CH534428A - Anordnung mit Halbleiterbauelementen und einem Träger - Google Patents

Anordnung mit Halbleiterbauelementen und einem Träger

Info

Publication number
CH534428A
CH534428A CH1291171A CH1291171A CH534428A CH 534428 A CH534428 A CH 534428A CH 1291171 A CH1291171 A CH 1291171A CH 1291171 A CH1291171 A CH 1291171A CH 534428 A CH534428 A CH 534428A
Authority
CH
Switzerland
Prior art keywords
carrier
arrangement
semiconductor components
semiconductor
components
Prior art date
Application number
CH1291171A
Other languages
German (de)
English (en)
Inventor
Peltz Hans-Heinz
Pretsch Hubert
Schmitter Detlev
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2057126A external-priority patent/DE2057126C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH534428A publication Critical patent/CH534428A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
CH1291171A 1970-11-20 1971-09-03 Anordnung mit Halbleiterbauelementen und einem Träger CH534428A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2057126A DE2057126C3 (de) 1970-05-14 1970-11-20 Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen

Publications (1)

Publication Number Publication Date
CH534428A true CH534428A (de) 1973-02-28

Family

ID=5788681

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1291171A CH534428A (de) 1970-11-20 1971-09-03 Anordnung mit Halbleiterbauelementen und einem Träger

Country Status (7)

Country Link
JP (1) JPS553811B1 (https=)
AT (1) AT333344B (https=)
CA (1) CA981807A (https=)
CH (1) CH534428A (https=)
GB (1) GB1325393A (https=)
IT (1) IT972047B (https=)
SE (1) SE378707B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2167228B (en) * 1984-10-11 1988-05-05 Anamartic Ltd Integrated circuit package

Also Published As

Publication number Publication date
ATA846671A (de) 1976-03-15
GB1325393A (en) 1973-08-01
CA981807A (en) 1976-01-13
IT972047B (it) 1974-05-20
AT333344B (de) 1976-11-10
JPS553811B1 (https=) 1980-01-26
SE378707B (https=) 1975-09-08

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Legal Events

Date Code Title Description
PL Patent ceased