CH418449A - Electrical system with several semiconductor components connected to heat sinks and a method for producing such an electrical system - Google Patents

Electrical system with several semiconductor components connected to heat sinks and a method for producing such an electrical system

Info

Publication number
CH418449A
CH418449A CH413963A CH413963A CH418449A CH 418449 A CH418449 A CH 418449A CH 413963 A CH413963 A CH 413963A CH 413963 A CH413963 A CH 413963A CH 418449 A CH418449 A CH 418449A
Authority
CH
Switzerland
Prior art keywords
electrical system
producing
heat sinks
semiconductor components
components connected
Prior art date
Application number
CH413963A
Other languages
German (de)
Inventor
Bautze Alfred
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH418449A publication Critical patent/CH418449A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Conversion In General (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CH413963A 1962-04-26 1963-04-02 Electrical system with several semiconductor components connected to heat sinks and a method for producing such an electrical system CH418449A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962S0079177 DE1273074B (en) 1962-04-26 1962-04-26 Converter system with semiconductor components mounted on profiled bodies made of insulating material

Publications (1)

Publication Number Publication Date
CH418449A true CH418449A (en) 1966-08-15

Family

ID=7508003

Family Applications (1)

Application Number Title Priority Date Filing Date
CH413963A CH418449A (en) 1962-04-26 1963-04-02 Electrical system with several semiconductor components connected to heat sinks and a method for producing such an electrical system

Country Status (4)

Country Link
BE (1) BE631403A (en)
CH (1) CH418449A (en)
DE (1) DE1273074B (en)
GB (1) GB1039734A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3638073A (en) * 1970-02-19 1972-01-25 Gen Instrument Corp Semiconductor assembly with heat sink and connector bodies
DE3007306A1 (en) * 1980-02-01 1981-08-06 BBC AG Brown, Boveri & Cie., Baden, Aargau AIR COOLED RECTIFIER
DE3802593A1 (en) * 1988-01-29 1989-08-10 Heidelberger Druckmasch Ag CONVERTER WITH DC INTERMEDIATE CIRCUIT

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2812699C2 (en) * 1978-03-23 1987-04-09 Brown, Boveri & Cie Ag, 6800 Mannheim Bridge-connected power converter with single-side cooled disc thyristors
US4710850A (en) * 1986-02-19 1987-12-01 Siemens Aktiengesellschaft Tower design for high-voltage systems
DE102008050487A1 (en) * 2008-10-01 2010-04-15 Siemens Aktiengesellschaft Electric device with a holding frame

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE896392C (en) * 1951-11-13 1953-11-12 Licentia Gmbh Housing for an electrically asymmetrically conductive system of the crystal type
DE971168C (en) * 1953-08-23 1958-12-18 Siemens Ag Dry rectifier arrangement for high voltage purposes
DE1037017B (en) * 1956-01-23 1958-08-21 Siemens Reiniger Werke Ag Dry rectifier high voltage unit
DE1062822B (en) * 1957-04-20 1959-08-06 Licentia Gmbh Dry rectifier unit for dry rectifier high load capacity

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3638073A (en) * 1970-02-19 1972-01-25 Gen Instrument Corp Semiconductor assembly with heat sink and connector bodies
DE3007306A1 (en) * 1980-02-01 1981-08-06 BBC AG Brown, Boveri & Cie., Baden, Aargau AIR COOLED RECTIFIER
DE3802593A1 (en) * 1988-01-29 1989-08-10 Heidelberger Druckmasch Ag CONVERTER WITH DC INTERMEDIATE CIRCUIT
US4992925A (en) * 1988-01-29 1991-02-12 Heidelberger Druckmaschinen Ag Converter with intermediate d.c. circuit

Also Published As

Publication number Publication date
GB1039734A (en) 1966-08-17
BE631403A (en)
DE1273074B (en) 1968-07-18

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