CH513521A - Method for producing a semiconductor component, wherein a tool is used to make electrical connections between contact points of the semiconductor component on the one hand and supply conductors on the other - Google Patents

Method for producing a semiconductor component, wherein a tool is used to make electrical connections between contact points of the semiconductor component on the one hand and supply conductors on the other

Info

Publication number
CH513521A
CH513521A CH1339970A CH1339970A CH513521A CH 513521 A CH513521 A CH 513521A CH 1339970 A CH1339970 A CH 1339970A CH 1339970 A CH1339970 A CH 1339970A CH 513521 A CH513521 A CH 513521A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
tool
producing
hand
electrical connections
Prior art date
Application number
CH1339970A
Other languages
German (de)
Inventor
Gerard Rudolph Joannes
Moesker Gerard
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH513521A publication Critical patent/CH513521A/en

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Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CH1339970A 1969-09-11 1970-09-08 Method for producing a semiconductor component, wherein a tool is used to make electrical connections between contact points of the semiconductor component on the one hand and supply conductors on the other CH513521A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6913812A NL6913812A (en) 1969-09-11 1969-09-11

Publications (1)

Publication Number Publication Date
CH513521A true CH513521A (en) 1971-09-30

Family

ID=19807875

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1339970A CH513521A (en) 1969-09-11 1970-09-08 Method for producing a semiconductor component, wherein a tool is used to make electrical connections between contact points of the semiconductor component on the one hand and supply conductors on the other

Country Status (8)

Country Link
US (1) US3707655A (en)
JP (1) JPS5023950B1 (en)
BE (1) BE755950A (en)
CH (1) CH513521A (en)
DE (1) DE2043297A1 (en)
FR (1) FR2061243A5 (en)
GB (1) GB1322788A (en)
NL (1) NL6913812A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2628519A1 (en) * 1975-06-26 1976-12-30 Kollmorgen Corp PROCESS AND DEVICE FOR ESTABLISHING CONNECTIONS BETWEEN THE CONNECTION POINTS OF A COMPONENT AND EXTERNAL CONTACTS
EP0114531A1 (en) * 1982-12-29 1984-08-01 Fujitsu Limited Package for a semiconductor chip with lead terminals

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US3801881A (en) * 1971-10-30 1974-04-02 Nippon Electric Co Packaged semiconductor device including a housing in the form of a rectangular parallelepiped and ceramic rectangular base member
US3984860A (en) * 1973-06-04 1976-10-05 International Business Machines Corporation Multi-function LSI wafers
JPS575887Y2 (en) * 1976-08-23 1982-02-03
DE3106376A1 (en) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München SEMICONDUCTOR ARRANGEMENT WITH CONNECTING CABLES cut out of sheet metal
US6664620B2 (en) * 1999-06-29 2003-12-16 Intel Corporation Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer

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NL142018B (en) * 1964-11-26 1974-04-16 Philips Nv PROCEDURE FOR THE MANUFACTURE OF A SEMI-CONDUCTIVE DEVICE AND DEVICE MANUFACTURED ACCORDING TO THE PROCESS.
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3539259A (en) * 1967-07-07 1970-11-10 Mitronics Inc Method of making lead array for connection to miniature electrical device such as a chip
GB1152809A (en) * 1968-05-07 1969-05-21 Standard Telephones Cables Ltd Electric Circuit Assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2628519A1 (en) * 1975-06-26 1976-12-30 Kollmorgen Corp PROCESS AND DEVICE FOR ESTABLISHING CONNECTIONS BETWEEN THE CONNECTION POINTS OF A COMPONENT AND EXTERNAL CONTACTS
EP0114531A1 (en) * 1982-12-29 1984-08-01 Fujitsu Limited Package for a semiconductor chip with lead terminals

Also Published As

Publication number Publication date
NL6913812A (en) 1971-03-15
JPS5023950B1 (en) 1975-08-12
BE755950A (en) 1971-03-09
DE2043297A1 (en) 1971-03-18
GB1322788A (en) 1973-07-11
US3707655A (en) 1972-12-26
FR2061243A5 (en) 1971-06-18

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