | |
| ES196297Y (es) | Un dispositivo semiconductor. | |
| CH555126A (de) | Elektrolumineszierende halbleitervorrichtung. | |
| NO138650C (no) | Fortoeyningsanordning. | |
| CH554600A (de) | Halbleiterbauelement. | |
| IT996680B (it) | Dispositivo semiconduttore | |
| NO140844C (no) | Halvlederanordning. | |
| CH548314A (de) | Schneidvorrichtung fuer verpackungen. | |
| CH595656B (de) | Zeithaltendes geraet. | |
| FI52885C (fi) | Laite etenkin pesualtaan asentamiseksi kannatuspintaan. | |
| IT996919B (it) | Dispositivo semiconduttore | |
| IT986562B (it) | Dispositivo semiconduttore | |
| NO140843C (no) | Halvlederanordning. | |
| IT990812B (it) | Dispositivo semiconduttore | |
| CH552285A (de) | Halbleiteranordnung. | |
| CH551230A (de) | Hochsauge-sichter fuer koerniges schuettgut. | |
| CH549869A (de) | Kuehlvorrichtung fuer ein scheibenfoermiges, gekapseltes halbleiterbauelement. | |
| CH549868A (de) | Halter fuer ein druckkontaktiertes halbleiterbauelement. | |
| CH553023A (de) | Selbstspannende mitnehmervorrichtung. | |
| CH550485A (de) | Kuehlanordnung fuer ein halbleiterbauelement. | |
| CH548111A (de) | Halbleiteranordnung. | |
| IT980938B (it) | Dispositivo semiconduttore | |
| BE806434A (fr) | Dispositif semiconducteur a dissipation calorifique elevee | |
| AR195531A1 (es) | Dispositivo semiconductor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |