CH520402A - Verfahren zur Herstellung eines Halbleiter-Kleingleichrichters - Google Patents
Verfahren zur Herstellung eines Halbleiter-KleingleichrichtersInfo
- Publication number
- CH520402A CH520402A CH193670A CH193670A CH520402A CH 520402 A CH520402 A CH 520402A CH 193670 A CH193670 A CH 193670A CH 193670 A CH193670 A CH 193670A CH 520402 A CH520402 A CH 520402A
- Authority
- CH
- Switzerland
- Prior art keywords
- production
- small semiconductor
- semiconductor rectifier
- rectifier
- small
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1907075A DE1907075B2 (de) | 1969-02-13 | 1969-02-13 | Verfahren zur Herstellung von Halbleiter-Kleingleichrichtern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH520402A true CH520402A (de) | 1972-03-15 |
Family
ID=5725060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH193670A CH520402A (de) | 1969-02-13 | 1970-02-11 | Verfahren zur Herstellung eines Halbleiter-Kleingleichrichters |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3708730A (de) |
| BR (1) | BR6915308D0 (de) |
| CH (1) | CH520402A (de) |
| DE (1) | DE1907075B2 (de) |
| ES (1) | ES375664A1 (de) |
| FR (1) | FR2031079A5 (de) |
| GB (1) | GB1298766A (de) |
| SE (1) | SE363426B (de) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4247864A (en) * | 1978-03-06 | 1981-01-27 | Amp Incorporated | Light emitting diode assembly |
| US4478588A (en) * | 1978-03-06 | 1984-10-23 | Amp Incorporated | Light emitting diode assembly |
| JPS57133655A (en) * | 1981-02-10 | 1982-08-18 | Pioneer Electronic Corp | Lead frame |
| FR2538164B1 (fr) * | 1982-12-21 | 1985-06-07 | Thomson Csf | Procede d'encapsulation et circuit integre sous boitier encapsule par ce procede |
| US4722060A (en) * | 1984-03-22 | 1988-01-26 | Thomson Components-Mostek Corporation | Integrated-circuit leadframe adapted for a simultaneous bonding operation |
| JPH06105721B2 (ja) * | 1985-03-25 | 1994-12-21 | 日立超エル・エス・アイエンジニアリング株式会社 | 半導体装置 |
| JP2875334B2 (ja) * | 1990-04-06 | 1999-03-31 | 株式会社日立製作所 | 半導体装置 |
| TW276357B (de) * | 1993-03-22 | 1996-05-21 | Motorola Inc | |
| US5714792A (en) * | 1994-09-30 | 1998-02-03 | Motorola, Inc. | Semiconductor device having a reduced die support area and method for making the same |
| US5907769A (en) * | 1996-12-30 | 1999-05-25 | Micron Technology, Inc. | Leads under chip in conventional IC package |
| US6121674A (en) | 1998-02-23 | 2000-09-19 | Micron Technology, Inc. | Die paddle clamping method for wire bond enhancement |
| US6977214B2 (en) * | 1998-12-11 | 2005-12-20 | Micron Technology, Inc. | Die paddle clamping method for wire bond enhancement |
| SG112799A1 (en) | 2000-10-09 | 2005-07-28 | St Assembly Test Services Ltd | Leaded semiconductor packages and method of trimming and singulating such packages |
| US6686258B2 (en) | 2000-11-02 | 2004-02-03 | St Assembly Test Services Ltd. | Method of trimming and singulating leaded semiconductor packages |
| CN112913009B (zh) * | 2019-04-10 | 2024-08-16 | 新电元工业株式会社 | 半导体装置以及引线框材料 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1514822A1 (de) * | 1964-08-14 | 1969-06-26 | Telefunken Patent | Verfahren zur Herstellung einer Halbleiteranordnung |
| US3537175A (en) * | 1966-11-09 | 1970-11-03 | Advalloy Inc | Lead frame for semiconductor devices and method for making same |
| GB1196452A (en) * | 1967-01-19 | 1970-06-24 | Lucas Industries Ltd | Semiconductor Circuits |
| US3500136A (en) * | 1968-01-24 | 1970-03-10 | Int Rectifier Corp | Contact structure for small area contact devices |
-
1969
- 1969-02-13 DE DE1907075A patent/DE1907075B2/de active Pending
- 1969-12-19 BR BR215308/69A patent/BR6915308D0/pt unknown
-
1970
- 1970-01-05 ES ES375664A patent/ES375664A1/es not_active Expired
- 1970-01-07 FR FR7000340A patent/FR2031079A5/fr not_active Expired
- 1970-02-05 US US00008997A patent/US3708730A/en not_active Expired - Lifetime
- 1970-02-11 CH CH193670A patent/CH520402A/de not_active IP Right Cessation
- 1970-02-11 SE SE01720/70A patent/SE363426B/xx unknown
- 1970-02-13 GB GB7179/70A patent/GB1298766A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| SE363426B (de) | 1974-01-14 |
| GB1298766A (en) | 1972-12-06 |
| US3708730A (en) | 1973-01-02 |
| DE1907075A1 (de) | 1971-02-11 |
| ES375664A1 (es) | 1972-05-16 |
| FR2031079A5 (de) | 1970-11-13 |
| BR6915308D0 (pt) | 1973-01-02 |
| DE1907075B2 (de) | 1974-07-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |