CH424993A - Halbleitervorrichtung und Verfahren zu ihrer Herstellung - Google Patents

Halbleitervorrichtung und Verfahren zu ihrer Herstellung

Info

Publication number
CH424993A
CH424993A CH312761A CH312761A CH424993A CH 424993 A CH424993 A CH 424993A CH 312761 A CH312761 A CH 312761A CH 312761 A CH312761 A CH 312761A CH 424993 A CH424993 A CH 424993A
Authority
CH
Switzerland
Prior art keywords
making
same
semiconductor device
semiconductor
Prior art date
Application number
CH312761A
Other languages
English (en)
Inventor
Keith Baker Lawrence
Edward Magill Thomas
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of CH424993A publication Critical patent/CH424993A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
CH312761A 1960-03-18 1961-03-15 Halbleitervorrichtung und Verfahren zu ihrer Herstellung CH424993A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16002A US3198999A (en) 1960-03-18 1960-03-18 Non-injecting, ohmic contact for semiconductive devices

Publications (1)

Publication Number Publication Date
CH424993A true CH424993A (de) 1966-11-30

Family

ID=21774819

Family Applications (1)

Application Number Title Priority Date Filing Date
CH312761A CH424993A (de) 1960-03-18 1961-03-15 Halbleitervorrichtung und Verfahren zu ihrer Herstellung

Country Status (7)

Country Link
US (1) US3198999A (de)
BE (1) BE601339A (de)
CH (1) CH424993A (de)
DE (1) DE1190583B (de)
FR (1) FR1284316A (de)
GB (1) GB980442A (de)
NL (1) NL261398A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3390020A (en) * 1964-03-17 1968-06-25 Mandelkorn Joseph Semiconductor material and method of making same
US3327181A (en) * 1964-03-24 1967-06-20 Crystalonics Inc Epitaxial transistor and method of manufacture
US3474307A (en) * 1965-03-29 1969-10-21 Hitachi Ltd Semiconductor device for chopper circuits having lead wires of copper metal and alloys thereof
US3610870A (en) * 1968-03-13 1971-10-05 Hitachi Ltd Method for sealing a semiconductor element
US3828425A (en) * 1970-10-16 1974-08-13 Texas Instruments Inc Method for making semiconductor packaged devices and assemblies
FR2454700A1 (fr) * 1979-04-18 1980-11-14 Cepe Boitier d'encapsulation pour composant electronique et composant comportant un tel boitier
US4919291A (en) * 1987-11-23 1990-04-24 Santa Barbara Research Center Metallurgically improved tip-off tube for a vacuum enclosure
US4942139A (en) * 1988-02-01 1990-07-17 General Instrument Corporation Method of fabricating a brazed glass pre-passivated chip rectifier
US5288456A (en) * 1993-02-23 1994-02-22 International Business Machines Corporation Compound with room temperature electrical resistivity comparable to that of elemental copper
FR2710810B1 (fr) * 1993-09-29 1995-12-01 Sagem Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier.

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2837703A (en) * 1958-06-03 Lidow
US2670441A (en) * 1949-09-07 1954-02-23 Bell Telephone Labor Inc Alpha particle counter
US2836878A (en) * 1952-04-25 1958-06-03 Int Standard Electric Corp Electric devices employing semiconductors
US2813326A (en) * 1953-08-20 1957-11-19 Liebowitz Benjamin Transistors
AT190593B (de) * 1954-07-01 1957-07-10 Philips Nv Sperrschichtelektrodensystem, welches einen halbleitenden Körper aus Germanium oder Silizium enthält, insbesondere Kristalldiode oder Transistor
DE1000533B (de) * 1954-10-22 1957-01-10 Siemens Ag Verfahren zur Kontaktierung eines Halbleiterkoerpers
US2796563A (en) * 1955-06-10 1957-06-18 Bell Telephone Labor Inc Semiconductive devices
US2863105A (en) * 1955-11-10 1958-12-02 Hoffman Electronics Corp Rectifying device
US3063129A (en) * 1956-08-08 1962-11-13 Bendix Corp Transistor
US2829432A (en) * 1956-09-27 1958-04-08 Haslett Elmer Container openers
US2957112A (en) * 1957-12-09 1960-10-18 Westinghouse Electric Corp Treatment of tantalum semiconductor electrodes
DE1783827U (de) * 1957-12-20 1959-02-26 Seiemens Schuckertwerke Ag Gekapselter leistungsgleichrichter mit einer einkristallinen halbleiterscheibe.
US3079254A (en) * 1959-01-26 1963-02-26 George W Crowley Photographic fabrication of semiconductor devices
US3028529A (en) * 1959-08-26 1962-04-03 Bendix Corp Semiconductor diode

Also Published As

Publication number Publication date
US3198999A (en) 1965-08-03
FR1284316A (fr) 1962-02-09
DE1190583B (de) 1965-04-08
NL261398A (de) 1900-01-01
BE601339A (fr) 1961-07-03
GB980442A (en) 1965-01-13

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