CH476395A - Verfahren und Vorrichtung zur Kühlung von Halbleiterbauelementen - Google Patents
Verfahren und Vorrichtung zur Kühlung von HalbleiterbauelementenInfo
- Publication number
- CH476395A CH476395A CH1560265A CH1560265A CH476395A CH 476395 A CH476395 A CH 476395A CH 1560265 A CH1560265 A CH 1560265A CH 1560265 A CH1560265 A CH 1560265A CH 476395 A CH476395 A CH 476395A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor components
- cooling semiconductor
- cooling
- components
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
- H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/02365—Fixing laser chips on mounts by clamping
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US411062A US3351698A (en) | 1964-11-13 | 1964-11-13 | Heat sink mounting for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH476395A true CH476395A (de) | 1969-07-31 |
Family
ID=23627403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1560265A CH476395A (de) | 1964-11-13 | 1965-11-11 | Verfahren und Vorrichtung zur Kühlung von Halbleiterbauelementen |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US3351698A (de) |
| CH (1) | CH476395A (de) |
| DE (1) | DE1514055C2 (de) |
| FR (1) | FR1453192A (de) |
| GB (1) | GB1052856A (de) |
| NL (1) | NL150621B (de) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3432778A (en) * | 1966-12-23 | 1969-03-11 | Texas Instruments Inc | Solid state microstripline attenuator |
| GB1113920A (en) * | 1967-04-18 | 1968-05-15 | Standard Telephones Cables Ltd | An improved laser unit |
| US3509348A (en) * | 1967-09-18 | 1970-04-28 | Bell Telephone Labor Inc | Optical memory device utilizing metal semiconductor phase transition materials |
| US3509429A (en) * | 1968-01-15 | 1970-04-28 | Ibm | Heat sink assembly for semiconductor devices |
| US3506878A (en) * | 1968-09-26 | 1970-04-14 | Hughes Aircraft Co | Apparatus for mounting miniature electronic components |
| US3614550A (en) * | 1969-01-09 | 1971-10-19 | Ibm | A semiconductor laser device with improved operating efficiency |
| US3711789A (en) * | 1970-11-18 | 1973-01-16 | Texas Instruments Inc | Diode array assembly for diode pumped lasers |
| US3710193A (en) * | 1971-03-04 | 1973-01-09 | Lambda Electronics Corp | Hybrid regulated power supply having individual heat sinks for heat generative and heat sensitive components |
| US3771031A (en) * | 1973-03-05 | 1973-11-06 | Texas Instruments Inc | Header assembly for lasers |
| US4143385A (en) * | 1976-09-30 | 1979-03-06 | Hitachi, Ltd. | Photocoupler |
| US4212020A (en) * | 1978-07-21 | 1980-07-08 | California Institute Of Technology | Solid state electro-optical devices on a semi-insulating substrate |
| US4393393A (en) * | 1979-08-13 | 1983-07-12 | Mcdonnell Douglas Corporation | Laser diode with double sided heat sink |
| US4315225A (en) * | 1979-08-24 | 1982-02-09 | Mcdonnell Douglas Corporation | Heat sink laser diode array |
| US4397234A (en) * | 1981-12-30 | 1983-08-09 | International Business Machines Corporation | Electromagnetic print hammer coil assembly |
| US4853763A (en) * | 1984-06-27 | 1989-08-01 | The Bergquist Company | Mounting base pad means for semiconductor devices and method of preparing same |
| US4660275A (en) * | 1984-08-29 | 1987-04-28 | General Motors Corporation | Method of making cleaved-coupled-cavity (C3) diode lasers |
| US4716568A (en) * | 1985-05-07 | 1987-12-29 | Spectra Diode Laboratories, Inc. | Stacked diode laser array assembly |
| US5325384A (en) * | 1992-01-09 | 1994-06-28 | Crystallume | Structure and method for mounting laser diode arrays |
| US5438580A (en) * | 1993-09-24 | 1995-08-01 | Opto Power Corporation | Laser package and method of assembly |
| US8101858B2 (en) * | 2006-03-14 | 2012-01-24 | Corus Technology B.V. | Chalcopyrite semiconductor based photovoltaic solar cell comprising a metal substrate, coated metal substrate for a photovoltaic solar cell and manufacturing method thereof |
| DE102009040835A1 (de) * | 2009-09-09 | 2011-03-10 | Jenoptik Laserdiode Gmbh | Verfahren zum thermischen Kontaktieren einander gegenüberliegender elektrischer Anschlüsse einer Halbleiterbauelement-Anordnung |
| CN101660113B (zh) * | 2009-09-18 | 2011-04-20 | 苏州群鑫电子有限公司 | 塑封二极管热浸锡定位夹具 |
| DE102013102328A1 (de) * | 2013-03-08 | 2014-09-11 | Osram Opto Semiconductors Gmbh | Halbleiterlaseranordnung |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE950491C (de) * | 1951-09-15 | 1956-10-11 | Gen Electric | Gleichrichterelement |
| NL87784C (de) * | 1953-10-23 | 1958-04-15 | ||
| GB779195A (en) * | 1954-03-12 | 1957-07-17 | British Thomson Houston Co Ltd | Improvements relating to hermetically sealed barrier-layer rectifiers |
| DE1754512U (de) * | 1955-02-26 | 1957-10-24 | Siemens Ag | Flaechengleichrichter bzw. -transistor. |
| NL217849A (de) * | 1956-06-12 | |||
| BE628175A (de) * | 1961-08-04 | 1900-01-01 | ||
| GB1001269A (de) * | 1960-09-30 | 1900-01-01 |
-
0
- US US411062D patent/USB411062I5/en active Pending
-
1964
- 1964-11-13 US US411062A patent/US3351698A/en not_active Expired - Lifetime
-
1965
- 1965-10-13 GB GB4334365A patent/GB1052856A/en not_active Expired
- 1965-10-28 NL NL656513945A patent/NL150621B/xx not_active IP Right Cessation
- 1965-11-10 DE DE1514055A patent/DE1514055C2/de not_active Expired
- 1965-11-11 CH CH1560265A patent/CH476395A/de not_active IP Right Cessation
- 1965-11-12 FR FR38063A patent/FR1453192A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL150621B (nl) | 1976-08-16 |
| FR1453192A (fr) | 1966-04-15 |
| DE1514055A1 (de) | 1969-08-21 |
| GB1052856A (de) | 1966-12-30 |
| USB411062I5 (de) | |
| NL6513945A (de) | 1966-05-16 |
| US3351698A (en) | 1967-11-07 |
| DE1514055C2 (de) | 1982-08-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |