CH520402A - Verfahren zur Herstellung eines Halbleiter-Kleingleichrichters - Google Patents

Verfahren zur Herstellung eines Halbleiter-Kleingleichrichters

Info

Publication number
CH520402A
CH520402A CH193670A CH193670A CH520402A CH 520402 A CH520402 A CH 520402A CH 193670 A CH193670 A CH 193670A CH 193670 A CH193670 A CH 193670A CH 520402 A CH520402 A CH 520402A
Authority
CH
Switzerland
Prior art keywords
production
small semiconductor
semiconductor rectifier
rectifier
small
Prior art date
Application number
CH193670A
Other languages
English (en)
Inventor
Schierz Winfried
Libolslav Vladik
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of CH520402A publication Critical patent/CH520402A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
  • Synchronous Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CH193670A 1969-02-13 1970-02-11 Verfahren zur Herstellung eines Halbleiter-Kleingleichrichters CH520402A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1907075A DE1907075B2 (de) 1969-02-13 1969-02-13 Verfahren zur Herstellung von Halbleiter-Kleingleichrichtern

Publications (1)

Publication Number Publication Date
CH520402A true CH520402A (de) 1972-03-15

Family

ID=5725060

Family Applications (1)

Application Number Title Priority Date Filing Date
CH193670A CH520402A (de) 1969-02-13 1970-02-11 Verfahren zur Herstellung eines Halbleiter-Kleingleichrichters

Country Status (8)

Country Link
US (1) US3708730A (de)
BR (1) BR6915308D0 (de)
CH (1) CH520402A (de)
DE (1) DE1907075B2 (de)
ES (1) ES375664A1 (de)
FR (1) FR2031079A5 (de)
GB (1) GB1298766A (de)
SE (1) SE363426B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
US4247864A (en) * 1978-03-06 1981-01-27 Amp Incorporated Light emitting diode assembly
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
FR2538164B1 (fr) * 1982-12-21 1985-06-07 Thomson Csf Procede d'encapsulation et circuit integre sous boitier encapsule par ce procede
US4722060A (en) * 1984-03-22 1988-01-26 Thomson Components-Mostek Corporation Integrated-circuit leadframe adapted for a simultaneous bonding operation
JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
JP2875334B2 (ja) * 1990-04-06 1999-03-31 株式会社日立製作所 半導体装置
TW276357B (de) * 1993-03-22 1996-05-21 Motorola Inc
US5714792A (en) * 1994-09-30 1998-02-03 Motorola, Inc. Semiconductor device having a reduced die support area and method for making the same
US5907769A (en) * 1996-12-30 1999-05-25 Micron Technology, Inc. Leads under chip in conventional IC package
US6121674A (en) 1998-02-23 2000-09-19 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
SG112799A1 (en) 2000-10-09 2005-07-28 St Assembly Test Services Ltd Leaded semiconductor packages and method of trimming and singulating such packages
US6686258B2 (en) 2000-11-02 2004-02-03 St Assembly Test Services Ltd. Method of trimming and singulating leaded semiconductor packages
CN112913009A (zh) * 2019-04-10 2021-06-04 新电元工业株式会社 半导体装置以及引线框材料

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514822A1 (de) * 1964-08-14 1969-06-26 Telefunken Patent Verfahren zur Herstellung einer Halbleiteranordnung
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
GB1196452A (en) * 1967-01-19 1970-06-24 Lucas Industries Ltd Semiconductor Circuits
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices

Also Published As

Publication number Publication date
GB1298766A (en) 1972-12-06
BR6915308D0 (pt) 1973-01-02
FR2031079A5 (de) 1970-11-13
SE363426B (de) 1974-01-14
US3708730A (en) 1973-01-02
ES375664A1 (es) 1972-05-16
DE1907075A1 (de) 1971-02-11
DE1907075B2 (de) 1974-07-04

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Legal Events

Date Code Title Description
PL Patent ceased