CH446534A - Halbleiteranordnung und Verfahren zum Herstellen derselben - Google Patents
Halbleiteranordnung und Verfahren zum Herstellen derselbenInfo
- Publication number
- CH446534A CH446534A CH107166A CH107166A CH446534A CH 446534 A CH446534 A CH 446534A CH 107166 A CH107166 A CH 107166A CH 107166 A CH107166 A CH 107166A CH 446534 A CH446534 A CH 446534A
- Authority
- CH
- Switzerland
- Prior art keywords
- manufacturing
- same
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES79642A DE1248814B (de) | 1962-05-28 | 1962-05-28 | Halbleiterbauelement und zugehörige Kühlordnung |
| DES0095262 | 1965-01-30 | ||
| DES0101036 | 1965-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH446534A true CH446534A (de) | 1967-11-15 |
Family
ID=52395368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH107166A CH446534A (de) | 1962-05-28 | 1966-01-26 | Halbleiteranordnung und Verfahren zum Herstellen derselben |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3499095A (nl) |
| BE (1) | BE675736A (nl) |
| CH (1) | CH446534A (nl) |
| DE (2) | DE1248814B (nl) |
| FR (1) | FR1466106A (nl) |
| GB (1) | GB1078779A (nl) |
| NL (1) | NL140362B (nl) |
| SE (1) | SE345038C (nl) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3532942A (en) * | 1967-05-23 | 1970-10-06 | Int Rectifier Corp | Pressure-assembled semiconductor device housing having three terminals |
| US3513361A (en) * | 1968-05-09 | 1970-05-19 | Westinghouse Electric Corp | Flat package electrical device |
| US3746947A (en) * | 1969-03-15 | 1973-07-17 | Mitsubishi Electric Corp | Semiconductor device |
| JPS5030428B1 (nl) * | 1969-03-31 | 1975-10-01 | ||
| DE2021158B2 (de) * | 1970-04-30 | 1972-07-13 | Licentia Patent Verwaltungs GmbH, 6000 Frankfurt | Halbleiteranordnung mit einem scheibenfoermigen gehaeuse und einem in dieses eingespannten halbleiterelement |
| DE2160001C2 (de) * | 1971-12-03 | 1974-01-10 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Halbleiteranordnung, insbesondere Thyristorbaugruppe |
| US3831067A (en) * | 1972-05-15 | 1974-08-20 | Int Rectifier Corp | Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring |
| US3992717A (en) * | 1974-06-21 | 1976-11-16 | Westinghouse Electric Corporation | Housing for a compression bonded encapsulation of a semiconductor device |
| US4008486A (en) * | 1975-06-02 | 1977-02-15 | International Rectifier Corporation | Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring |
| DE2907780A1 (de) * | 1979-02-28 | 1980-09-11 | Alsthom Atlantique | Halter fuer eine leistungshalbleiterscheibe, die zur kuehlung in fluessigen fluorierten kohlenwasserstoff eingetaucht wird |
| JPS5678130A (en) * | 1979-11-30 | 1981-06-26 | Hitachi Ltd | Semiconductor device and its manufacture |
| DE3143335A1 (de) * | 1981-10-31 | 1983-05-11 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitervorrichtung |
| DE102019217386B4 (de) * | 2019-11-11 | 2023-12-14 | Mahle International Gmbh | Verfahren zum Herstellen einer Elektronikanordnung und die Elektronikanordnung |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2066856A (en) * | 1936-02-28 | 1937-01-05 | Rca Corp | Stem for electron discharge devices |
| BE628175A (nl) * | 1961-08-04 | 1900-01-01 | ||
| GB1001269A (nl) * | 1960-09-30 | 1900-01-01 | ||
| NL302170A (nl) * | 1963-06-15 |
-
1962
- 1962-05-28 DE DES79642A patent/DE1248814B/de active Pending
-
1965
- 1965-12-18 DE DE19651514643 patent/DE1514643A1/de active Pending
-
1966
- 1966-01-26 GB GB359066A patent/GB1078779A/en not_active Expired
- 1966-01-26 NL NL6600991A patent/NL140362B/nl unknown
- 1966-01-26 CH CH107166A patent/CH446534A/de unknown
- 1966-01-28 FR FR47654A patent/FR1466106A/fr not_active Expired
- 1966-01-28 BE BE675736D patent/BE675736A/xx unknown
- 1966-01-28 SE SE111566A patent/SE345038C/xx unknown
-
1968
- 1968-04-11 US US72986268 patent/US3499095A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| SE345038C (sv) | 1974-09-23 |
| SE345038B (sv) | 1972-05-08 |
| GB1078779A (en) | 1967-08-09 |
| DE1248814B (de) | 1968-03-14 |
| BE675736A (nl) | 1966-07-28 |
| NL6600991A (nl) | 1966-08-01 |
| US3499095A (en) | 1970-03-03 |
| NL140362B (nl) | 1973-11-15 |
| DE1514393A1 (de) | 1970-09-24 |
| DE1514643A1 (de) | 1972-01-20 |
| DE1514393B2 (de) | 1972-11-09 |
| FR1466106A (fr) | 1967-01-13 |
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