CH535287A - Verfahren zur Erzeugung eines zusammen-hängenden Kupferüberzuges auf Aluminium und dessen Legierungen nach der elektrochemischen Austauschmethode ohne äussere Stromquelle - Google Patents
Verfahren zur Erzeugung eines zusammen-hängenden Kupferüberzuges auf Aluminium und dessen Legierungen nach der elektrochemischen Austauschmethode ohne äussere StromquelleInfo
- Publication number
- CH535287A CH535287A CH1181470A CH1181470A CH535287A CH 535287 A CH535287 A CH 535287A CH 1181470 A CH1181470 A CH 1181470A CH 1181470 A CH1181470 A CH 1181470A CH 535287 A CH535287 A CH 535287A
- Authority
- CH
- Switzerland
- Prior art keywords
- alloys
- aluminum
- producing
- power source
- external power
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title 1
- 229910052782 aluminium Inorganic materials 0.000 title 1
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 230000001427 coherent effect Effects 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19691947003 DE1947003B2 (de) | 1969-09-17 | 1969-09-17 | Verfahren zum stromlosen verkupfern von aluminium und dessen legierungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH535287A true CH535287A (de) | 1973-03-31 |
Family
ID=5745716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1181470A CH535287A (de) | 1969-09-17 | 1970-08-05 | Verfahren zur Erzeugung eines zusammen-hängenden Kupferüberzuges auf Aluminium und dessen Legierungen nach der elektrochemischen Austauschmethode ohne äussere Stromquelle |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3672976A (https=) |
| AT (1) | AT296714B (https=) |
| CH (1) | CH535287A (https=) |
| DE (1) | DE1947003B2 (https=) |
| FR (1) | FR2062309A5 (https=) |
| GB (1) | GB1288026A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5475463A (en) * | 1977-11-28 | 1979-06-16 | Nippon Mining Co Ltd | Manufacture of copper coated iron powder |
| KR960003723B1 (ko) * | 1986-05-19 | 1996-03-21 | 하라마 카세이 고오교오 가부시끼가이샤 | 기판 금속의 표면상에 금속 필름을 형성하는 방법 |
| CN114093842A (zh) * | 2020-12-23 | 2022-02-25 | 矽磐微电子(重庆)有限公司 | 裸片及其制作方法、芯片封装结构及其制作方法 |
-
1969
- 1969-09-17 DE DE19691947003 patent/DE1947003B2/de active Pending
-
1970
- 1970-08-05 CH CH1181470A patent/CH535287A/de not_active IP Right Cessation
- 1970-09-04 US US69964A patent/US3672976A/en not_active Expired - Lifetime
- 1970-09-04 AT AT804370A patent/AT296714B/de not_active IP Right Cessation
- 1970-09-11 GB GB4365770A patent/GB1288026A/en not_active Expired
- 1970-09-17 FR FR7033827A patent/FR2062309A5/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US3672976A (en) | 1972-06-27 |
| GB1288026A (https=) | 1972-09-06 |
| DE1947003B2 (de) | 1971-10-21 |
| FR2062309A5 (https=) | 1971-06-25 |
| DE1947003A1 (de) | 1971-04-15 |
| AT296714B (de) | 1972-02-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |