CH450856A - Procédé d'attaque sélective du silicium - Google Patents
Procédé d'attaque sélective du siliciumInfo
- Publication number
- CH450856A CH450856A CH563866A CH563866A CH450856A CH 450856 A CH450856 A CH 450856A CH 563866 A CH563866 A CH 563866A CH 563866 A CH563866 A CH 563866A CH 450856 A CH450856 A CH 450856A
- Authority
- CH
- Switzerland
- Prior art keywords
- silicon
- etching process
- selective etching
- selective
- etching
- Prior art date
Links
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
- C25F1/12—Pickling; Descaling in melts
- C25F1/14—Iron or steel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR16295A FR1442535A (fr) | 1965-05-07 | 1965-05-07 | Procédé d'attaque sélective du silicium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH450856A true CH450856A (fr) | 1968-04-30 |
Family
ID=8578284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH563866A CH450856A (fr) | 1965-05-07 | 1966-04-18 | Procédé d'attaque sélective du silicium |
Country Status (7)
| Country | Link |
|---|---|
| BE (1) | BE679812A (enrdf_load_stackoverflow) |
| CH (1) | CH450856A (enrdf_load_stackoverflow) |
| DE (1) | DE1496764A1 (enrdf_load_stackoverflow) |
| FR (1) | FR1442535A (enrdf_load_stackoverflow) |
| GB (1) | GB1145876A (enrdf_load_stackoverflow) |
| LU (1) | LU50965A1 (enrdf_load_stackoverflow) |
| NL (1) | NL6605960A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9184364B2 (en) | 2005-03-02 | 2015-11-10 | Rosemount Inc. | Pipeline thermoelectric generator assembly |
| US20090184092A1 (en) * | 2005-10-28 | 2009-07-23 | Kanto Kagaku Kabuashiki Kaisha | Palladium-Selective Etching Solution and Method for Controlling Etching Selectivity |
| RU2308786C1 (ru) * | 2006-05-26 | 2007-10-20 | Государственное образовательное учреждение высшего профессионального образования "Брянская государственная инженерно-технологическая академия" | Раствор для электрохимического растворения кремния |
-
1965
- 1965-05-07 FR FR16295A patent/FR1442535A/fr not_active Expired
-
1966
- 1966-04-18 CH CH563866A patent/CH450856A/fr unknown
- 1966-04-21 BE BE679812D patent/BE679812A/xx unknown
- 1966-04-25 LU LU50965A patent/LU50965A1/xx unknown
- 1966-05-03 NL NL6605960A patent/NL6605960A/xx unknown
- 1966-05-04 DE DE19661496764 patent/DE1496764A1/de active Pending
- 1966-05-06 GB GB2029266A patent/GB1145876A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| BE679812A (enrdf_load_stackoverflow) | 1966-10-21 |
| DE1496764A1 (de) | 1969-04-10 |
| GB1145876A (en) | 1969-03-19 |
| FR1442535A (fr) | 1966-06-17 |
| NL6605960A (enrdf_load_stackoverflow) | 1966-11-08 |
| LU50965A1 (enrdf_load_stackoverflow) | 1966-10-25 |
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