CH449730A - Procédé de fabrication de circuits imprimés - Google Patents

Procédé de fabrication de circuits imprimés

Info

Publication number
CH449730A
CH449730A CH1260466A CH1260466A CH449730A CH 449730 A CH449730 A CH 449730A CH 1260466 A CH1260466 A CH 1260466A CH 1260466 A CH1260466 A CH 1260466A CH 449730 A CH449730 A CH 449730A
Authority
CH
Switzerland
Prior art keywords
printed circuit
manufacturing process
circuit manufacturing
printed
manufacturing
Prior art date
Application number
CH1260466A
Other languages
English (en)
French (fr)
Inventor
A Shannon Joseph
Original Assignee
Goodyear Aerospace Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goodyear Aerospace Corp filed Critical Goodyear Aerospace Corp
Publication of CH449730A publication Critical patent/CH449730A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y10T29/49812—Temporary protective coating, impregnation, or cast layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CH1260466A 1965-09-20 1966-08-31 Procédé de fabrication de circuits imprimés CH449730A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US488490A US3384957A (en) 1965-09-20 1965-09-20 Fabrication of three-dimensional printed circuitry

Publications (1)

Publication Number Publication Date
CH449730A true CH449730A (fr) 1968-01-15

Family

ID=23939872

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1260466A CH449730A (fr) 1965-09-20 1966-08-31 Procédé de fabrication de circuits imprimés

Country Status (6)

Country Link
US (1) US3384957A (OSRAM)
BE (1) BE685940A (OSRAM)
CH (1) CH449730A (OSRAM)
GB (1) GB1105650A (OSRAM)
NL (1) NL6613203A (OSRAM)
SE (1) SE323120B (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3526949A (en) * 1967-10-09 1970-09-08 Ibm Fly's eye molding technique
US3574933A (en) * 1968-11-29 1971-04-13 Sylvania Electric Prod Method of making printed circuit boards with plated-through holes
BE757067A (fr) * 1969-10-03 1971-03-16 Eastman Kodak Co Procede de fabrication d'objets par voie photographique
US4664962A (en) * 1985-04-08 1987-05-12 Additive Technology Corporation Printed circuit laminate, printed circuit board produced therefrom, and printed circuit process therefor
US5041188A (en) * 1989-03-02 1991-08-20 Santa Barbara Research Center High temperature superconductor detector fabrication process

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3151278A (en) * 1960-08-22 1964-09-29 Amphenol Borg Electronics Corp Electronic circuit module with weldable terminals
US3311966A (en) * 1962-09-24 1967-04-04 North American Aviation Inc Method of fabricating multilayer printed-wiring boards

Also Published As

Publication number Publication date
US3384957A (en) 1968-05-28
BE685940A (OSRAM) 1967-02-01
SE323120B (OSRAM) 1970-04-27
NL6613203A (OSRAM) 1967-03-21
GB1105650A (en) 1968-03-06

Similar Documents

Publication Publication Date Title
FR1458859A (fr) Procédé de fabrication de circuits imprimés à couches multiples
FR1418731A (fr) Procédé de fabrication de circuits imprimés
FR1208251A (fr) Procédé de fabrication de circuits imprimés
FR1507802A (fr) Procédé de fabrication de circuits intégrés
FR1339920A (fr) Fabrication de circuits
BE789174A (fr) Procede de fabrication de circuits
FR1385422A (fr) Procédé de fabrication de circuits imprimés
FR1522338A (fr) Procédé de fabrication de circuits imprimés
FR1389506A (fr) Fabrication de circuits
FR1458890A (fr) Module pour circuits électriques et son procédé de fabrication
FR1463642A (fr) Fabrication de circuits imprimés
FR1535920A (fr) Procédé de fabrication de circuits intégrés
FR1420044A (fr) Procédé de fabrication des circuits imprimés
FR1407752A (fr) Procédé de fabrication de circuits imprimés
CH452709A (fr) Procédé de fabrication de circuits solides
CH475690A (fr) Procédé pour la fabrication de circuits imprimés et circuit imprimé obtenu par ce procédé
FR1471003A (fr) Procédé de fabrication de circuits imprimés
FR1431598A (fr) Procédé de fabrication de circuits imprimés
FR1440669A (fr) Procédé de fabrication de circuits imprimés
FR1450874A (fr) Procédé de fabrication de circuits imprimés
FR1474311A (fr) Procédé de fabrication de circuits intégrés
FR1438718A (fr) Technique pour la fabrication de résistances de circuits imprimés
FR1469961A (fr) Procédés de fabrication de circuits intégrés
FR1525740A (fr) Procédé de fabrication de circuits imprimés
FR1443794A (fr) Procédé de fabrication de panneaux de circuit multicouche