AT333344B - Anordnung zur kontaktierung von halbleiterbauelementen - Google Patents

Anordnung zur kontaktierung von halbleiterbauelementen

Info

Publication number
AT333344B
AT333344B AT846671A AT846671A AT333344B AT 333344 B AT333344 B AT 333344B AT 846671 A AT846671 A AT 846671A AT 846671 A AT846671 A AT 846671A AT 333344 B AT333344 B AT 333344B
Authority
AT
Austria
Prior art keywords
arrangement
conductor components
semi
contacting
contacting semi
Prior art date
Application number
AT846671A
Other languages
English (en)
Other versions
ATA846671A (de
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2057126A external-priority patent/DE2057126C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ATA846671A publication Critical patent/ATA846671A/de
Application granted granted Critical
Publication of AT333344B publication Critical patent/AT333344B/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
AT846671A 1970-11-20 1971-09-30 Anordnung zur kontaktierung von halbleiterbauelementen AT333344B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2057126A DE2057126C3 (de) 1970-05-14 1970-11-20 Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen

Publications (2)

Publication Number Publication Date
ATA846671A ATA846671A (de) 1976-03-15
AT333344B true AT333344B (de) 1976-11-10

Family

ID=5788681

Family Applications (1)

Application Number Title Priority Date Filing Date
AT846671A AT333344B (de) 1970-11-20 1971-09-30 Anordnung zur kontaktierung von halbleiterbauelementen

Country Status (7)

Country Link
JP (1) JPS553811B1 (de)
AT (1) AT333344B (de)
CA (1) CA981807A (de)
CH (1) CH534428A (de)
GB (1) GB1325393A (de)
IT (1) IT972047B (de)
SE (1) SE378707B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2167228B (en) * 1984-10-11 1988-05-05 Anamartic Ltd Integrated circuit package

Also Published As

Publication number Publication date
GB1325393A (en) 1973-08-01
CA981807A (en) 1976-01-13
JPS553811B1 (de) 1980-01-26
IT972047B (it) 1974-05-20
SE378707B (de) 1975-09-08
ATA846671A (de) 1976-03-15
CH534428A (de) 1973-02-28

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee