CH483182A - Verfahren und Vorrichtung zur Herstellung elektrischer Verbindungen in einem Schaltungspack - Google Patents

Verfahren und Vorrichtung zur Herstellung elektrischer Verbindungen in einem Schaltungspack

Info

Publication number
CH483182A
CH483182A CH1846068A CH1846068A CH483182A CH 483182 A CH483182 A CH 483182A CH 1846068 A CH1846068 A CH 1846068A CH 1846068 A CH1846068 A CH 1846068A CH 483182 A CH483182 A CH 483182A
Authority
CH
Switzerland
Prior art keywords
electrical connections
making electrical
circuit pack
pack
circuit
Prior art date
Application number
CH1846068A
Other languages
English (en)
Inventor
Joseph Steranko James
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH483182A publication Critical patent/CH483182A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CH1846068A 1967-12-11 1968-12-10 Verfahren und Vorrichtung zur Herstellung elektrischer Verbindungen in einem Schaltungspack CH483182A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68971667A 1967-12-11 1967-12-11

Publications (1)

Publication Number Publication Date
CH483182A true CH483182A (de) 1969-12-15

Family

ID=24769635

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1846068A CH483182A (de) 1967-12-11 1968-12-10 Verfahren und Vorrichtung zur Herstellung elektrischer Verbindungen in einem Schaltungspack

Country Status (8)

Country Link
US (1) US3516156A (de)
BE (1) BE724114A (de)
CH (1) CH483182A (de)
DE (1) DE1813074B2 (de)
FR (1) FR1594821A (de)
GB (1) GB1216215A (de)
NL (1) NL6816606A (de)
SE (1) SE350681B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995024730A2 (en) * 1994-03-11 1995-09-14 The Panda Project Apparatus having inner layers supporting surface-mount components

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673681A (en) * 1969-04-01 1972-07-04 Inforex Electrical circuit board wiring
US3812581A (en) * 1969-11-24 1974-05-28 Wells Electronics Method for forming electrical joints between intermediate parts of an elongated conductor and selected conductive elements on an electrical assembly
DE2247279A1 (de) * 1972-09-27 1974-04-04 Siemens Ag Verfahren zur kontaktierung und/oder verdrahtung von elektrischen bauelementen
US3798394A (en) * 1972-10-11 1974-03-19 Bell Telephone Labor Inc Keyboard switch assembly with conductive diaphragm operators and rotary switch operators for adjustably selecting a multidigit number
US3859711A (en) * 1973-03-20 1975-01-14 Ibm Method of detecting misregistration of internal layers of a multilayer printed circuit panel
FR2223934B1 (de) * 1973-03-26 1979-01-12 Cii Honeywell Bull
US3867759A (en) * 1973-06-13 1975-02-25 Us Air Force Method of manufacturing a multi-layered strip transmission line printed circuit board integrated package
DE3108546A1 (de) * 1981-03-06 1982-09-16 Siemens AG, 1000 Berlin und 8000 München Durchkontaktierung fuer mehrlagen-leiterplatten
WO1983002521A1 (en) * 1982-01-13 1983-07-21 Elxsi Improved backplane power connection system
US4694123A (en) * 1982-01-13 1987-09-15 Elxsi Backplane power connector system
FR2531302A1 (fr) * 1982-07-30 1984-02-03 Xerox Corp Procedes de formation d'un circuit electrique a haute densite et d'elements d'interconnexion pour le circuit
GB2166603B (en) * 1984-09-28 1988-07-20 Yazaki Corp Electrical harness
US4716500A (en) * 1985-10-18 1987-12-29 Tektronix, Inc. Probe cable assembly
US4781600A (en) * 1986-06-25 1988-11-01 Yazaki Corporation Junction box and a process of assembling the same
US5159536A (en) * 1988-05-13 1992-10-27 Mupac Corporation Panel board
US4900878A (en) * 1988-10-03 1990-02-13 Hughes Aircraft Company Circuit terminations having improved electrical and structural integrity
US4916260A (en) * 1988-10-11 1990-04-10 International Business Machines Corporation Circuit member for use in multilayered printed circuit board assembly and method of making same
US4914829A (en) * 1988-12-16 1990-04-10 Ag Communication Systems Corporation Image alignment indicators
US5044966A (en) * 1989-05-23 1991-09-03 Peter Friesen Electrical panel for physically supporting and electrically connecting electrical components
US5191174A (en) * 1990-08-01 1993-03-02 International Business Machines Corporation High density circuit board and method of making same
US5245135A (en) * 1992-04-20 1993-09-14 Hughes Aircraft Company Stackable high density interconnection mechanism (SHIM)
JP2513443B2 (ja) * 1993-06-11 1996-07-03 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層回路基板組立体
US6339191B1 (en) * 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5619018A (en) * 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
US5832596A (en) * 1996-12-31 1998-11-10 Stmicroelectronics, Inc. Method of making multiple-bond shelf plastic package
US6016005A (en) * 1998-02-09 2000-01-18 Cellarosi; Mario J. Multilayer, high density micro circuit module and method of manufacturing same
US6936502B2 (en) * 2003-05-14 2005-08-30 Nortel Networks Limited Package modification for channel-routed circuit boards
US20050150682A1 (en) * 2004-01-12 2005-07-14 Agere Systems Inc. Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material
US7347701B2 (en) * 2006-05-17 2008-03-25 Intel Corporation Differential I/O spline for inexpensive breakout and excellent signal quality
US11109489B2 (en) 2019-08-15 2021-08-31 Raytheon Company Apparatus for fabricating Z-axis vertical launch within a printed circuit board
CN117602159B (zh) * 2024-01-23 2024-04-05 四川英创力电子科技股份有限公司 一种带有覆膜功能的电路板自动投板装置及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2569059A (en) * 1947-12-18 1951-09-25 Union Carbide & Carbon Corp Welded rivet construction for electrical brushes and contacts
US3264524A (en) * 1963-05-17 1966-08-02 Electro Mechanisms Inc Bonding of printed circuit components and the like
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
US3356786A (en) * 1964-10-07 1967-12-05 Texas Instruments Inc Modular circuit boards
GB1098846A (en) * 1965-04-05 1968-01-10 Marconi Co Ltd Improvements in or relating to multi-layer printed circuit arrangements
US3361869A (en) * 1965-04-16 1968-01-02 Western Electric Co Circuit board and method of connecting connectors thereto

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995024730A2 (en) * 1994-03-11 1995-09-14 The Panda Project Apparatus having inner layers supporting surface-mount components
WO1995024730A3 (en) * 1994-03-11 1996-02-15 Panda Project Apparatus having inner layers supporting surface-mount components
US5543586A (en) * 1994-03-11 1996-08-06 The Panda Project Apparatus having inner layers supporting surface-mount components
US5659953A (en) * 1994-03-11 1997-08-26 The Panda Project Method of manufacturing an apparatus having inner layers supporting surface-mount components

Also Published As

Publication number Publication date
US3516156A (en) 1970-06-23
DE1813074A1 (de) 1970-10-01
DE1813074B2 (de) 1971-03-04
BE724114A (de) 1969-05-02
GB1216215A (en) 1970-12-16
SE350681B (de) 1972-10-30
NL6816606A (de) 1969-06-13
FR1594821A (de) 1970-06-08

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Legal Events

Date Code Title Description
PL Patent ceased