CH455071A4 - - Google Patents

Info

Publication number
CH455071A4
CH455071A4 CH455071DD CH455071A4 CH 455071 A4 CH455071 A4 CH 455071A4 CH 455071D D CH455071D D CH 455071DD CH 455071 A4 CH455071 A4 CH 455071A4
Authority
CH
Switzerland
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of CH455071A4 publication Critical patent/CH455071A4/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
    • H01S3/107—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using electro-optic devices, e.g. exhibiting Pockels or Kerr effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0069—Watchmakers' or watch-repairers' machines or tools for working materials for working with non-mechanical means, e.g. chemical, electrochemical, metallising, vapourising; with electron beams, laser beams
    • G04D3/0071—Watchmakers' or watch-repairers' machines or tools for working materials for working with non-mechanical means, e.g. chemical, electrochemical, metallising, vapourising; with electron beams, laser beams for bearing components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/105—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the mutual position or the reflecting properties of the reflectors of the cavity, e.g. by controlling the cavity length
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/10038—Amplitude control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
    • H01S3/1123—Q-switching
    • H01S3/115—Q-switching using intracavity electro-optic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
    • H01S3/1123—Q-switching
    • H01S3/117—Q-switching using intracavity acousto-optic devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
CH455071D 1971-03-29 1971-03-29 CH455071A4 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH455071A CH532993A (de) 1971-03-29 1971-03-29 Verfahren zum Bohren von Uhrensteinen mittels Laserstrahlen und Anordnung zur Durchführung des Verfahrens

Publications (1)

Publication Number Publication Date
CH455071A4 true CH455071A4 (en:Method) 1972-08-15

Family

ID=4278162

Family Applications (2)

Application Number Title Priority Date Filing Date
CH455071D CH455071A4 (en:Method) 1971-03-29 1971-03-29
CH455071A CH532993A (de) 1971-03-29 1971-03-29 Verfahren zum Bohren von Uhrensteinen mittels Laserstrahlen und Anordnung zur Durchführung des Verfahrens

Family Applications After (1)

Application Number Title Priority Date Filing Date
CH455071A CH532993A (de) 1971-03-29 1971-03-29 Verfahren zum Bohren von Uhrensteinen mittels Laserstrahlen und Anordnung zur Durchführung des Verfahrens

Country Status (8)

Country Link
JP (1) JPS574436B1 (en:Method)
CA (1) CA943192A (en:Method)
CH (2) CH455071A4 (en:Method)
DE (1) DE2214212B2 (en:Method)
FR (1) FR2131695A5 (en:Method)
GB (1) GB1373181A (en:Method)
IT (1) IT949991B (en:Method)
NL (1) NL173927C (en:Method)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH599827A5 (en:Method) * 1975-10-02 1978-05-31 Lasag Ag
DE2711889C3 (de) * 1977-03-18 1982-03-11 Kernforschungsanlage Juelich Gmbh, 5170 Juelich Verfahren zum Ausheben von Kanälen in Werkstücken mit Hilfe von Laserpulsen und Vorrichtung zur Durchführung dieses Verfahrens
US4092515A (en) * 1977-04-07 1978-05-30 United Technologies Corporation Laser method of precision hole drilling
GB1601355A (en) * 1977-05-03 1981-10-28 Boc Ltd Lasers
JPS604629U (ja) * 1983-06-18 1985-01-14 有限会社　馬渡コンクリ−ト工業 土止め板
US4930901A (en) * 1988-12-23 1990-06-05 Electro Scientific Industries, Inc. Method of and apparatus for modulating a laser beam
JP3691221B2 (ja) * 1997-09-24 2005-09-07 三菱電機株式会社 レーザ加工方法
JP6682146B2 (ja) * 2016-12-12 2020-04-15 住友重機械工業株式会社 レーザパルス切出装置及びレーザ加工方法

Also Published As

Publication number Publication date
CA943192A (en) 1974-03-05
NL7203251A (en:Method) 1972-10-03
DE2214212C3 (en:Method) 1974-09-19
DE2214212A1 (de) 1972-10-12
NL173927C (nl) 1984-04-02
JPS574436B1 (en:Method) 1982-01-26
GB1373181A (en) 1974-11-06
CH532993A (de) 1972-08-15
DE2214212B2 (de) 1974-02-21
IT949991B (it) 1973-06-11
FR2131695A5 (en:Method) 1972-11-10
NL173927B (nl) 1983-11-01

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Legal Events

Date Code Title Description
PL Patent ceased