CH465355A - Verfahren zur Aktivierung einer Zinn-Nickelfläche zwecks nachfolgender Goldplattierung - Google Patents
Verfahren zur Aktivierung einer Zinn-Nickelfläche zwecks nachfolgender GoldplattierungInfo
- Publication number
- CH465355A CH465355A CH1306765A CH1306765A CH465355A CH 465355 A CH465355 A CH 465355A CH 1306765 A CH1306765 A CH 1306765A CH 1306765 A CH1306765 A CH 1306765A CH 465355 A CH465355 A CH 465355A
- Authority
- CH
- Switzerland
- Prior art keywords
- activating
- tin
- gold plating
- nickel surface
- subsequent gold
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB40030/64A GB1045728A (en) | 1964-10-01 | 1964-10-01 | Improvements relating to the deposition of gold on a tin nickel surface |
Publications (1)
Publication Number | Publication Date |
---|---|
CH465355A true CH465355A (de) | 1968-11-15 |
Family
ID=10412818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1306765A CH465355A (de) | 1964-10-01 | 1965-09-22 | Verfahren zur Aktivierung einer Zinn-Nickelfläche zwecks nachfolgender Goldplattierung |
Country Status (4)
Country | Link |
---|---|
US (1) | US3427181A (de) |
CH (1) | CH465355A (de) |
DE (1) | DE1271493B (de) |
GB (1) | GB1045728A (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3807971A (en) * | 1970-03-12 | 1974-04-30 | Ibm | Deposition of non-porous and durable tin-gold surface layers in microinch thicknesses |
US4946563A (en) * | 1988-12-12 | 1990-08-07 | General Electric Company | Process for manufacturing a selective plated board for surface mount components |
DE4238242C2 (de) * | 1992-09-17 | 2003-04-24 | Rieger Franz Metallveredelung | Verfahren zur Vorbehandlung von Leichtmetallen nach Patent DE 4231052 C2 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1329250A (fr) * | 1962-07-18 | 1963-06-07 | Benckiser Gmbh Joh A | Procédé de polissage chimique du cuivre et de ses alliages |
US3214292A (en) * | 1962-09-12 | 1965-10-26 | Western Electric Co | Gold plating |
US3266929A (en) * | 1962-12-17 | 1966-08-16 | Shipley Co | Gold plating by immersion |
-
1964
- 1964-10-01 GB GB40030/64A patent/GB1045728A/en not_active Expired
-
1965
- 1965-09-14 US US487331A patent/US3427181A/en not_active Expired - Lifetime
- 1965-09-17 DE DEP1271A patent/DE1271493B/de not_active Withdrawn
- 1965-09-22 CH CH1306765A patent/CH465355A/de unknown
Also Published As
Publication number | Publication date |
---|---|
DE1271493B (de) | 1968-06-27 |
US3427181A (en) | 1969-02-11 |
GB1045728A (en) | 1966-10-19 |
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